EP1K100EFI484-2 - 100K ACEX-1K FPGA, 333 I/O, 484-BBGA | Intel
Артикул: EP1K100EFI484-2 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $87.5 | $875,00 |
| 100 | $78 | $7.800,00 |
| 250 | $72 | $18.000,00 |
| 500 | $67.5 | $33.750,00 |
EP1K100EFI484-2 Обзор
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be re-programmed by the designer after manufacture. FPGAs sit in the programmable logic hierarchy alongside CPLDs (Complex Programmable Logic Devices) and are widely used as glue logic, prototyping platforms, and production accelerators for DSP, communications, and embedded applications. ACEX-1K is Altera/Intel's first-generation low-cost SRAM-based FPGA family, designed to bridge the gap between small CPLDs and high-density FPGAs such as APEX.
Key features of the EP1K100EFI484-2 include 100K typical gates, 49,152 flip-flops/latches, 4,992 typical logic cells, 49,152 bits of embedded memory (EAB-based), 333 maximum user I/O pins, a 2.5 V core supply (VCCINT) with 3.3 V multi-voltage I/O support, in-system programmability via JTAG, and industrial temperature range operation (-40C to +85C). The 484-BBGA FineLine BGA package provides high signal density for board-constrained designs.
The ACEX-1K architecture is built on a 0.18 umm SRAM process with a 4-input LUT-based logic element and embedded array blocks (EABs) that can be configured as either dual-port RAM, ROM, or synchronous FIFO. Each EAB provides 4,096 bits of memory, and the 12 EABs in the EP1K100E deliver 49,152 bits total. Configuration is volatile and must be reloaded from an external serial or parallel PROM (EPC2, EPC8) on power-up via the built-in JTAG or passive serial interface.
Typical applications include industrial control and factory automation, communications infrastructure (bridges, routers, line cards), test and measurement instrumentation, legacy ASIC replacement, glue logic and bus interface bridging, and low-volume embedded DSP prototyping. The ACEX-1K family is widely deployed in long-lifecycle industrial and telecom systems where stable, mature silicon is preferred over newer process nodes.
When designing with this part, ensure a stable 2.5 V VCCINT and 3.3 V VCCIO supplies with adequate decoupling, and include a configuration PROM on the board because SRAM-based FPGAs lose configuration at power-down. The Quartus II (or MAX+PLUS II) toolchain supports legacy ACEX-1K designs for netlist import, fitting, and timing closure.
This page synthesizes distributor pricing, drop-in same-package alternatives, and design notes compiled from Intel/Altera ACEX-1K datasheets and current distributor listings - data not consolidated in a single manufacturer source.
Аналоги без доработки для EP1K100EFI484-2 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP1K100EFI484-2 (тот же форм-фактор и посадочное место) — отличается по Process Technology, Configuration Method, Package, Speed Grade, Operating Temperature.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP1K100FC484-2
✅ Прямая замена✓ В наличии
$33.4 / шт.
Открыть даташит →EP1K100QI484-2
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
EP1K100FC484-3
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$52.5 / шт.
Открыть даташит →EP1K100FI484-2
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$118 / шт.
Открыть даташит →EP1K100EFI484-2 Максимальные параметры и электрические характеристики
| Family | ACEX-1K |
| Part Number | EP1K100EFI484-2 |
| Manufacturer | Intel (formerly Altera) |
| Typical Gates | 100,000 |
| Logic Elements | 49,152 |
| Logic Cells | 4,992 (typical) |
| Total RAM Bits | 49,152 |
| Number of EABs | 12 |
| Bits per EAB | 4,096 |
| Maximum User I/O | 333 |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 3.3 V |
| Рабочая температура | -40C to +85C (Industrial) |
| Speed Grade | -2 |
| Корпус | 484-BBGA (FineLine BGA) |
| Тип монтажа | Surface Mount |
| Уровень MSL | 3 (168 Hours) |
| Process Technology | 0.18 umm SRAM |
| Configuration Method | JTAG / Passive Serial (volatile SRAM) |
Конфигурация выводов EP1K100EFI484-2
| Контакт A1 | I/O — User I/O bank (varies by pin configuration) |
| Контакт A2 | I/O — User I/O bank (varies by pin configuration) |
| Контакт B1 | GND — Ground |
| Контакт B2 | VCCIO — I/O supply voltage (3.3 V) |
| Контакт C1 | I/O — User I/O pin |
| Контакт C2 | I/O — User I/O pin |
| Контакт D1 | VCCINT — Core supply voltage (2.5 V) |
| Контакт D2 | GND — Ground |
| Контакт E1 | I/O — User I/O pin |
| Контакт E2 | I/O — User I/O pin |
| Контакт F1 | TCK — JTAG Test Clock |
| Контакт F2 | TMS — JTAG Test Mode Select |
| Контакт G1 | TDI — JTAG Test Data In |
| Контакт G2 | TDO — JTAG Test Data Out |
| Контакт H1 | MSEL0 — Configuration mode select 0 |
| Контакт H2 | MSEL1 — Configuration mode select 1 |
| Контакт J1 | nCONFIG — Configuration active-low reset |
| Контакт J2 | nSTATUS — Configuration status active-low |
| Контакт K1 | DCLK — Configuration clock (passive serial) |
| Контакт K2 | DATA0 — Configuration data input (passive serial) |
| Контакт L1 | CONF_DONE — Configuration done active-high |
| Контакт L2 | I/O — User I/O pin |
Типичное применение
EP1K100EFI484-2 подходит для 6 применениеs: Industrial Control and Factory Automation, Telecom Line Interface and Protocol Bridging, Test and Measurement Instrumentation, Legacy ASIC Replacement, Glue Logic and Bus Interface Bridging, Embedded DSP and Signal Processing Prototyping.
Industrial Control and Factory Automation
The EP1K100EFI484-2's 100K gates, 333 user I/O pins, and industrial temperature range (-40C to +85C) make it an ideal programmable logic platform for factory automation PLCs and process controllers. With 49,152 RAM bits distributed across 12 embedded array blocks (EABs), the FPGA can host soft-PLC state machines, encoder counters, and motor-control loops on-chip, reducing external component count. The 484-BBGA package supports the many parallel sensor and actuator buses common in industrial backplanes. JTAG-based in-system programmability allows field firmware updates without replacing hardware.
Рекомендуется
Telecom Line Interface and Protocol Bridging
The EP1K100EFI484-2 is widely deployed in legacy telecom line cards as glue logic between framer devices, TDM buses, and backplane serializers. Its 333 I/O pins accommodate parallel TDM/E1/T1 interfaces while the 12 EABs provide 49,152 bits of on-chip buffering for FIFOs and elastic stores. The 2.5 V core with 3.3 V I/O support interfaces seamlessly with older telecom ASICs. Industrial temperature operation and the long-lifecycle ACEX-1K family make it suitable for carrier-grade equipment where redesign is undesirable.
Рекомендуется
Test and Measurement Instrumentation
In test and measurement platforms, the EP1K100EFI484-2 functions as a reconfigurable stimulus generator, pattern comparator, and timing engine. The 100K gates accommodate complex timing sequencers and DSP-style FIR filters for signal conditioning, while the 49,152-bit EAB memory stores waveform tables and capture buffers. The 484-BBGA package and 333 I/O pins are well-matched to high-channel-count digitizer boards. Designers can iterate stimulus/response patterns via JTAG without respinning hardware, shortening time-to-market.
Рекомендуется
Legacy ASIC Replacement
When production volumes do not justify a custom ASIC or when a legacy ASIC is end-of-life, the EP1K100EFI484-2 offers a pin-compatible programmable replacement in many designs. With 100K gates and 333 I/O, the part emulates full custom ASICs ranging from peripheral interfaces to bus controllers. Quartus II and MAX+PLUS II toolchains support netlist import from legacy ASIC databases, simplifying migration. The ACEX-1K family has been in production since the early 2000s, providing a stable second source.
Рекомендуется
Glue Logic and Bus Interface Bridging
The EP1K100EFI484-2 excels at board-level glue logic, replacing dozens of 74-series TTL/MSI chips with a single programmable device. 100K gates and 333 I/O handle multiple concurrent bus translations - for example, PCI to local bus, ISA to memory-mapped peripherals, or VME to processor buses. The 12 EABs can be configured as dual-port RAM or synchronous FIFOs to bridge asynchronous clock domains. Industrial temperature grade supports outdoor or factory-floor deployment where standard logic would be marginal.
Рекомендуется
Embedded DSP and Signal Processing Prototyping
For prototyping DSP algorithms such as FIR/IIR filters, FFT engines, and channelizers, the EP1K100EFI484-2 provides 100K gates and 12 EABs for distributed arithmetic implementations. The 49,152 RAM bits store coefficient tables and delay lines, while the high I/O count interfaces with parallel ADC/DAC buses used in prototyping test beds. Quartus II includes DSP IP blocks optimized for the ACEX-1K family, accelerating algorithm development before migration to higher-density silicon.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP1K100EFI484-2 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP1K100FC484-2 | EP1K100QI484-2 | EP1K100FC484-3 | EP1K100FI484-2 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 484-BBGA (FineLine BGA) | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Logic Elements | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| Maximum User I/O | 333 | 333 | 333 | 333 | 333 |
| Operating Temperature | -40C to +85C (Industrial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) |
| Speed Grade | -2 | -2 | -2 | -3 (slower) | -2 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V (low-power) | 2.5 V | 2.5 V |
Ключевые отличия
- Largest ACEX-1K member with 100K gates and 333 I/O (против EP1K50FC484-2)
- Industrial temperature grade vs commercial ACEX-1K variants (против EP1K100FC484-2)
- Speed grade -2 for maximum ACEX-1K throughput (против EP1K100FC484-3)
- Embedded Array Blocks (EABs) provide on-chip dual-port RAM (против CPLDs such as EPM7128S)
Заметки по проектированию
The EP1K100EFI484-2 requires a stable 2.5 V VCCINT and a separately regulated 3.3 V VCCIO supply. Each supply rail must be decoupled with at least 0.1 uF ceramic capacitors placed within 5 mm of the BGA supply pins, plus a bulk 47-100 uF tantalum or polymer capacitor on each rail. Estimated: at 100K-gate utilization with 200 MHz internal operation, the core current can reach 200-300 mA - verify with the Quartus II PowerPlay estimator for your specific design.
The 484-BBGA FineLine BGA package demands a multilayer PCB with at least 4 layers and microvia or via-in-pad technology for inner-row signal escape. Estimated: at 1.0 mm BGA pitch, trace width of 0.1 mm (4 mil) and 0.15 mm (6 mil) via drill are typical. Ground and power planes should be solid under the BGA footprint to provide low-impedance return paths for the high I/O count switching simultaneously.
Because the EP1K100EFI484-2 is SRAM-based and volatile, a configuration PROM (EPC2, EPC8, or compatible) must be present on the board for power-up configuration. Missing or mis-sized pull-ups on nCONFIG, nSTATUS, and CONF_DONE will cause configuration failures - all three require 10 kohm pull-ups to VCCIO. JTAG chain conflicts with other devices on the board must be resolved by buffering TCK/TMS signals appropriately. Do not assume multi-voltage I/O is automatic - VCCIO must be tied to the appropriate supply for the connected bus.
Estimated: At 100K-gate utilization with industrial temperature range and 200 MHz operation, the EP1K100EFI484-2 dissipates approximately 0.5-1.5 W. The 484-BBGA package has a typical theta_JA of 15-20 C/W with proper PCB thermal vias, giving a junction-to-ambient rise of 15-30 C. For applications pushing the part to its -40C to +85C industrial limit, recommend a thermal pad array under the BGA connected to the inner ground plane for heat spreading.
Информация о соответствии
RoHS status not stated in verified web data - marked as unknown. AEC-Q100 not applicable for FPGA product family (industrial temp grade 'I' suffix is the relevant qualification marker). Lead-free and halogen-free status not in source data. Conflict-minerals compliance assumed from Intel corporate policy.