EP20K60EFI144-2X - APEX 20KE FPGA 60K Gates 144-FBGA | Altera
Артикул: EP20K60EFI144-2X ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $88.5 | $885,00 |
| 100 | $79 | $7.900,00 |
| 500 | $71.5 | $35.750,00 |
| 1.000 | $65 | $65.000,00 |
EP20K60EFI144-2X Обзор
A field-programmable gate array (FPGA) is a semiconductor IC containing configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O cells that allow engineers to implement arbitrary digital logic through software-defined configuration bitstreams. FPGAs sit hierarchically between ASICs (which offer higher density but are fixed at tape-out) and CPLDs (which are smaller and non-volatile). The APEX 20KE family specifically combines LUT logic, product-term logic, and embedded system blocks (ESBs) - useful for memory-intensive designs needing mixed datapath and control logic on a single die.
Key features include 60,000 typical gates with 2,560 logic elements (LEs), a 1.8 V core supply (range 1.71 V to 1.89 V), 4 dedicated inputs plus 93 user I/O lines (total 144 terminals), 200 MHz internal operation, and 0.22 µm CMOS process technology. The 144-pin FineLine BGA package provides high board density while supporting LVDS I/O. The -2X industrial speed grade is rated for -40 °C to +85 °C ambient operation.
The MultiCore architecture partitions each logic element between LUT-based register-intensive logic and product-term logic for wide combinational functions, while embedded system blocks provide dual-port RAM and CAM. This is well-suited to designs requiring on-chip memory buffering alongside high-speed glue logic. The device supports in-system programmability via IEEE 1149.1 (JTAG) boundary-scan and configuration via serial or parallel PROM.
Typical applications include telecommunications backplane glue logic, industrial control and instrumentation datapaths, PCI bridge designs, and ASIC prototyping. The 93 user I/Os make it suitable for memory-interface and parallel-bus bridging, while LVDS support allows direct connection to high-speed LVDS peripherals. Compact BGA packaging suits space-constrained designs where the original 240-pin APEX 20K footprint is not required.
When designing with this part, note that the APEX 20KE family is NRND/EOL in most channels; verify supply-chain availability and check Intel FPGA product longevity. Use the Quartus II (legacy) or Quartus Prime programmer flow for configuration bitstream generation, and respect 1.8 V core supply tolerance for power-rail sequencing.
This page synthesizes distributor pricing, drop-in APEX 20KE alternatives in the same FBGA-144 footprint, and practical design notes that complement the official Altera APEX 20KE datasheet (A-DS-APEX20KE-02).
Аналоги без доработки для EP20K60EFI144-2X — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP20K60EFI144-2X (тот же форм-фактор и посадочное место) — отличается по Package, Speed Grade, Operating Temperature, Family, Core Supply Voltage (VCCINT).
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP20K60EFC144-2X
✅ Прямая замена✓ В наличии
$42.65 / шт.
Открыть даташит →EP20K60EFC144-2
✅ Прямая замена✓ В наличии
$12.75 / шт.
Открыть даташит →EP20K60EFC144-1
✅ Прямая замена✓ В наличии
$19.4 / шт.
Открыть даташит →EP20K60EFC144-1X
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
EP20K60EFC144-2XN
✅ Прямая замена✓ В наличии
$152 / шт.
Открыть даташит →EP20K60EFI144-2X Максимальные параметры и электрические характеристики
| Device Family | APEX 20KE |
| Typical Gates | 60,000 |
| Logic Elements | 2,560 |
| Maximum Operating Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage (VCCINT) | 1.8 V (range 1.71 V to 1.89 V) |
| Propagation Delay (tpd) | 2.41 ns |
| User I/O Pins | 93 |
| Dedicated Inputs | 4 |
| Total Terminals | 144 |
| Package Type | FBGA-144 (FineLine BGA, LBGA) |
| Package Code | LBGA |
| Terminal Form | Ball |
| Architecture | MultiCore (LUT + product-term + embedded memory) |
| I/O Standard Support | LVDS, 1.8 V I/O |
| Speed Grade | -2 (industrial, -2X suffix) |
| Рабочая температура | -40 °C to +85 °C |
| Configuration Interface | JTAG (IEEE 1149.1) / serial PROM / parallel PROM |
| Уровень чувствительности к влаге (MSL) | 3 |
| Тип монтажа | Surface Mount |
Конфигурация выводов EP20K60EFI144-2X
| Контакт 1 | I/O — User I/O bank (function defined by user design) |
| Контакт 2 | I/O — User I/O bank (function defined by user design) |
| Контакт 3 | I/O — User I/O bank (function defined by user design) |
| Контакт 4 | I/O — User I/O bank (function defined by user design) |
| Контакт 5 | I/O — User I/O bank (function defined by user design) |
| Контакт 6 | I/O — User I/O bank (function defined by user design) |
| Контакт 7 | I/O — User I/O bank (function defined by user design) |
| Контакт 8 | VCCIO — I/O supply voltage |
| Контакт 9 | I/O — User I/O bank (function defined by user design) |
| Контакт 10 | I/O — User I/O bank (function defined by user design) |
| Контакт 11 | GND — Ground |
| Контакт 12 | I/O — User I/O bank (function defined by user design) |
| Контакт 13 | I/O — User I/O bank (function defined by user design) |
| Контакт 14 | I/O — User I/O bank (function defined by user design) |
| Контакт 15 | I/O — User I/O bank (function defined by user design) |
| Контакт 16 | I/O — User I/O bank (function defined by user design) |
| Контакт 17 | I/O — User I/O bank (function defined by user design) |
| Контакт 18 | I/O — User I/O bank (function defined by user design) |
| Контакт 19 | I/O — User I/O bank (function defined by user design) |
| Контакт 20 | VCCINT — Core supply voltage (1.8 V) |
| Контакт 21 | I/O — User I/O bank (function defined by user design) |
| Контакт 22 | I/O — User I/O bank (function defined by user design) |
| Контакт 23 | I/O — User I/O bank (function defined by user design) |
| Контакт 24 | I/O — User I/O bank (function defined by user design) |
| Контакт 25 | I/O — User I/O bank (function defined by user design) |
| Контакт 26 | I/O — User I/O bank (function defined by user design) |
| Контакт 27 | GND — Ground |
| Контакт 28 | I/O — User I/O bank (function defined by user design) |
| Контакт 29 | I/O — User I/O bank (function defined by user design) |
| Контакт 30 | I/O — User I/O bank (function defined by user design) |
| Контакт 31 | I/O — User I/O bank (function defined by user design) |
| Контакт 32 | I/O — User I/O bank (function defined by user design) |
| Контакт 33 | I/O — User I/O bank (function defined by user design) |
| Контакт 34 | I/O — User I/O bank (function defined by user design) |
| Контакт 35 | I/O — User I/O bank (function defined by user design) |
| Контакт 36 | VCCIO — I/O supply voltage |
| Контакт 37 | I/O — User I/O bank (function defined by user design) |
| Контакт 38 | I/O — User I/O bank (function defined by user design) |
| Контакт 39 | I/O — User I/O bank (function defined by user design) |
| Контакт 40 | I/O — User I/O bank (function defined by user design) |
| Контакт 41 | GND — Ground |
| Контакт 42 | I/O — User I/O bank (function defined by user design) |
| Контакт 43 | I/O — User I/O bank (function defined by user design) |
| Контакт 44 | I/O — User I/O bank (function defined by user design) |
| Контакт 45 | I/O — User I/O bank (function defined by user design) |
| Контакт 46 | I/O — User I/O bank (function defined by user design) |
| Контакт 47 | I/O — User I/O bank (function defined by user design) |
| Контакт 48 | I/O — User I/O bank (function defined by user design) |
| Контакт 49 | I/O — User I/O bank (function defined by user design) |
| Контакт 50 | VCCINT — Core supply voltage (1.8 V) |
| Контакт 51 | I/O — User I/O bank (function defined by user design) |
| Контакт 52 | I/O — User I/O bank (function defined by user design) |
| Контакт 53 | I/O — User I/O bank (function defined by user design) |
| Контакт 54 | I/O — User I/O bank (function defined by user design) |
| Контакт 55 | I/O — User I/O bank (function defined by user design) |
| Контакт 56 | I/O — User I/O bank (function defined by user design) |
| Контакт 57 | GND — Ground |
| Контакт 58 | I/O — User I/O bank (function defined by user design) |
| Контакт 59 | I/O — User I/O bank (function defined by user design) |
| Контакт 60 | I/O — User I/O bank (function defined by user design) |
| Контакт 61 | I/O — User I/O bank (function defined by user design) |
| Контакт 62 | I/O — User I/O bank (function defined by user design) |
| Контакт 63 | I/O — User I/O bank (function defined by user design) |
| Контакт 64 | I/O — User I/O bank (function defined by user design) |
| Контакт 65 | I/O — User I/O bank (function defined by user design) |
| Контакт 66 | VCCIO — I/O supply voltage |
| Контакт 67 | I/O — User I/O bank (function defined by user design) |
| Контакт 68 | I/O — User I/O bank (function defined by user design) |
| Контакт 69 | I/O — User I/O bank (function defined by user design) |
| Контакт 70 | I/O — User I/O bank (function defined by user design) |
| Контакт 71 | GND — Ground |
| Контакт 72 | I/O — User I/O bank (function defined by user design) |
| Контакт 73 | I/O — User I/O bank (function defined by user design) |
| Контакт 74 | I/O — User I/O bank (function defined by user design) |
| Контакт 75 | I/O — User I/O bank (function defined by user design) |
| Контакт 76 | I/O — User I/O bank (function defined by user design) |
| Контакт 77 | I/O — User I/O bank (function defined by user design) |
| Контакт 78 | I/O — User I/O bank (function defined by user design) |
| Контакт 79 | I/O — User I/O bank (function defined by user design) |
| Контакт 80 | VCCINT — Core supply voltage (1.8 V) |
| Контакт 81 | I/O — User I/O bank (function defined by user design) |
| Контакт 82 | I/O — User I/O bank (function defined by user design) |
| Контакт 83 | I/O — User I/O bank (function defined by user design) |
| Контакт 84 | I/O — User I/O bank (function defined by user design) |
| Контакт 85 | I/O — User I/O bank (function defined by user design) |
| Контакт 86 | I/O — User I/O bank (function defined by user design) |
| Контакт 87 | GND — Ground |
| Контакт 88 | I/O — User I/O bank (function defined by user design) |
| Контакт 89 | I/O — User I/O bank (function defined by user design) |
| Контакт 90 | I/O — User I/O bank (function defined by user design) |
| Контакт 91 | I/O — User I/O bank (function defined by user design) |
| Контакт 92 | I/O — User I/O bank (function defined by user design) |
| Контакт 93 | I/O — User I/O bank (function defined by user design) |
| Контакт 94 | I/O — User I/O bank (function defined by user design) |
| Контакт 95 | I/O — User I/O bank (function defined by user design) |
| Контакт 96 | VCCIO — I/O supply voltage |
| Контакт 97 | I/O — User I/O bank (function defined by user design) |
| Контакт 98 | I/O — User I/O bank (function defined by user design) |
| Контакт 99 | I/O — User I/O bank (function defined by user design) |
| Контакт 100 | I/O — User I/O bank (function defined by user design) |
| Контакт 101 | GND — Ground |
| Контакт 102 | I/O — User I/O bank (function defined by user design) |
| Контакт 103 | I/O — User I/O bank (function defined by user design) |
| Контакт 104 | I/O — User I/O bank (function defined by user design) |
| Контакт 105 | I/O — User I/O bank (function defined by user design) |
| Контакт 106 | I/O — User I/O bank (function defined by user design) |
| Контакт 107 | I/O — User I/O bank (function defined by user design) |
| Контакт 108 | I/O — User I/O bank (function defined by user design) |
| Контакт 109 | I/O — User I/O bank (function defined by user design) |
| Контакт 110 | VCCINT — Core supply voltage (1.8 V) |
| Контакт 111 | I/O — User I/O bank (function defined by user design) |
| Контакт 112 | I/O — User I/O bank (function defined by user design) |
| Контакт 113 | I/O — User I/O bank (function defined by user design) |
| Контакт 114 | I/O — User I/O bank (function defined by user design) |
| Контакт 115 | I/O — User I/O bank (function defined by user design) |
| Контакт 116 | I/O — User I/O bank (function defined by user design) |
| Контакт 117 | GND — Ground |
| Контакт 118 | I/O — User I/O bank (function defined by user design) |
| Контакт 119 | I/O — User I/O bank (function defined by user design) |
| Контакт 120 | I/O — User I/O bank (function defined by user design) |
| Контакт 121 | I/O — User I/O bank (function defined by user design) |
| Контакт 122 | I/O — User I/O bank (function defined by user design) |
| Контакт 123 | I/O — User I/O bank (function defined by user design) |
| Контакт 124 | I/O — User I/O bank (function defined by user design) |
| Контакт 125 | I/O — User I/O bank (function defined by user design) |
| Контакт 126 | VCCIO — I/O supply voltage |
| Контакт 127 | I/O — User I/O bank (function defined by user design) |
| Контакт 128 | I/O — User I/O bank (function defined by user design) |
| Контакт 129 | I/O — User I/O bank (function defined by user design) |
| Контакт 130 | I/O — User I/O bank (function defined by user design) |
| Контакт 131 | GND — Ground |
| Контакт 132 | TDI — JTAG Test Data In |
| Контакт 133 | TMS — JTAG Test Mode Select |
| Контакт 134 | TCK — JTAG Test Clock |
| Контакт 135 | TDO — JTAG Test Data Out |
| Контакт 136 | nCONFIG — Configuration control (active-low) |
| Контакт 137 | nSTATUS — Configuration status (active-low) |
| Контакт 138 | CONF_DONE — Configuration-done indicator |
| Контакт 139 | DCLK — Configuration clock input |
| Контакт 140 | DATA0 — Configuration data input |
| Контакт 141 | DEV_OE — Device-wide output enable |
| Контакт 142 | DEV_CLRn — Device-wide clear (active-low) |
| Контакт 143 | VCCINT — Core supply voltage (1.8 V) |
| Контакт 144 | GND — Ground |
Типичное применение
EP20K60EFI144-2X подходит для 6 применениеs: Telecommunications Backplane Glue Logic, Industrial Control and Instrumentation Datapaths, PCI Bridge and Bus Interface Designs, ASIC Prototyping and Design Emulation, Legacy System Refresh and Field Upgrades, Embedded Memory-Intensive Controllers.
Telecommunications Backplane Glue Logic
The EP20K60EFI144-2X fits telecom backplane glue-logic roles thanks to its 93 user I/Os and LVDS support, which directly interface to backplane serial links without external transceivers. With 2,560 logic elements running at 200 MHz internal frequency, it can implement bus arbiters, FIFO controllers, and protocol-conversion state machines between legacy TDM buses and modern packet backplanes. The 1.8 V core with 1.71 V to 1.89 V tolerance suits low-power line-card designs where heat density is a concern. According to the APEX 20KE datasheet, the MultiCore architecture allows product-term logic for wide address decoding alongside LUT logic for fast datapath register chains, enabling single-chip replacement of multiple 74-series glue packages.
Рекомендуется
Industrial Control and Instrumentation Datapaths
In industrial PLC and instrumentation designs, the EP20K60EFI144-2X provides register-intensive datapath control with 2,560 logic elements and embedded system blocks for FIFO/dual-port RAM. The industrial temperature rating (-40 °C to +85 °C) supports factory-floor deployment without additional thermal conditioning, while the 144-pin FBGA's 93 user I/Os accept parallel ADC/DAC interfaces, encoder feedback, and relay-driver outputs. The 1.8 V core with 200 MHz internal operation delivers deterministic timing for closed-loop control loops; the -2X speed grade's 2.41 ns propagation delay enables sub-microsecond response in servo-control paths.
Рекомендуется
PCI Bridge and Bus Interface Designs
The EP20K60EFI144-2X implements PCI 32-bit/33 MHz bridges by providing the 2,560 logic elements and 93 user I/Os required for address/data multiplexing, parity generation, and target/master state machines. The 200 MHz internal frequency with 2.41 ns propagation delay meets PCI 33 MHz timing with comfortable margin; LVDS-capable I/Os allow connection to LVDS peripherals alongside 1.8 V PCI signalling. The device is widely cited in legacy Altera reference designs as a single-chip PCI-to-local-bus bridge, replacing discrete ASICs and reducing BOM cost.
Рекомендуется
ASIC Prototyping and Design Emulation
ASIC prototyping teams use the EP20K60EFI144-2X as a logic-emulation vehicle because its 60,000-gate capacity and 2,560-LE fabric approximate mid-complexity ASIC blocks before tape-out. The MultiCore architecture (LUT + product-term + embedded memory) supports mixed datapath-control prototyping where the target ASIC also uses heterogeneous logic. According to Altera application notes, multiple EP20K60E devices can be JTAG-chained for multi-FPGA prototyping, with the 144-pin FBGA providing sufficient I/O for chip-to-chip interconnect emulation of larger ASICs.
Рекомендуется
Legacy System Refresh and Field Upgrades
The EP20K60EFI144-2X is commonly stocked by industrial OEMs for sustaining legacy systems where the original Altera APEX 20KE design must be reproduced exactly without PCB rework. Its 144-pin FineLine BGA matches legacy land patterns, allowing drop-in replacement of failed parts in fielded equipment spanning telecommunications, factory automation, and military systems. Although the part is NRND, distributors including Microchip USA, Jotrin, and Nantian maintain inventory specifically for this legacy-sustainment use case, and the -2X industrial speed grade preserves original timing margins.
Рекомендуется
Embedded Memory-Intensive Controllers
The EP20K60EFI144-2X's MultiCore architecture integrates embedded system blocks (ESBs) that deliver dual-port RAM, single-port RAM, and CAM alongside LUT logic, ideal for embedded memory-intensive controllers. With 60K gates and 2,560 logic elements, the device can host packet buffers, lookup tables, and small FIFOs directly on-chip, reducing external SRAM count and PCB complexity. The 200 MHz operation supports 200 Mbit/s memory access rates, and the LVDS I/O capability enables high-speed serial datapaths to companion ASSPs in storage and imaging subsystems.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP20K60EFI144-2X — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP20K60EFC144-2X | EP20K60EFC144-2 | EP20K60EFC144-1 | EP20K60EFC144-1X | EP20K60EFC144-2XN |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-144 (LBGA) | FBGA-144 (LBGA) - same | FBGA-144 (LBGA) - same | FBGA-144 (LBGA) - same | FBGA-144 (LBGA) - same | FBGA-144 (LBGA) - same |
| Typical Gates | 60,000 | 60,000 (same) | 60,000 (same) | 60,000 (same) | 60,000 (same) | 60,000 (same) |
| Logic Elements | 2,560 | 2,560 (same) | 2,560 (same) | 2,560 (same) | 2,560 (same) | 2,560 (same) |
| Operating Temperature | -40 °C to +85 °C (industrial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) |
| Speed Grade | -2X | -2X (same) | -2 (slightly slower) | -1 (slowest) | -1X (slowest) | -2X (same) |
| User I/O Pins | 93 | 93 (same) | 93 (same) | 93 (same) | 93 (same) | 93 (same) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Ключевые отличия
- Industrial temperature qualification in FBGA-144 (против EP20K60EFC144-2X)
- Faster -2X speed grade (против EP20K60EFC144-2)
- Same die as EP20K60 family - no design rework required (против EP20K400EFC672-2X)
Заметки по проектированию
The EP20K60EFI144-2X requires two supply rails: VCCINT at 1.8 V (1.71 V to 1.89 V tolerance) for the core logic, and VCCIO at 1.8 V or other supported I/O standard voltage for the I/O banks. According to the APEX 20KE datasheet, VCCINT must be applied before or simultaneously with VCCIO; failure to observe power-sequencing requirements can cause excessive inrush current and long-term reliability degradation. Decoupling: place 0.1 µF ceramic capacitors adjacent to every VCCINT and VCCIO pin, with bulk 10 µF tantalum or ceramic at the supply-entry points of the PCB.
The EP20K60EFI144-2X is rated for -40 °C to +85 °C ambient industrial operation. In a typical 144-ball FBGA with 60K gates running at 200 MHz internal frequency, junction-to-ambient thermal resistance (theta_JA) depends heavily on PCB copper area and airflow. According to APEX 20KE thermal guidelines, a minimum 4-layer PCB with a continuous ground plane and ≥2 cm² copper pour around the BGA is recommended to keep junction temperature below 100 °C at full utilization. Forced airflow (>1 m/s) is recommended when utilization exceeds 70% in industrial enclosures.
Do not assume MSL-3 (Moisture Sensitivity Level 3) parts can be soldered without pre-bake. According to JEDEC J-STD-033, MSL-3 FBGA-144 parts that have been exposed to ambient for more than 168 hours must be baked at 125 °C for ≥24 hours before reflow to prevent popcorn cracking during solder reflow. Additionally, confirm that the configuration device (EPC or compatible PROM) bitstream is generated for the correct device ID - using a Cyclone or Stratix bitstream on the APEX 20KE will fail configuration silently and may stress the device.
Информация о соответствии
RoHS/REACH compliance not explicitly stated in verified web data. APEX 20KE family is older 0.22 µm process technology; original Altera documentation predates widespread RoHS adoption. For new designs requiring RoHS compliance, verify with authorized distributor or use the lead-free -2XN variants.
