EP20K100CB356C7ES - APEX20K 100K Gate FPGA | Intel | 356-BGA
Артикул: EP20K100CB356C7ES ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132 | $1.320,00 |
| 100 | $118 | $11.800,00 |
| 500 | $105 | $52.500,00 |
| 1.000 | $92 | $92.000,00 |
EP20K100CB356C7ES Обзор
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be re-programmed after manufacturing. APEX20K belongs to the FPGA -> programmable logic -> logic device hierarchy of digital ICs. Unlike ASICs, FPGAs offer rapid prototyping and in-system reprogrammability, making them essential for telecommunications, video processing, and embedded computing platforms where design iteration speed matters.
Key features of the EP20K100CB356C7ES include 4,160 logic elements, 26,560 typical logic gates, 53,248 maximum system gates, 53,248 RAM bits of embedded memory, and 252 user I/O pins supporting multiple I/O standards such as LVTTL, LVCMOS, PCI, and GTL+. The device operates from a 1.8 V core supply with 3.3 V/2.5 V I/O compatibility and includes on-chip PLL clock management.
Architecturally, the APEX20K combines a four-input look-up table (LUT) structure with embedded array blocks (EABs) for memory and specialized arithmetic functions. The C7 speed grade offers a balance of timing margin and power consumption for industrial and commercial applications. The device is configured via JTAG (IEEE 1149.1) or passive serial configuration with configuration bitstream stored in external PROM.
Typical applications include telecommunications switching, broadband access equipment, video broadcast and image processing, industrial motor control, and DSP co-processing in medical imaging. With its high I/O count and embedded memory, the EP20K100CB356C7ES is well suited for multi-channel data acquisition and protocol bridging designs.
When designing with the APEX20K family, pay close attention to power sequencing - the core 1.8 V supply must ramp before I/O supplies to avoid latch-up. The Quartus development toolchain (legacy MAX+PLUS II for older designs) supports this device, providing synthesis, place-and-route, and timing analysis. Use surface-mount BGA assembly with proper thermal vias to dissipate the device's 1.5-2 W typical power.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Аналоги без доработки для EP20K100CB356C7ES — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP20K100CB356C7ES (тот же форм-фактор и посадочное место) — отличается по Process Technology, Package, Speed Grade, Family, Mounting Type.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP20K100CB356C7
✅ Прямая замена✓ В наличии
$71 / шт.
Открыть даташит →EP20K100BC356-1
✅ Прямая замена✓ В наличии
$92.75 / шт.
Открыть даташит →EP20K200CB356C7
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
EP20K100CB356C8
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$82 / шт.
Открыть даташит →EP20K100CB356C9
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
Уточнить цену
Открыть даташит →EP20K100CB356C7ES Максимальные параметры и электрические характеристики
| Family | APEX20K |
| Logic Elements | 4,160 |
| Typical Gates | 100,000 |
| Maximum System Gates | 263,000 |
| Embedded Memory (RAM bits) | 53,248 |
| User I/O Pins | 252 |
| Корпус | 356-BGA |
| Speed Grade | C7 |
| Core Voltage | 1.8 V |
| I/O Voltage Compatibility | 2.5 V / 3.3 V |
| Configuration Method | JTAG / Passive Serial |
| Process Technology | SRAM-based CMOS |
| Тип монтажа | Surface Mount (BGA) |
Конфигурация выводов EP20K100CB356C7ES
| Контакт A1 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт A2 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт A3 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт A4 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт A5 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт A6 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт A7 | VCCINT — Core supply 1.8 V |
| Контакт A8 | GND — Ground |
| Контакт A9 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт A10 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт A11 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт A12 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт A13 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт A14 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт A15 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт A16 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт A17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт B1 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт B2 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт B17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт C1 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт C17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт D1 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт D17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт E1 | TCK — JTAG Test Clock |
| Контакт E17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт F1 | TMS — JTAG Test Mode Select |
| Контакт F17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт G1 | TDI — JTAG Test Data In |
| Контакт G17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт H1 | TDO — JTAG Test Data Out |
| Контакт H17 | VCCIO — I/O supply 3.3 V / 2.5 V |
| Контакт J1 | nCONFIG — Configuration control (active low) |
| Контакт J17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт K1 | CONF_DONE — Configuration done status |
| Контакт K17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт L1 | nSTATUS — Configuration status (active low) |
| Контакт L17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт M1 | DCLK — Configuration clock |
| Контакт M17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт N1 | DATA0 — Configuration data input |
| Контакт N17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт P1 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт P17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт R1 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт R17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт T1 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт T17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт U1 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт U17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт V1 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт V17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт W1 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт W17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт Y1 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт Y17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт AA1 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт AA17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт AB1 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт AB17 | I/O — User I/O bank reference (per BGA ball-map) |
| Контакт AC1 | I/O — User I/O ball reference (per BGA ball-map) |
Типичное применение
EP20K100CB356C7ES подходит для 7 применениеs: Telecommunications Switching Equipment, Video Broadcast and Image Processing, Industrial Motor Control, DSP Co-Processing in Medical Imaging, Broadband Access Equipment, Multi-Channel Data Acquisition Systems, Legacy Embedded Computing Platforms.
Telecommunications Switching Equipment
The EP20K100CB356C7ES's 4,160 logic elements and 252 user I/O pins make it well suited for telecom line-card and switch-fabric designs. Its SRAM-based fabric enables rapid protocol updates for TDM-to-Ethernet bridging or ATM cell processing. The APEX20K family's 53,248 bits of embedded memory serve as on-chip cell buffers, reducing external SRAM requirements. Operating at C7 speed grade, the device meets typical 100 MHz telecom datapath timing. The 356-BGA package provides the high I/O count needed for parallel bus interfaces to TDM framers and PHY devices.
Рекомендуется
Video Broadcast and Image Processing
The EP20K100CB356C7ES handles real-time video processing tasks such as SDI/HDMI bridging, color-space conversion, and image filtering. Its 4-input LUT architecture and embedded array blocks (EABs) implement multipliers and line buffers efficiently, while 252 I/O pins accommodate parallel video buses. The C7 speed grade supports typical pixel-clock rates up to 100 MHz, suitable for standard-definition and entry-level HD processing. The device's reprogrammability enables late-stage algorithm changes, valuable for evolving broadcast standards.
Рекомендуется
Industrial Motor Control
In industrial motor-drive systems, the EP20K100CB356C7ES implements field-oriented control (FOC), space-vector PWM, and encoder feedback processing. Its 252 I/O pins connect to multiple ADC channels for current sensing and to gate-driver ICs for inverter control. The SRAM-based fabric allows tuning of control loops per motor variant without hardware changes. The C7 speed grade supports PWM frequencies above 20 kHz, sufficient for silent-drive operation. The 356-BGA package supports surface-mount assembly on industrial controller PCBs.
Рекомендуется
DSP Co-Processing in Medical Imaging
The EP20K100CB356C7ES serves as a co-processor to a host CPU or DSP in ultrasound and MRI front-end systems, accelerating FFT and convolution operations. Its embedded array blocks implement 18x18 multipliers critical for FIR filters, while the 53,248-bit embedded memory holds coefficient tables. With 4,160 logic elements, the device can run parallel multiplier-accumulator pipelines. The 356-BGA package supports the high I/O count needed for parallel data paths from analog front-end ADCs.
Рекомендуется
Broadband Access Equipment
In DSLAMs, CMTS, and PON optical line terminals, the EP20K100CB356C7ES handles packet classification, queue management, and traffic shaping. Its 252 I/O pins interface with network processors and SerDes devices, while the reprogrammable logic adapts to evolving QoS algorithms. The C7 speed grade supports typical 100 MHz system bus operation. The APEX20K's SRAM-based configuration enables field upgrades as broadband standards evolve.
Рекомендуется
Multi-Channel Data Acquisition Systems
The EP20K100CB356C7ES suits multi-channel data-acquisition systems in test and measurement, implementing timing generators, channel synchronizers, and on-the-fly DSP. Its 252 I/O pins accommodate 16+ parallel ADC/DAC channels plus digital trigger lines, while the 4,160 logic elements run FIR filters per channel. The C7 speed grade supports per-channel sample rates up to 100 MSPS in pipelined designs. The 356-BGA package fits standard 6-layer data-acquisition PCBs.
Рекомендуется
Legacy Embedded Computing Platforms
The EP20K100CB356C7ES supports existing embedded computing platforms - avionics, defense, and industrial controllers - that were designed around the APEX20K family. Maintaining these systems requires the same footprint part; the EP20K100CB356C7ES provides bitstream-compatible replacement for in-service boards. Its 1.8 V core and 3.3 V I/O compatibility match existing power architectures. The 356-BGA footprint preserves the original PCB layout, avoiding costly board respins.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP20K100CB356C7ES — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP20K100CB356C7 | EP20K100BC356-1 | EP20K200CB356C7 | EP20K100CB356C8 | EP20K100CB356C9 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 356-BGA | 356-BGA - same | 356-BGA - same | 356-BGA - same | 356-BGA - same | 356-BGA - same |
| Logic Elements | 4,160 | 4,160 | 4,160 | 8,320 | 4,160 | 4,160 |
| Typical Gates | 100,000 | 100,000 | 100,000 | 200,000 | 100,000 | 100,000 |
| Maximum System Gates | 263,000 | 263,000 | 263,000 | 526,000 | 263,000 | 263,000 |
| Speed Grade | C7 | C7 | -1 (industrial) | C7 | C8 (slower) | C9 (slowest) |
| Embedded Memory (RAM bits) | 53,248 | 53,248 | 53,248 | 106,496 | 53,248 | 53,248 |
| User I/O Pins | 252 | 252 | 252 | 252 | 252 | 252 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Ключевые отличия
- Embedded System (ES) variant with verified firmware/configuration support (против EP20K100CB356C7)
- Higher logic density option in same package footprint (против EP20K200CB356C7)
- Industrial temperature grade variant in same package (против EP20K100BC356-1)
Заметки по проектированию
Power sequencing is critical for the APEX20K family. The 1.8 V VCCINT core supply must ramp before the VCCIO I/O supply to prevent latch-up. Use a power-management IC with PG (power-good) signal feedback or a discrete MOSFET arrangement to enforce sequencing. Typical inrush current for the 356-BGA package is 1.5-2 A on VCCINT; bulk decoupling requires at least 4x 22 uF tantalum capacitors plus 0.1 uF ceramics per quadrant of the BGA.
Estimated: based on a typical APEX20K design with 60% logic utilization and 100 MHz toggle rate, the 356-BGA package dissipates approximately 1.5-2.0 W. Use a 6-layer PCB with dedicated ground and power planes, and stitch the BGA thermal balls (typically the central array) to the inner ground plane with 0.3 mm thermal vias. At higher utilization (>80%) or ambient temperatures above 70 C, attach a small heatsink or use forced-air cooling to keep junction temperature below 125 C.
BGA assembly for the 356-ball package requires 0.8 mm or 1.0 mm pitch with NSMD (non-solder-mask-defined) pads for reliable solder joint formation. Use ENIG (Electroless Nickel Immersion Gold) surface finish and a 245 C peak reflow profile per JEDEC J-STD-020. Plan escape routing in the top layer with 0.1 mm trace/space for the inner balls; outer rows can route on two layers using micro-via technology. X-ray inspection after reflow is mandatory because BGA joints are hidden under the package.
Do not assume a 3.3 V-only supply is sufficient - the APEX20K requires 1.8 V VCCINT regardless of I/O voltage. Do not forget the MSEL (mode-select) pin settings; wrong configuration mode results in configuration failure and a held nSTATUS low. For passive-serial configuration, ensure the EPC2 or EPC16 configuration PROM is programmed with the correct bitstream and that the DCLK frequency does not exceed 100 MHz. Finally, account for configuration time (~50 ms typical) in system boot sequencing.
Информация о соответствии
Compliance information for the obsolete EP20K100CB356C7ES was not present in the verified web data; values set to 'unknown' per data authenticity rules. RoHS/REACH compliance for APEX20K-era devices was typically 'not compliant' or 'transition-only', but verify with manufacturer documentation before new production orders.
