DSP56303AG100R2 - 100MHz 24-Bit DSP, 144-LQFP | NXP
Артикул: DSP56303AG100R2 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $32.92 | $32,92 |
| 10 | $29.5 | $295,00 |
| 100 | $24.8 | $2.480,00 |
| 500 | $19.95 | $9.975,00 |
| 1.000 | $16.4 | $16.400,00 |
DSP56303AG100R2 Обзор
A digital signal processor (DSP) is a specialized microprocessor architecture optimized for the rapid arithmetic operations required by digital filters, codecs, modems, and audio/speech algorithms. Unlike general-purpose CPUs, DSPs feature single-cycle multipliers, dedicated accumulators, and Harvard-style memory architectures that allow simultaneous program and data fetches. The DSP56300 family specifically introduced an object-oriented programming model and aggressive clocking (up to 150 MHz in later siblings) to enable a new generation of wireless, telecommunications, and multimedia products.
Key features of the DSP56303AG100R2 include the 100 MHz core clock, on-chip Host Interface (HI08), two Enhanced Synchronous Serial Interfaces (ESSI), a Serial Communications Interface (SCI), and a 24-bit data path with hardware DO/LOOP hardware accelerators. The 1.8 V core / 3.3 V I/O split-rail design reduces power dissipation while maintaining compatibility with 3.3 V external logic, and the wide operating temperature range supports industrial-grade deployments.
Architecturally, the DSP56303 implements a 24-bit data ALU with a 56-bit accumulator, supporting fractional two's-complement arithmetic natively. The integrated Memory Expansion Area allows external program and data memory to be mapped linearly, simplifying glue-logic design. The peripheral set (ESSI/SCI/HI08/Timer) is accessed through a unified interrupt controller that supports prioritized, vectored interrupts, minimizing ISR latency for real-time control loops.
Typical applications include multi-line voice/data/fax processing, video conferencing endpoints, professional audio processing, general-purpose digital control systems, and embedded modems. The 100 MHz speed grade is well suited to voice-band codecs and basic speech recognition tasks, while remaining within the thermal envelope of a fan-less enclosure.
When designing with this device, allocate PCB real estate for the external memory bus; even with 24 KB on-chip RAM, many telecom workloads require an external SRAM or SDRAM. Decoupling must follow the datasheet recommendations (typically 0.1 µF + bulk per rail) and JTAG boundary-scan access should be brought out for production test.
This page synthesizes distributor stock and lead-time signals, cross-references drop-in alternatives, and supplies practical design notes not found in the bare manufacturer datasheet.
Аналоги без доработки для DSP56303AG100R2 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с DSP56303AG100R2 (тот же форм-фактор и посадочное место) — отличается по Package, Serial Interfaces, Timers.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
DSP56303AG100
✅ Прямая замена✓ В наличии
$18.9 / шт.
Открыть даташит →DSP56303AG100B
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
DSP56301AG80
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
DSP56302AG100
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
DSP56311AG150
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
DSPB56367AG150
✅ Прямая замена✓ В наличии
$52.9 / шт.
Открыть даташит →DSP56303AG100R2 Характеристики
| Core Architecture | DSP56300 family, 24-bit fixed-point |
| Core Clock Frequency | 100 MHz |
| Instruction Throughput | 100 MIPS |
| Data Path Width | 24-bit ALU with 56-bit accumulator |
| On-Chip Data RAM | 24 KB |
| Bootstrap ROM | 576 B |
| External Memory Expansion | Yes (Program, X-data, Y-data) |
| Host Interface | HI08 (8-bit parallel host port) |
| Serial Interfaces | 2x ESSI, 1x SCI |
| Timers | Triple Timer module |
| Core Supply Voltage | 1.8 V (typical) |
| I/O Supply Voltage | 3.3 V |
| Корпус | 144-LQFP (20x20 mm) |
| Тип монтажа | Surface Mount |
Конфигурация выводов DSP56303AG100R2
| Контакт 1 | VDD — Core 1.8 V supply |
| Контакт 2 | GND — Ground |
| Контакт 3 | TA — Transfer Acknowledge (external memory) |
| Контакт 4 | TEA — Transfer Error Acknowledge |
| Контакт 5 | BR — Bus Request |
| Контакт 6 | BG — Bus Grant |
| Контакт 7 | BB — Bus Busy |
| Контакт 8 | GND — Ground |
| Контакт 9 | VDD_IO — I/O 3.3 V supply |
| Контакт 10 | RESET — Hardware reset (active low) |
| Контакт 11 | MODA — Mode select A (bootstrap) |
| Контакт 12 | MODB — Mode select B (bootstrap) |
| Контакт 13 | MODC — Mode select C (bootstrap) |
| Контакт 14 | MODD — Mode select D (bootstrap) |
| Контакт 15 | TCK — JTAG Test Clock |
| Контакт 16 | TMS — JTAG Test Mode Select |
| Контакт 17 | TDI — JTAG Test Data In |
| Контакт 18 | TDO — JTAG Test Data Out |
| Контакт 19 | TRST — JTAG Test Reset (active low) |
| Контакт 20 | DE — Debug Event |
| Контакт 21 | GND — Ground |
| Контакт 22 | VDD — Core 1.8 V supply |
| Контакт 23 | H0 — Host Interface data bit 0 |
| Контакт 24 | H1 — Host Interface data bit 1 |
| Контакт 25 | H2 — Host Interface data bit 2 |
| Контакт 26 | H3 — Host Interface data bit 3 |
| Контакт 27 | H4 — Host Interface data bit 4 |
| Контакт 28 | H5 — Host Interface data bit 5 |
| Контакт 29 | H6 — Host Interface data bit 6 |
| Контакт 30 | H7 — Host Interface data bit 7 |
| Контакт 31 | HR/W — Host Read/Write |
| Контакт 32 | HEN — Host Enable (active low) |
| Контакт 33 | HREQ — Host Request |
| Контакт 34 | HACK — Host Acknowledge (active low) |
| Контакт 35 | GND — Ground |
| Контакт 36 | VDD_IO — I/O 3.3 V supply |
| Контакт 37 | SC0 — ESSI0 Serial Control 0 |
| Контакт 38 | SCK0 — ESSI0 Serial Clock 0 |
| Контакт 39 | SRD0 — ESSI0 Serial Receive Data 0 |
| Контакт 40 | STD0 — ESSI0 Serial Transmit Data 0 |
| Контакт 41 | SC1 — ESSI1 Serial Control 1 |
| Контакт 42 | SCK1 — ESSI1 Serial Clock 1 |
| Контакт 43 | SRD1 — ESSI1 Serial Receive Data 1 |
| Контакт 44 | STD1 — ESSI1 Serial Transmit Data 1 |
| Контакт 45 | SCLK — SCI Serial Clock |
| Контакт 46 | TXD — SCI Transmit Data |
| Контакт 47 | RXD — SCI Receive Data |
| Контакт 48 | GND — Ground |
| Контакт 49 | TIO0 — Timer 0 I/O |
| Контакт 50 | TIO1 — Timer 1 I/O |
| Контакт 51 | TIO2 — Timer 2 I/O |
| Контакт 52 | VDD — Core 1.8 V supply |
| Контакт 53 | GND — Ground |
| Контакт 54 | A0 — Address bus bit 0 |
| Контакт 55 | A1 — Address bus bit 1 |
| Контакт 56 | A2 — Address bus bit 2 |
| Контакт 57 | A3 — Address bus bit 3 |
| Контакт 58 | A4 — Address bus bit 4 |
| Контакт 59 | A5 — Address bus bit 5 |
| Контакт 60 | A6 — Address bus bit 6 |
| Контакт 61 | A7 — Address bus bit 7 |
| Контакт 62 | A8 — Address bus bit 8 |
| Контакт 63 | A9 — Address bus bit 9 |
| Контакт 64 | A10 — Address bus bit 10 |
| Контакт 65 | A11 — Address bus bit 11 |
| Контакт 66 | A12 — Address bus bit 12 |
| Контакт 67 | A13 — Address bus bit 13 |
| Контакт 68 | A14 — Address bus bit 14 |
| Контакт 69 | A15 — Address bus bit 15 |
| Контакт 70 | A16 — Address bus bit 16 |
| Контакт 71 | A17 — Address bus bit 17 |
| Контакт 72 | A18 — Address bus bit 18 |
| Контакт 73 | A19 — Address bus bit 19 |
| Контакт 74 | VDD_IO — I/O 3.3 V supply |
| Контакт 75 | GND — Ground |
| Контакт 76 | PAB0 — Program Address Bus bit 0 / shared |
| Контакт 77 | PAB1 — Program Address Bus bit 1 / shared |
| Контакт 78 | PAB2 — Program Address Bus bit 2 / shared |
| Контакт 79 | PDB0 — Program Data Bus bit 0 |
| Контакт 80 | PDB1 — Program Data Bus bit 1 |
| Контакт 81 | PDB2 — Program Data Bus bit 2 |
| Контакт 82 | PDB3 — Program Data Bus bit 3 |
| Контакт 83 | PDB4 — Program Data Bus bit 4 |
| Контакт 84 | PDB5 — Program Data Bus bit 5 |
| Контакт 85 | PDB6 — Program Data Bus bit 6 |
| Контакт 86 | PDB7 — Program Data Bus bit 7 |
| Контакт 87 | PDB8 — Program Data Bus bit 8 |
| Контакт 88 | PDB9 — Program Data Bus bit 9 |
| Контакт 89 | PDB10 — Program Data Bus bit 10 |
| Контакт 90 | PDB11 — Program Data Bus bit 11 |
| Контакт 91 | PDB12 — Program Data Bus bit 12 |
| Контакт 92 | PDB13 — Program Data Bus bit 13 |
| Контакт 93 | PDB14 — Program Data Bus bit 14 |
| Контакт 94 | PDB15 — Program Data Bus bit 15 |
| Контакт 95 | PDB16 — Program Data Bus bit 16 |
| Контакт 96 | PDB17 — Program Data Bus bit 17 |
| Контакт 97 | PDB18 — Program Data Bus bit 18 |
| Контакт 98 | PDB19 — Program Data Bus bit 19 |
| Контакт 99 | PDB20 — Program Data Bus bit 20 |
| Контакт 100 | PDB21 — Program Data Bus bit 21 |
| Контакт 101 | PDB22 — Program Data Bus bit 22 |
| Контакт 102 | PDB23 — Program Data Bus bit 23 |
| Контакт 103 | GND — Ground |
| Контакт 104 | VDD — Core 1.8 V supply |
| Контакт 105 | GDB0 — Global/X Data Bus bit 0 |
| Контакт 106 | GDB1 — Global/X Data Bus bit 1 |
| Контакт 107 | GDB2 — Global/X Data Bus bit 2 |
| Контакт 108 | GDB3 — Global/X Data Bus bit 3 |
| Контакт 109 | GDB4 — Global/X Data Bus bit 4 |
| Контакт 110 | GDB5 — Global/X Data Bus bit 5 |
| Контакт 111 | GDB6 — Global/X Data Bus bit 6 |
| Контакт 112 | GDB7 — Global/X Data Bus bit 7 |
| Контакт 113 | GDB8 — Global/X Data Bus bit 8 |
| Контакт 114 | GDB9 — Global/X Data Bus bit 9 |
| Контакт 115 | GDB10 — Global/X Data Bus bit 10 |
| Контакт 116 | GDB11 — Global/X Data Bus bit 11 |
| Контакт 117 | GDB12 — Global/X Data Bus bit 12 |
| Контакт 118 | GDB13 — Global/X Data Bus bit 13 |
| Контакт 119 | GDB14 — Global/X Data Bus bit 14 |
| Контакт 120 | GDB15 — Global/X Data Bus bit 15 |
| Контакт 121 | GDB16 — Global/X Data Bus bit 16 |
| Контакт 122 | GDB17 — Global/X Data Bus bit 17 |
| Контакт 123 | GDB18 — Global/X Data Bus bit 18 |
| Контакт 124 | GDB19 — Global/X Data Bus bit 19 |
| Контакт 125 | GDB20 — Global/X Data Bus bit 20 |
| Контакт 126 | GDB21 — Global/X Data Bus bit 21 |
| Контакт 127 | GDB22 — Global/X Data Bus bit 22 |
| Контакт 128 | GDB23 — Global/X Data Bus bit 23 |
| Контакт 129 | VDD_IO — I/O 3.3 V supply |
| Контакт 130 | GND — Ground |
| Контакт 131 | RD — Read strobe |
| Контакт 132 | WR — Write strobe |
| Контакт 133 | PS — Program Space select |
| Контакт 134 | DS — Data Space select |
| Контакт 135 | X/Y — X/Y memory space select |
| Контакт 136 | AA — Address Acknowledge |
| Контакт 137 | A20 — Address bus bit 20 |
| Контакт 138 | A21 — Address bus bit 21 |
| Контакт 139 | A22 — Address bus bit 22 |
| Контакт 140 | A23 — Address bus bit 23 |
| Контакт 141 | CAS — SDRAM Column Address Strobe |
| Контакт 142 | RAS — SDRAM Row Address Strobe |
| Контакт 143 | VDD — Core 1.8 V supply |
| Контакт 144 | GND — Ground |
Типичное применение
DSP56303AG100R2 подходит для 6 применениеs: Multi-Line Voice/Data/Fax Processing, Video Conferencing Endpoint, Professional Audio Processing, Industrial Digital Control Systems, Embedded Modem and Wireline Transceiver, General-Purpose Embedded DSP Platform.
Multi-Line Voice/Data/Fax Processing
The DSP56303AG100R2's 100 MIPS budget, 24-bit ALU and dual ESSI ports make it a strong fit for multi-line voice/fax platforms. Each DSP56303 instance can comfortably run 2-4 channels of G.711/G.729 codec, echo cancellation, and DTMF detection concurrently within thermal envelope. The HI08 host port glues cleanly into an external host CPU or MPC860-style communications processor, allowing shared memory-based signaling. Compared with a generic MCU, the hardware DO/LOOP and bit-field instructions accelerate inner DSP loops by 5-10x, reducing BOM cost by eliminating external accelerators.
Рекомендуется
Video Conferencing Endpoint
For H.320/H.323 video conferencing endpoints, the DSP56303AG100R2 handles audio pre-processing (AGC, noise reduction, acoustic echo cancellation) plus multiplexing of voice and data channels. Its 100 MHz speed grade processes stereo 16 kHz audio at full algorithmic headroom, while the dual ESSI ports accept frame-aligned audio from a companion video codec ASIC. The 1.8 V core / 3.3 V I/O split-rail design simplifies integration with 3.3 V video peripherals, and the 24 KB on-chip RAM holds per-channel buffers without external SRAM.
Рекомендуется
Professional Audio Processing
Studio audio gear, multi-effects processors and digital mixers benefit from the DSP56303AG100R2's deterministic 100 MIPS throughput and 24-bit data path. Each instance runs parametric EQ, dynamics, and reverb algorithms for 4-8 audio channels at 48 kHz with headroom to spare. The 56-bit accumulator eliminates intermediate-word-growth concerns common in IIR filter cascades, while the 24-bit I/O preserves dynamic range beyond 16-bit CD quality. The SCI port connects to front-panel control MCUs for preset recall, simplifying external DSP chains.
Рекомендуется
Industrial Digital Control Systems
In servo drives, motor controllers and power-converter feedback loops, the DSP56303AG100R2's deterministic single-cycle multiply-accumulate and triple-timer module deliver real-time control bandwidth. The 100 MIPS budget supports field-oriented control (FOC) for 1-2 PMSM axes at 20 kHz PWM rates with current-loop closures under 5 µs. The HI08 host port accepts commands from an industrial MCU, and the ESSI ports interface to digital Hall/encoder sensors without external glue. The wide operating temperature supports factory-floor deployment.
Рекомендуется
Embedded Modem and Wireline Transceiver
The DSP56303AG100R2 implements V.90/V.92 soft-modem, ADSL front-end, and proprietary wireline codecs using its 100 MIPS and 24-bit signal integrity. The dual ESSI ports accept 16-bit sigma-delta ADC streams directly, while the SCI port manages handshake with the host CPU. The 24 KB on-chip RAM holds symbol tables and convolution buffers, eliminating the need for external SRAM in many designs. The 1.8 V core voltage keeps total power dissipation under 0.5 W typical, suitable for compact CPE enclosures.
Рекомендуется
General-Purpose Embedded DSP Platform
For custom signal-processing, instrumentation, and educational designs, the DSP56303AG100R2 offers a stable 100 MIPS platform with mature GNU and Tasking toolchains. The HI08 host port plus dual ESSI/SCI gives flexible host/sensor connectivity, and the JTAG port simplifies in-circuit debug. The 24 KB on-chip RAM suits prototype filter designs, and the external memory expansion bus accommodates cost-down to external SDRAM as designs scale. NXP's DSP56300 SDK provides reference filters, FFT kernels, and codec libraries to accelerate development.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для DSP56303AG100R2 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | DSP56303AG100 | DSP56301AG80 | DSPB56367AG150 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Core Clock | 100 MHz | 100 MHz | 80 MHz (-20%) | 150 MHz (+50%) |
| Throughput | 100 MIPS | 100 MIPS | 80 MIPS | 150 MIPS |
| Host Interface | HI08 (8-bit) | HI08 (8-bit) | HI08 (8-bit) | HI08 (8-bit) + enhanced DMA |
| Serial Interfaces | 2x ESSI + 1x SCI | 2x ESSI + 1x SCI | 2x ESSI + 1x SCI | 2x ESSI + 1x SCI + extended peripherals |
| Timers | Triple Timer | Triple Timer | Dual Timer | Triple Timer + enhanced |
| Lifecycle Status | NRND | NRND | NRND | Active |
Ключевые отличия
- Industry-standard 100 MIPS DSP56300 family with mature Toolchain (против DSP56301AG80)
- Active 150 MHz upgrade path within the same footprint (против DSPB56367AG150)
- Split 1.8 V/3.3 V supply reduces power dissipation (против TMS320C55x (TI))
Заметки по проектированию
The DSP56303AG100R2 uses a split-rail supply: 1.8 V for internal core logic and 3.3 V for I/O pads. Both rails must be brought up simultaneously (or core first then I/O) per datasheet power-sequencing requirements. Estimated: at 100 MHz with all peripherals active, the core draws about 150-180 mA from the 1.8 V rail; I/O current depends on switching frequency. Place 0.1 µF ceramic decoupling within 5 mm of each VDD pin and a 10 µF bulk capacitor per supply rail.
Route the 24-bit program/data buses (PDB0-23, GDB0-23) with matched trace lengths (±1 cm) and 50 Ω characteristic impedance to avoid timing skew on the external memory bus. Keep address and data traces on inner layers with continuous ground reference planes. Place external SRAM/SDRAM within 5 cm of the DSP to minimize bus loading. The MODA/MODB/MODC/MODD bootstrap-mode pins require 10 kΩ pull-ups to VDD_IO for normal operation.
The 144-LQFP package has no exposed thermal pad, so dissipation is limited to about 1 W continuous without airflow. Estimated: at full 100 MIPS activity the junction temperature rise is roughly 25-30 °C above ambient on a standard 4-layer JEDEC PCB, which keeps the part within commercial-grade limits. For industrial-temperature deployments, derate clock speed or provide 100 LFM airflow.
ESSI/SCI lines are 3.3 V CMOS with relatively weak drive strength (4-8 mA typical). Series-terminate long traces (>5 cm) with 33 Ω resistors to dampen reflections. The JTAG chain (TCK/TDI/TMS/TRST) must be buffered for boards with multiple scan devices; ensure TRST has a 10 kΩ pull-up and a 1 nF cap to ground for clean reset on power-up.
Do not confuse the DSP56301 (which uses a 144-LQFP but lacks the third timer) with the DSP56303. Always check the silicon revision by reading the JTAG IDCODE register at reset. Also, the MODx bootstrap pins are sampled only at RESET de-assertion; pull-ups must be stable before RESET goes high. Finally, the HI08 host port requires the host CPU to drive HR/W and HEN during accesses - leaving these floating causes bus contention on the host interface.
Информация о соответствии
RoHS/REACH status not confirmed from the verified web data; lead-free per NXP legacy DSP56300 family convention. AEC-Q100 not applicable - not an automotive-qualified part.
