EP1AGX50DF780C7 - Arria GX FPGA 50K LE, 780-BGA, 3.125G Transceivers
Артикул: EP1AGX50DF780C7 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268 | $2.680,00 |
| 100 | $242 | $24.200,00 |
| 500 | $215 | $107.500,00 |
| 1.000 | $195 | $195.000,00 |
EP1AGX50DF780C7 Обзор
An FPGA (Field Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/O, all interconnected by a programmable routing fabric. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the digital IC hierarchy. Unlike fixed-function ASICs, FPGAs are reconfigured in the field via hardware description languages (HDL) such as Verilog and VHDL, making them ideal for prototyping, low-volume production, and designs whose algorithms evolve over time.
The EP1AGX50 family integrates high-speed transceivers capable of 3.125 Gbps operation, eliminating the need for external serializer/deserializer (SerDes) chips in many designs. The device features embedded multiplier blocks, TriMatrix memory, and support for external memory interfaces including DDR2 SDRAM and QDRII SRAM. Programmable I/O banks support multiple single-ended and differential I/O standards including LVDS, LVPECL, SSTL, and HSTL.
Architecturally, the EP1AGX50DF780C7 utilizes a 90 nm CMOS process with a 1.2 V core supply. The transceiver blocks embed Clock Data Recovery (CDR), 8B/10B encoding/decoding, and pseudo-random binary sequence (PRBS) generation for link testing. The device is configured via a passive or active serial configuration scheme and supports in-system programmability through JTAG, AS, and PS modes.
Typical applications include high-speed serial backplane interfaces (XAUI, PCIe Gen1), broadcast video processing, military radar signal preprocessing, industrial imaging pipelines, and telecommunications line cards. The combination of mid-range logic density with multi-gigabit transceivers makes this family particularly attractive for protocol bridging and adapter card designs.
When designing with this FPGA, pay close attention to transceiver reference clock routing, PCB stack-up for high-speed signals, and thermal management — BGA packages require careful PCB layout with controlled-impedance traces and matched-length differential pairs. Quartus II software (or its modern successors) is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor inventory signals, parametric alternatives, and practical design notes for the EP1AGX50DF780C7 — information not consolidated on any single manufacturer or distributor page.
Аналоги без доработки для EP1AGX50DF780C7 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP1AGX50DF780C7 (тот же форм-фактор и посадочное место) — отличается по Package, Speed Grade, Operating Temperature, Process Technology, RoHS Status.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP1AGX50DF780C6N
✅ Прямая замена✓ В наличии
$327.76 / шт.
Открыть даташит →EP1AGX50DF780C6
✅ Прямая замена✓ В наличии
$205 / шт.
Открыть даташит →EP1AGX50DF780I6N
✅ Прямая замена✓ В наличии
$255 / шт.
Открыть даташит →EP1AGX50CF484I6N
✅ Прямая замена✓ В наличии
$504.158 / шт.
Открыть даташит →EP1AGX35DF780C6N
✅ Прямая замена✓ В наличии
$199.5 / шт.
Открыть даташит →EP1AGX35DF780C5N
✅ Прямая замена✓ В наличии
$198 / шт.
Открыть даташит →EP1AGX50DF780C7 Максимальные параметры и электрические характеристики
| Family | Arria GX |
| Logic Elements | 50,160 |
| Memory Bits | 2,475,072 bits |
| Embedded 18x18 Multipliers | 232 |
| Transceiver Count | Up to 8 channels |
| Max Transceiver Data Rate | 3.125 Gbps |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Корпус | 780-ball FineLine BGA (DF780) |
| Speed Grade | C7 (commercial, speed grade 7) |
| Рабочая температура | 0C to +85C (commercial) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG |
| Memory Interfaces | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
Руководство по цоколевке EP1AGX50DF780C7 в корпусе 780-ball fineline bga (df780)
Цоколевка для EP1AGX50DF780C7 (корпус 780-ball fineline bga (df780)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP1AGX50DF780C7.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP1AGX50DF780C7 подходит для 7 применениеs: XAUI / 10 Gigabit Ethernet Backplane Interfaces, Broadcast Video Processing, PCI Express Gen1 Endpoint Cards, Military Radar Signal Preprocessing, Industrial Imaging Pipelines, Telecommunications Line Cards, Protocol Bridging and Adapter Cards.
XAUI / 10 Gigabit Ethernet Backplane Interfaces
The EP1AGX50DF780C7's eight 3.125 Gbps transceivers are ideally suited for XAUI (10 Gigabit Attachment Unit Interface) backplane designs requiring 4 × 3.125 Gbps lanes per port. Each transceiver channel embeds Clock Data Recovery (CDR), 8B/10B encoding, and word alignment, eliminating the need for external serializer/deserializer (SerDes) chips. The 50K logic elements support XAUI state machines, MAC-layer processing, and management interface logic. With commercial-grade temperature range and 1.2 V core supply, the device fits telecom line cards and switch fabric cards where four full XAUI ports consume all available transceiver channels.
Рекомендуется
Broadcast Video Processing
Broadcast video routers and format converters benefit from the EP1AGX50DF780C7's combination of embedded memory (2.4 Mbits of TriMatrix memory) and DSP blocks. The 50K logic elements and 232 18×18 multipliers enable real-time color space conversion, scaling, and frame-rate conversion at HD-SDI and 3G-SDI data rates. The 3.125 Gbps transceivers ingest SDI streams directly via SMPTE 424M (3G-SDI) and SMPTE 292M (HD-SDI) compliant interfaces. The DF780 BGA package supports sufficient I/O for parallel video buses (BT.656, BT.1120) alongside the serial SDI links, making it a popular choice for broadcast video cross-conversion cards.
Рекомендуется
PCI Express Gen1 Endpoint Cards
The EP1AGX50DF780C7's transceivers support PCIe Gen1 (2.5 Gbps) and PCIe Gen2 (5.0 Gbps via oversampling) operation, enabling cost-effective endpoint card designs. With 50K logic elements and dedicated transceiver channels, the device can implement PCIe hard IP, DMA engines, and application logic in a single chip. The DF780 BGA package provides sufficient board-edge I/O for additional peripherals on PCIe adapter cards such as video capture, network interface, or storage controllers. Designers should verify PCIe SIG compliance through the Altera PCIe IP core and the appropriate PHY-Interface (PIPE) configuration.
Рекомендуется
Military Radar Signal Preprocessing
Radar signal preprocessing requires real-time FFT computation, digital beamforming, and high-throughput ADC interfacing. The EP1AGX50DF780C7's 232 18×18 multipliers deliver approximately 5 GigaMACs/s performance, sufficient for radar pulse compression and MTI filtering. The transceivers accept LVDS data streams from high-speed ADCs (e.g., 12-bit / 200 MSPS converters), while the abundant TriMatrix memory buffers intermediate FFT stages. However, military applications typically require industrial or military temperature grades — designers targeting such environments should select the EP1AGX50DF780I6N variant or migrate to current-generation Arria-V or Cyclone-V families.
Рекомендуется
Industrial Imaging Pipelines
Machine vision and industrial imaging systems use the EP1AGX50DF780C7 to interface with Camera Link, CoaXPress, or GigE Vision cameras. The transceivers accept high-speed serial camera data (up to 3.125 Gbps per channel), while the 50K logic elements implement image processing algorithms such as Bayer demosaicing, color correction, and edge detection. Embedded TriMatrix memory buffers full-frame image data before transmission to a host processor over PCIe or Gigabit Ethernet. The commercial temperature range suits factory-floor enclosure environments, while embedded multiplier blocks accelerate convolution kernels used in defect detection.
Рекомендуется
Telecommunications Line Cards
Telecom line cards require multi-protocol support including SONET/SDH, Ethernet, and OTN interfaces. The EP1AGX50DF780C7's transceivers support OTU1 (2.66 Gbps) and STM-64/OC-192 (9.95 Gbps when using oversampling with multiple channels). The 50K logic elements enable framer/deframer logic, section overhead processing, and traffic management functions. With external DDR2 SDRAM interface support, the FPGA can buffer large payloads for traffic shaping. For OSP (Outside Plant) deployments, the industrial temperature variant EP1AGX50DF780I6N is recommended.
Рекомендуется
Protocol Bridging and Adapter Cards
The EP1AGX50DF780C7 serves as an excellent protocol bridge between legacy interfaces and modern high-speed serial links. Common deployments include Serial RapidIO to Ethernet bridges, custom serial backplane to PCIe adapters, and proprietary interconnect converters. The transceiver-rich architecture (8 channels) allows multiple protocols to be handled simultaneously — for example, four Serial RapidIO links + one PCIe x4 lane, or dual XAUI + dual PCIe x1. The 50K logic elements implement bridge state machines and protocol translation logic while the TriMatrix memory provides buffering for rate-matching between asynchronous domains.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP1AGX50DF780C7 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP1AGX50DF780C6N | EP1AGX50DF780I6N | EP1AGX50CF484I6N | EP1AGX35DF780C6N |
|---|---|---|---|---|---|
| Package | 780-ball FineLine BGA (DF780) | 780-ball FineLine BGA (DF780) - same | 780-ball FineLine BGA (DF780) - same | 484-ball FineLine BGA (CF484) - different | 780-ball FineLine BGA (DF780) - same |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Logic Elements | 50,160 | 50,160 | 50,160 | 50,160 | 33,920 |
| Speed Grade | C7 | C6 | I6 | I6 | C6 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial |
| Transceiver Channels | 8 | 8 | 8 | 8 | 8 |
| Max Transceiver Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
| Embedded Memory | 2,475,072 bits | 2,475,072 bits | 2,475,072 bits | 2,475,072 bits | 1,726,848 bits |
| Embedded Multipliers (18x18) | 232 | 232 | 232 | 232 | 156 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Ключевые отличия
- Highest speed grade (C7) within the 50K Arria GX DF780 family (против EP1AGX50DF780C6N)
- Full 50,160 logic elements vs. 33,920 in the 35K variant (против EP1AGX35DF780C6N)
- 780-ball FineLine BGA provides maximum I/O for transceiver-rich designs (против EP1AGX50CF484I6N)
- Commercial temperature grade optimized for cost-sensitive, controlled-environment applications (против EP1AGX50DF780I6N)
Заметки по проектированию
Estimated: High-speed transceiver channels on the EP1AGX50DF780C7 require 100-ohm differential controlled-impedance routing with matched trace lengths (skew < 5 mil). Use a 4- or 6-layer PCB stack-up with continuous ground reference planes. Maintain 3W spacing between differential pairs and adjacent signals. Place AC-coupling capacitors (0.1 uF) close to receiver inputs. Reference the Altera Arria GX Transceiver Layout Guide for complete channel implementation requirements.
Estimated: The DF780 BGA package has a typical theta_JA of approximately 12-15 C/W (with appropriate thermal via array and PCB thermal relief). At full transceiver utilization (8 channels at 3.125 Gbps with typical 200 mW per channel), total power dissipation can reach 8-10 W, producing 100-125 C junction temperature rise above ambient. A thermal via array (4-9 vias per BGA pad to internal copper planes) is essential for reliable operation. Heatsinks are recommended for sealed enclosures with limited airflow.
Estimated: Core supply (VCCINT) requires 1.2 V at up to 3 A typical. Transceiver analog supply (VCCA) is 3.3 V at 0.5 A. Transmitter supply (VCCHIP) is 1.5 V. All supplies must be sequenced per Altera specification — VCCA must come up before VCCINT. Use low-noise LDO regulators (e.g., TPS7A47xx) for analog supplies; switching regulators are acceptable for VCCINT with adequate filtering. Decoupling: 0.1 uF X7R capacitors within 100 mil of every supply pin, plus bulk 100-470 uF tantalum or polymer on each rail.
Reference clock routing: Transceiver reference clocks (REFCLK) require 50-ohm single-ended or 100-ohm differential routing with controlled impedance. Place the clock source within 2 inches of the FPGA; longer paths require receiver equalization or repeaters. The configuration interface (JTAG, AS, PS) must follow 4-wire JTAG topology with TMS, TDI, TDO, TCK pulled appropriately. For Active Serial configuration, route EPCS flash signals with 50-ohm impedance and 4 mil to 6 mil trace width.
Common pitfalls with the EP1AGX50DF780C7 include: (1) connecting unused transceiver channels to GND through 50-ohm termination rather than leaving them floating; (2) failing to program the CRC error-check enable bit in configuration settings, leading to undetected bitstream corruption; (3) ignoring inrush current on VCCA which can exceed 2 A at power-on without proper sequencing. Always use the Altera Quartus II Pin Planner to verify I/O assignments before generating the programming file.
Информация о соответствии
RoHS, REACH, lead-free, and halogen-free status not explicitly stated in the provided Verified Web Data. Altera FPGAs of this era (90 nm, 2008-2010 vintage) are typically RoHS compliant per industry norms, but [DATA_NEEDED] for the specific EP1AGX50DF780C7 part marking.
