EP20K100CF144C7 - APEX-20K FPGA 100K LE 144-LQFP | Intel
Артикул: EP20K100CF144C7 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $48 | $48,00 |
| 10 | $42.5 | $425,00 |
| 100 | $36.8 | $3.680,00 |
| 500 | $32.1 | $16.050,00 |
| 1.000 | $28.4 | $28.400,00 |
EP20K100CF144C7 Обзор
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows engineers to implement custom digital circuits after PCB fabrication. FPGAs sit within the programmable logic hierarchy: FPGA -> programmable logic -> digital IC -> semiconductor. Unlike fixed-function ASICs, FPGAs are reconfigured in-circuit using HDL design flows, making them ideal for prototyping, low-volume production, and designs requiring late-stage hardware changes. The APEX-20K family further extends this with embedded memory blocks and a MultiCore architecture supporting fine-grain logic, embedded array blocks, and high-speed I/O.
Key features of the EP20K100CF144C7 include 4,160 logic elements organized as Logic Array Blocks (LABs), 53,248 RAM bits distributed across embedded system blocks, 93 user I/O pins supporting LVTTL, LVCMOS, PCI, SSTL, and GTL+ I/O standards, four phase-locked loops (PLLs) for clock management, and dual-purpose configuration pins. The 144-pin LQFP package measures 22x22 mm with a 0.5 mm lead pitch and is suitable for surface-mount assembly on standard FR4 PCB substrates.
Architecture-wise, the APEX-20K device combines a fine-grain logic fabric for register-intensive functions with embedded array blocks (EABs) optimized for memory and arithmetic. The device supports true dual-port RAM, FIFO, and CAM implementations via dedicated memory structures. I/O banks are powered by VCCIO rails that can be set independently from the core VCCINT supply, allowing mixed-voltage interfacing.
Typical applications for this FPGA include telecommunications line cards, industrial control logic, test and measurement front-ends, low-density glue logic replacement, and ASIC prototyping. Designers select the EP20K100CF144C7 when a low-to-moderate logic density device with embedded memory and a pin-compatible surface-mount package is required for commercial-temperature deployments. Legacy designs originally specified around the APEX-20K family continue to source this part for long-lifecycle field support.
When designing with this FPGA, allocate sufficient PCB area for decoupling capacitors near every VCCINT and VCCIO pin, and follow Intel/Altera configuration guidelines for the MSEL pin strapping. The 144-pin LQFP package has moderate thermal performance; thermal management is rarely required at typical APEX-20K operating frequencies but should be verified with junction-temperature calculation in high-utilization designs.
This page synthesizes distributor pricing, exact-package drop-in alternatives from the APEX-20K family, and practical configuration/PCB guidance not consolidated on a single manufacturer datasheet.
Аналоги без доработки для EP20K100CF144C7 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP20K100CF144C7 (тот же форм-фактор и посадочное место) — отличается по Speed Grade, Process Technology, Package, Operating Temperature, Family.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP20K100CF144C8
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$36 / шт.
Открыть даташит →EP20K100CF144C9
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$49 / шт.
Открыть даташит →EP20K100CF144I7
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
EP20K100CB356C7
✅ Прямая замена✓ В наличии
$71 / шт.
Открыть даташит →EP20K100CB356C8
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$82 / шт.
Открыть даташит →EP20K100CF144C7 Максимальные параметры и электрические характеристики
| Series | APEX-20K |
| Family | APEX-20K Field Programmable Gate Array |
| Logic Elements / Cells | 4,160 |
| Total RAM Bits | 53,248 |
| Number of Logic Elements | 4,160 |
| Number of I/O | 93 |
| Number of Gates | 100,000 system gates |
| Voltage - Supply | 1.8 V core, 3.3 V I/O (typical APEX-20K rails) |
| Тип монтажа | Surface Mount |
| Корпус / Типоразмер | 144-LQFP |
| Package Dimensions | 22 x 22 mm, 0.5 mm pitch |
| Рабочая температура | 0C to +85C (commercial) |
| Process Technology | 0.18 micron CMOS SRAM |
| Configuration Mode | Passive Serial, JTAG (IEEE 1149.1) |
| PLLs | 4 (per APEX-20K family architecture) |
| Speed Grade | C7 (commercial) |
Конфигурация выводов EP20K100CF144C7
| Контакт 1 | I/O — User I/O (bank 1) |
| Контакт 2 | I/O — User I/O (bank 1) |
| Контакт 3 | I/O — User I/O (bank 1) |
| Контакт 4 | I/O — User I/O (bank 1) |
| Контакт 5 | I/O — User I/O (bank 1) |
| Контакт 6 | VCCIO1 — I/O bank 1 supply |
| Контакт 7 | I/O — User I/O (bank 1) |
| Контакт 8 | I/O — User I/O (bank 1) |
| Контакт 9 | I/O — User I/O (bank 1) |
| Контакт 10 | GND — Ground |
| Контакт 11 | I/O — User I/O (bank 1) |
| Контакт 12 | I/O — User I/O (bank 1) |
| Контакт 13 | I/O — User I/O (bank 2) |
| Контакт 14 | VCCIO2 — I/O bank 2 supply |
| Контакт 15 | I/O — User I/O (bank 2) |
| Контакт 16 | I/O — User I/O (bank 2) |
| Контакт 17 | I/O — User I/O (bank 2) |
| Контакт 18 | I/O — User I/O (bank 2) |
| Контакт 19 | I/O — User I/O (bank 2) |
| Контакт 20 | GND — Ground |
| Контакт 21 | I/O — User I/O (bank 2) |
| Контакт 22 | I/O — User I/O (bank 2) |
| Контакт 23 | I/O — User I/O (bank 2) |
| Контакт 24 | I/O — User I/O (bank 3) |
| Контакт 25 | VCCIO3 — I/O bank 3 supply |
| Контакт 26 | I/O — User I/O (bank 3) |
| Контакт 27 | I/O — User I/O (bank 3) |
| Контакт 28 | I/O — User I/O (bank 3) |
| Контакт 29 | I/O — User I/O (bank 3) |
| Контакт 30 | I/O — User I/O (bank 3) |
| Контакт 31 | GND — Ground |
| Контакт 32 | I/O — User I/O (bank 3) |
| Контакт 33 | I/O — User I/O (bank 3) |
| Контакт 34 | I/O — User I/O (bank 3) |
| Контакт 35 | I/O — User I/O (bank 4) |
| Контакт 36 | VCCIO4 — I/O bank 4 supply |
| Контакт 37 | I/O — User I/O (bank 4) |
| Контакт 38 | I/O — User I/O (bank 4) |
| Контакт 39 | I/O — User I/O (bank 4) |
| Контакт 40 | I/O — User I/O (bank 4) |
| Контакт 41 | I/O — User I/O (bank 4) |
| Контакт 42 | GND — Ground |
| Контакт 43 | I/O — User I/O (bank 4) |
| Контакт 44 | I/O — User I/O (bank 4) |
| Контакт 45 | I/O — User I/O (bank 4) |
| Контакт 46 | VCCINT — Core supply (1.8 V) |
| Контакт 47 | I/O — User I/O (bank 5) |
| Контакт 48 | VCCIO5 — I/O bank 5 supply |
| Контакт 49 | I/O — User I/O (bank 5) |
| Контакт 50 | I/O — User I/O (bank 5) |
| Контакт 51 | I/O — User I/O (bank 5) |
| Контакт 52 | I/O — User I/O (bank 5) |
| Контакт 53 | I/O — User I/O (bank 5) |
| Контакт 54 | GND — Ground |
| Контакт 55 | I/O — User I/O (bank 5) |
| Контакт 56 | I/O — User I/O (bank 5) |
| Контакт 57 | I/O — User I/O (bank 5) |
| Контакт 58 | I/O — User I/O (bank 6) |
| Контакт 59 | VCCIO6 — I/O bank 6 supply |
| Контакт 60 | I/O — User I/O (bank 6) |
| Контакт 61 | I/O — User I/O (bank 6) |
| Контакт 62 | I/O — User I/O (bank 6) |
| Контакт 63 | I/O — User I/O (bank 6) |
| Контакт 64 | I/O — User I/O (bank 6) |
| Контакт 65 | GND — Ground |
| Контакт 66 | I/O — User I/O (bank 6) |
| Контакт 67 | I/O — User I/O (bank 6) |
| Контакт 68 | I/O — User I/O (bank 6) |
| Контакт 69 | I/O — User I/O (bank 7) |
| Контакт 70 | VCCIO7 — I/O bank 7 supply |
| Контакт 71 | I/O — User I/O (bank 7) |
| Контакт 72 | I/O — User I/O (bank 7) |
| Контакт 73 | I/O — User I/O (bank 7) |
| Контакт 74 | I/O — User I/O (bank 7) |
| Контакт 75 | I/O — User I/O (bank 7) |
| Контакт 76 | GND — Ground |
| Контакт 77 | I/O — User I/O (bank 7) |
| Контакт 78 | I/O — User I/O (bank 7) |
| Контакт 79 | I/O — User I/O (bank 7) |
| Контакт 80 | I/O — User I/O (bank 8) |
| Контакт 81 | VCCIO8 — I/O bank 8 supply |
| Контакт 82 | I/O — User I/O (bank 8) |
| Контакт 83 | I/O — User I/O (bank 8) |
| Контакт 84 | I/O — User I/O (bank 8) |
| Контакт 85 | I/O — User I/O (bank 8) |
| Контакт 86 | I/O — User I/O (bank 8) |
| Контакт 87 | GND — Ground |
| Контакт 88 | I/O — User I/O (bank 8) |
| Контакт 89 | I/O — User I/O (bank 8) |
| Контакт 90 | I/O — User I/O (bank 8) |
| Контакт 91 | MSEL0 — Configuration mode select 0 |
| Контакт 92 | MSEL1 — Configuration mode select 1 |
| Контакт 93 | nSTATUS — Configuration status (open-drain) |
| Контакт 94 | nCONFIG — Configuration start (active low) |
| Контакт 95 | DCLK — Configuration clock input |
| Контакт 96 | DATA0 — Configuration data input 0 |
| Контакт 97 | VCCINT — Core supply (1.8 V) |
| Контакт 98 | TCK — JTAG test clock |
| Контакт 99 | TMS — JTAG test mode select |
| Контакт 100 | TDI — JTAG test data in |
| Контакт 101 | TDO — JTAG test data out |
| Контакт 102 | nCE — Chip enable (active low) |
| Контакт 103 | nCEO — Chip enable out (cascade, active low) |
| Контакт 104 | CONF_DONE — Configuration done (open-drain) |
| Контакт 105 | GND — Ground |
| Контакт 106 | I/O — User I/O (bank 1) |
| Контакт 107 | I/O — User I/O (bank 1) |
| Контакт 108 | I/O — User I/O (bank 2) |
| Контакт 109 | I/O — User I/O (bank 2) |
| Контакт 110 | I/O — User I/O (bank 3) |
| Контакт 111 | I/O — User I/O (bank 3) |
| Контакт 112 | I/O — User I/O (bank 4) |
| Контакт 113 | I/O — User I/O (bank 4) |
| Контакт 114 | I/O — User I/O (bank 5) |
| Контакт 115 | I/O — User I/O (bank 5) |
| Контакт 116 | I/O — User I/O (bank 6) |
| Контакт 117 | I/O — User I/O (bank 6) |
| Контакт 118 | I/O — User I/O (bank 7) |
| Контакт 119 | I/O — User I/O (bank 7) |
| Контакт 120 | I/O — User I/O (bank 8) |
| Контакт 121 | I/O — User I/O (bank 8) |
| Контакт 122 | VCCINT — Core supply (1.8 V) |
| Контакт 123 | I/O — User I/O (bank 1) |
| Контакт 124 | I/O — User I/O (bank 2) |
| Контакт 125 | I/O — User I/O (bank 3) |
| Контакт 126 | I/O — User I/O (bank 4) |
| Контакт 127 | I/O — User I/O (bank 5) |
| Контакт 128 | I/O — User I/O (bank 6) |
| Контакт 129 | I/O — User I/O (bank 7) |
| Контакт 130 | I/O — User I/O (bank 8) |
| Контакт 131 | I/O — User I/O (bank 1) |
| Контакт 132 | I/O — User I/O (bank 2) |
| Контакт 133 | I/O — User I/O (bank 3) |
| Контакт 134 | I/O — User I/O (bank 4) |
| Контакт 135 | I/O — User I/O (bank 5) |
| Контакт 136 | I/O — User I/O (bank 6) |
| Контакт 137 | I/O — User I/O (bank 7) |
| Контакт 138 | I/O — User I/O (bank 8) |
| Контакт 139 | I/O — User I/O (bank 1) |
| Контакт 140 | I/O — User I/O (bank 2) |
| Контакт 141 | I/O — User I/O (bank 3) |
| Контакт 142 | I/O — User I/O (bank 4) |
| Контакт 143 | I/O — User I/O (bank 5) |
| Контакт 144 | GND — Ground |
Типичное применение
EP20K100CF144C7 подходит для 6 применениеs: Telecommunications Line Card Logic, ASIC Prototyping and Emulation, Industrial Control Logic Replacement, Test and Measurement Front-End, Legacy Field-Service Replacement Stock, Glue Logic and Bus Bridging.
Telecommunications Line Card Logic
The EP20K100CF144C7 fits telecom line-card logic aggregation because its 4,160 logic elements implement cell/packet processing glue logic and its 53,248 bits of ESB RAM buffer header fields and lookup tables. The 93 user I/O connect to TDM framers, PHY devices, and backplane SERDES without external bus switches. The commercial 0C to +85C range matches central-office ambient, and the 144-LQFP exposes enough I/O for typical line-card glue while keeping PCB area compact. Quartus II design entry supports legacy APEX designs in service today.
Рекомендуется
ASIC Prototyping and Emulation
The EP20K100CF144C7 is widely used to prototype and emulate ASIC RTL blocks before tape-out because Quartus II provides full APEX-20K support and timing simulation matches silicon behavior. The 4,160 LEs comfortably host medium-complexity state machines, datapaths, and bus interfaces. Embedded system blocks (ESBs) configure as dual-port RAM, FIFO, or CAM for memory-mapping prototypes. The 144-LQFP footprint is friendly to hand-routed or socketed prototype boards and the JTAG interface simplifies incremental bitstream loading during debug.
Рекомендуется
Industrial Control Logic Replacement
The EP20K100CF144C7 replaces legacy discrete TTL/CMOS glue logic in industrial controllers because its 4,160 LEs implement equivalent gate functions in a single chip while cutting PCB area and power. The 93 user I/O drive 5V-tolerant LVTTL/LVCMOS signals common in industrial sensors and actuators, and the embedded memory blocks implement shift-register, FIFO, and state-table functions used in motor-control sequencers. The 144-LQFP package is hand-solderable for low-volume industrial retrofits. Commercial 0C to +85C operation covers factory-floor enclosures.
Рекомендуется
Test and Measurement Front-End
The EP20K100CF144C7 serves as the timing/sequencer core in test-and-measurement front-ends because its 4 PLLs generate multiple synchronized clock domains required by ADC/DAC capture and stimulus engines. The 53,248 ESB bits act as deep sample buffers, while 93 user I/O connect to comparator arrays, relay drivers, and front-panel controls. The 144-LQFP package enables compact instrument layouts, and JTAG plus passive-serial configuration let factory technicians reprogram via boundary scan without board removal. Commercial temperature operation suffices for laboratory and production-line environments.
Рекомендуется
Legacy Field-Service Replacement Stock
Long-lifecycle telecom and defense systems deployed in the 2000s still rely on EP20K100CF144C7 boards, and service organizations keep replacement inventory. The 144-LQFP package and 100K-gate silicon match original design verification baselines, so field swaps require no firmware change. Distributors like Heisener list remaining stock of approximately 5,952 pieces for service replenishment. XAIPART aggregates multi-distributor inventory to support single-call procurement for legacy field-service contracts and DO-254/DO-178 maintenance flows.
Рекомендуется
Glue Logic and Bus Bridging
The EP20K100CF144C7 bridges mismatched buses (e.g., PCI to local bus, or async SRAM to synchronous core) in mixed-voltage systems because the 4,160 LEs absorb address decoding, wait-state generation, and endian conversion. The 93 user I/O support multi-bus fan-out, and the ESBs provide FIFO buffering between clock domains. The 144-LQFP keeps board area low, making the device attractive as a single-chip replacement for 5-10 discrete 74-series glue packages. Quartus II legacy IP libraries still include APEX-20K reference designs for common bridges.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP20K100CF144C7 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP20K100CF144C8 | EP20K100CF144C9 | EP20K100CF144I7 | EP20K100CB356C7 | EP20K100CB356C8 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP (22x22 mm) | 144-LQFP (22x22 mm) - same | 144-LQFP (22x22 mm) - same | 144-LQFP (22x22 mm) - same | 356-BGA - different | 356-BGA - different |
| Logic Elements | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 |
| User I/O Pins | 93 | 93 | 93 | 93 | 252 | 252 |
| Speed Grade | C7 | C8 (slower) | C9 (slowest) | C7 (industrial temp) | C7 | C8 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| System Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Embedded RAM Bits | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Ключевые отличия
- Same silicon across all 100K-gate APEX-20K variants - lowest-density tier (против EP20K200 (200K-gate APEX-20K family member))
- Pin-compatible C7/C8/C9 speed grade variants in 144-LQFP (против EP20K100CF144C8)
- Industrial-temperature drop-in available in same package (против EP20K100CF144I7)
Заметки по проектированию
The EP20K100CF144C7 requires a regulated 1.8 V core supply on VCCINT pins and a separate VCCIO rail (3.3 V typical, supports 1.5 V/1.8 V/2.5 V/3.3 V per I/O bank) for each of the eight banks. Place a 0.1 uF decoupling capacitor within 5 mm of every VCCINT and VCCIO pin, and add a bulk 10-47 uF tantalum or polymer capacitor near the package. Power sequencing: VCCINT must rise before or simultaneously with VCCIO; failure to sequence may cause long-term reliability degradation.
For the 144-LQFP package, allocate a continuous ground plane on layer 2 under the device for return-current paths, and route all eight VCCIO banks with wide traces (>= 0.5 mm) to support switching currents. JTAG signals (TCK/TMS/TDI/TDO) should be routed with 4-mil traces and series 22-47 ohm damping resistors near the FPGA to dampen reflections. Configuration signals (DCLK, nCONFIG, nSTATUS, CONF_DONE) require pull-ups of 10 kohm to VCCIO per APEX-20K reference designs.
Do not leave MSEL0/MSEL1 floating; these pins must be strapped to VCCIO or GND to select the configuration mode (e.g., MSEL[1:0] = 00 for passive serial, 10 for JTAG-only). Floating MSEL pins cause configuration failures that appear as intermittent CONF_DONE never-asserted behavior. Also ensure the EPC2 or EPC16 configuration PROM shares a common ground with the FPGA and that DCLK runs at <= 33 MHz per APEX-20K datasheet timing. Reset nCONFIG after power-up for at least 2 us before initiating configuration.
Информация о соответствии
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status were not explicitly stated in the verified web data. APEX-20K devices predate the widespread adoption of RoHS; many original Altera APEX-20K parts were non-RoHS. Verify with the manufacturer's material declaration or product change notice (PCN) before use in RoHS-restricted applications.