EP1SGX40DF1020C7N - 41,250-Cell Stratix GX FPGA | Altera/Intel
Référence : EP1SGX40DF1020C7N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $425 | $425,00 |
| 10 | $395 | $3 950,00 |
| 100 | $365 | $36 500,00 |
| 500 | $340 | $170 000,00 |
| 1 000 | $315 | $315 000,00 |
EP1SGX40DF1020C7N Présentation
A Field Programmable Gate Array (FPGA) is a programmable logic device that lets engineers implement arbitrary digital logic, memory blocks, DSP pipelines, and high-speed serial interfaces in a single chip. FPGAs sit between fixed-function ASICs and software-programmable processors: unlike ASICs they are reconfigurable after fabrication, and unlike processors they achieve deterministic, parallel hardware performance. The Stratix GX family in particular adds multi-gigabit transceivers and dedicated SERDES blocks, positioning it as a programmable alternative to custom silicon for wired communications and high-performance DSP.
Key features of the EP1SGX40DF1020C7N include 4,697 Configurable Logic Blocks (CLBs), built-in clock management, embedded memory, and DSP blocks. It supports the Quartus II design flow (legacy versions of Quartus Prime are also backward-compatible). The 1020-pin FC-FBGA package provides the high pin density required for 624 user I/Os plus transceiver and global clock pins. According to the Stratix GX Family Data Sheet, the device supports multi-gigabit transceivers operating in the hundreds-of-MHz to multi-Gbps range, making it suitable for protocols such as SPI-4.2, RapidIO, and 10 Gigabit Ethernet PHY interfaces.
Typical applications include telecom line cards, baseband processing, high-speed serial bridging, video processing, and ASIC prototyping. Designers choose this device when they need a balance of logic density, embedded memory/DSP, and high-speed serial I/O without migrating to a fully custom ASIC. Note that the Stratix GX family is mature/last-time-buy; new designs should evaluate Cyclone, Arria, or Stratix V families unless legacy compatibility is required.
When designing with this FPGA, plan the PCB for the 33x33 mm BGA with 1.0 mm pitch: use 0.8 mm via-in-pad or microvia stackups with ENIG or ENEPIG surface finish for reliable BGA assembly, and provide at least 6 signal layers with controlled-impedance routing for the transceiver lanes. Decouple every VCC/VCCINT/VCCIO ball with 0.1 uF plus bulk capacitance per the Stratix GX pin connection guidelines.
Alternatives de remplacement direct pour EP1SGX40DF1020C7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1SGX40DF1020C7N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Speed Grade, Package Type, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1S40F1020C7N
✅ Remplacement direct✓ En stock
$926.78 / unité
Voir la fiche technique →EP1SGX40DF1020C7ES
✅ Remplacement direct✓ En stock
$1325 / unité
Voir la fiche technique →EP1SGX40DF1020C6N
✅ Remplacement direct✓ En stock
$142 / unité
Voir la fiche technique →EP1SGX40DF1020C5N
✅ Remplacement direct✓ En stock
$210 / unité
Voir la fiche technique →EP1SGX25FF1020C7N
✅ Remplacement direct✓ En stock
$62.5 / unité
Voir la fiche technique →EP1SGX40DF1020C7N Valeurs maximales et caractéristiques électriques
| Family | Stratix GX |
| Logic Cells | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,697 |
| User I/Os | 624 |
| Boîtier | 1020-ball FC-FBGA, 33x33 mm, 1.0 mm pitch |
| Type de montage | Surface Mount (BGA) |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Logic Family | CMOS |
| Température de fonctionnement | 0C to +85C (commercial) |
| Type de mémoire | SRAM-based configuration |
| Configuration Method | Serial/Parallel via Quartus II |
Guide de configuration des broches du EP1SGX40DF1020C7N 1020-ball fc-fbga, 33x33 mm, 1.0 mm pitch
Configuration des broches du EP1SGX40DF1020C7N (boîtier 1020-ball fc-fbga, 33x33 mm, 1.0 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1SGX40DF1020C7N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1SGX40DF1020C7N convient pour 6 applications: Telecom Line Card / Backplane Bridge, Baseband DSP / Wireless Base Station, High-Speed Serial Protocol Bridging, ASIC Prototyping and Emulation, Video Processing and Broadcast, Industrial Test and Measurement Equipment.
Telecom Line Card / Backplane Bridge
The EP1SGX40DF1020C7N's 41,250 logic cells plus embedded multi-gigabit transceivers make it a natural fit for telecom line cards that aggregate and de-aggregate high-speed serial links. In a typical ATCA or AdvancedTCA line card, the FPGA bridges SPI-4.2, RapidIO, or 10 Gigabit Ethernet PHY interfaces to the network processor and framer/mapper ASICs. The 624 user I/Os give the designer ample headroom for parallel LVDS or LVCMOS connections to the switch fabric, while the integrated SERDES channels deliver multi-gigabit serial throughput without external PHY chips. Designers should budget transceiver reference-clock jitter and PCB skew to meet the protocol's eye-mask requirements.
Recommandé
Baseband DSP / Wireless Base Station
The 4,697 CLBs and DSP blocks of the EP1SGX40DF1020C7N support baseband processing for wireless base stations and repeaters. Upconversion, downconversion, channel filtering, and crest-factor reduction (CFR) algorithms all map efficiently onto the FPGA's parallel DSP fabric, while the integrated transceivers drive CPRI or OBSAI links to the radio unit. Compared with a fixed-function DSP, the Stratix GX FPGA accelerates chip-rate processing and lets the designer add proprietary algorithms without an ASIC redesign.
Recommandé
High-Speed Serial Protocol Bridging
The EP1SGX40DF1020C7N is widely used as a bridge between incompatible high-speed serial protocols, for example PCIe to SATA, RapidIO to Ethernet, or Fibre Channel to Serial RapidIO. The integrated multi-gigabit transceivers cover the line rates needed for these protocols, while the FPGA fabric implements the protocol state machines, buffer management, and bridging logic. The 1020-ball FC-FBGA exposes enough high-speed serial pins to run multiple protocols concurrently, with 624 user I/Os for sideband control and status signals.
Recommandé
ASIC Prototyping and Emulation
With 41,250 logic cells and Stratix GX transceivers, the EP1SGX40DF1020C7N serves as an ASIC prototyping platform for mid-complexity ASICs in the 200k-400k gate range. Designers map RTL to the FPGA, validate functional and timing behavior at near-ASIC speeds, and use the integrated SERDES for I/O compliance checks. Multi-FPGA boards partition larger ASICs across several EP1SGX40 FPGAs, and the FPGA's Quartus II flow supports time-budget-driven partitioning and pin multiplexing for ASIC-to-FPGA conversion.
Recommandé
Video Processing and Broadcast
The EP1SGX40DF1020C7N's logic density and SERDES channels make it a strong fit for broadcast video processing equipment, including SDI/HD-SDI/3G-SDI routers, frame synchronizers, and format converters. The FPGA fabric handles scaling, de-interlacing, color space conversion, and overlay composition, while the transceivers drive serial digital video at 270 Mb/s, 1.485 Gb/s, or 2.97 Gb/s. Multiple SDI streams can be processed concurrently thanks to the 624 available user I/Os.
Recommandé
Industrial Test and Measurement Equipment
Engineers building protocol analyzers, logic analyzers, BERT testers, and high-speed oscilloscopes choose the EP1SGX40DF1020C7N to capture, generate, and analyze multi-gigabit serial traffic. The FPGA's transceivers provide physical-layer access at line rates up to several Gbps, and the 41,250 cells implement deep pattern-matching state machines, capture buffers, and trigger logic. The 1020-ball FC-FBGA exposes enough pins to interface directly with high-speed ADCs and DACs, reducing external analog front-end complexity.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1SGX40DF1020C7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1S40F1020C7N | EP1SGX40DF1020C7ES | EP1SGX40DF1020C6N | EP1SGX40DF1020C5N | EP1SGX25FF1020C7N |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA, 33x33 mm | 1020-ball FC-FBGA, 33x33 mm | 1020-ball FC-FBGA, 33x33 mm | 1020-ball FC-FBGA, 33x33 mm | 1020-ball FC-FBGA, 33x33 mm | 1020-ball FC-FBGA, 33x33 mm |
| Brand | Altera (now Intel PSG) | Altera | Altera | Altera | Altera | Altera |
| Family | Stratix GX | Stratix (no transceivers) | Stratix GX | Stratix GX | Stratix GX | Stratix GX |
| Logic Cells | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 25,660 |
| Speed Grade | C7 | C7 | C7 | C6 | C5 | C7 |
| Integrated Transceivers | Yes (Stratix GX SERDES) | No | Yes | Yes | Yes | Yes |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Principaux différenciateurs
- Mid-high-density Stratix GX tier with 41,250 cells and integrated SERDES (vs EP1SGX25FF1020C7N)
- Same 1020-ball FC-FBGA footprint across the Stratix and Stratix GX family (vs EP1S40F1020C7N)
- C7 speed grade is the fastest production tier for the EP1SGX40 die (vs EP1SGX40DF1020C6N)
Notes de conception
Estimated: at the 33x33 mm FC-FBGA with 1.0 mm ball pitch, plan a PCB stackup with at least 6 signal layers (4 routing, 2 ground planes) to escape 624 user I/Os. Use 0.8 mm via-in-pad microvias with ENIG or ENEPIG surface finish to ensure reliable BGA assembly. Route the SERDES differential pairs as 100 ohm differential with intra-pair skew under 1 ps and length matching per the Stratix GX pin connection guidelines.
Provide a sequenced power tree for VCCINT (1.5 V), VCCIO (1.5/1.8/2.5/3.3 V), VCCA, VCCP, and PLL supplies as specified in the Stratix GX family datasheet. Decouple each supply pin with a 0.1 uF X7R ceramic plus a 10 uF bulk capacitor placed within 100 mil of the BGA ball. Power sequencing must follow the recommended order to avoid latch-up and to ensure clean configuration.
Place reference-clock oscillators and clock-distribution buffers within 250 mil of the dedicated clock input pins to minimize jitter. Keep high-speed serial lanes (transceivers) routed only over continuous ground planes, and avoid routing any signal under the BGA escape vias. For multi-FPGA boards, match SERDES trace lengths within 25 mil across the backplane to maintain link-margin compliance.
Informations de conformité
Compliance fields not present in the verified web data; refer to the manufacturer datasheet for definitive compliance statements. The EP1SGX40DF1020C7ES suffix typically denotes the lead-free RoHS variant, while the 'N' suffix denotes Pb-free.
