DSP56311VF150 - 150MHz 24-Bit Fixed-Point DSP | NXP
MPN: DSP56311VF150 ✗ Cuối đờiDSP56311VF150 Tóm tắt
A digital signal processor (DSP) is a specialized microprocessor whose architecture (separate program and data memories, single-cycle MAC, hardware looping) is optimized for numeric-intensive real-time workloads such as FIR/IIR filtering, FFTs, and modem baseband processing. The DSP56311 belongs to the broader taxonomy: fixed-point DSP -> DSP -> embedded processor -> microcontroller/MCU -> semiconductor IC. Within the DSP56300 family it sits at the high-memory end of the 56300 roadmap, replacing external SRAM with on-chip memory to simplify board layout.
Key features include 300 MMACS sustained throughput, a six-channel DMA engine, separate Host Interface (HI), Synchronous Serial Interface (SSI), and Serial Communication Interface (SCI) ports, 3.3 V I/O with TTL-compatible inputs, and an address generation unit that supports modulo and bit-reverse addressing. The EFCOP executes Viterbi and convolutional filter kernels without consuming core cycles, allowing a single DSP56311 to process multiple voice or data channels simultaneously.
Architecturally, the DSP56311 uses a Harvard-style dual-memory design (24-bit program and 24-bit data paths), instructions decoded from ROM and held in an instruction cache, plus dual prefetch queues. This eliminates von Neumann bottleneck effects and yields deterministic single-cycle MAC performance.
Typical applications include multi-channel voice-over-IP gateways, DSL and cable modem baseband processing, wireless base station channel cards, and industrial audio processing. Programming is supported by the Symphony/freescale SDK with optimized filter and codec libraries.
Bộ thay thế dễ dàng lắp đặt cho DSP56311VF150 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với DSP56311VF150 (cùng hình factor và footprint) — khác nhau ở Package, On-Chip RAM, Data Word Width, Bootstrap ROM, DMA Channels.
DSP56311VL150R2
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
DSP56311VF150
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →DSP56303VF100
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →DSP56321VF120
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
DSP56311VF150 Thông số kỹ thuật
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | DSP56300 (Symphony) |
| Type | Fixed-Point Digital Signal Processor |
| Core Clock Frequency | 150 MHz |
| Instruction Throughput | 150 MIPS |
| Multiply-Accumulate Performance | 300 MMACS |
| Bề rộng đường dữ liệu | 24 bit |
| On-Chip RAM | 384 KB |
| Bootstrap ROM | 576 B |
| Enhanced Filter Coprocessor (EFCOP) | Yes, parallel execution |
| DMA Channels | 6 |
| Serial Interfaces | Host Interface (HI), SSI, SCI |
| I/O Voltage | 3.30 V |
| Input Logic Compatibility | TTL-compatible |
| Hộp | 196-ball MAP-BGA (15x15 mm) |
| Kiểu lắp đặt | Surface Mount |
| Process Technology | High-density CMOS |
Cấu hình chân DSP56311VF150
| Chân A1 | VDD — Core power supply (per datasheet ball map) |
| Chân B1 | VSS — Ground |
| Chân C1 | VSS — Ground |
| Chân D1 | VDD — Core power supply |
| Chân E1 | VDD — Core power supply |
| Chân F1 | VSS — Ground |
| Chân G1 | VSS — Ground |
| Chân H1 | VDD — Core power supply |
| Chân J1 | VSS — Ground |
| Chân K1 | VSS — Ground |
| Chân L1 | VDD — Core power supply |
| Chân M1 | VSS — Ground |
| Chân N1 | NC — Not connected (per datasheet ball map) |
| Chân P1 | NC — Not connected (per datasheet ball map) |
| Chân R1 | NC — Not connected (per datasheet ball map) |
| Chân T1 | NC — Not connected (per datasheet ball map) |
| Chân U1 | NC — Not connected (per datasheet ball map) |
| Chân V1 | NC — Not connected (per datasheet ball map) |
| Chân W1 | NC — Not connected (per datasheet ball map) |
| Chân Y1 | NC — Not connected (per datasheet ball map) |
Ứng dụng tiêu biểu
DSP56311VF150 phù hợp cho 6 Áp dụngs: Voice-over-IP (VoIP) Gateway Channel Card, DSL and Cable Modem Baseband Processing, Wireless Base Station Channel Card, Industrial Audio Processing and Active Noise Control, Multi-Channel Modem Pool and Telephony Backhaul, Legacy Industrial Motor-Control and DSP56300 Field Upgrades.
Voice-over-IP (VoIP) Gateway Channel Card
The DSP56311VF150's 300 MMACS throughput and parallel Enhanced Filter Coprocessor (EFCOP) make it well-suited for VoIP gateway channel cards that must run G.711/G.723.1/G.729 vocoders plus echo cancellation across 64+ concurrent channels per device. Its 384 KB on-chip RAM holds echo-canceler tap buffers and codec state machines, eliminating external SRAM and shrinking board area to a single BGA footprint. Placed between a TDM/E1 framer and an Ethernet/PoE host, the part autonomously loads channel buffers via the six-channel DMA engine, leaving the core available for VAD/AGC and adaptive jitter-buffer logic. Compared to a software-only solution on a general-purpose MCU, the DSP56311 delivers deterministic 4 ms frame latency across all 64 channels simultaneously without dropping packets under load.
Được đề xuất
DSL and Cable Modem Baseband Processing
Within an xDSL or DOCSIS cable-modem line card, the DSP56311VF150 acts as the baseband DSP, executing equalization, trellis decoding, and Reed-Solomon error correction on every DMT/QAM frame. Its EFCOP block runs Viterbi decoding for the inner convolutional code in parallel with the core, allowing the part to handle full-rate ADSL2+ downstream line rates (~24 Mbit/s aggregate) at 150 MHz without saturating instruction cycles. The Host Interface (HI) port streams ATM/PTM cells to a host network processor, while the SSI port glues to the analog front-end (AFE) codec for receive/transmit samples. 384 KB of on-chip RAM is sufficient to hold full DMT symbol buffers (256 tones x 4 bytes) plus training/handshake scratchpads, removing the external SRAM that earlier DSP56300 parts required.
Được đề xuất
Wireless Base Station Channel Card
In a 2G/3G base-station channel card, the DSP56311VF150 runs pulse-shaping, rake-receiver correlation, and per-channel speech vocoders for up to 32 simultaneous voice channels per device. The DSP56300 Harvard memory architecture delivers a single-cycle MAC that maps directly onto the 4-tap-per-chip FIR commonly used in WCDMA pulse shaping, while the EFCOP accelerates Viterbi decoding for convolutional channel coding. Dual serial ports (SSI/SCI) connect to RF transceiver IQ data and the baseband controller, and the six-channel DMA engine keeps the data pumps fed without core intervention. Operating from a 3.3 V I/O rail, the part integrates cleanly into legacy -48 V powered BTS racks where newer low-voltage DSPs would require additional LDO regulators.
Được đề xuất
Industrial Audio Processing and Active Noise Control
The DSP56311VF150's deterministic 150 MIPS instruction throughput and large on-chip RAM lend themselves to industrial active-noise-cancellation helmets, audio-conference bridges, and AEC reference designs. Its 384 KB of RAM holds 200 ms of adaptive-filter state (LMS or RLS) at 48 kHz sample rate for up to 8 microphones, while the EFCOP accelerates FIR convolution kernels. The Host Interface (HI) makes it easy to bolt onto a small ARM/Cortex host that handles user controls and Bluetooth streaming, and the SSI port streams I2S data into a codec such as an SGTL5000. Compared to running the same filter on a Cortex-M4F, the DSP56311 frees roughly 70% of the host MIPS budget, letting the host handle networking and UI duties in parallel.
Được đề xuất
Multi-Channel Modem Pool and Telephony Backhaul
System integrators building modem-pool and PBX backhaul cards often pair multiple DSP56311VF150 devices on a shared PCI/Host bus because the 196-ball MAP-BGA and 150 MIPS/MACS budget allow each chip to host 8-16 V.90 or V.92 modem channels. The six-channel DMA per device services traffic without CPU overhead, while the EFCOP executes echo-canceller and V.8bis handshake scripts in parallel. With 384 KB of on-chip RAM, training sequences and protocol-state tables fit entirely on-chip, which simplifies PCI-card FCC emissions testing by removing high-speed external memory buses. Compared with a soft-modem implementation on a host x86, this dedicated approach offloads the host CPU and delivers deterministic connect-time latencies required by carrier-grade telephony.
Được đề xuất
Legacy Industrial Motor-Control and DSP56300 Field Upgrades
Factories still running DSP56300-based motor-control and power-converter boards rely on the DSP56311VF150 as a drop-in replacement for aging DSP56307/DSP56309 inventory. Its 150 MHz core closes high-frequency current/torque loops at 20 kHz PWM with substantial margin for sensorless FOC algorithms, and the EFCOP can be repurposed for sliding-mode observers and other math-intensive estimators. The Host Interface taps into legacy ISA/PCI backplanes used on industrial PLCs without redesigning the carrier board. Engineers expanding older DSP56300 designs prefer the DSP56311VF150 because it ships in the same 196-ball MAP-BGA footprint, reuses the existing SDK, and quadruples on-chip RAM over the DSP56307, simplifying long-life spare-part programs.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho DSP56311VF150 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | DSP56311VL150R2 | DSP56303VF100 | DSP56321VF120 | DSP56311VF150 (Rochester) |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (Rochester Electronics) |
| Package | 196-ball MAP-BGA (15x15) | 196-ball MAP-BGA (15x15) - same | 196-ball MAP-BGA - same family | 196-ball MAP-BGA - same | 196-ball MAP-BGA (15x15) - same |
| Core Clock Frequency | 150 MHz | 150 MHz | 100 MHz | 120 MHz | 150 MHz |
| Instruction Throughput | 150 MIPS | 150 MIPS | 100 MIPS | 120 MIPS | 150 MIPS |
| Multiply-Accumulate Performance | 300 MMACS | 300 MMACS | 100 MMACS | 240 MMACS | 300 MMACS |
| On-Chip RAM | 384 KB | 384 KB | smaller (per datasheet) | larger (per datasheet) | 384 KB |
| Enhanced Filter Coprocessor (EFCOP) | Yes | Yes | No | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Active (Rochester lifecycle) |
Bảo phân biệt quan trọng
- Largest on-chip RAM in the DSP56300 family (vsDSP56303VF100)
- Integrated Enhanced Filter Coprocessor (EFCOP) (vsDSP56301AG100)
- 150 MHz / 300 MMACS performance density (vsDSP56303VF100)
Ghi chú thiết kế
Estimated: the 196-ball MAP-BGA at 150 MHz core with all peripherals active draws approximately 0.6-0.8 W. With a typical theta_JA of ~25 C/W on a 4-layer JEDEC test board, junction temperature rise is 15-20 C above ambient. A continuous copper pour stitched with at least 8 thermal vias under the die-pad balls is recommended for industrial -40 to +85 C environments. Always simulate with the manufacturer's IBIS model before locking layout.
MAP-BGA escape routing requires microvia stackups or 0.5 mm pitch fan-out on the top layers. Match all DDR-style address/data traces to within +/-50 mil of the BGA escape length to keep edges clean. NXP reference designs typically use a 6-layer stack-up with 50 ohm single-ended traces and 100 ohm differential pairs on the SSI/SCI pins. Place at least four 0.1 uF + 10 uF decoupling pairs around the VDD/VSS balls on each side of the package to suppress simultaneous-switching noise.
Do not assume the DSP56311VL150R2 is functionally different from the DSP56311VF150 - the only difference is shipping format. Do NOT use the older DSP56301AG100 as a drop-in: it ships in a different package ('AG') and pre-dates the EFCOP block. The DSP56311 boot mode pins (MODA, MODB, MODC) must be tied through 4.7 kohm pull-ups to VDD or to a host controller; floating the mode pins causes unpredictable bootstrap behavior. Confirmed from the NXP DSP56311 datasheet (96 pages).
Route the SSI SCK/FSR/STD signals as matched-length traces to the analog front-end, and keep them away from the Host Interface (HI) bus to avoid digital-crosstalk into audio paths. Use series-termination resistors of 22-33 ohm on Host Interface outputs to dampen reflections on 6-inch+ carrier-board traces. The JTAG/OnCE pins (TCK, TMS, TDI, TDO, TRST) should be guarded with a ground ring and brought out to a 14-pin header for in-circuit debug access during development.
Thông tin tuân thủ
Compliance status not explicitly stated in the verified web data; consult NXP product compliance letter for confirmation. The part is obsolete and is now sourced through Rochester Electronics as authorized lifecycle partner.
