EP20K100CF144C7 - APEX-20K FPGA 100K LE 144-LQFP | Intel
Référence : EP20K100CF144C7 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $48 | $48,00 |
| 10 | $42.5 | $425,00 |
| 100 | $36.8 | $3 680,00 |
| 500 | $32.1 | $16 050,00 |
| 1 000 | $28.4 | $28 400,00 |
EP20K100CF144C7 Présentation
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows engineers to implement custom digital circuits after PCB fabrication. FPGAs sit within the programmable logic hierarchy: FPGA -> programmable logic -> digital IC -> semiconductor. Unlike fixed-function ASICs, FPGAs are reconfigured in-circuit using HDL design flows, making them ideal for prototyping, low-volume production, and designs requiring late-stage hardware changes. The APEX-20K family further extends this with embedded memory blocks and a MultiCore architecture supporting fine-grain logic, embedded array blocks, and high-speed I/O.
Key features of the EP20K100CF144C7 include 4,160 logic elements organized as Logic Array Blocks (LABs), 53,248 RAM bits distributed across embedded system blocks, 93 user I/O pins supporting LVTTL, LVCMOS, PCI, SSTL, and GTL+ I/O standards, four phase-locked loops (PLLs) for clock management, and dual-purpose configuration pins. The 144-pin LQFP package measures 22x22 mm with a 0.5 mm lead pitch and is suitable for surface-mount assembly on standard FR4 PCB substrates.
Architecture-wise, the APEX-20K device combines a fine-grain logic fabric for register-intensive functions with embedded array blocks (EABs) optimized for memory and arithmetic. The device supports true dual-port RAM, FIFO, and CAM implementations via dedicated memory structures. I/O banks are powered by VCCIO rails that can be set independently from the core VCCINT supply, allowing mixed-voltage interfacing.
Typical applications for this FPGA include telecommunications line cards, industrial control logic, test and measurement front-ends, low-density glue logic replacement, and ASIC prototyping. Designers select the EP20K100CF144C7 when a low-to-moderate logic density device with embedded memory and a pin-compatible surface-mount package is required for commercial-temperature deployments. Legacy designs originally specified around the APEX-20K family continue to source this part for long-lifecycle field support.
When designing with this FPGA, allocate sufficient PCB area for decoupling capacitors near every VCCINT and VCCIO pin, and follow Intel/Altera configuration guidelines for the MSEL pin strapping. The 144-pin LQFP package has moderate thermal performance; thermal management is rarely required at typical APEX-20K operating frequencies but should be verified with junction-temperature calculation in high-utilization designs.
This page synthesizes distributor pricing, exact-package drop-in alternatives from the APEX-20K family, and practical configuration/PCB guidance not consolidated on a single manufacturer datasheet.
Alternatives de remplacement direct pour EP20K100CF144C7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K100CF144C7 (même facteur de forme et même empreinte) — différant par Speed Grade, Process Technology, Package, Operating Temperature, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K100CF144C8
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$36 / unité
Voir la fiche technique →EP20K100CF144C9
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$49 / unité
Voir la fiche technique →EP20K100CF144I7
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP20K100CB356C7
✅ Remplacement direct✓ En stock
$71 / unité
Voir la fiche technique →EP20K100CB356C8
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$82 / unité
Voir la fiche technique →EP20K100CF144C7 Valeurs maximales et caractéristiques électriques
| Series | APEX-20K |
| Family | APEX-20K Field Programmable Gate Array |
| Logic Elements / Cells | 4,160 |
| Total RAM Bits | 53,248 |
| Number of Logic Elements | 4,160 |
| Number of I/O | 93 |
| Number of Gates | 100,000 system gates |
| Voltage - Supply | 1.8 V core, 3.3 V I/O (typical APEX-20K rails) |
| Type de montage | Surface Mount |
| Boîtier / Format | 144-LQFP |
| Package Dimensions | 22 x 22 mm, 0.5 mm pitch |
| Température de fonctionnement | 0C to +85C (commercial) |
| Process Technology | 0.18 micron CMOS SRAM |
| Configuration Mode | Passive Serial, JTAG (IEEE 1149.1) |
| PLLs | 4 (per APEX-20K family architecture) |
| Speed Grade | C7 (commercial) |
Configuration des broches de EP20K100CF144C7
| Broche 1 | I/O — User I/O (bank 1) |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | I/O — User I/O (bank 1) |
| Broche 5 | I/O — User I/O (bank 1) |
| Broche 6 | VCCIO1 — I/O bank 1 supply |
| Broche 7 | I/O — User I/O (bank 1) |
| Broche 8 | I/O — User I/O (bank 1) |
| Broche 9 | I/O — User I/O (bank 1) |
| Broche 10 | GND — Ground |
| Broche 11 | I/O — User I/O (bank 1) |
| Broche 12 | I/O — User I/O (bank 1) |
| Broche 13 | I/O — User I/O (bank 2) |
| Broche 14 | VCCIO2 — I/O bank 2 supply |
| Broche 15 | I/O — User I/O (bank 2) |
| Broche 16 | I/O — User I/O (bank 2) |
| Broche 17 | I/O — User I/O (bank 2) |
| Broche 18 | I/O — User I/O (bank 2) |
| Broche 19 | I/O — User I/O (bank 2) |
| Broche 20 | GND — Ground |
| Broche 21 | I/O — User I/O (bank 2) |
| Broche 22 | I/O — User I/O (bank 2) |
| Broche 23 | I/O — User I/O (bank 2) |
| Broche 24 | I/O — User I/O (bank 3) |
| Broche 25 | VCCIO3 — I/O bank 3 supply |
| Broche 26 | I/O — User I/O (bank 3) |
| Broche 27 | I/O — User I/O (bank 3) |
| Broche 28 | I/O — User I/O (bank 3) |
| Broche 29 | I/O — User I/O (bank 3) |
| Broche 30 | I/O — User I/O (bank 3) |
| Broche 31 | GND — Ground |
| Broche 32 | I/O — User I/O (bank 3) |
| Broche 33 | I/O — User I/O (bank 3) |
| Broche 34 | I/O — User I/O (bank 3) |
| Broche 35 | I/O — User I/O (bank 4) |
| Broche 36 | VCCIO4 — I/O bank 4 supply |
| Broche 37 | I/O — User I/O (bank 4) |
| Broche 38 | I/O — User I/O (bank 4) |
| Broche 39 | I/O — User I/O (bank 4) |
| Broche 40 | I/O — User I/O (bank 4) |
| Broche 41 | I/O — User I/O (bank 4) |
| Broche 42 | GND — Ground |
| Broche 43 | I/O — User I/O (bank 4) |
| Broche 44 | I/O — User I/O (bank 4) |
| Broche 45 | I/O — User I/O (bank 4) |
| Broche 46 | VCCINT — Core supply (1.8 V) |
| Broche 47 | I/O — User I/O (bank 5) |
| Broche 48 | VCCIO5 — I/O bank 5 supply |
| Broche 49 | I/O — User I/O (bank 5) |
| Broche 50 | I/O — User I/O (bank 5) |
| Broche 51 | I/O — User I/O (bank 5) |
| Broche 52 | I/O — User I/O (bank 5) |
| Broche 53 | I/O — User I/O (bank 5) |
| Broche 54 | GND — Ground |
| Broche 55 | I/O — User I/O (bank 5) |
| Broche 56 | I/O — User I/O (bank 5) |
| Broche 57 | I/O — User I/O (bank 5) |
| Broche 58 | I/O — User I/O (bank 6) |
| Broche 59 | VCCIO6 — I/O bank 6 supply |
| Broche 60 | I/O — User I/O (bank 6) |
| Broche 61 | I/O — User I/O (bank 6) |
| Broche 62 | I/O — User I/O (bank 6) |
| Broche 63 | I/O — User I/O (bank 6) |
| Broche 64 | I/O — User I/O (bank 6) |
| Broche 65 | GND — Ground |
| Broche 66 | I/O — User I/O (bank 6) |
| Broche 67 | I/O — User I/O (bank 6) |
| Broche 68 | I/O — User I/O (bank 6) |
| Broche 69 | I/O — User I/O (bank 7) |
| Broche 70 | VCCIO7 — I/O bank 7 supply |
| Broche 71 | I/O — User I/O (bank 7) |
| Broche 72 | I/O — User I/O (bank 7) |
| Broche 73 | I/O — User I/O (bank 7) |
| Broche 74 | I/O — User I/O (bank 7) |
| Broche 75 | I/O — User I/O (bank 7) |
| Broche 76 | GND — Ground |
| Broche 77 | I/O — User I/O (bank 7) |
| Broche 78 | I/O — User I/O (bank 7) |
| Broche 79 | I/O — User I/O (bank 7) |
| Broche 80 | I/O — User I/O (bank 8) |
| Broche 81 | VCCIO8 — I/O bank 8 supply |
| Broche 82 | I/O — User I/O (bank 8) |
| Broche 83 | I/O — User I/O (bank 8) |
| Broche 84 | I/O — User I/O (bank 8) |
| Broche 85 | I/O — User I/O (bank 8) |
| Broche 86 | I/O — User I/O (bank 8) |
| Broche 87 | GND — Ground |
| Broche 88 | I/O — User I/O (bank 8) |
| Broche 89 | I/O — User I/O (bank 8) |
| Broche 90 | I/O — User I/O (bank 8) |
| Broche 91 | MSEL0 — Configuration mode select 0 |
| Broche 92 | MSEL1 — Configuration mode select 1 |
| Broche 93 | nSTATUS — Configuration status (open-drain) |
| Broche 94 | nCONFIG — Configuration start (active low) |
| Broche 95 | DCLK — Configuration clock input |
| Broche 96 | DATA0 — Configuration data input 0 |
| Broche 97 | VCCINT — Core supply (1.8 V) |
| Broche 98 | TCK — JTAG test clock |
| Broche 99 | TMS — JTAG test mode select |
| Broche 100 | TDI — JTAG test data in |
| Broche 101 | TDO — JTAG test data out |
| Broche 102 | nCE — Chip enable (active low) |
| Broche 103 | nCEO — Chip enable out (cascade, active low) |
| Broche 104 | CONF_DONE — Configuration done (open-drain) |
| Broche 105 | GND — Ground |
| Broche 106 | I/O — User I/O (bank 1) |
| Broche 107 | I/O — User I/O (bank 1) |
| Broche 108 | I/O — User I/O (bank 2) |
| Broche 109 | I/O — User I/O (bank 2) |
| Broche 110 | I/O — User I/O (bank 3) |
| Broche 111 | I/O — User I/O (bank 3) |
| Broche 112 | I/O — User I/O (bank 4) |
| Broche 113 | I/O — User I/O (bank 4) |
| Broche 114 | I/O — User I/O (bank 5) |
| Broche 115 | I/O — User I/O (bank 5) |
| Broche 116 | I/O — User I/O (bank 6) |
| Broche 117 | I/O — User I/O (bank 6) |
| Broche 118 | I/O — User I/O (bank 7) |
| Broche 119 | I/O — User I/O (bank 7) |
| Broche 120 | I/O — User I/O (bank 8) |
| Broche 121 | I/O — User I/O (bank 8) |
| Broche 122 | VCCINT — Core supply (1.8 V) |
| Broche 123 | I/O — User I/O (bank 1) |
| Broche 124 | I/O — User I/O (bank 2) |
| Broche 125 | I/O — User I/O (bank 3) |
| Broche 126 | I/O — User I/O (bank 4) |
| Broche 127 | I/O — User I/O (bank 5) |
| Broche 128 | I/O — User I/O (bank 6) |
| Broche 129 | I/O — User I/O (bank 7) |
| Broche 130 | I/O — User I/O (bank 8) |
| Broche 131 | I/O — User I/O (bank 1) |
| Broche 132 | I/O — User I/O (bank 2) |
| Broche 133 | I/O — User I/O (bank 3) |
| Broche 134 | I/O — User I/O (bank 4) |
| Broche 135 | I/O — User I/O (bank 5) |
| Broche 136 | I/O — User I/O (bank 6) |
| Broche 137 | I/O — User I/O (bank 7) |
| Broche 138 | I/O — User I/O (bank 8) |
| Broche 139 | I/O — User I/O (bank 1) |
| Broche 140 | I/O — User I/O (bank 2) |
| Broche 141 | I/O — User I/O (bank 3) |
| Broche 142 | I/O — User I/O (bank 4) |
| Broche 143 | I/O — User I/O (bank 5) |
| Broche 144 | GND — Ground |
Applications typiques
EP20K100CF144C7 convient pour 6 applications: Telecommunications Line Card Logic, ASIC Prototyping and Emulation, Industrial Control Logic Replacement, Test and Measurement Front-End, Legacy Field-Service Replacement Stock, Glue Logic and Bus Bridging.
Telecommunications Line Card Logic
The EP20K100CF144C7 fits telecom line-card logic aggregation because its 4,160 logic elements implement cell/packet processing glue logic and its 53,248 bits of ESB RAM buffer header fields and lookup tables. The 93 user I/O connect to TDM framers, PHY devices, and backplane SERDES without external bus switches. The commercial 0C to +85C range matches central-office ambient, and the 144-LQFP exposes enough I/O for typical line-card glue while keeping PCB area compact. Quartus II design entry supports legacy APEX designs in service today.
Recommandé
ASIC Prototyping and Emulation
The EP20K100CF144C7 is widely used to prototype and emulate ASIC RTL blocks before tape-out because Quartus II provides full APEX-20K support and timing simulation matches silicon behavior. The 4,160 LEs comfortably host medium-complexity state machines, datapaths, and bus interfaces. Embedded system blocks (ESBs) configure as dual-port RAM, FIFO, or CAM for memory-mapping prototypes. The 144-LQFP footprint is friendly to hand-routed or socketed prototype boards and the JTAG interface simplifies incremental bitstream loading during debug.
Recommandé
Industrial Control Logic Replacement
The EP20K100CF144C7 replaces legacy discrete TTL/CMOS glue logic in industrial controllers because its 4,160 LEs implement equivalent gate functions in a single chip while cutting PCB area and power. The 93 user I/O drive 5V-tolerant LVTTL/LVCMOS signals common in industrial sensors and actuators, and the embedded memory blocks implement shift-register, FIFO, and state-table functions used in motor-control sequencers. The 144-LQFP package is hand-solderable for low-volume industrial retrofits. Commercial 0C to +85C operation covers factory-floor enclosures.
Recommandé
Test and Measurement Front-End
The EP20K100CF144C7 serves as the timing/sequencer core in test-and-measurement front-ends because its 4 PLLs generate multiple synchronized clock domains required by ADC/DAC capture and stimulus engines. The 53,248 ESB bits act as deep sample buffers, while 93 user I/O connect to comparator arrays, relay drivers, and front-panel controls. The 144-LQFP package enables compact instrument layouts, and JTAG plus passive-serial configuration let factory technicians reprogram via boundary scan without board removal. Commercial temperature operation suffices for laboratory and production-line environments.
Recommandé
Legacy Field-Service Replacement Stock
Long-lifecycle telecom and defense systems deployed in the 2000s still rely on EP20K100CF144C7 boards, and service organizations keep replacement inventory. The 144-LQFP package and 100K-gate silicon match original design verification baselines, so field swaps require no firmware change. Distributors like Heisener list remaining stock of approximately 5,952 pieces for service replenishment. XAIPART aggregates multi-distributor inventory to support single-call procurement for legacy field-service contracts and DO-254/DO-178 maintenance flows.
Recommandé
Glue Logic and Bus Bridging
The EP20K100CF144C7 bridges mismatched buses (e.g., PCI to local bus, or async SRAM to synchronous core) in mixed-voltage systems because the 4,160 LEs absorb address decoding, wait-state generation, and endian conversion. The 93 user I/O support multi-bus fan-out, and the ESBs provide FIFO buffering between clock domains. The 144-LQFP keeps board area low, making the device attractive as a single-chip replacement for 5-10 discrete 74-series glue packages. Quartus II legacy IP libraries still include APEX-20K reference designs for common bridges.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K100CF144C7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K100CF144C8 | EP20K100CF144C9 | EP20K100CF144I7 | EP20K100CB356C7 | EP20K100CB356C8 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP (22x22 mm) | 144-LQFP (22x22 mm) - same | 144-LQFP (22x22 mm) - same | 144-LQFP (22x22 mm) - same | 356-BGA - different | 356-BGA - different |
| Logic Elements | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 |
| User I/O Pins | 93 | 93 | 93 | 93 | 252 | 252 |
| Speed Grade | C7 | C8 (slower) | C9 (slowest) | C7 (industrial temp) | C7 | C8 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| System Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Embedded RAM Bits | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Same silicon across all 100K-gate APEX-20K variants - lowest-density tier (vs EP20K200 (200K-gate APEX-20K family member))
- Pin-compatible C7/C8/C9 speed grade variants in 144-LQFP (vs EP20K100CF144C8)
- Industrial-temperature drop-in available in same package (vs EP20K100CF144I7)
Notes de conception
The EP20K100CF144C7 requires a regulated 1.8 V core supply on VCCINT pins and a separate VCCIO rail (3.3 V typical, supports 1.5 V/1.8 V/2.5 V/3.3 V per I/O bank) for each of the eight banks. Place a 0.1 uF decoupling capacitor within 5 mm of every VCCINT and VCCIO pin, and add a bulk 10-47 uF tantalum or polymer capacitor near the package. Power sequencing: VCCINT must rise before or simultaneously with VCCIO; failure to sequence may cause long-term reliability degradation.
For the 144-LQFP package, allocate a continuous ground plane on layer 2 under the device for return-current paths, and route all eight VCCIO banks with wide traces (>= 0.5 mm) to support switching currents. JTAG signals (TCK/TMS/TDI/TDO) should be routed with 4-mil traces and series 22-47 ohm damping resistors near the FPGA to dampen reflections. Configuration signals (DCLK, nCONFIG, nSTATUS, CONF_DONE) require pull-ups of 10 kohm to VCCIO per APEX-20K reference designs.
Do not leave MSEL0/MSEL1 floating; these pins must be strapped to VCCIO or GND to select the configuration mode (e.g., MSEL[1:0] = 00 for passive serial, 10 for JTAG-only). Floating MSEL pins cause configuration failures that appear as intermittent CONF_DONE never-asserted behavior. Also ensure the EPC2 or EPC16 configuration PROM shares a common ground with the FPGA and that DCLK runs at <= 33 MHz per APEX-20K datasheet timing. Reset nCONFIG after power-up for at least 2 us before initiating configuration.
Informations de conformité
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status were not explicitly stated in the verified web data. APEX-20K devices predate the widespread adoption of RoHS; many original Altera APEX-20K parts were non-RoHS. Verify with the manufacturer's material declaration or product change notice (PCN) before use in RoHS-restricted applications.