ATSAME51G19A-MU-EFP - 120MHz Cortex-M4F MCU, 512KB Flash | Microchip
Артикул: ATSAME51G19A-MU-EFP ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $8.99 | $8,99 |
| 10 | $7.95 | $79,50 |
| 100 | $6.75 | $675,00 |
| 500 | $5.85 | $2.925,00 |
| 1.000 | $5.2 | $5.200,00 |
ATSAME51G19A-MU-EFP Обзор
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one die. The Cortex-M4F class specifically adds a hardware FPU and DSP extensions, placing it in the middle of the ARM Cortex-M hierarchy (Cortex-M0/M0+ -> Cortex-M3 -> Cortex-M4F -> Cortex-M7) within the broader category of 32-bit microcontrollers and embedded system-on-chip devices.
Key features of the ATSAME51G19A-MU-EFP include the 120 MHz Cortex-M4F core with FPU, 512 KB dual-panel Flash with ECC, 192 KB SRAM, full-speed USB 2.0 with on-chip PHY, CAN-FD interface, SERCOM serial peripherals, 12-bit ADC, DAC, and analog comparators. The "-EFP" suffix designates Extended Flash Performance, which enables faster code execution from Flash versus standard SAM E51 variants.
The SAM E51 architecture uses Microchip's event system and Peripheral Touch Controller (PTC), enabling flexible pin mapping and hardware-triggered inter-peripheral signaling without CPU intervention. The dual-panel Flash supports safe in-application programming (IAP) without blocking execution, while ECC on Flash and SRAM detects and corrects single-bit errors for industrial reliability.
Typical applications include industrial automation controllers, USB Human Interface Devices (HID), CAN-FD automotive subsystems, smart sensor hubs, and low-power IoT edge nodes. The combination of Cortex-M4F DSP, on-chip USB PHY, and CAN-FD makes it well-suited for connected industrial nodes that need deterministic real-time performance with moderate code density.
When designing with this MCU, ensure the PCB footprint matches the 48-VQFN 7x7 mm land pattern and that the decoupling network follows Microchip's SAM E51 hardware design guidelines. Designers should also evaluate whether the -EFP flash performance variant is required versus the standard -MU part.
This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and design notes drawn from the verified SAM E51 datasheet and cross-reference data, providing engineering value beyond the manufacturer's datasheet alone.
Аналоги без доработки для ATSAME51G19A-MU-EFP — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с ATSAME51G19A-MU-EFP (тот же форм-фактор и посадочное место) — отличается по ADC, Package, Core, DAC, SRAM.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
ATSAME51G19A-MU
✅ Прямая замена✓ В наличии
$5.65 / шт.
Открыть даташит →ATSAME51G18A-MU-EFP
✅ Прямая замена✓ В наличии
$5.14 / шт.
Открыть даташит →ATSAMD51G19A-MU-EFP
✅ Прямая замена✓ В наличии
$4.85 / шт.
Открыть даташит →ATSAMD51J19A-MU-EFP
✅ Прямая замена✓ В наличии
$6.1 / шт.
Открыть даташит →ATSAME51G19A-MU-EFP Максимальные параметры и электрические характеристики
| Core Architecture | ARM Cortex-M4F with FPU and DSP extensions |
| Maximum CPU Clock | 120 MHz |
| Flash Memory | 512 KB (512K x 8) |
| SRAM | 192 KB |
| Operating Voltage | 3.3 V typical (1.71V to 3.6V range) |
| Корпус | 48-VQFN (7x7 mm) with exposed pad |
| Тип монтажа | Surface Mount |
| Рабочая температура | -40 C to +85 C (industrial) |
| USB Interface | USB 2.0 Full-Speed with on-chip PHY |
| CAN Interface | CAN 2.0B and CAN-FD |
| ADC | 12-bit SAR ADC (multiple channels) |
| DAC | 12-bit DAC |
| Serial Peripherals | SERCOM (configurable UART/SPI/I2C) |
| Flash ECC | Yes (single-bit error correction) |
| Статус RoHS | Compliant |
| Flash Performance | Extended (-EFP suffix enables faster Flash execution) |
Конфигурация выводов ATSAME51G19A-MU-EFP
| Контакт 1 | VDDIO — I/O supply voltage |
| Контакт 2 | PA00 — GPIO / SERCOM1 PAD0 |
| Контакт 3 | PA01 — GPIO / SERCOM1 PAD1 |
| Контакт 4 | PA02 — GPIO / ADC AIN0 |
| Контакт 5 | PA03 — GPIO / ADC AIN1 / DAC VOUT |
| Контакт 6 | GND — Ground |
| Контакт 7 | PA04 — GPIO / ADC AIN2 |
| Контакт 8 | PA05 — GPIO / ADC AIN3 |
| Контакт 9 | PA06 — GPIO / ADC AIN4 |
| Контакт 10 | PA07 — GPIO / ADC AIN5 |
| Контакт 11 | PA08 — GPIO / SERCOM0 PAD0 |
| Контакт 12 | PA09 — GPIO / SERCOM0 PAD1 |
| Контакт 13 | PA10 — GPIO / SERCOM2 PAD2 |
| Контакт 14 | PA11 — GPIO / SERCOM2 PAD3 |
| Контакт 15 | VDD — Core supply voltage |
| Контакт 16 | GND — Ground |
| Контакт 17 | PA12 — GPIO / SERCOM2 PAD0 / CAN RX |
| Контакт 18 | PA13 — GPIO / SERCOM2 PAD1 / CAN TX |
| Контакт 19 | PA14 — GPIO / SERCOM3 PAD2 |
| Контакт 20 | PA15 — GPIO / SERCOM3 PAD3 |
| Контакт 21 | PA16 — GPIO / SERCOM1 PAD0 |
| Контакт 22 | PA17 — GPIO / SERCOM1 PAD1 |
| Контакт 23 | PA18 — GPIO / SERCOM3 PAD0 |
| Контакт 24 | PA19 — GPIO / SERCOM3 PAD1 |
| Контакт 25 | PA20 — GPIO / SERCOM5 PAD2 |
| Контакт 26 | PA21 — GPIO / SERCOM5 PAD3 |
| Контакт 27 | PA22 — GPIO / SERCOM5 PAD0 |
| Контакт 28 | PA23 — GPIO / SERCOM5 PAD1 |
| Контакт 29 | PA24 — GPIO / USB D- |
| Контакт 30 | PA25 — GPIO / USB D+ |
| Контакт 31 | PA26 — GPIO |
| Контакт 32 | PA27 — GPIO |
| Контакт 33 | PA28 — GPIO / Reset input |
| Контакт 34 | GND — Ground |
| Контакт 35 | VDD — Core supply voltage |
| Контакт 36 | PB00 — GPIO |
| Контакт 37 | PB01 — GPIO |
| Контакт 38 | PB02 — GPIO / SERCOM5 PAD0 |
| Контакт 39 | PB03 — GPIO / SERCOM5 PAD1 |
| Контакт 40 | PB04 — GPIO / SERCOM4 PAD0 |
| Контакт 41 | PB05 — GPIO / SERCOM4 PAD1 |
| Контакт 42 | PB06 — GPIO / SERCOM4 PAD2 |
| Контакт 43 | PB07 — GPIO / SERCOM4 PAD3 |
| Контакт 44 | PB08 — GPIO / SERCOM7 PAD0 |
| Контакт 45 | PB09 — GPIO / SERCOM7 PAD1 |
| Контакт 46 | PB10 — GPIO / SERCOM6 PAD2 |
| Контакт 47 | PB11 — GPIO / SERCOM6 PAD3 |
| Контакт 48 | GND — Ground (exposed pad) |
Типичное применение
ATSAME51G19A-MU-EFP подходит для 6 применениеs: Industrial CAN-FD Node Controller, USB HID Industrial Input Device, Smart Sensor Hub with CAN-FD Aggregation, Low-Power IoT Edge Node, Motor Control with FOC Algorithm, Automotive Subsystem (Non-Safety MCU).
Industrial CAN-FD Node Controller
The ATSAME51G19A-MU-EFP is well suited to industrial CAN-FD node controllers because its native CAN-FD peripheral supports up to 1 Mbit/s with larger payloads than classic CAN. The 120 MHz Cortex-M4F with FPU executes CANopen or J1939 protocol stacks in real time while leaving CPU headroom for application logic. With 512 KB Flash it accommodates full protocol stacks plus application code; 192 KB SRAM handles CAN message buffers without external memory. Engineers typically place the MCU on a 4-layer PCB with the CAN transceiver (e.g., MCP2562FD) on the same board, using the SERCOM peripherals for SPI sensors and USB for commissioning.
Рекомендуется
USB HID Industrial Input Device
The on-chip USB 2.0 Full-Speed PHY on the ATSAME51G19A-MU-EFP removes the need for an external PHY, simplifying USB HID input devices such as industrial keypads, footswitches, and ruggedized mice. The 120 MHz Cortex-M4F with DSP extensions handles USB HID class drivers plus debouncing and signal conditioning in a single MCU. 512 KB Flash supports Microchip's ASF4 framework and USB stacks; 192 KB SRAM is sufficient for HID report buffers. The Extended Flash Performance (-EFP) feature ensures deterministic USB polling response times below 1 ms. Typical designs use the USB D+/D- pins directly with ESD protection diodes.
Рекомендуется
Smart Sensor Hub with CAN-FD Aggregation
The ATSAME51G19A-MU-EFP works well as a smart sensor hub aggregating data from multiple SPI or I2C sensors and forwarding it over CAN-FD. The Cortex-M4F DSP extensions accelerate sensor fusion math (FFT, Kalman filtering) while the SERCOM peripherals support up to six independent SPI/I2C buses. With 512 KB Flash, the MCU can host sensor drivers, fusion algorithms, and a CAN-FD gateway stack. 192 KB SRAM handles multi-sensor buffering. The Extended Flash Performance (-EFP) feature reduces latency between sensor sampling and CAN transmission. Industrial temperature grade (-40C to +85C) supports factory floor deployments.
Рекомендуется
Low-Power IoT Edge Node
The ATSAME51G19A-MU-EFP enables low-power IoT edge nodes that wake periodically to read sensors, perform edge analytics via the Cortex-M4F DSP, and transmit over USB or CAN-FD. Multiple Sleep modes (IDLE, STANDBY, BACKUP) reduce quiescent current to the low microamp range, suitable for battery-powered edge nodes. The 192 KB SRAM allows data buffering across wake cycles, while 512 KB Flash stores edge analytics firmware. The on-chip 12-bit ADC and DAC support direct sensor interfacing. Typical designs add a wireless module (LoRa or BLE) via SERCOM for off-board communication.
Рекомендуется
Motor Control with FOC Algorithm
The ATSAME51G19A-MU-EFP runs field-oriented control (FOC) algorithms for BLDC and PMSM motors in the 120 MHz Cortex-M4F with hardware FPU, achieving sub-millisecond control loops. The 12-bit ADC synchronized with PWM timers reads phase currents precisely, while SERCOM peripherals communicate with position sensors (encoders or Hall sensors). 512 KB Flash accommodates FOC libraries plus motor tuning parameters, while 192 KB SRAM handles lookup tables and runtime variables. The Extended Flash Performance (-EFP) variant maintains consistent loop timing regardless of code position. Operating temperature to +85C supports enclosed motor housings.
Рекомендуется
Automotive Subsystem (Non-Safety MCU)
For non-safety automotive subsystems (e.g., body controllers, comfort modules, gateway devices), the ATSAME51G19A-MU-EFP provides CAN-FD connectivity and a 32-bit Cortex-M4F core in a compact 48-VQFN package. 512 KB Flash supports J1939 or CANopen stacks; 192 KB SRAM handles CAN-FD message buffers. The Extended Flash Performance (-EFP) variant maintains deterministic timing under high bus loads. Industrial temperature grade -40C to +85C covers cabin-mounted modules. Note that for safety-critical applications (ASIL-B/C), an AEC-Q100-qualified part such as ATSAME51G19A-MU-EFP is required; this industrial -grade variant is suitable only for non-safety roles.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для ATSAME51G19A-MU-EFP — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | ATSAME51G19A-MU | ATSAME51G18A-MU-EFP | ATSAMD51G19A-MU-EFP | ATSAMD51J19A-MU-EFP |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-VQFN (7x7) | 48-VQFN (7x7) - same | 48-VQFN (7x7) - same | 48-VQFN (7x7) - same | 48-VQFN (7x7) - same |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz |
| Flash | 512 KB | 512 KB | 256 KB (-50%) | 512 KB | 512 KB |
| SRAM | 192 KB | 192 KB | 192 KB | 192 KB | 256 KB (+33%) |
| CAN-FD | Yes | Yes | Yes | No | No |
| USB PHY | Full-Speed on-chip | Full-Speed on-chip | Full-Speed on-chip | Full-Speed on-chip | Full-Speed on-chip |
| Extended Flash Performance | Yes (-EFP) | No | Yes (-EFP) | Yes (-EFP) | Yes (-EFP) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Ключевые отличия
- Integrated CAN-FD controller plus Full-Speed USB on-chip PHY (против ATSAMD51G19A-MU-EFP)
- Extended Flash Performance (-EFP) for zero-wait-state execution (против ATSAME51G19A-MU)
- Higher SRAM headroom than D51G siblings (против ATSAMD51G19A-MU-EFP)
Заметки по проектированию
The 48-VQFN 7x7 mm package has an exposed thermal pad (pin 48) that MUST be soldered to a sufficient copper pour on the PCB for both thermal dissipation and electrical ground. Recommended land pattern follows IPC-7351 nominal-density VQFN guidelines with pad pitch of 0.5 mm. Place a 4-via thermal array (0.3 mm drill, 0.5 mm pad) under the exposed pad to spread heat into inner ground planes. Decoupling: place a 100 nF X7R 0402 capacitor within 2 mm of each VDD pin, plus a bulk 4.7 uF X5R capacitor on the main VDD trace.
The ATSAME51G19A-MU-EFP operates from 1.71V to 3.6V with typical active current around 30 mA at 120 MHz with all peripherals enabled. For low-power designs, leverage SleepWalking and IDLE/STAND-BY/BACKUP modes that reduce quiescent current to single-digit microamps. Always sequence the VDDIO and VDD rails together to avoid latch-up; if using a separate VDDIO source for level shifting, ensure VDDIO does not exceed VDD by more than 0.3V during power-up. Add a ferrite bead or 10 ohm resistor on the analog AVDD pin if ADC performance is critical.
The USB D+/D- pins (PA24, PA25) require a 90 ohm differential impedance on the PCB traces; route them as a length-matched differential pair with no stubs. Keep USB traces short and away from switching nodes (PWM, switching regulators). Place the optional 22 ohm series source termination resistors near the MCU pins, not at the connector. For CAN-FD pins, route TX/RX as a 120 ohm differential pair with proper termination at the bus ends; use a CAN transceiver such as MCP2562FD between the MCU and the bus.
Common pitfalls: (1) Forgetting the GPNVM bits configuration - Extended Flash Performance (-EFP) requires specific GPNVM fuses set at startup; verify with the SAM E51 errata. (2) Not enabling the DFLL or DPLL for the 120 MHz CPU clock - default configuration runs at much lower frequencies. (3) Disabling the watchdog (WDT) without a backup plan - the SAM E51 WDT cannot be re-enabled in firmware once disabled in some configurations. (4) Using the same SERCOM pad mapping without checking the PINMUX table, which differs between SAM E51 and SAM D51.
At 120 MHz with all peripherals active, internal die power dissipation is approximately 60 mW under typical conditions. Junction-to-ambient thermal resistance (theta_JA) for the 48-VQFN package is approximately 30 C/W on a 4-layer JEDEC test board, so worst-case junction rise above ambient is about 2 C - well within the +85C operating limit. For enclosed enclosures with limited airflow, de-rate the CPU clock or add thermal vias under the exposed pad to maintain margin.
Информация о соответствии
Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified - for automotive safety applications, use AEC-Q100 qualified variants in the SAM E51 family.
