EP20K60EFI144-2X - APEX 20KE FPGA 60K Gates 144-FBGA | Altera
N.º da peça: EP20K60EFI144-2X ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $88.5 | $885,00 |
| 100 | $79 | $7.900,00 |
| 500 | $71.5 | $35.750,00 |
| 1.000 | $65 | $65.000,00 |
EP20K60EFI144-2X Visão geral
A field-programmable gate array (FPGA) is a semiconductor IC containing configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O cells that allow engineers to implement arbitrary digital logic through software-defined configuration bitstreams. FPGAs sit hierarchically between ASICs (which offer higher density but are fixed at tape-out) and CPLDs (which are smaller and non-volatile). The APEX 20KE family specifically combines LUT logic, product-term logic, and embedded system blocks (ESBs) - useful for memory-intensive designs needing mixed datapath and control logic on a single die.
Key features include 60,000 typical gates with 2,560 logic elements (LEs), a 1.8 V core supply (range 1.71 V to 1.89 V), 4 dedicated inputs plus 93 user I/O lines (total 144 terminals), 200 MHz internal operation, and 0.22 µm CMOS process technology. The 144-pin FineLine BGA package provides high board density while supporting LVDS I/O. The -2X industrial speed grade is rated for -40 °C to +85 °C ambient operation.
The MultiCore architecture partitions each logic element between LUT-based register-intensive logic and product-term logic for wide combinational functions, while embedded system blocks provide dual-port RAM and CAM. This is well-suited to designs requiring on-chip memory buffering alongside high-speed glue logic. The device supports in-system programmability via IEEE 1149.1 (JTAG) boundary-scan and configuration via serial or parallel PROM.
Typical applications include telecommunications backplane glue logic, industrial control and instrumentation datapaths, PCI bridge designs, and ASIC prototyping. The 93 user I/Os make it suitable for memory-interface and parallel-bus bridging, while LVDS support allows direct connection to high-speed LVDS peripherals. Compact BGA packaging suits space-constrained designs where the original 240-pin APEX 20K footprint is not required.
When designing with this part, note that the APEX 20KE family is NRND/EOL in most channels; verify supply-chain availability and check Intel FPGA product longevity. Use the Quartus II (legacy) or Quartus Prime programmer flow for configuration bitstream generation, and respect 1.8 V core supply tolerance for power-rail sequencing.
This page synthesizes distributor pricing, drop-in APEX 20KE alternatives in the same FBGA-144 footprint, and practical design notes that complement the official Altera APEX 20KE datasheet (A-DS-APEX20KE-02).
Alternativas drop-in para EP20K60EFI144-2X — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP20K60EFI144-2X (mesmo formato e footprint) — diferindo em Package, Speed Grade, Operating Temperature, Family, Core Supply Voltage (VCCINT).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP20K60EFC144-2X
✅ Drop-In✓ Em estoque
$42.65 / unidade
Ver ficha técnica →EP20K60EFC144-2
✅ Drop-In✓ Em estoque
$12.75 / unidade
Ver ficha técnica →EP20K60EFC144-1
✅ Drop-In✓ Em estoque
$19.4 / unidade
Ver ficha técnica →EP20K60EFC144-1X
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP20K60EFC144-2XN
✅ Drop-In✓ Em estoque
$152 / unidade
Ver ficha técnica →EP20K60EFI144-2X Classificações máximas e características elétricas
| Device Family | APEX 20KE |
| Typical Gates | 60,000 |
| Logic Elements | 2,560 |
| Maximum Operating Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage (VCCINT) | 1.8 V (range 1.71 V to 1.89 V) |
| Propagation Delay (tpd) | 2.41 ns |
| User I/O Pins | 93 |
| Dedicated Inputs | 4 |
| Total Terminals | 144 |
| Package Type | FBGA-144 (FineLine BGA, LBGA) |
| Package Code | LBGA |
| Terminal Form | Ball |
| Architecture | MultiCore (LUT + product-term + embedded memory) |
| I/O Standard Support | LVDS, 1.8 V I/O |
| Speed Grade | -2 (industrial, -2X suffix) |
| Temperatura de operação | -40 °C to +85 °C |
| Configuration Interface | JTAG (IEEE 1149.1) / serial PROM / parallel PROM |
| Nível de sensibilidade à umidade (MSL) | 3 |
| Tipo de montagem | Surface Mount |
Configuração de pinos do EP20K60EFI144-2X
| Pino 1 | I/O — User I/O bank (function defined by user design) |
| Pino 2 | I/O — User I/O bank (function defined by user design) |
| Pino 3 | I/O — User I/O bank (function defined by user design) |
| Pino 4 | I/O — User I/O bank (function defined by user design) |
| Pino 5 | I/O — User I/O bank (function defined by user design) |
| Pino 6 | I/O — User I/O bank (function defined by user design) |
| Pino 7 | I/O — User I/O bank (function defined by user design) |
| Pino 8 | VCCIO — I/O supply voltage |
| Pino 9 | I/O — User I/O bank (function defined by user design) |
| Pino 10 | I/O — User I/O bank (function defined by user design) |
| Pino 11 | GND — Ground |
| Pino 12 | I/O — User I/O bank (function defined by user design) |
| Pino 13 | I/O — User I/O bank (function defined by user design) |
| Pino 14 | I/O — User I/O bank (function defined by user design) |
| Pino 15 | I/O — User I/O bank (function defined by user design) |
| Pino 16 | I/O — User I/O bank (function defined by user design) |
| Pino 17 | I/O — User I/O bank (function defined by user design) |
| Pino 18 | I/O — User I/O bank (function defined by user design) |
| Pino 19 | I/O — User I/O bank (function defined by user design) |
| Pino 20 | VCCINT — Core supply voltage (1.8 V) |
| Pino 21 | I/O — User I/O bank (function defined by user design) |
| Pino 22 | I/O — User I/O bank (function defined by user design) |
| Pino 23 | I/O — User I/O bank (function defined by user design) |
| Pino 24 | I/O — User I/O bank (function defined by user design) |
| Pino 25 | I/O — User I/O bank (function defined by user design) |
| Pino 26 | I/O — User I/O bank (function defined by user design) |
| Pino 27 | GND — Ground |
| Pino 28 | I/O — User I/O bank (function defined by user design) |
| Pino 29 | I/O — User I/O bank (function defined by user design) |
| Pino 30 | I/O — User I/O bank (function defined by user design) |
| Pino 31 | I/O — User I/O bank (function defined by user design) |
| Pino 32 | I/O — User I/O bank (function defined by user design) |
| Pino 33 | I/O — User I/O bank (function defined by user design) |
| Pino 34 | I/O — User I/O bank (function defined by user design) |
| Pino 35 | I/O — User I/O bank (function defined by user design) |
| Pino 36 | VCCIO — I/O supply voltage |
| Pino 37 | I/O — User I/O bank (function defined by user design) |
| Pino 38 | I/O — User I/O bank (function defined by user design) |
| Pino 39 | I/O — User I/O bank (function defined by user design) |
| Pino 40 | I/O — User I/O bank (function defined by user design) |
| Pino 41 | GND — Ground |
| Pino 42 | I/O — User I/O bank (function defined by user design) |
| Pino 43 | I/O — User I/O bank (function defined by user design) |
| Pino 44 | I/O — User I/O bank (function defined by user design) |
| Pino 45 | I/O — User I/O bank (function defined by user design) |
| Pino 46 | I/O — User I/O bank (function defined by user design) |
| Pino 47 | I/O — User I/O bank (function defined by user design) |
| Pino 48 | I/O — User I/O bank (function defined by user design) |
| Pino 49 | I/O — User I/O bank (function defined by user design) |
| Pino 50 | VCCINT — Core supply voltage (1.8 V) |
| Pino 51 | I/O — User I/O bank (function defined by user design) |
| Pino 52 | I/O — User I/O bank (function defined by user design) |
| Pino 53 | I/O — User I/O bank (function defined by user design) |
| Pino 54 | I/O — User I/O bank (function defined by user design) |
| Pino 55 | I/O — User I/O bank (function defined by user design) |
| Pino 56 | I/O — User I/O bank (function defined by user design) |
| Pino 57 | GND — Ground |
| Pino 58 | I/O — User I/O bank (function defined by user design) |
| Pino 59 | I/O — User I/O bank (function defined by user design) |
| Pino 60 | I/O — User I/O bank (function defined by user design) |
| Pino 61 | I/O — User I/O bank (function defined by user design) |
| Pino 62 | I/O — User I/O bank (function defined by user design) |
| Pino 63 | I/O — User I/O bank (function defined by user design) |
| Pino 64 | I/O — User I/O bank (function defined by user design) |
| Pino 65 | I/O — User I/O bank (function defined by user design) |
| Pino 66 | VCCIO — I/O supply voltage |
| Pino 67 | I/O — User I/O bank (function defined by user design) |
| Pino 68 | I/O — User I/O bank (function defined by user design) |
| Pino 69 | I/O — User I/O bank (function defined by user design) |
| Pino 70 | I/O — User I/O bank (function defined by user design) |
| Pino 71 | GND — Ground |
| Pino 72 | I/O — User I/O bank (function defined by user design) |
| Pino 73 | I/O — User I/O bank (function defined by user design) |
| Pino 74 | I/O — User I/O bank (function defined by user design) |
| Pino 75 | I/O — User I/O bank (function defined by user design) |
| Pino 76 | I/O — User I/O bank (function defined by user design) |
| Pino 77 | I/O — User I/O bank (function defined by user design) |
| Pino 78 | I/O — User I/O bank (function defined by user design) |
| Pino 79 | I/O — User I/O bank (function defined by user design) |
| Pino 80 | VCCINT — Core supply voltage (1.8 V) |
| Pino 81 | I/O — User I/O bank (function defined by user design) |
| Pino 82 | I/O — User I/O bank (function defined by user design) |
| Pino 83 | I/O — User I/O bank (function defined by user design) |
| Pino 84 | I/O — User I/O bank (function defined by user design) |
| Pino 85 | I/O — User I/O bank (function defined by user design) |
| Pino 86 | I/O — User I/O bank (function defined by user design) |
| Pino 87 | GND — Ground |
| Pino 88 | I/O — User I/O bank (function defined by user design) |
| Pino 89 | I/O — User I/O bank (function defined by user design) |
| Pino 90 | I/O — User I/O bank (function defined by user design) |
| Pino 91 | I/O — User I/O bank (function defined by user design) |
| Pino 92 | I/O — User I/O bank (function defined by user design) |
| Pino 93 | I/O — User I/O bank (function defined by user design) |
| Pino 94 | I/O — User I/O bank (function defined by user design) |
| Pino 95 | I/O — User I/O bank (function defined by user design) |
| Pino 96 | VCCIO — I/O supply voltage |
| Pino 97 | I/O — User I/O bank (function defined by user design) |
| Pino 98 | I/O — User I/O bank (function defined by user design) |
| Pino 99 | I/O — User I/O bank (function defined by user design) |
| Pino 100 | I/O — User I/O bank (function defined by user design) |
| Pino 101 | GND — Ground |
| Pino 102 | I/O — User I/O bank (function defined by user design) |
| Pino 103 | I/O — User I/O bank (function defined by user design) |
| Pino 104 | I/O — User I/O bank (function defined by user design) |
| Pino 105 | I/O — User I/O bank (function defined by user design) |
| Pino 106 | I/O — User I/O bank (function defined by user design) |
| Pino 107 | I/O — User I/O bank (function defined by user design) |
| Pino 108 | I/O — User I/O bank (function defined by user design) |
| Pino 109 | I/O — User I/O bank (function defined by user design) |
| Pino 110 | VCCINT — Core supply voltage (1.8 V) |
| Pino 111 | I/O — User I/O bank (function defined by user design) |
| Pino 112 | I/O — User I/O bank (function defined by user design) |
| Pino 113 | I/O — User I/O bank (function defined by user design) |
| Pino 114 | I/O — User I/O bank (function defined by user design) |
| Pino 115 | I/O — User I/O bank (function defined by user design) |
| Pino 116 | I/O — User I/O bank (function defined by user design) |
| Pino 117 | GND — Ground |
| Pino 118 | I/O — User I/O bank (function defined by user design) |
| Pino 119 | I/O — User I/O bank (function defined by user design) |
| Pino 120 | I/O — User I/O bank (function defined by user design) |
| Pino 121 | I/O — User I/O bank (function defined by user design) |
| Pino 122 | I/O — User I/O bank (function defined by user design) |
| Pino 123 | I/O — User I/O bank (function defined by user design) |
| Pino 124 | I/O — User I/O bank (function defined by user design) |
| Pino 125 | I/O — User I/O bank (function defined by user design) |
| Pino 126 | VCCIO — I/O supply voltage |
| Pino 127 | I/O — User I/O bank (function defined by user design) |
| Pino 128 | I/O — User I/O bank (function defined by user design) |
| Pino 129 | I/O — User I/O bank (function defined by user design) |
| Pino 130 | I/O — User I/O bank (function defined by user design) |
| Pino 131 | GND — Ground |
| Pino 132 | TDI — JTAG Test Data In |
| Pino 133 | TMS — JTAG Test Mode Select |
| Pino 134 | TCK — JTAG Test Clock |
| Pino 135 | TDO — JTAG Test Data Out |
| Pino 136 | nCONFIG — Configuration control (active-low) |
| Pino 137 | nSTATUS — Configuration status (active-low) |
| Pino 138 | CONF_DONE — Configuration-done indicator |
| Pino 139 | DCLK — Configuration clock input |
| Pino 140 | DATA0 — Configuration data input |
| Pino 141 | DEV_OE — Device-wide output enable |
| Pino 142 | DEV_CLRn — Device-wide clear (active-low) |
| Pino 143 | VCCINT — Core supply voltage (1.8 V) |
| Pino 144 | GND — Ground |
Aplicações típicas
EP20K60EFI144-2X é adequado para 6 aplicaçãos: Telecommunications Backplane Glue Logic, Industrial Control and Instrumentation Datapaths, PCI Bridge and Bus Interface Designs, ASIC Prototyping and Design Emulation, Legacy System Refresh and Field Upgrades, Embedded Memory-Intensive Controllers.
Telecommunications Backplane Glue Logic
The EP20K60EFI144-2X fits telecom backplane glue-logic roles thanks to its 93 user I/Os and LVDS support, which directly interface to backplane serial links without external transceivers. With 2,560 logic elements running at 200 MHz internal frequency, it can implement bus arbiters, FIFO controllers, and protocol-conversion state machines between legacy TDM buses and modern packet backplanes. The 1.8 V core with 1.71 V to 1.89 V tolerance suits low-power line-card designs where heat density is a concern. According to the APEX 20KE datasheet, the MultiCore architecture allows product-term logic for wide address decoding alongside LUT logic for fast datapath register chains, enabling single-chip replacement of multiple 74-series glue packages.
Recomendado
Industrial Control and Instrumentation Datapaths
In industrial PLC and instrumentation designs, the EP20K60EFI144-2X provides register-intensive datapath control with 2,560 logic elements and embedded system blocks for FIFO/dual-port RAM. The industrial temperature rating (-40 °C to +85 °C) supports factory-floor deployment without additional thermal conditioning, while the 144-pin FBGA's 93 user I/Os accept parallel ADC/DAC interfaces, encoder feedback, and relay-driver outputs. The 1.8 V core with 200 MHz internal operation delivers deterministic timing for closed-loop control loops; the -2X speed grade's 2.41 ns propagation delay enables sub-microsecond response in servo-control paths.
Recomendado
PCI Bridge and Bus Interface Designs
The EP20K60EFI144-2X implements PCI 32-bit/33 MHz bridges by providing the 2,560 logic elements and 93 user I/Os required for address/data multiplexing, parity generation, and target/master state machines. The 200 MHz internal frequency with 2.41 ns propagation delay meets PCI 33 MHz timing with comfortable margin; LVDS-capable I/Os allow connection to LVDS peripherals alongside 1.8 V PCI signalling. The device is widely cited in legacy Altera reference designs as a single-chip PCI-to-local-bus bridge, replacing discrete ASICs and reducing BOM cost.
Recomendado
ASIC Prototyping and Design Emulation
ASIC prototyping teams use the EP20K60EFI144-2X as a logic-emulation vehicle because its 60,000-gate capacity and 2,560-LE fabric approximate mid-complexity ASIC blocks before tape-out. The MultiCore architecture (LUT + product-term + embedded memory) supports mixed datapath-control prototyping where the target ASIC also uses heterogeneous logic. According to Altera application notes, multiple EP20K60E devices can be JTAG-chained for multi-FPGA prototyping, with the 144-pin FBGA providing sufficient I/O for chip-to-chip interconnect emulation of larger ASICs.
Recomendado
Legacy System Refresh and Field Upgrades
The EP20K60EFI144-2X is commonly stocked by industrial OEMs for sustaining legacy systems where the original Altera APEX 20KE design must be reproduced exactly without PCB rework. Its 144-pin FineLine BGA matches legacy land patterns, allowing drop-in replacement of failed parts in fielded equipment spanning telecommunications, factory automation, and military systems. Although the part is NRND, distributors including Microchip USA, Jotrin, and Nantian maintain inventory specifically for this legacy-sustainment use case, and the -2X industrial speed grade preserves original timing margins.
Recomendado
Embedded Memory-Intensive Controllers
The EP20K60EFI144-2X's MultiCore architecture integrates embedded system blocks (ESBs) that deliver dual-port RAM, single-port RAM, and CAM alongside LUT logic, ideal for embedded memory-intensive controllers. With 60K gates and 2,560 logic elements, the device can host packet buffers, lookup tables, and small FIFOs directly on-chip, reducing external SRAM count and PCB complexity. The 200 MHz operation supports 200 Mbit/s memory access rates, and the LVDS I/O capability enables high-speed serial datapaths to companion ASSPs in storage and imaging subsystems.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP20K60EFI144-2X — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP20K60EFC144-2X | EP20K60EFC144-2 | EP20K60EFC144-1 | EP20K60EFC144-1X | EP20K60EFC144-2XN |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-144 (LBGA) | FBGA-144 (LBGA) - same | FBGA-144 (LBGA) - same | FBGA-144 (LBGA) - same | FBGA-144 (LBGA) - same | FBGA-144 (LBGA) - same |
| Typical Gates | 60,000 | 60,000 (same) | 60,000 (same) | 60,000 (same) | 60,000 (same) | 60,000 (same) |
| Logic Elements | 2,560 | 2,560 (same) | 2,560 (same) | 2,560 (same) | 2,560 (same) | 2,560 (same) |
| Operating Temperature | -40 °C to +85 °C (industrial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) |
| Speed Grade | -2X | -2X (same) | -2 (slightly slower) | -1 (slowest) | -1X (slowest) | -2X (same) |
| User I/O Pins | 93 | 93 (same) | 93 (same) | 93 (same) | 93 (same) | 93 (same) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principais diferenciais
- Industrial temperature qualification in FBGA-144 (vs EP20K60EFC144-2X)
- Faster -2X speed grade (vs EP20K60EFC144-2)
- Same die as EP20K60 family - no design rework required (vs EP20K400EFC672-2X)
Notas de projeto
The EP20K60EFI144-2X requires two supply rails: VCCINT at 1.8 V (1.71 V to 1.89 V tolerance) for the core logic, and VCCIO at 1.8 V or other supported I/O standard voltage for the I/O banks. According to the APEX 20KE datasheet, VCCINT must be applied before or simultaneously with VCCIO; failure to observe power-sequencing requirements can cause excessive inrush current and long-term reliability degradation. Decoupling: place 0.1 µF ceramic capacitors adjacent to every VCCINT and VCCIO pin, with bulk 10 µF tantalum or ceramic at the supply-entry points of the PCB.
The EP20K60EFI144-2X is rated for -40 °C to +85 °C ambient industrial operation. In a typical 144-ball FBGA with 60K gates running at 200 MHz internal frequency, junction-to-ambient thermal resistance (theta_JA) depends heavily on PCB copper area and airflow. According to APEX 20KE thermal guidelines, a minimum 4-layer PCB with a continuous ground plane and ≥2 cm² copper pour around the BGA is recommended to keep junction temperature below 100 °C at full utilization. Forced airflow (>1 m/s) is recommended when utilization exceeds 70% in industrial enclosures.
Do not assume MSL-3 (Moisture Sensitivity Level 3) parts can be soldered without pre-bake. According to JEDEC J-STD-033, MSL-3 FBGA-144 parts that have been exposed to ambient for more than 168 hours must be baked at 125 °C for ≥24 hours before reflow to prevent popcorn cracking during solder reflow. Additionally, confirm that the configuration device (EPC or compatible PROM) bitstream is generated for the correct device ID - using a Cyclone or Stratix bitstream on the APEX 20KE will fail configuration silently and may stress the device.
Informações de conformidade
RoHS/REACH compliance not explicitly stated in verified web data. APEX 20KE family is older 0.22 µm process technology; original Altera documentation predates widespread RoHS adoption. For new designs requiring RoHS compliance, verify with authorized distributor or use the lead-free -2XN variants.
