EP1K100EFI484-2 - 100K ACEX-1K FPGA, 333 I/O, 484-BBGA | Intel
MPN: EP1K100EFI484-2 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $87.5 | $875.00 |
| 100 | $78 | $7,800.00 |
| 250 | $72 | $18,000.00 |
| 500 | $67.5 | $33,750.00 |
Drop-in alternatives for EP1K100EFI484-2 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP1K100FC484-2
β Drop-Inβ In Stock
$33.4 / Unit
View Datasheet βEP1K100QI484-2
β Drop-Inπ Reference alternative (not in catalog)
EP1K100FC484-3
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$52.5 / Unit
View Datasheet βEP1K100FI484-2
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$118 / Unit
View Datasheet βEP1K100EFI484-2 Maximum Ratings & Electrical Characteristics
| Family | ACEX-1K |
| Part Number | EP1K100EFI484-2 |
| Manufacturer | Intel (formerly Altera) |
| Typical Gates | 100,000 |
| Logic Elements | 49,152 |
| Logic Cells | 4,992 (typical) |
| Total RAM Bits | 49,152 |
| Number of EABs | 12 |
| Bits per EAB | 4,096 |
| Maximum User I/O | 333 |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 3.3 V |
| Operating Temperature | -40C to +85C (Industrial) |
| Speed Grade | -2 |
| Package | 484-BBGA (FineLine BGA) |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 Hours) |
| Process Technology | 0.18 umm SRAM |
| Configuration Method | JTAG / Passive Serial (volatile SRAM) |
EP1K100EFI484-2 Pin Configuration
| Pin A1 | I/O β User I/O bank (varies by pin configuration) |
| Pin A2 | I/O β User I/O bank (varies by pin configuration) |
| Pin B1 | GND β Ground |
| Pin B2 | VCCIO β I/O supply voltage (3.3 V) |
| Pin C1 | I/O β User I/O pin |
| Pin C2 | I/O β User I/O pin |
| Pin D1 | VCCINT β Core supply voltage (2.5 V) |
| Pin D2 | GND β Ground |
| Pin E1 | I/O β User I/O pin |
| Pin E2 | I/O β User I/O pin |
| Pin F1 | TCK β JTAG Test Clock |
| Pin F2 | TMS β JTAG Test Mode Select |
| Pin G1 | TDI β JTAG Test Data In |
| Pin G2 | TDO β JTAG Test Data Out |
| Pin H1 | MSEL0 β Configuration mode select 0 |
| Pin H2 | MSEL1 β Configuration mode select 1 |
| Pin J1 | nCONFIG β Configuration active-low reset |
| Pin J2 | nSTATUS β Configuration status active-low |
| Pin K1 | DCLK β Configuration clock (passive serial) |
| Pin K2 | DATA0 β Configuration data input (passive serial) |
| Pin L1 | CONF_DONE β Configuration done active-high |
| Pin L2 | I/O β User I/O pin |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K100EFI484-2 is suitable for 6 applications: Industrial Control and Factory Automation, Telecom Line Interface and Protocol Bridging, Test and Measurement Instrumentation, Legacy ASIC Replacement, Glue Logic and Bus Interface Bridging, Embedded DSP and Signal Processing Prototyping.
Industrial Control and Factory Automation
The EP1K100EFI484-2's 100K gates, 333 user I/O pins, and industrial temperature range (-40C to +85C) make it an ideal programmable logic platform for factory automation PLCs and process controllers. With 49,152 RAM bits distributed across 12 embedded array blocks (EABs), the FPGA can host soft-PLC state machines, encoder counters, and motor-control loops on-chip, reducing external component count. The 484-BBGA package supports the many parallel sensor and actuator buses common in industrial backplanes. JTAG-based in-system programmability allows field firmware updates without replacing hardware.
Recommended
Telecom Line Interface and Protocol Bridging
The EP1K100EFI484-2 is widely deployed in legacy telecom line cards as glue logic between framer devices, TDM buses, and backplane serializers. Its 333 I/O pins accommodate parallel TDM/E1/T1 interfaces while the 12 EABs provide 49,152 bits of on-chip buffering for FIFOs and elastic stores. The 2.5 V core with 3.3 V I/O support interfaces seamlessly with older telecom ASICs. Industrial temperature operation and the long-lifecycle ACEX-1K family make it suitable for carrier-grade equipment where redesign is undesirable.
Recommended
Test and Measurement Instrumentation
In test and measurement platforms, the EP1K100EFI484-2 functions as a reconfigurable stimulus generator, pattern comparator, and timing engine. The 100K gates accommodate complex timing sequencers and DSP-style FIR filters for signal conditioning, while the 49,152-bit EAB memory stores waveform tables and capture buffers. The 484-BBGA package and 333 I/O pins are well-matched to high-channel-count digitizer boards. Designers can iterate stimulus/response patterns via JTAG without respinning hardware, shortening time-to-market.
Recommended
Legacy ASIC Replacement
When production volumes do not justify a custom ASIC or when a legacy ASIC is end-of-life, the EP1K100EFI484-2 offers a pin-compatible programmable replacement in many designs. With 100K gates and 333 I/O, the part emulates full custom ASICs ranging from peripheral interfaces to bus controllers. Quartus II and MAX+PLUS II toolchains support netlist import from legacy ASIC databases, simplifying migration. The ACEX-1K family has been in production since the early 2000s, providing a stable second source.
Recommended
Glue Logic and Bus Interface Bridging
The EP1K100EFI484-2 excels at board-level glue logic, replacing dozens of 74-series TTL/MSI chips with a single programmable device. 100K gates and 333 I/O handle multiple concurrent bus translations - for example, PCI to local bus, ISA to memory-mapped peripherals, or VME to processor buses. The 12 EABs can be configured as dual-port RAM or synchronous FIFOs to bridge asynchronous clock domains. Industrial temperature grade supports outdoor or factory-floor deployment where standard logic would be marginal.
Recommended
Embedded DSP and Signal Processing Prototyping
For prototyping DSP algorithms such as FIR/IIR filters, FFT engines, and channelizers, the EP1K100EFI484-2 provides 100K gates and 12 EABs for distributed arithmetic implementations. The 49,152 RAM bits store coefficient tables and delay lines, while the high I/O count interfaces with parallel ADC/DAC buses used in prototyping test beds. Quartus II includes DSP IP blocks optimized for the ACEX-1K family, accelerating algorithm development before migration to higher-density silicon.
Recommended
Recommended Products Summary
Engineering reference data for EP1K100EFI484-2 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K100FC484-2 | EP1K100QI484-2 | EP1K100FC484-3 | EP1K100FI484-2 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 484-BBGA (FineLine BGA) | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Logic Elements | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| Maximum User I/O | 333 | 333 | 333 | 333 | 333 |
| Operating Temperature | -40C to +85C (Industrial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) |
| Speed Grade | -2 | -2 | -2 | -3 (slower) | -2 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V (low-power) | 2.5 V | 2.5 V |
Key Differentiators
- Largest ACEX-1K member with 100K gates and 333 I/O (vs EP1K50FC484-2)
- Industrial temperature grade vs commercial ACEX-1K variants (vs EP1K100FC484-2)
- Speed grade -2 for maximum ACEX-1K throughput (vs EP1K100FC484-3)
- Embedded Array Blocks (EABs) provide on-chip dual-port RAM (vs CPLDs such as EPM7128S)
Design Notes
The EP1K100EFI484-2 requires a stable 2.5 V VCCINT and a separately regulated 3.3 V VCCIO supply. Each supply rail must be decoupled with at least 0.1 uF ceramic capacitors placed within 5 mm of the BGA supply pins, plus a bulk 47-100 uF tantalum or polymer capacitor on each rail. Estimated: at 100K-gate utilization with 200 MHz internal operation, the core current can reach 200-300 mA - verify with the Quartus II PowerPlay estimator for your specific design.
The 484-BBGA FineLine BGA package demands a multilayer PCB with at least 4 layers and microvia or via-in-pad technology for inner-row signal escape. Estimated: at 1.0 mm BGA pitch, trace width of 0.1 mm (4 mil) and 0.15 mm (6 mil) via drill are typical. Ground and power planes should be solid under the BGA footprint to provide low-impedance return paths for the high I/O count switching simultaneously.
Because the EP1K100EFI484-2 is SRAM-based and volatile, a configuration PROM (EPC2, EPC8, or compatible) must be present on the board for power-up configuration. Missing or mis-sized pull-ups on nCONFIG, nSTATUS, and CONF_DONE will cause configuration failures - all three require 10 kohm pull-ups to VCCIO. JTAG chain conflicts with other devices on the board must be resolved by buffering TCK/TMS signals appropriately. Do not assume multi-voltage I/O is automatic - VCCIO must be tied to the appropriate supply for the connected bus.
Estimated: At 100K-gate utilization with industrial temperature range and 200 MHz operation, the EP1K100EFI484-2 dissipates approximately 0.5-1.5 W. The 484-BBGA package has a typical theta_JA of 15-20 C/W with proper PCB thermal vias, giving a junction-to-ambient rise of 15-30 C. For applications pushing the part to its -40C to +85C industrial limit, recommend a thermal pad array under the BGA connected to the inner ground plane for heat spreading.
Compliance Information
RoHS status not stated in verified web data - marked as unknown. AEC-Q100 not applicable for FPGA product family (industrial temp grade 'I' suffix is the relevant qualification marker). Lead-free and halogen-free status not in source data. Conflict-minerals compliance assumed from Intel corporate policy.
