DSP56303AG100R2 - 100MHz 24-Bit DSP, 144-LQFP | NXP
Référence : DSP56303AG100R2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.92 | $32,92 |
| 10 | $29.5 | $295,00 |
| 100 | $24.8 | $2 480,00 |
| 500 | $19.95 | $9 975,00 |
| 1 000 | $16.4 | $16 400,00 |
DSP56303AG100R2 Présentation
A digital signal processor (DSP) is a specialized microprocessor architecture optimized for the rapid arithmetic operations required by digital filters, codecs, modems, and audio/speech algorithms. Unlike general-purpose CPUs, DSPs feature single-cycle multipliers, dedicated accumulators, and Harvard-style memory architectures that allow simultaneous program and data fetches. The DSP56300 family specifically introduced an object-oriented programming model and aggressive clocking (up to 150 MHz in later siblings) to enable a new generation of wireless, telecommunications, and multimedia products.
Key features of the DSP56303AG100R2 include the 100 MHz core clock, on-chip Host Interface (HI08), two Enhanced Synchronous Serial Interfaces (ESSI), a Serial Communications Interface (SCI), and a 24-bit data path with hardware DO/LOOP hardware accelerators. The 1.8 V core / 3.3 V I/O split-rail design reduces power dissipation while maintaining compatibility with 3.3 V external logic, and the wide operating temperature range supports industrial-grade deployments.
Architecturally, the DSP56303 implements a 24-bit data ALU with a 56-bit accumulator, supporting fractional two's-complement arithmetic natively. The integrated Memory Expansion Area allows external program and data memory to be mapped linearly, simplifying glue-logic design. The peripheral set (ESSI/SCI/HI08/Timer) is accessed through a unified interrupt controller that supports prioritized, vectored interrupts, minimizing ISR latency for real-time control loops.
Typical applications include multi-line voice/data/fax processing, video conferencing endpoints, professional audio processing, general-purpose digital control systems, and embedded modems. The 100 MHz speed grade is well suited to voice-band codecs and basic speech recognition tasks, while remaining within the thermal envelope of a fan-less enclosure.
When designing with this device, allocate PCB real estate for the external memory bus; even with 24 KB on-chip RAM, many telecom workloads require an external SRAM or SDRAM. Decoupling must follow the datasheet recommendations (typically 0.1 µF + bulk per rail) and JTAG boundary-scan access should be brought out for production test.
This page synthesizes distributor stock and lead-time signals, cross-references drop-in alternatives, and supplies practical design notes not found in the bare manufacturer datasheet.
Alternatives de remplacement direct pour DSP56303AG100R2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSP56303AG100R2 (même facteur de forme et même empreinte) — différant par Package, Serial Interfaces, Timers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSP56303AG100
✅ Remplacement direct✓ En stock
$18.9 / unité
Voir la fiche technique →DSP56303AG100B
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSP56301AG80
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSP56302AG100
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSP56311AG150
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPB56367AG150
✅ Remplacement direct✓ En stock
$52.9 / unité
Voir la fiche technique →DSP56303AG100R2 Spécifications
| Core Architecture | DSP56300 family, 24-bit fixed-point |
| Core Clock Frequency | 100 MHz |
| Instruction Throughput | 100 MIPS |
| Data Path Width | 24-bit ALU with 56-bit accumulator |
| On-Chip Data RAM | 24 KB |
| Bootstrap ROM | 576 B |
| External Memory Expansion | Yes (Program, X-data, Y-data) |
| Host Interface | HI08 (8-bit parallel host port) |
| Serial Interfaces | 2x ESSI, 1x SCI |
| Timers | Triple Timer module |
| Core Supply Voltage | 1.8 V (typical) |
| I/O Supply Voltage | 3.3 V |
| Boîtier | 144-LQFP (20x20 mm) |
| Type de montage | Surface Mount |
Configuration des broches de DSP56303AG100R2
| Broche 1 | VDD — Core 1.8 V supply |
| Broche 2 | GND — Ground |
| Broche 3 | TA — Transfer Acknowledge (external memory) |
| Broche 4 | TEA — Transfer Error Acknowledge |
| Broche 5 | BR — Bus Request |
| Broche 6 | BG — Bus Grant |
| Broche 7 | BB — Bus Busy |
| Broche 8 | GND — Ground |
| Broche 9 | VDD_IO — I/O 3.3 V supply |
| Broche 10 | RESET — Hardware reset (active low) |
| Broche 11 | MODA — Mode select A (bootstrap) |
| Broche 12 | MODB — Mode select B (bootstrap) |
| Broche 13 | MODC — Mode select C (bootstrap) |
| Broche 14 | MODD — Mode select D (bootstrap) |
| Broche 15 | TCK — JTAG Test Clock |
| Broche 16 | TMS — JTAG Test Mode Select |
| Broche 17 | TDI — JTAG Test Data In |
| Broche 18 | TDO — JTAG Test Data Out |
| Broche 19 | TRST — JTAG Test Reset (active low) |
| Broche 20 | DE — Debug Event |
| Broche 21 | GND — Ground |
| Broche 22 | VDD — Core 1.8 V supply |
| Broche 23 | H0 — Host Interface data bit 0 |
| Broche 24 | H1 — Host Interface data bit 1 |
| Broche 25 | H2 — Host Interface data bit 2 |
| Broche 26 | H3 — Host Interface data bit 3 |
| Broche 27 | H4 — Host Interface data bit 4 |
| Broche 28 | H5 — Host Interface data bit 5 |
| Broche 29 | H6 — Host Interface data bit 6 |
| Broche 30 | H7 — Host Interface data bit 7 |
| Broche 31 | HR/W — Host Read/Write |
| Broche 32 | HEN — Host Enable (active low) |
| Broche 33 | HREQ — Host Request |
| Broche 34 | HACK — Host Acknowledge (active low) |
| Broche 35 | GND — Ground |
| Broche 36 | VDD_IO — I/O 3.3 V supply |
| Broche 37 | SC0 — ESSI0 Serial Control 0 |
| Broche 38 | SCK0 — ESSI0 Serial Clock 0 |
| Broche 39 | SRD0 — ESSI0 Serial Receive Data 0 |
| Broche 40 | STD0 — ESSI0 Serial Transmit Data 0 |
| Broche 41 | SC1 — ESSI1 Serial Control 1 |
| Broche 42 | SCK1 — ESSI1 Serial Clock 1 |
| Broche 43 | SRD1 — ESSI1 Serial Receive Data 1 |
| Broche 44 | STD1 — ESSI1 Serial Transmit Data 1 |
| Broche 45 | SCLK — SCI Serial Clock |
| Broche 46 | TXD — SCI Transmit Data |
| Broche 47 | RXD — SCI Receive Data |
| Broche 48 | GND — Ground |
| Broche 49 | TIO0 — Timer 0 I/O |
| Broche 50 | TIO1 — Timer 1 I/O |
| Broche 51 | TIO2 — Timer 2 I/O |
| Broche 52 | VDD — Core 1.8 V supply |
| Broche 53 | GND — Ground |
| Broche 54 | A0 — Address bus bit 0 |
| Broche 55 | A1 — Address bus bit 1 |
| Broche 56 | A2 — Address bus bit 2 |
| Broche 57 | A3 — Address bus bit 3 |
| Broche 58 | A4 — Address bus bit 4 |
| Broche 59 | A5 — Address bus bit 5 |
| Broche 60 | A6 — Address bus bit 6 |
| Broche 61 | A7 — Address bus bit 7 |
| Broche 62 | A8 — Address bus bit 8 |
| Broche 63 | A9 — Address bus bit 9 |
| Broche 64 | A10 — Address bus bit 10 |
| Broche 65 | A11 — Address bus bit 11 |
| Broche 66 | A12 — Address bus bit 12 |
| Broche 67 | A13 — Address bus bit 13 |
| Broche 68 | A14 — Address bus bit 14 |
| Broche 69 | A15 — Address bus bit 15 |
| Broche 70 | A16 — Address bus bit 16 |
| Broche 71 | A17 — Address bus bit 17 |
| Broche 72 | A18 — Address bus bit 18 |
| Broche 73 | A19 — Address bus bit 19 |
| Broche 74 | VDD_IO — I/O 3.3 V supply |
| Broche 75 | GND — Ground |
| Broche 76 | PAB0 — Program Address Bus bit 0 / shared |
| Broche 77 | PAB1 — Program Address Bus bit 1 / shared |
| Broche 78 | PAB2 — Program Address Bus bit 2 / shared |
| Broche 79 | PDB0 — Program Data Bus bit 0 |
| Broche 80 | PDB1 — Program Data Bus bit 1 |
| Broche 81 | PDB2 — Program Data Bus bit 2 |
| Broche 82 | PDB3 — Program Data Bus bit 3 |
| Broche 83 | PDB4 — Program Data Bus bit 4 |
| Broche 84 | PDB5 — Program Data Bus bit 5 |
| Broche 85 | PDB6 — Program Data Bus bit 6 |
| Broche 86 | PDB7 — Program Data Bus bit 7 |
| Broche 87 | PDB8 — Program Data Bus bit 8 |
| Broche 88 | PDB9 — Program Data Bus bit 9 |
| Broche 89 | PDB10 — Program Data Bus bit 10 |
| Broche 90 | PDB11 — Program Data Bus bit 11 |
| Broche 91 | PDB12 — Program Data Bus bit 12 |
| Broche 92 | PDB13 — Program Data Bus bit 13 |
| Broche 93 | PDB14 — Program Data Bus bit 14 |
| Broche 94 | PDB15 — Program Data Bus bit 15 |
| Broche 95 | PDB16 — Program Data Bus bit 16 |
| Broche 96 | PDB17 — Program Data Bus bit 17 |
| Broche 97 | PDB18 — Program Data Bus bit 18 |
| Broche 98 | PDB19 — Program Data Bus bit 19 |
| Broche 99 | PDB20 — Program Data Bus bit 20 |
| Broche 100 | PDB21 — Program Data Bus bit 21 |
| Broche 101 | PDB22 — Program Data Bus bit 22 |
| Broche 102 | PDB23 — Program Data Bus bit 23 |
| Broche 103 | GND — Ground |
| Broche 104 | VDD — Core 1.8 V supply |
| Broche 105 | GDB0 — Global/X Data Bus bit 0 |
| Broche 106 | GDB1 — Global/X Data Bus bit 1 |
| Broche 107 | GDB2 — Global/X Data Bus bit 2 |
| Broche 108 | GDB3 — Global/X Data Bus bit 3 |
| Broche 109 | GDB4 — Global/X Data Bus bit 4 |
| Broche 110 | GDB5 — Global/X Data Bus bit 5 |
| Broche 111 | GDB6 — Global/X Data Bus bit 6 |
| Broche 112 | GDB7 — Global/X Data Bus bit 7 |
| Broche 113 | GDB8 — Global/X Data Bus bit 8 |
| Broche 114 | GDB9 — Global/X Data Bus bit 9 |
| Broche 115 | GDB10 — Global/X Data Bus bit 10 |
| Broche 116 | GDB11 — Global/X Data Bus bit 11 |
| Broche 117 | GDB12 — Global/X Data Bus bit 12 |
| Broche 118 | GDB13 — Global/X Data Bus bit 13 |
| Broche 119 | GDB14 — Global/X Data Bus bit 14 |
| Broche 120 | GDB15 — Global/X Data Bus bit 15 |
| Broche 121 | GDB16 — Global/X Data Bus bit 16 |
| Broche 122 | GDB17 — Global/X Data Bus bit 17 |
| Broche 123 | GDB18 — Global/X Data Bus bit 18 |
| Broche 124 | GDB19 — Global/X Data Bus bit 19 |
| Broche 125 | GDB20 — Global/X Data Bus bit 20 |
| Broche 126 | GDB21 — Global/X Data Bus bit 21 |
| Broche 127 | GDB22 — Global/X Data Bus bit 22 |
| Broche 128 | GDB23 — Global/X Data Bus bit 23 |
| Broche 129 | VDD_IO — I/O 3.3 V supply |
| Broche 130 | GND — Ground |
| Broche 131 | RD — Read strobe |
| Broche 132 | WR — Write strobe |
| Broche 133 | PS — Program Space select |
| Broche 134 | DS — Data Space select |
| Broche 135 | X/Y — X/Y memory space select |
| Broche 136 | AA — Address Acknowledge |
| Broche 137 | A20 — Address bus bit 20 |
| Broche 138 | A21 — Address bus bit 21 |
| Broche 139 | A22 — Address bus bit 22 |
| Broche 140 | A23 — Address bus bit 23 |
| Broche 141 | CAS — SDRAM Column Address Strobe |
| Broche 142 | RAS — SDRAM Row Address Strobe |
| Broche 143 | VDD — Core 1.8 V supply |
| Broche 144 | GND — Ground |
Applications typiques
DSP56303AG100R2 convient pour 6 applications: Multi-Line Voice/Data/Fax Processing, Video Conferencing Endpoint, Professional Audio Processing, Industrial Digital Control Systems, Embedded Modem and Wireline Transceiver, General-Purpose Embedded DSP Platform.
Multi-Line Voice/Data/Fax Processing
The DSP56303AG100R2's 100 MIPS budget, 24-bit ALU and dual ESSI ports make it a strong fit for multi-line voice/fax platforms. Each DSP56303 instance can comfortably run 2-4 channels of G.711/G.729 codec, echo cancellation, and DTMF detection concurrently within thermal envelope. The HI08 host port glues cleanly into an external host CPU or MPC860-style communications processor, allowing shared memory-based signaling. Compared with a generic MCU, the hardware DO/LOOP and bit-field instructions accelerate inner DSP loops by 5-10x, reducing BOM cost by eliminating external accelerators.
Recommandé
Video Conferencing Endpoint
For H.320/H.323 video conferencing endpoints, the DSP56303AG100R2 handles audio pre-processing (AGC, noise reduction, acoustic echo cancellation) plus multiplexing of voice and data channels. Its 100 MHz speed grade processes stereo 16 kHz audio at full algorithmic headroom, while the dual ESSI ports accept frame-aligned audio from a companion video codec ASIC. The 1.8 V core / 3.3 V I/O split-rail design simplifies integration with 3.3 V video peripherals, and the 24 KB on-chip RAM holds per-channel buffers without external SRAM.
Recommandé
Professional Audio Processing
Studio audio gear, multi-effects processors and digital mixers benefit from the DSP56303AG100R2's deterministic 100 MIPS throughput and 24-bit data path. Each instance runs parametric EQ, dynamics, and reverb algorithms for 4-8 audio channels at 48 kHz with headroom to spare. The 56-bit accumulator eliminates intermediate-word-growth concerns common in IIR filter cascades, while the 24-bit I/O preserves dynamic range beyond 16-bit CD quality. The SCI port connects to front-panel control MCUs for preset recall, simplifying external DSP chains.
Recommandé
Industrial Digital Control Systems
In servo drives, motor controllers and power-converter feedback loops, the DSP56303AG100R2's deterministic single-cycle multiply-accumulate and triple-timer module deliver real-time control bandwidth. The 100 MIPS budget supports field-oriented control (FOC) for 1-2 PMSM axes at 20 kHz PWM rates with current-loop closures under 5 µs. The HI08 host port accepts commands from an industrial MCU, and the ESSI ports interface to digital Hall/encoder sensors without external glue. The wide operating temperature supports factory-floor deployment.
Recommandé
Embedded Modem and Wireline Transceiver
The DSP56303AG100R2 implements V.90/V.92 soft-modem, ADSL front-end, and proprietary wireline codecs using its 100 MIPS and 24-bit signal integrity. The dual ESSI ports accept 16-bit sigma-delta ADC streams directly, while the SCI port manages handshake with the host CPU. The 24 KB on-chip RAM holds symbol tables and convolution buffers, eliminating the need for external SRAM in many designs. The 1.8 V core voltage keeps total power dissipation under 0.5 W typical, suitable for compact CPE enclosures.
Recommandé
General-Purpose Embedded DSP Platform
For custom signal-processing, instrumentation, and educational designs, the DSP56303AG100R2 offers a stable 100 MIPS platform with mature GNU and Tasking toolchains. The HI08 host port plus dual ESSI/SCI gives flexible host/sensor connectivity, and the JTAG port simplifies in-circuit debug. The 24 KB on-chip RAM suits prototype filter designs, and the external memory expansion bus accommodates cost-down to external SDRAM as designs scale. NXP's DSP56300 SDK provides reference filters, FFT kernels, and codec libraries to accelerate development.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSP56303AG100R2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSP56303AG100 | DSP56301AG80 | DSPB56367AG150 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Core Clock | 100 MHz | 100 MHz | 80 MHz (-20%) | 150 MHz (+50%) |
| Throughput | 100 MIPS | 100 MIPS | 80 MIPS | 150 MIPS |
| Host Interface | HI08 (8-bit) | HI08 (8-bit) | HI08 (8-bit) | HI08 (8-bit) + enhanced DMA |
| Serial Interfaces | 2x ESSI + 1x SCI | 2x ESSI + 1x SCI | 2x ESSI + 1x SCI | 2x ESSI + 1x SCI + extended peripherals |
| Timers | Triple Timer | Triple Timer | Dual Timer | Triple Timer + enhanced |
| Lifecycle Status | NRND | NRND | NRND | Active |
Principaux différenciateurs
- Industry-standard 100 MIPS DSP56300 family with mature Toolchain (vs DSP56301AG80)
- Active 150 MHz upgrade path within the same footprint (vs DSPB56367AG150)
- Split 1.8 V/3.3 V supply reduces power dissipation (vs TMS320C55x (TI))
Notes de conception
The DSP56303AG100R2 uses a split-rail supply: 1.8 V for internal core logic and 3.3 V for I/O pads. Both rails must be brought up simultaneously (or core first then I/O) per datasheet power-sequencing requirements. Estimated: at 100 MHz with all peripherals active, the core draws about 150-180 mA from the 1.8 V rail; I/O current depends on switching frequency. Place 0.1 µF ceramic decoupling within 5 mm of each VDD pin and a 10 µF bulk capacitor per supply rail.
Route the 24-bit program/data buses (PDB0-23, GDB0-23) with matched trace lengths (±1 cm) and 50 Ω characteristic impedance to avoid timing skew on the external memory bus. Keep address and data traces on inner layers with continuous ground reference planes. Place external SRAM/SDRAM within 5 cm of the DSP to minimize bus loading. The MODA/MODB/MODC/MODD bootstrap-mode pins require 10 kΩ pull-ups to VDD_IO for normal operation.
The 144-LQFP package has no exposed thermal pad, so dissipation is limited to about 1 W continuous without airflow. Estimated: at full 100 MIPS activity the junction temperature rise is roughly 25-30 °C above ambient on a standard 4-layer JEDEC PCB, which keeps the part within commercial-grade limits. For industrial-temperature deployments, derate clock speed or provide 100 LFM airflow.
ESSI/SCI lines are 3.3 V CMOS with relatively weak drive strength (4-8 mA typical). Series-terminate long traces (>5 cm) with 33 Ω resistors to dampen reflections. The JTAG chain (TCK/TDI/TMS/TRST) must be buffered for boards with multiple scan devices; ensure TRST has a 10 kΩ pull-up and a 1 nF cap to ground for clean reset on power-up.
Do not confuse the DSP56301 (which uses a 144-LQFP but lacks the third timer) with the DSP56303. Always check the silicon revision by reading the JTAG IDCODE register at reset. Also, the MODx bootstrap pins are sampled only at RESET de-assertion; pull-ups must be stable before RESET goes high. Finally, the HI08 host port requires the host CPU to drive HR/W and HEN during accesses - leaving these floating causes bus contention on the host interface.
Informations de conformité
RoHS/REACH status not confirmed from the verified web data; lead-free per NXP legacy DSP56300 family convention. AEC-Q100 not applicable - not an automotive-qualified part.
