EP1SGX40DF1020C7N - 41,250-Cell Stratix GX FPGA | Altera/Intel
MPN: EP1SGX40DF1020C7N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $365 | $36,500.00 |
| 500 | $340 | $170,000.00 |
| 1,000 | $315 | $315,000.00 |
Drop-in alternatives for EP1SGX40DF1020C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S40F1020C7N
✅ Drop-In✓ In Stock
$926.78 / Unit
View Datasheet →EP1SGX40DF1020C7ES
✅ Drop-In✓ In Stock
$1325 / Unit
View Datasheet →EP1SGX40DF1020C6N
✅ Drop-In✓ In Stock
$142 / Unit
View Datasheet →EP1SGX40DF1020C5N
✅ Drop-In✓ In Stock
$210 / Unit
View Datasheet →EP1SGX25FF1020C7N
✅ Drop-In✓ In Stock
$62.5 / Unit
View Datasheet →EP1SGX40DF1020C7N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Cells | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,697 |
| User I/Os | 624 |
| Package | 1020-ball FC-FBGA, 33x33 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount (BGA) |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Logic Family | CMOS |
| Operating Temperature | 0C to +85C (commercial) |
| Memory Type | SRAM-based configuration |
| Configuration Method | Serial/Parallel via Quartus II |
EP1SGX40DF1020C7N 1020-ball fc-fbga, 33x33 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1SGX40DF1020C7N (1020-ball fc-fbga, 33x33 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40DF1020C7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40DF1020C7N is suitable for 6 applications: Telecom Line Card / Backplane Bridge, Baseband DSP / Wireless Base Station, High-Speed Serial Protocol Bridging, ASIC Prototyping and Emulation, Video Processing and Broadcast, Industrial Test and Measurement Equipment.
Telecom Line Card / Backplane Bridge
The EP1SGX40DF1020C7N's 41,250 logic cells plus embedded multi-gigabit transceivers make it a natural fit for telecom line cards that aggregate and de-aggregate high-speed serial links. In a typical ATCA or AdvancedTCA line card, the FPGA bridges SPI-4.2, RapidIO, or 10 Gigabit Ethernet PHY interfaces to the network processor and framer/mapper ASICs. The 624 user I/Os give the designer ample headroom for parallel LVDS or LVCMOS connections to the switch fabric, while the integrated SERDES channels deliver multi-gigabit serial throughput without external PHY chips. Designers should budget transceiver reference-clock jitter and PCB skew to meet the protocol's eye-mask requirements.
Recommended
Baseband DSP / Wireless Base Station
The 4,697 CLBs and DSP blocks of the EP1SGX40DF1020C7N support baseband processing for wireless base stations and repeaters. Upconversion, downconversion, channel filtering, and crest-factor reduction (CFR) algorithms all map efficiently onto the FPGA's parallel DSP fabric, while the integrated transceivers drive CPRI or OBSAI links to the radio unit. Compared with a fixed-function DSP, the Stratix GX FPGA accelerates chip-rate processing and lets the designer add proprietary algorithms without an ASIC redesign.
Recommended
High-Speed Serial Protocol Bridging
The EP1SGX40DF1020C7N is widely used as a bridge between incompatible high-speed serial protocols, for example PCIe to SATA, RapidIO to Ethernet, or Fibre Channel to Serial RapidIO. The integrated multi-gigabit transceivers cover the line rates needed for these protocols, while the FPGA fabric implements the protocol state machines, buffer management, and bridging logic. The 1020-ball FC-FBGA exposes enough high-speed serial pins to run multiple protocols concurrently, with 624 user I/Os for sideband control and status signals.
Recommended
ASIC Prototyping and Emulation
With 41,250 logic cells and Stratix GX transceivers, the EP1SGX40DF1020C7N serves as an ASIC prototyping platform for mid-complexity ASICs in the 200k-400k gate range. Designers map RTL to the FPGA, validate functional and timing behavior at near-ASIC speeds, and use the integrated SERDES for I/O compliance checks. Multi-FPGA boards partition larger ASICs across several EP1SGX40 FPGAs, and the FPGA's Quartus II flow supports time-budget-driven partitioning and pin multiplexing for ASIC-to-FPGA conversion.
Recommended
Video Processing and Broadcast
The EP1SGX40DF1020C7N's logic density and SERDES channels make it a strong fit for broadcast video processing equipment, including SDI/HD-SDI/3G-SDI routers, frame synchronizers, and format converters. The FPGA fabric handles scaling, de-interlacing, color space conversion, and overlay composition, while the transceivers drive serial digital video at 270 Mb/s, 1.485 Gb/s, or 2.97 Gb/s. Multiple SDI streams can be processed concurrently thanks to the 624 available user I/Os.
Recommended
Industrial Test and Measurement Equipment
Engineers building protocol analyzers, logic analyzers, BERT testers, and high-speed oscilloscopes choose the EP1SGX40DF1020C7N to capture, generate, and analyze multi-gigabit serial traffic. The FPGA's transceivers provide physical-layer access at line rates up to several Gbps, and the 41,250 cells implement deep pattern-matching state machines, capture buffers, and trigger logic. The 1020-ball FC-FBGA exposes enough pins to interface directly with high-speed ADCs and DACs, reducing external analog front-end complexity.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40DF1020C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S40F1020C7N | EP1SGX40DF1020C7ES | EP1SGX40DF1020C6N | EP1SGX40DF1020C5N | EP1SGX25FF1020C7N |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA, 33x33 mm | 1020-ball FC-FBGA, 33x33 mm | 1020-ball FC-FBGA, 33x33 mm | 1020-ball FC-FBGA, 33x33 mm | 1020-ball FC-FBGA, 33x33 mm | 1020-ball FC-FBGA, 33x33 mm |
| Brand | Altera (now Intel PSG) | Altera | Altera | Altera | Altera | Altera |
| Family | Stratix GX | Stratix (no transceivers) | Stratix GX | Stratix GX | Stratix GX | Stratix GX |
| Logic Cells | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 25,660 |
| User I/Os | 624 | 624 | 624 | 624 | 624 | [DATA_NEEDED] |
| Speed Grade | C7 | C7 | C7 | C6 | C5 | C7 |
| Integrated Transceivers | Yes (Stratix GX SERDES) | No | Yes | Yes | Yes | Yes |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Mid-high-density Stratix GX tier with 41,250 cells and integrated SERDES (vs EP1SGX25FF1020C7N)
- Same 1020-ball FC-FBGA footprint across the Stratix and Stratix GX family (vs EP1S40F1020C7N)
- C7 speed grade is the fastest production tier for the EP1SGX40 die (vs EP1SGX40DF1020C6N)
Design Notes
Estimated: at the 33x33 mm FC-FBGA with 1.0 mm ball pitch, plan a PCB stackup with at least 6 signal layers (4 routing, 2 ground planes) to escape 624 user I/Os. Use 0.8 mm via-in-pad microvias with ENIG or ENEPIG surface finish to ensure reliable BGA assembly. Route the SERDES differential pairs as 100 ohm differential with intra-pair skew under 1 ps and length matching per the Stratix GX pin connection guidelines.
Provide a sequenced power tree for VCCINT (1.5 V), VCCIO (1.5/1.8/2.5/3.3 V), VCCA, VCCP, and PLL supplies as specified in the Stratix GX family datasheet. Decouple each supply pin with a 0.1 uF X7R ceramic plus a 10 uF bulk capacitor placed within 100 mil of the BGA ball. Power sequencing must follow the recommended order to avoid latch-up and to ensure clean configuration.
Place reference-clock oscillators and clock-distribution buffers within 250 mil of the dedicated clock input pins to minimize jitter. Keep high-speed serial lanes (transceivers) routed only over continuous ground planes, and avoid routing any signal under the BGA escape vias. For multi-FPGA boards, match SERDES trace lengths within 25 mil across the backplane to maintain link-margin compliance.
Compliance Information
Compliance fields not present in the verified web data; refer to the manufacturer datasheet for definitive compliance statements. The EP1SGX40DF1020C7ES suffix typically denotes the lead-free RoHS variant, while the 'N' suffix denotes Pb-free.
