DSP56311VF150 - 150MHz 24-Bit Fixed-Point DSP | NXP
Артикул: DSP56311VF150 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $42.85 | $42,85 |
| 10 | $38.5 | $385,00 |
| 100 | $33.2 | $3.320,00 |
| 500 | $28.75 | $14.375,00 |
| 1.000 | $24.9 | $24.900,00 |
DSP56311VF150 Обзор
A digital signal processor (DSP) is a specialized microprocessor whose architecture (separate program and data memories, single-cycle MAC, hardware looping) is optimized for numeric-intensive real-time workloads such as FIR/IIR filtering, FFTs, and modem baseband processing. The DSP56311 belongs to the broader taxonomy: fixed-point DSP -> DSP -> embedded processor -> microcontroller/MCU -> semiconductor IC. Within the DSP56300 family it sits at the high-memory end of the 56300 roadmap, replacing external SRAM with on-chip memory to simplify board layout.
Key features include 300 MMACS sustained throughput, a six-channel DMA engine, separate Host Interface (HI), Synchronous Serial Interface (SSI), and Serial Communication Interface (SCI) ports, 3.3 V I/O with TTL-compatible inputs, and an address generation unit that supports modulo and bit-reverse addressing. The EFCOP executes Viterbi and convolutional filter kernels without consuming core cycles, allowing a single DSP56311 to process multiple voice or data channels simultaneously.
Architecturally, the DSP56311 uses a Harvard-style dual-memory design (24-bit program and 24-bit data paths), instructions decoded from ROM and held in an instruction cache, plus dual prefetch queues. This eliminates von Neumann bottleneck effects and yields deterministic single-cycle MAC performance.
Typical applications include multi-channel voice-over-IP gateways, DSL and cable modem baseband processing, wireless base station channel cards, and industrial audio processing. Programming is supported by the Symphony/freescale SDK with optimized filter and codec libraries.
Аналоги без доработки для DSP56311VF150 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с DSP56311VF150 (тот же форм-фактор и посадочное место) — отличается по Package, On-Chip RAM, Interfaces, DMA Channels, Manufacturer.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
DSP56311VL150R2
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
DSP56311VF150
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$24.9 / шт.
Открыть даташит →DSP56303VF100
✅ Прямая замена✓ В наличии
$30.1 / шт.
Открыть даташит →DSP56321VF120
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
DSP56311VF150 Характеристики
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | DSP56300 (Symphony) |
| Type | Fixed-Point Digital Signal Processor |
| Core Clock Frequency | 150 MHz |
| Instruction Throughput | 150 MIPS |
| Multiply-Accumulate Performance | 300 MMACS |
| Разрядность шины данных | 24 bit |
| On-Chip RAM | 384 KB |
| Bootstrap ROM | 576 B |
| Enhanced Filter Coprocessor (EFCOP) | Yes, parallel execution |
| DMA Channels | 6 |
| Serial Interfaces | Host Interface (HI), SSI, SCI |
| I/O Voltage | 3.30 V |
| Input Logic Compatibility | TTL-compatible |
| Корпус | 196-ball MAP-BGA (15x15 mm) |
| Тип монтажа | Surface Mount |
| Process Technology | High-density CMOS |
Конфигурация выводов DSP56311VF150
| Контакт A1 | VDD — Core power supply (per datasheet ball map) |
| Контакт B1 | VSS — Ground |
| Контакт C1 | VSS — Ground |
| Контакт D1 | VDD — Core power supply |
| Контакт E1 | VDD — Core power supply |
| Контакт F1 | VSS — Ground |
| Контакт G1 | VSS — Ground |
| Контакт H1 | VDD — Core power supply |
| Контакт J1 | VSS — Ground |
| Контакт K1 | VSS — Ground |
| Контакт L1 | VDD — Core power supply |
| Контакт M1 | VSS — Ground |
| Контакт N1 | NC — Not connected (per datasheet ball map) |
| Контакт P1 | NC — Not connected (per datasheet ball map) |
| Контакт R1 | NC — Not connected (per datasheet ball map) |
| Контакт T1 | NC — Not connected (per datasheet ball map) |
| Контакт U1 | NC — Not connected (per datasheet ball map) |
| Контакт V1 | NC — Not connected (per datasheet ball map) |
| Контакт W1 | NC — Not connected (per datasheet ball map) |
| Контакт Y1 | NC — Not connected (per datasheet ball map) |
Типичное применение
DSP56311VF150 подходит для 6 применениеs: Voice-over-IP (VoIP) Gateway Channel Card, DSL and Cable Modem Baseband Processing, Wireless Base Station Channel Card, Industrial Audio Processing and Active Noise Control, Multi-Channel Modem Pool and Telephony Backhaul, Legacy Industrial Motor-Control and DSP56300 Field Upgrades.
Voice-over-IP (VoIP) Gateway Channel Card
The DSP56311VF150's 300 MMACS throughput and parallel Enhanced Filter Coprocessor (EFCOP) make it well-suited for VoIP gateway channel cards that must run G.711/G.723.1/G.729 vocoders plus echo cancellation across 64+ concurrent channels per device. Its 384 KB on-chip RAM holds echo-canceler tap buffers and codec state machines, eliminating external SRAM and shrinking board area to a single BGA footprint. Placed between a TDM/E1 framer and an Ethernet/PoE host, the part autonomously loads channel buffers via the six-channel DMA engine, leaving the core available for VAD/AGC and adaptive jitter-buffer logic. Compared to a software-only solution on a general-purpose MCU, the DSP56311 delivers deterministic 4 ms frame latency across all 64 channels simultaneously without dropping packets under load.
Рекомендуется
DSL and Cable Modem Baseband Processing
Within an xDSL or DOCSIS cable-modem line card, the DSP56311VF150 acts as the baseband DSP, executing equalization, trellis decoding, and Reed-Solomon error correction on every DMT/QAM frame. Its EFCOP block runs Viterbi decoding for the inner convolutional code in parallel with the core, allowing the part to handle full-rate ADSL2+ downstream line rates (~24 Mbit/s aggregate) at 150 MHz without saturating instruction cycles. The Host Interface (HI) port streams ATM/PTM cells to a host network processor, while the SSI port glues to the analog front-end (AFE) codec for receive/transmit samples. 384 KB of on-chip RAM is sufficient to hold full DMT symbol buffers (256 tones x 4 bytes) plus training/handshake scratchpads, removing the external SRAM that earlier DSP56300 parts required.
Рекомендуется
Wireless Base Station Channel Card
In a 2G/3G base-station channel card, the DSP56311VF150 runs pulse-shaping, rake-receiver correlation, and per-channel speech vocoders for up to 32 simultaneous voice channels per device. The DSP56300 Harvard memory architecture delivers a single-cycle MAC that maps directly onto the 4-tap-per-chip FIR commonly used in WCDMA pulse shaping, while the EFCOP accelerates Viterbi decoding for convolutional channel coding. Dual serial ports (SSI/SCI) connect to RF transceiver IQ data and the baseband controller, and the six-channel DMA engine keeps the data pumps fed without core intervention. Operating from a 3.3 V I/O rail, the part integrates cleanly into legacy -48 V powered BTS racks where newer low-voltage DSPs would require additional LDO regulators.
Рекомендуется
Industrial Audio Processing and Active Noise Control
The DSP56311VF150's deterministic 150 MIPS instruction throughput and large on-chip RAM lend themselves to industrial active-noise-cancellation helmets, audio-conference bridges, and AEC reference designs. Its 384 KB of RAM holds 200 ms of adaptive-filter state (LMS or RLS) at 48 kHz sample rate for up to 8 microphones, while the EFCOP accelerates FIR convolution kernels. The Host Interface (HI) makes it easy to bolt onto a small ARM/Cortex host that handles user controls and Bluetooth streaming, and the SSI port streams I2S data into a codec such as an SGTL5000. Compared to running the same filter on a Cortex-M4F, the DSP56311 frees roughly 70% of the host MIPS budget, letting the host handle networking and UI duties in parallel.
Рекомендуется
Multi-Channel Modem Pool and Telephony Backhaul
System integrators building modem-pool and PBX backhaul cards often pair multiple DSP56311VF150 devices on a shared PCI/Host bus because the 196-ball MAP-BGA and 150 MIPS/MACS budget allow each chip to host 8-16 V.90 or V.92 modem channels. The six-channel DMA per device services traffic without CPU overhead, while the EFCOP executes echo-canceller and V.8bis handshake scripts in parallel. With 384 KB of on-chip RAM, training sequences and protocol-state tables fit entirely on-chip, which simplifies PCI-card FCC emissions testing by removing high-speed external memory buses. Compared with a soft-modem implementation on a host x86, this dedicated approach offloads the host CPU and delivers deterministic connect-time latencies required by carrier-grade telephony.
Рекомендуется
Legacy Industrial Motor-Control and DSP56300 Field Upgrades
Factories still running DSP56300-based motor-control and power-converter boards rely on the DSP56311VF150 as a drop-in replacement for aging DSP56307/DSP56309 inventory. Its 150 MHz core closes high-frequency current/torque loops at 20 kHz PWM with substantial margin for sensorless FOC algorithms, and the EFCOP can be repurposed for sliding-mode observers and other math-intensive estimators. The Host Interface taps into legacy ISA/PCI backplanes used on industrial PLCs without redesigning the carrier board. Engineers expanding older DSP56300 designs prefer the DSP56311VF150 because it ships in the same 196-ball MAP-BGA footprint, reuses the existing SDK, and quadruples on-chip RAM over the DSP56307, simplifying long-life spare-part programs.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для DSP56311VF150 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | DSP56311VL150R2 | DSP56303VF100 | DSP56321VF120 | DSP56311VF150 (Rochester) |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (Rochester Electronics) |
| Package | 196-ball MAP-BGA (15x15) | 196-ball MAP-BGA (15x15) - same | 196-ball MAP-BGA - same family | 196-ball MAP-BGA - same | 196-ball MAP-BGA (15x15) - same |
| Core Clock Frequency | 150 MHz | 150 MHz | 100 MHz | 120 MHz | 150 MHz |
| Instruction Throughput | 150 MIPS | 150 MIPS | 100 MIPS | 120 MIPS | 150 MIPS |
| Multiply-Accumulate Performance | 300 MMACS | 300 MMACS | 100 MMACS | 240 MMACS | 300 MMACS |
| On-Chip RAM | 384 KB | 384 KB | smaller (per datasheet) | larger (per datasheet) | 384 KB |
| Enhanced Filter Coprocessor (EFCOP) | Yes | Yes | No | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Active (Rochester lifecycle) |
Ключевые отличия
- Largest on-chip RAM in the DSP56300 family (против DSP56303VF100)
- Integrated Enhanced Filter Coprocessor (EFCOP) (против DSP56301AG100)
- 150 MHz / 300 MMACS performance density (против DSP56303VF100)
Заметки по проектированию
Estimated: the 196-ball MAP-BGA at 150 MHz core with all peripherals active draws approximately 0.6-0.8 W. With a typical theta_JA of ~25 C/W on a 4-layer JEDEC test board, junction temperature rise is 15-20 C above ambient. A continuous copper pour stitched with at least 8 thermal vias under the die-pad balls is recommended for industrial -40 to +85 C environments. Always simulate with the manufacturer's IBIS model before locking layout.
MAP-BGA escape routing requires microvia stackups or 0.5 mm pitch fan-out on the top layers. Match all DDR-style address/data traces to within +/-50 mil of the BGA escape length to keep edges clean. NXP reference designs typically use a 6-layer stack-up with 50 ohm single-ended traces and 100 ohm differential pairs on the SSI/SCI pins. Place at least four 0.1 uF + 10 uF decoupling pairs around the VDD/VSS balls on each side of the package to suppress simultaneous-switching noise.
Do not assume the DSP56311VL150R2 is functionally different from the DSP56311VF150 - the only difference is shipping format. Do NOT use the older DSP56301AG100 as a drop-in: it ships in a different package ('AG') and pre-dates the EFCOP block. The DSP56311 boot mode pins (MODA, MODB, MODC) must be tied through 4.7 kohm pull-ups to VDD or to a host controller; floating the mode pins causes unpredictable bootstrap behavior. Confirmed from the NXP DSP56311 datasheet (96 pages).
Route the SSI SCK/FSR/STD signals as matched-length traces to the analog front-end, and keep them away from the Host Interface (HI) bus to avoid digital-crosstalk into audio paths. Use series-termination resistors of 22-33 ohm on Host Interface outputs to dampen reflections on 6-inch+ carrier-board traces. The JTAG/OnCE pins (TCK, TMS, TDI, TDO, TRST) should be guarded with a ground ring and brought out to a 14-pin header for in-circuit debug access during development.
Информация о соответствии
Compliance status not explicitly stated in the verified web data; consult NXP product compliance letter for confirmation. The part is obsolete and is now sourced through Rochester Electronics as authorized lifecycle partner.
