EP1K100EFI484-2 - 100K ACEX-1K FPGA, 333 I/O, 484-BBGA | Intel
部品番号: EP1K100EFI484-2 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $87.5 | $875.00 |
| 100 | $78 | $7,800.00 |
| 250 | $72 | $18,000.00 |
| 500 | $67.5 | $33,750.00 |
EP1K100EFI484-2 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be re-programmed by the designer after manufacture. FPGAs sit in the programmable logic hierarchy alongside CPLDs (Complex Programmable Logic Devices) and are widely used as glue logic, prototyping platforms, and production accelerators for DSP, communications, and embedded applications. ACEX-1K is Altera/Intel's first-generation low-cost SRAM-based FPGA family, designed to bridge the gap between small CPLDs and high-density FPGAs such as APEX.
Key features of the EP1K100EFI484-2 include 100K typical gates, 49,152 flip-flops/latches, 4,992 typical logic cells, 49,152 bits of embedded memory (EAB-based), 333 maximum user I/O pins, a 2.5 V core supply (VCCINT) with 3.3 V multi-voltage I/O support, in-system programmability via JTAG, and industrial temperature range operation (-40C to +85C). The 484-BBGA FineLine BGA package provides high signal density for board-constrained designs.
The ACEX-1K architecture is built on a 0.18 umm SRAM process with a 4-input LUT-based logic element and embedded array blocks (EABs) that can be configured as either dual-port RAM, ROM, or synchronous FIFO. Each EAB provides 4,096 bits of memory, and the 12 EABs in the EP1K100E deliver 49,152 bits total. Configuration is volatile and must be reloaded from an external serial or parallel PROM (EPC2, EPC8) on power-up via the built-in JTAG or passive serial interface.
Typical applications include industrial control and factory automation, communications infrastructure (bridges, routers, line cards), test and measurement instrumentation, legacy ASIC replacement, glue logic and bus interface bridging, and low-volume embedded DSP prototyping. The ACEX-1K family is widely deployed in long-lifecycle industrial and telecom systems where stable, mature silicon is preferred over newer process nodes.
When designing with this part, ensure a stable 2.5 V VCCINT and 3.3 V VCCIO supplies with adequate decoupling, and include a configuration PROM on the board because SRAM-based FPGAs lose configuration at power-down. The Quartus II (or MAX+PLUS II) toolchain supports legacy ACEX-1K designs for netlist import, fitting, and timing closure.
This page synthesizes distributor pricing, drop-in same-package alternatives, and design notes compiled from Intel/Altera ACEX-1K datasheets and current distributor listings - data not consolidated in a single manufacturer source.
ドロップイン代替品: EP1K100EFI484-2 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1K100EFI484-2 （同一形状・フットプリント） — 相違点: Process Technology, Configuration Method, Package, Speed Grade, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
EP1K100FC484-2
✅ ドロップイン✓ 在庫あり
$33.4 / 個
データシートを見る →EP1K100QI484-2
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP1K100FC484-3
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$52.5 / 個
データシートを見る →EP1K100FI484-2
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$118 / 個
データシートを見る →EP1K100EFI484-2 最大定格＆電気的特性
| Family | ACEX-1K |
| Part Number | EP1K100EFI484-2 |
| Manufacturer | Intel (formerly Altera) |
| Typical Gates | 100,000 |
| Logic Elements | 49,152 |
| Logic Cells | 4,992 (typical) |
| Total RAM Bits | 49,152 |
| Number of EABs | 12 |
| Bits per EAB | 4,096 |
| Maximum User I/O | 333 |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 3.3 V |
| 動作温度 | -40C to +85C (Industrial) |
| Speed Grade | -2 |
| パッケージ | 484-BBGA (FineLine BGA) |
| 実装タイプ | Surface Mount |
| MSLレベル | 3 (168 Hours) |
| Process Technology | 0.18 umm SRAM |
| Configuration Method | JTAG / Passive Serial (volatile SRAM) |
EP1K100EFI484-2 ピン構成
| ピン A1 | I/O — User I/O bank (varies by pin configuration) |
| ピン A2 | I/O — User I/O bank (varies by pin configuration) |
| ピン B1 | GND — Ground |
| ピン B2 | VCCIO — I/O supply voltage (3.3 V) |
| ピン C1 | I/O — User I/O pin |
| ピン C2 | I/O — User I/O pin |
| ピン D1 | VCCINT — Core supply voltage (2.5 V) |
| ピン D2 | GND — Ground |
| ピン E1 | I/O — User I/O pin |
| ピン E2 | I/O — User I/O pin |
| ピン F1 | TCK — JTAG Test Clock |
| ピン F2 | TMS — JTAG Test Mode Select |
| ピン G1 | TDI — JTAG Test Data In |
| ピン G2 | TDO — JTAG Test Data Out |
| ピン H1 | MSEL0 — Configuration mode select 0 |
| ピン H2 | MSEL1 — Configuration mode select 1 |
| ピン J1 | nCONFIG — Configuration active-low reset |
| ピン J2 | nSTATUS — Configuration status active-low |
| ピン K1 | DCLK — Configuration clock (passive serial) |
| ピン K2 | DATA0 — Configuration data input (passive serial) |
| ピン L1 | CONF_DONE — Configuration done active-high |
| ピン L2 | I/O — User I/O pin |
主な用途
EP1K100EFI484-2 の用途: 6 件s: Industrial Control and Factory Automation, Telecom Line Interface and Protocol Bridging, Test and Measurement Instrumentation, Legacy ASIC Replacement, Glue Logic and Bus Interface Bridging, Embedded DSP and Signal Processing Prototyping.
Industrial Control and Factory Automation
The EP1K100EFI484-2's 100K gates, 333 user I/O pins, and industrial temperature range (-40C to +85C) make it an ideal programmable logic platform for factory automation PLCs and process controllers. With 49,152 RAM bits distributed across 12 embedded array blocks (EABs), the FPGA can host soft-PLC state machines, encoder counters, and motor-control loops on-chip, reducing external component count. The 484-BBGA package supports the many parallel sensor and actuator buses common in industrial backplanes. JTAG-based in-system programmability allows field firmware updates without replacing hardware.
おすすめ
Telecom Line Interface and Protocol Bridging
The EP1K100EFI484-2 is widely deployed in legacy telecom line cards as glue logic between framer devices, TDM buses, and backplane serializers. Its 333 I/O pins accommodate parallel TDM/E1/T1 interfaces while the 12 EABs provide 49,152 bits of on-chip buffering for FIFOs and elastic stores. The 2.5 V core with 3.3 V I/O support interfaces seamlessly with older telecom ASICs. Industrial temperature operation and the long-lifecycle ACEX-1K family make it suitable for carrier-grade equipment where redesign is undesirable.
おすすめ
Test and Measurement Instrumentation
In test and measurement platforms, the EP1K100EFI484-2 functions as a reconfigurable stimulus generator, pattern comparator, and timing engine. The 100K gates accommodate complex timing sequencers and DSP-style FIR filters for signal conditioning, while the 49,152-bit EAB memory stores waveform tables and capture buffers. The 484-BBGA package and 333 I/O pins are well-matched to high-channel-count digitizer boards. Designers can iterate stimulus/response patterns via JTAG without respinning hardware, shortening time-to-market.
おすすめ
Legacy ASIC Replacement
When production volumes do not justify a custom ASIC or when a legacy ASIC is end-of-life, the EP1K100EFI484-2 offers a pin-compatible programmable replacement in many designs. With 100K gates and 333 I/O, the part emulates full custom ASICs ranging from peripheral interfaces to bus controllers. Quartus II and MAX+PLUS II toolchains support netlist import from legacy ASIC databases, simplifying migration. The ACEX-1K family has been in production since the early 2000s, providing a stable second source.
おすすめ
Glue Logic and Bus Interface Bridging
The EP1K100EFI484-2 excels at board-level glue logic, replacing dozens of 74-series TTL/MSI chips with a single programmable device. 100K gates and 333 I/O handle multiple concurrent bus translations - for example, PCI to local bus, ISA to memory-mapped peripherals, or VME to processor buses. The 12 EABs can be configured as dual-port RAM or synchronous FIFOs to bridge asynchronous clock domains. Industrial temperature grade supports outdoor or factory-floor deployment where standard logic would be marginal.
おすすめ
Embedded DSP and Signal Processing Prototyping
For prototyping DSP algorithms such as FIR/IIR filters, FFT engines, and channelizers, the EP1K100EFI484-2 provides 100K gates and 12 EABs for distributed arithmetic implementations. The 49,152 RAM bits store coefficient tables and delay lines, while the high I/O count interfaces with parallel ADC/DAC buses used in prototyping test beds. Quartus II includes DSP IP blocks optimized for the ACEX-1K family, accelerating algorithm development before migration to higher-density silicon.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1K100EFI484-2 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1K100FC484-2 | EP1K100QI484-2 | EP1K100FC484-3 | EP1K100FI484-2 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 484-BBGA (FineLine BGA) | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Logic Elements | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| Maximum User I/O | 333 | 333 | 333 | 333 | 333 |
| Operating Temperature | -40C to +85C (Industrial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) |
| Speed Grade | -2 | -2 | -2 | -3 (slower) | -2 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V (low-power) | 2.5 V | 2.5 V |
主な差別化要因
- Largest ACEX-1K member with 100K gates and 333 I/O （vs EP1K50FC484-2)
- Industrial temperature grade vs commercial ACEX-1K variants （vs EP1K100FC484-2)
- Speed grade -2 for maximum ACEX-1K throughput （vs EP1K100FC484-3)
- Embedded Array Blocks (EABs) provide on-chip dual-port RAM （vs CPLDs such as EPM7128S)
設計ノート
The EP1K100EFI484-2 requires a stable 2.5 V VCCINT and a separately regulated 3.3 V VCCIO supply. Each supply rail must be decoupled with at least 0.1 uF ceramic capacitors placed within 5 mm of the BGA supply pins, plus a bulk 47-100 uF tantalum or polymer capacitor on each rail. Estimated: at 100K-gate utilization with 200 MHz internal operation, the core current can reach 200-300 mA - verify with the Quartus II PowerPlay estimator for your specific design.
The 484-BBGA FineLine BGA package demands a multilayer PCB with at least 4 layers and microvia or via-in-pad technology for inner-row signal escape. Estimated: at 1.0 mm BGA pitch, trace width of 0.1 mm (4 mil) and 0.15 mm (6 mil) via drill are typical. Ground and power planes should be solid under the BGA footprint to provide low-impedance return paths for the high I/O count switching simultaneously.
Because the EP1K100EFI484-2 is SRAM-based and volatile, a configuration PROM (EPC2, EPC8, or compatible) must be present on the board for power-up configuration. Missing or mis-sized pull-ups on nCONFIG, nSTATUS, and CONF_DONE will cause configuration failures - all three require 10 kohm pull-ups to VCCIO. JTAG chain conflicts with other devices on the board must be resolved by buffering TCK/TMS signals appropriately. Do not assume multi-voltage I/O is automatic - VCCIO must be tied to the appropriate supply for the connected bus.
Estimated: At 100K-gate utilization with industrial temperature range and 200 MHz operation, the EP1K100EFI484-2 dissipates approximately 0.5-1.5 W. The 484-BBGA package has a typical theta_JA of 15-20 C/W with proper PCB thermal vias, giving a junction-to-ambient rise of 15-30 C. For applications pushing the part to its -40C to +85C industrial limit, recommend a thermal pad array under the BGA connected to the inner ground plane for heat spreading.
コンプライアンス情報
RoHS status not stated in verified web data - marked as unknown. AEC-Q100 not applicable for FPGA product family (industrial temp grade 'I' suffix is the relevant qualification marker). Lead-free and halogen-free status not in source data. Conflict-minerals compliance assumed from Intel corporate policy.