EP1SGX40DF1020C7N - 41,250-Cell Stratix GX FPGA | Altera/Intel
Артикул: EP1SGX40DF1020C7N ⚠ Последняя закупка| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $425 | $425,00 |
| 10 | $395 | $3.950,00 |
| 100 | $365 | $36.500,00 |
| 500 | $340 | $170.000,00 |
| 1.000 | $315 | $315.000,00 |
EP1SGX40DF1020C7N Обзор
A Field Programmable Gate Array (FPGA) is a programmable logic device that lets engineers implement arbitrary digital logic, memory blocks, DSP pipelines, and high-speed serial interfaces in a single chip. FPGAs sit between fixed-function ASICs and software-programmable processors: unlike ASICs they are reconfigurable after fabrication, and unlike processors they achieve deterministic, parallel hardware performance. The Stratix GX family in particular adds multi-gigabit transceivers and dedicated SERDES blocks, positioning it as a programmable alternative to custom silicon for wired communications and high-performance DSP.
Key features of the EP1SGX40DF1020C7N include 4,697 Configurable Logic Blocks (CLBs), built-in clock management, embedded memory, and DSP blocks. It supports the Quartus II design flow (legacy versions of Quartus Prime are also backward-compatible). The 1020-pin FC-FBGA package provides the high pin density required for 624 user I/Os plus transceiver and global clock pins. According to the Stratix GX Family Data Sheet, the device supports multi-gigabit transceivers operating in the hundreds-of-MHz to multi-Gbps range, making it suitable for protocols such as SPI-4.2, RapidIO, and 10 Gigabit Ethernet PHY interfaces.
Typical applications include telecom line cards, baseband processing, high-speed serial bridging, video processing, and ASIC prototyping. Designers choose this device when they need a balance of logic density, embedded memory/DSP, and high-speed serial I/O without migrating to a fully custom ASIC. Note that the Stratix GX family is mature/last-time-buy; new designs should evaluate Cyclone, Arria, or Stratix V families unless legacy compatibility is required.
When designing with this FPGA, plan the PCB for the 33x33 mm BGA with 1.0 mm pitch: use 0.8 mm via-in-pad or microvia stackups with ENIG or ENEPIG surface finish for reliable BGA assembly, and provide at least 6 signal layers with controlled-impedance routing for the transceiver lanes. Decouple every VCC/VCCINT/VCCIO ball with 0.1 uF plus bulk capacitance per the Stratix GX pin connection guidelines.
Аналоги без доработки для EP1SGX40DF1020C7N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP1SGX40DF1020C7N (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package, Speed Grade, Package Type, Process Technology.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP1S40F1020C7N
✅ Прямая замена✓ В наличии
$926.78 / шт.
Открыть даташит →EP1SGX40DF1020C7ES
✅ Прямая замена✓ В наличии
$1325 / шт.
Открыть даташит →EP1SGX40DF1020C6N
✅ Прямая замена✓ В наличии
$142 / шт.
Открыть даташит →EP1SGX40DF1020C5N
✅ Прямая замена✓ В наличии
$210 / шт.
Открыть даташит →EP1SGX25FF1020C7N
✅ Прямая замена✓ В наличии
$62.5 / шт.
Открыть даташит →EP1SGX40DF1020C7N Максимальные параметры и электрические характеристики
| Family | Stratix GX |
| Logic Cells | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,697 |
| User I/Os | 624 |
| Корпус | 1020-ball FC-FBGA, 33x33 mm, 1.0 mm pitch |
| Тип монтажа | Surface Mount (BGA) |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Logic Family | CMOS |
| Рабочая температура | 0C to +85C (commercial) |
| Тип памяти | SRAM-based configuration |
| Configuration Method | Serial/Parallel via Quartus II |
Руководство по цоколевке EP1SGX40DF1020C7N в корпусе 1020-ball fc-fbga, 33x33 mm, 1.0 mm pitch
Цоколевка для EP1SGX40DF1020C7N (корпус 1020-ball fc-fbga, 33x33 mm, 1.0 mm pitch). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP1SGX40DF1020C7N.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP1SGX40DF1020C7N подходит для 6 применениеs: Telecom Line Card / Backplane Bridge, Baseband DSP / Wireless Base Station, High-Speed Serial Protocol Bridging, ASIC Prototyping and Emulation, Video Processing and Broadcast, Industrial Test and Measurement Equipment.
Telecom Line Card / Backplane Bridge
The EP1SGX40DF1020C7N's 41,250 logic cells plus embedded multi-gigabit transceivers make it a natural fit for telecom line cards that aggregate and de-aggregate high-speed serial links. In a typical ATCA or AdvancedTCA line card, the FPGA bridges SPI-4.2, RapidIO, or 10 Gigabit Ethernet PHY interfaces to the network processor and framer/mapper ASICs. The 624 user I/Os give the designer ample headroom for parallel LVDS or LVCMOS connections to the switch fabric, while the integrated SERDES channels deliver multi-gigabit serial throughput without external PHY chips. Designers should budget transceiver reference-clock jitter and PCB skew to meet the protocol's eye-mask requirements.
Рекомендуется
Baseband DSP / Wireless Base Station
The 4,697 CLBs and DSP blocks of the EP1SGX40DF1020C7N support baseband processing for wireless base stations and repeaters. Upconversion, downconversion, channel filtering, and crest-factor reduction (CFR) algorithms all map efficiently onto the FPGA's parallel DSP fabric, while the integrated transceivers drive CPRI or OBSAI links to the radio unit. Compared with a fixed-function DSP, the Stratix GX FPGA accelerates chip-rate processing and lets the designer add proprietary algorithms without an ASIC redesign.
Рекомендуется
High-Speed Serial Protocol Bridging
The EP1SGX40DF1020C7N is widely used as a bridge between incompatible high-speed serial protocols, for example PCIe to SATA, RapidIO to Ethernet, or Fibre Channel to Serial RapidIO. The integrated multi-gigabit transceivers cover the line rates needed for these protocols, while the FPGA fabric implements the protocol state machines, buffer management, and bridging logic. The 1020-ball FC-FBGA exposes enough high-speed serial pins to run multiple protocols concurrently, with 624 user I/Os for sideband control and status signals.
Рекомендуется
ASIC Prototyping and Emulation
With 41,250 logic cells and Stratix GX transceivers, the EP1SGX40DF1020C7N serves as an ASIC prototyping platform for mid-complexity ASICs in the 200k-400k gate range. Designers map RTL to the FPGA, validate functional and timing behavior at near-ASIC speeds, and use the integrated SERDES for I/O compliance checks. Multi-FPGA boards partition larger ASICs across several EP1SGX40 FPGAs, and the FPGA's Quartus II flow supports time-budget-driven partitioning and pin multiplexing for ASIC-to-FPGA conversion.
Рекомендуется
Video Processing and Broadcast
The EP1SGX40DF1020C7N's logic density and SERDES channels make it a strong fit for broadcast video processing equipment, including SDI/HD-SDI/3G-SDI routers, frame synchronizers, and format converters. The FPGA fabric handles scaling, de-interlacing, color space conversion, and overlay composition, while the transceivers drive serial digital video at 270 Mb/s, 1.485 Gb/s, or 2.97 Gb/s. Multiple SDI streams can be processed concurrently thanks to the 624 available user I/Os.
Рекомендуется
Industrial Test and Measurement Equipment
Engineers building protocol analyzers, logic analyzers, BERT testers, and high-speed oscilloscopes choose the EP1SGX40DF1020C7N to capture, generate, and analyze multi-gigabit serial traffic. The FPGA's transceivers provide physical-layer access at line rates up to several Gbps, and the 41,250 cells implement deep pattern-matching state machines, capture buffers, and trigger logic. The 1020-ball FC-FBGA exposes enough pins to interface directly with high-speed ADCs and DACs, reducing external analog front-end complexity.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP1SGX40DF1020C7N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP1S40F1020C7N | EP1SGX40DF1020C7ES | EP1SGX40DF1020C6N | EP1SGX40DF1020C5N | EP1SGX25FF1020C7N |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA, 33x33 mm | 1020-ball FC-FBGA, 33x33 mm | 1020-ball FC-FBGA, 33x33 mm | 1020-ball FC-FBGA, 33x33 mm | 1020-ball FC-FBGA, 33x33 mm | 1020-ball FC-FBGA, 33x33 mm |
| Brand | Altera (now Intel PSG) | Altera | Altera | Altera | Altera | Altera |
| Family | Stratix GX | Stratix (no transceivers) | Stratix GX | Stratix GX | Stratix GX | Stratix GX |
| Logic Cells | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 25,660 |
| Speed Grade | C7 | C7 | C7 | C6 | C5 | C7 |
| Integrated Transceivers | Yes (Stratix GX SERDES) | No | Yes | Yes | Yes | Yes |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Ключевые отличия
- Mid-high-density Stratix GX tier with 41,250 cells and integrated SERDES (против EP1SGX25FF1020C7N)
- Same 1020-ball FC-FBGA footprint across the Stratix and Stratix GX family (против EP1S40F1020C7N)
- C7 speed grade is the fastest production tier for the EP1SGX40 die (против EP1SGX40DF1020C6N)
Заметки по проектированию
Estimated: at the 33x33 mm FC-FBGA with 1.0 mm ball pitch, plan a PCB stackup with at least 6 signal layers (4 routing, 2 ground planes) to escape 624 user I/Os. Use 0.8 mm via-in-pad microvias with ENIG or ENEPIG surface finish to ensure reliable BGA assembly. Route the SERDES differential pairs as 100 ohm differential with intra-pair skew under 1 ps and length matching per the Stratix GX pin connection guidelines.
Provide a sequenced power tree for VCCINT (1.5 V), VCCIO (1.5/1.8/2.5/3.3 V), VCCA, VCCP, and PLL supplies as specified in the Stratix GX family datasheet. Decouple each supply pin with a 0.1 uF X7R ceramic plus a 10 uF bulk capacitor placed within 100 mil of the BGA ball. Power sequencing must follow the recommended order to avoid latch-up and to ensure clean configuration.
Place reference-clock oscillators and clock-distribution buffers within 250 mil of the dedicated clock input pins to minimize jitter. Keep high-speed serial lanes (transceivers) routed only over continuous ground planes, and avoid routing any signal under the BGA escape vias. For multi-FPGA boards, match SERDES trace lengths within 25 mil across the backplane to maintain link-margin compliance.
Информация о соответствии
Compliance fields not present in the verified web data; refer to the manufacturer datasheet for definitive compliance statements. The EP1SGX40DF1020C7ES suffix typically denotes the lead-free RoHS variant, while the 'N' suffix denotes Pb-free.
