EP20K100CF144C7 - APEX-20K FPGA 100K LE 144-LQFP | Intel
N.º da peça: EP20K100CF144C7 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $48 | $48,00 |
| 10 | $42.5 | $425,00 |
| 100 | $36.8 | $3.680,00 |
| 500 | $32.1 | $16.050,00 |
| 1.000 | $28.4 | $28.400,00 |
EP20K100CF144C7 Visão geral
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows engineers to implement custom digital circuits after PCB fabrication. FPGAs sit within the programmable logic hierarchy: FPGA -> programmable logic -> digital IC -> semiconductor. Unlike fixed-function ASICs, FPGAs are reconfigured in-circuit using HDL design flows, making them ideal for prototyping, low-volume production, and designs requiring late-stage hardware changes. The APEX-20K family further extends this with embedded memory blocks and a MultiCore architecture supporting fine-grain logic, embedded array blocks, and high-speed I/O.
Key features of the EP20K100CF144C7 include 4,160 logic elements organized as Logic Array Blocks (LABs), 53,248 RAM bits distributed across embedded system blocks, 93 user I/O pins supporting LVTTL, LVCMOS, PCI, SSTL, and GTL+ I/O standards, four phase-locked loops (PLLs) for clock management, and dual-purpose configuration pins. The 144-pin LQFP package measures 22x22 mm with a 0.5 mm lead pitch and is suitable for surface-mount assembly on standard FR4 PCB substrates.
Architecture-wise, the APEX-20K device combines a fine-grain logic fabric for register-intensive functions with embedded array blocks (EABs) optimized for memory and arithmetic. The device supports true dual-port RAM, FIFO, and CAM implementations via dedicated memory structures. I/O banks are powered by VCCIO rails that can be set independently from the core VCCINT supply, allowing mixed-voltage interfacing.
Typical applications for this FPGA include telecommunications line cards, industrial control logic, test and measurement front-ends, low-density glue logic replacement, and ASIC prototyping. Designers select the EP20K100CF144C7 when a low-to-moderate logic density device with embedded memory and a pin-compatible surface-mount package is required for commercial-temperature deployments. Legacy designs originally specified around the APEX-20K family continue to source this part for long-lifecycle field support.
When designing with this FPGA, allocate sufficient PCB area for decoupling capacitors near every VCCINT and VCCIO pin, and follow Intel/Altera configuration guidelines for the MSEL pin strapping. The 144-pin LQFP package has moderate thermal performance; thermal management is rarely required at typical APEX-20K operating frequencies but should be verified with junction-temperature calculation in high-utilization designs.
This page synthesizes distributor pricing, exact-package drop-in alternatives from the APEX-20K family, and practical configuration/PCB guidance not consolidated on a single manufacturer datasheet.
Alternativas drop-in para EP20K100CF144C7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP20K100CF144C7 (mesmo formato e footprint) — diferindo em Speed Grade, Process Technology, Package, Operating Temperature, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP20K100CF144C8
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$36 / unidade
Ver ficha técnica →EP20K100CF144C9
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$49 / unidade
Ver ficha técnica →EP20K100CF144I7
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP20K100CB356C7
✅ Drop-In✓ Em estoque
$71 / unidade
Ver ficha técnica →EP20K100CB356C8
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$82 / unidade
Ver ficha técnica →EP20K100CF144C7 Classificações máximas e características elétricas
| Series | APEX-20K |
| Family | APEX-20K Field Programmable Gate Array |
| Logic Elements / Cells | 4,160 |
| Total RAM Bits | 53,248 |
| Number of Logic Elements | 4,160 |
| Number of I/O | 93 |
| Number of Gates | 100,000 system gates |
| Voltage - Supply | 1.8 V core, 3.3 V I/O (typical APEX-20K rails) |
| Tipo de montagem | Surface Mount |
| Encapsulamento / Caixa | 144-LQFP |
| Package Dimensions | 22 x 22 mm, 0.5 mm pitch |
| Temperatura de operação | 0C to +85C (commercial) |
| Process Technology | 0.18 micron CMOS SRAM |
| Configuration Mode | Passive Serial, JTAG (IEEE 1149.1) |
| PLLs | 4 (per APEX-20K family architecture) |
| Speed Grade | C7 (commercial) |
Configuração de pinos do EP20K100CF144C7
| Pino 1 | I/O — User I/O (bank 1) |
| Pino 2 | I/O — User I/O (bank 1) |
| Pino 3 | I/O — User I/O (bank 1) |
| Pino 4 | I/O — User I/O (bank 1) |
| Pino 5 | I/O — User I/O (bank 1) |
| Pino 6 | VCCIO1 — I/O bank 1 supply |
| Pino 7 | I/O — User I/O (bank 1) |
| Pino 8 | I/O — User I/O (bank 1) |
| Pino 9 | I/O — User I/O (bank 1) |
| Pino 10 | GND — Ground |
| Pino 11 | I/O — User I/O (bank 1) |
| Pino 12 | I/O — User I/O (bank 1) |
| Pino 13 | I/O — User I/O (bank 2) |
| Pino 14 | VCCIO2 — I/O bank 2 supply |
| Pino 15 | I/O — User I/O (bank 2) |
| Pino 16 | I/O — User I/O (bank 2) |
| Pino 17 | I/O — User I/O (bank 2) |
| Pino 18 | I/O — User I/O (bank 2) |
| Pino 19 | I/O — User I/O (bank 2) |
| Pino 20 | GND — Ground |
| Pino 21 | I/O — User I/O (bank 2) |
| Pino 22 | I/O — User I/O (bank 2) |
| Pino 23 | I/O — User I/O (bank 2) |
| Pino 24 | I/O — User I/O (bank 3) |
| Pino 25 | VCCIO3 — I/O bank 3 supply |
| Pino 26 | I/O — User I/O (bank 3) |
| Pino 27 | I/O — User I/O (bank 3) |
| Pino 28 | I/O — User I/O (bank 3) |
| Pino 29 | I/O — User I/O (bank 3) |
| Pino 30 | I/O — User I/O (bank 3) |
| Pino 31 | GND — Ground |
| Pino 32 | I/O — User I/O (bank 3) |
| Pino 33 | I/O — User I/O (bank 3) |
| Pino 34 | I/O — User I/O (bank 3) |
| Pino 35 | I/O — User I/O (bank 4) |
| Pino 36 | VCCIO4 — I/O bank 4 supply |
| Pino 37 | I/O — User I/O (bank 4) |
| Pino 38 | I/O — User I/O (bank 4) |
| Pino 39 | I/O — User I/O (bank 4) |
| Pino 40 | I/O — User I/O (bank 4) |
| Pino 41 | I/O — User I/O (bank 4) |
| Pino 42 | GND — Ground |
| Pino 43 | I/O — User I/O (bank 4) |
| Pino 44 | I/O — User I/O (bank 4) |
| Pino 45 | I/O — User I/O (bank 4) |
| Pino 46 | VCCINT — Core supply (1.8 V) |
| Pino 47 | I/O — User I/O (bank 5) |
| Pino 48 | VCCIO5 — I/O bank 5 supply |
| Pino 49 | I/O — User I/O (bank 5) |
| Pino 50 | I/O — User I/O (bank 5) |
| Pino 51 | I/O — User I/O (bank 5) |
| Pino 52 | I/O — User I/O (bank 5) |
| Pino 53 | I/O — User I/O (bank 5) |
| Pino 54 | GND — Ground |
| Pino 55 | I/O — User I/O (bank 5) |
| Pino 56 | I/O — User I/O (bank 5) |
| Pino 57 | I/O — User I/O (bank 5) |
| Pino 58 | I/O — User I/O (bank 6) |
| Pino 59 | VCCIO6 — I/O bank 6 supply |
| Pino 60 | I/O — User I/O (bank 6) |
| Pino 61 | I/O — User I/O (bank 6) |
| Pino 62 | I/O — User I/O (bank 6) |
| Pino 63 | I/O — User I/O (bank 6) |
| Pino 64 | I/O — User I/O (bank 6) |
| Pino 65 | GND — Ground |
| Pino 66 | I/O — User I/O (bank 6) |
| Pino 67 | I/O — User I/O (bank 6) |
| Pino 68 | I/O — User I/O (bank 6) |
| Pino 69 | I/O — User I/O (bank 7) |
| Pino 70 | VCCIO7 — I/O bank 7 supply |
| Pino 71 | I/O — User I/O (bank 7) |
| Pino 72 | I/O — User I/O (bank 7) |
| Pino 73 | I/O — User I/O (bank 7) |
| Pino 74 | I/O — User I/O (bank 7) |
| Pino 75 | I/O — User I/O (bank 7) |
| Pino 76 | GND — Ground |
| Pino 77 | I/O — User I/O (bank 7) |
| Pino 78 | I/O — User I/O (bank 7) |
| Pino 79 | I/O — User I/O (bank 7) |
| Pino 80 | I/O — User I/O (bank 8) |
| Pino 81 | VCCIO8 — I/O bank 8 supply |
| Pino 82 | I/O — User I/O (bank 8) |
| Pino 83 | I/O — User I/O (bank 8) |
| Pino 84 | I/O — User I/O (bank 8) |
| Pino 85 | I/O — User I/O (bank 8) |
| Pino 86 | I/O — User I/O (bank 8) |
| Pino 87 | GND — Ground |
| Pino 88 | I/O — User I/O (bank 8) |
| Pino 89 | I/O — User I/O (bank 8) |
| Pino 90 | I/O — User I/O (bank 8) |
| Pino 91 | MSEL0 — Configuration mode select 0 |
| Pino 92 | MSEL1 — Configuration mode select 1 |
| Pino 93 | nSTATUS — Configuration status (open-drain) |
| Pino 94 | nCONFIG — Configuration start (active low) |
| Pino 95 | DCLK — Configuration clock input |
| Pino 96 | DATA0 — Configuration data input 0 |
| Pino 97 | VCCINT — Core supply (1.8 V) |
| Pino 98 | TCK — JTAG test clock |
| Pino 99 | TMS — JTAG test mode select |
| Pino 100 | TDI — JTAG test data in |
| Pino 101 | TDO — JTAG test data out |
| Pino 102 | nCE — Chip enable (active low) |
| Pino 103 | nCEO — Chip enable out (cascade, active low) |
| Pino 104 | CONF_DONE — Configuration done (open-drain) |
| Pino 105 | GND — Ground |
| Pino 106 | I/O — User I/O (bank 1) |
| Pino 107 | I/O — User I/O (bank 1) |
| Pino 108 | I/O — User I/O (bank 2) |
| Pino 109 | I/O — User I/O (bank 2) |
| Pino 110 | I/O — User I/O (bank 3) |
| Pino 111 | I/O — User I/O (bank 3) |
| Pino 112 | I/O — User I/O (bank 4) |
| Pino 113 | I/O — User I/O (bank 4) |
| Pino 114 | I/O — User I/O (bank 5) |
| Pino 115 | I/O — User I/O (bank 5) |
| Pino 116 | I/O — User I/O (bank 6) |
| Pino 117 | I/O — User I/O (bank 6) |
| Pino 118 | I/O — User I/O (bank 7) |
| Pino 119 | I/O — User I/O (bank 7) |
| Pino 120 | I/O — User I/O (bank 8) |
| Pino 121 | I/O — User I/O (bank 8) |
| Pino 122 | VCCINT — Core supply (1.8 V) |
| Pino 123 | I/O — User I/O (bank 1) |
| Pino 124 | I/O — User I/O (bank 2) |
| Pino 125 | I/O — User I/O (bank 3) |
| Pino 126 | I/O — User I/O (bank 4) |
| Pino 127 | I/O — User I/O (bank 5) |
| Pino 128 | I/O — User I/O (bank 6) |
| Pino 129 | I/O — User I/O (bank 7) |
| Pino 130 | I/O — User I/O (bank 8) |
| Pino 131 | I/O — User I/O (bank 1) |
| Pino 132 | I/O — User I/O (bank 2) |
| Pino 133 | I/O — User I/O (bank 3) |
| Pino 134 | I/O — User I/O (bank 4) |
| Pino 135 | I/O — User I/O (bank 5) |
| Pino 136 | I/O — User I/O (bank 6) |
| Pino 137 | I/O — User I/O (bank 7) |
| Pino 138 | I/O — User I/O (bank 8) |
| Pino 139 | I/O — User I/O (bank 1) |
| Pino 140 | I/O — User I/O (bank 2) |
| Pino 141 | I/O — User I/O (bank 3) |
| Pino 142 | I/O — User I/O (bank 4) |
| Pino 143 | I/O — User I/O (bank 5) |
| Pino 144 | GND — Ground |
Aplicações típicas
EP20K100CF144C7 é adequado para 6 aplicaçãos: Telecommunications Line Card Logic, ASIC Prototyping and Emulation, Industrial Control Logic Replacement, Test and Measurement Front-End, Legacy Field-Service Replacement Stock, Glue Logic and Bus Bridging.
Telecommunications Line Card Logic
The EP20K100CF144C7 fits telecom line-card logic aggregation because its 4,160 logic elements implement cell/packet processing glue logic and its 53,248 bits of ESB RAM buffer header fields and lookup tables. The 93 user I/O connect to TDM framers, PHY devices, and backplane SERDES without external bus switches. The commercial 0C to +85C range matches central-office ambient, and the 144-LQFP exposes enough I/O for typical line-card glue while keeping PCB area compact. Quartus II design entry supports legacy APEX designs in service today.
Recomendado
ASIC Prototyping and Emulation
The EP20K100CF144C7 is widely used to prototype and emulate ASIC RTL blocks before tape-out because Quartus II provides full APEX-20K support and timing simulation matches silicon behavior. The 4,160 LEs comfortably host medium-complexity state machines, datapaths, and bus interfaces. Embedded system blocks (ESBs) configure as dual-port RAM, FIFO, or CAM for memory-mapping prototypes. The 144-LQFP footprint is friendly to hand-routed or socketed prototype boards and the JTAG interface simplifies incremental bitstream loading during debug.
Recomendado
Industrial Control Logic Replacement
The EP20K100CF144C7 replaces legacy discrete TTL/CMOS glue logic in industrial controllers because its 4,160 LEs implement equivalent gate functions in a single chip while cutting PCB area and power. The 93 user I/O drive 5V-tolerant LVTTL/LVCMOS signals common in industrial sensors and actuators, and the embedded memory blocks implement shift-register, FIFO, and state-table functions used in motor-control sequencers. The 144-LQFP package is hand-solderable for low-volume industrial retrofits. Commercial 0C to +85C operation covers factory-floor enclosures.
Recomendado
Test and Measurement Front-End
The EP20K100CF144C7 serves as the timing/sequencer core in test-and-measurement front-ends because its 4 PLLs generate multiple synchronized clock domains required by ADC/DAC capture and stimulus engines. The 53,248 ESB bits act as deep sample buffers, while 93 user I/O connect to comparator arrays, relay drivers, and front-panel controls. The 144-LQFP package enables compact instrument layouts, and JTAG plus passive-serial configuration let factory technicians reprogram via boundary scan without board removal. Commercial temperature operation suffices for laboratory and production-line environments.
Recomendado
Legacy Field-Service Replacement Stock
Long-lifecycle telecom and defense systems deployed in the 2000s still rely on EP20K100CF144C7 boards, and service organizations keep replacement inventory. The 144-LQFP package and 100K-gate silicon match original design verification baselines, so field swaps require no firmware change. Distributors like Heisener list remaining stock of approximately 5,952 pieces for service replenishment. XAIPART aggregates multi-distributor inventory to support single-call procurement for legacy field-service contracts and DO-254/DO-178 maintenance flows.
Recomendado
Glue Logic and Bus Bridging
The EP20K100CF144C7 bridges mismatched buses (e.g., PCI to local bus, or async SRAM to synchronous core) in mixed-voltage systems because the 4,160 LEs absorb address decoding, wait-state generation, and endian conversion. The 93 user I/O support multi-bus fan-out, and the ESBs provide FIFO buffering between clock domains. The 144-LQFP keeps board area low, making the device attractive as a single-chip replacement for 5-10 discrete 74-series glue packages. Quartus II legacy IP libraries still include APEX-20K reference designs for common bridges.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP20K100CF144C7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP20K100CF144C8 | EP20K100CF144C9 | EP20K100CF144I7 | EP20K100CB356C7 | EP20K100CB356C8 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP (22x22 mm) | 144-LQFP (22x22 mm) - same | 144-LQFP (22x22 mm) - same | 144-LQFP (22x22 mm) - same | 356-BGA - different | 356-BGA - different |
| Logic Elements | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 |
| User I/O Pins | 93 | 93 | 93 | 93 | 252 | 252 |
| Speed Grade | C7 | C8 (slower) | C9 (slowest) | C7 (industrial temp) | C7 | C8 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| System Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Embedded RAM Bits | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Same silicon across all 100K-gate APEX-20K variants - lowest-density tier (vs EP20K200 (200K-gate APEX-20K family member))
- Pin-compatible C7/C8/C9 speed grade variants in 144-LQFP (vs EP20K100CF144C8)
- Industrial-temperature drop-in available in same package (vs EP20K100CF144I7)
Notas de projeto
The EP20K100CF144C7 requires a regulated 1.8 V core supply on VCCINT pins and a separate VCCIO rail (3.3 V typical, supports 1.5 V/1.8 V/2.5 V/3.3 V per I/O bank) for each of the eight banks. Place a 0.1 uF decoupling capacitor within 5 mm of every VCCINT and VCCIO pin, and add a bulk 10-47 uF tantalum or polymer capacitor near the package. Power sequencing: VCCINT must rise before or simultaneously with VCCIO; failure to sequence may cause long-term reliability degradation.
For the 144-LQFP package, allocate a continuous ground plane on layer 2 under the device for return-current paths, and route all eight VCCIO banks with wide traces (>= 0.5 mm) to support switching currents. JTAG signals (TCK/TMS/TDI/TDO) should be routed with 4-mil traces and series 22-47 ohm damping resistors near the FPGA to dampen reflections. Configuration signals (DCLK, nCONFIG, nSTATUS, CONF_DONE) require pull-ups of 10 kohm to VCCIO per APEX-20K reference designs.
Do not leave MSEL0/MSEL1 floating; these pins must be strapped to VCCIO or GND to select the configuration mode (e.g., MSEL[1:0] = 00 for passive serial, 10 for JTAG-only). Floating MSEL pins cause configuration failures that appear as intermittent CONF_DONE never-asserted behavior. Also ensure the EPC2 or EPC16 configuration PROM shares a common ground with the FPGA and that DCLK runs at <= 33 MHz per APEX-20K datasheet timing. Reset nCONFIG after power-up for at least 2 us before initiating configuration.
Informações de conformidade
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status were not explicitly stated in the verified web data. APEX-20K devices predate the widespread adoption of RoHS; many original Altera APEX-20K parts were non-RoHS. Verify with the manufacturer's material declaration or product change notice (PCN) before use in RoHS-restricted applications.