EP20K60EFI144-2X - APEX 20KE FPGA 60K Gates 144-FBGA | Altera
Référence : EP20K60EFI144-2X ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $88.5 | $885,00 |
| 100 | $79 | $7 900,00 |
| 500 | $71.5 | $35 750,00 |
| 1 000 | $65 | $65 000,00 |
EP20K60EFI144-2X Présentation
A field-programmable gate array (FPGA) is a semiconductor IC containing configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O cells that allow engineers to implement arbitrary digital logic through software-defined configuration bitstreams. FPGAs sit hierarchically between ASICs (which offer higher density but are fixed at tape-out) and CPLDs (which are smaller and non-volatile). The APEX 20KE family specifically combines LUT logic, product-term logic, and embedded system blocks (ESBs) - useful for memory-intensive designs needing mixed datapath and control logic on a single die.
Key features include 60,000 typical gates with 2,560 logic elements (LEs), a 1.8 V core supply (range 1.71 V to 1.89 V), 4 dedicated inputs plus 93 user I/O lines (total 144 terminals), 200 MHz internal operation, and 0.22 µm CMOS process technology. The 144-pin FineLine BGA package provides high board density while supporting LVDS I/O. The -2X industrial speed grade is rated for -40 °C to +85 °C ambient operation.
The MultiCore architecture partitions each logic element between LUT-based register-intensive logic and product-term logic for wide combinational functions, while embedded system blocks provide dual-port RAM and CAM. This is well-suited to designs requiring on-chip memory buffering alongside high-speed glue logic. The device supports in-system programmability via IEEE 1149.1 (JTAG) boundary-scan and configuration via serial or parallel PROM.
Typical applications include telecommunications backplane glue logic, industrial control and instrumentation datapaths, PCI bridge designs, and ASIC prototyping. The 93 user I/Os make it suitable for memory-interface and parallel-bus bridging, while LVDS support allows direct connection to high-speed LVDS peripherals. Compact BGA packaging suits space-constrained designs where the original 240-pin APEX 20K footprint is not required.
When designing with this part, note that the APEX 20KE family is NRND/EOL in most channels; verify supply-chain availability and check Intel FPGA product longevity. Use the Quartus II (legacy) or Quartus Prime programmer flow for configuration bitstream generation, and respect 1.8 V core supply tolerance for power-rail sequencing.
This page synthesizes distributor pricing, drop-in APEX 20KE alternatives in the same FBGA-144 footprint, and practical design notes that complement the official Altera APEX 20KE datasheet (A-DS-APEX20KE-02).
Alternatives de remplacement direct pour EP20K60EFI144-2X — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K60EFI144-2X (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Family, Core Supply Voltage (VCCINT).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K60EFC144-2X
✅ Remplacement direct✓ En stock
$42.65 / unité
Voir la fiche technique →EP20K60EFC144-2
✅ Remplacement direct✓ En stock
$12.75 / unité
Voir la fiche technique →EP20K60EFC144-1
✅ Remplacement direct✓ En stock
$19.4 / unité
Voir la fiche technique →EP20K60EFC144-1X
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP20K60EFC144-2XN
✅ Remplacement direct✓ En stock
$152 / unité
Voir la fiche technique →EP20K60EFI144-2X Valeurs maximales et caractéristiques électriques
| Device Family | APEX 20KE |
| Typical Gates | 60,000 |
| Logic Elements | 2,560 |
| Maximum Operating Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage (VCCINT) | 1.8 V (range 1.71 V to 1.89 V) |
| Propagation Delay (tpd) | 2.41 ns |
| User I/O Pins | 93 |
| Dedicated Inputs | 4 |
| Total Terminals | 144 |
| Package Type | FBGA-144 (FineLine BGA, LBGA) |
| Package Code | LBGA |
| Terminal Form | Ball |
| Architecture | MultiCore (LUT + product-term + embedded memory) |
| I/O Standard Support | LVDS, 1.8 V I/O |
| Speed Grade | -2 (industrial, -2X suffix) |
| Température de fonctionnement | -40 °C to +85 °C |
| Configuration Interface | JTAG (IEEE 1149.1) / serial PROM / parallel PROM |
| Niveau de sensibilité à l'humidité (MSL) | 3 |
| Type de montage | Surface Mount |
Configuration des broches de EP20K60EFI144-2X
| Broche 1 | I/O — User I/O bank (function defined by user design) |
| Broche 2 | I/O — User I/O bank (function defined by user design) |
| Broche 3 | I/O — User I/O bank (function defined by user design) |
| Broche 4 | I/O — User I/O bank (function defined by user design) |
| Broche 5 | I/O — User I/O bank (function defined by user design) |
| Broche 6 | I/O — User I/O bank (function defined by user design) |
| Broche 7 | I/O — User I/O bank (function defined by user design) |
| Broche 8 | VCCIO — I/O supply voltage |
| Broche 9 | I/O — User I/O bank (function defined by user design) |
| Broche 10 | I/O — User I/O bank (function defined by user design) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O bank (function defined by user design) |
| Broche 13 | I/O — User I/O bank (function defined by user design) |
| Broche 14 | I/O — User I/O bank (function defined by user design) |
| Broche 15 | I/O — User I/O bank (function defined by user design) |
| Broche 16 | I/O — User I/O bank (function defined by user design) |
| Broche 17 | I/O — User I/O bank (function defined by user design) |
| Broche 18 | I/O — User I/O bank (function defined by user design) |
| Broche 19 | I/O — User I/O bank (function defined by user design) |
| Broche 20 | VCCINT — Core supply voltage (1.8 V) |
| Broche 21 | I/O — User I/O bank (function defined by user design) |
| Broche 22 | I/O — User I/O bank (function defined by user design) |
| Broche 23 | I/O — User I/O bank (function defined by user design) |
| Broche 24 | I/O — User I/O bank (function defined by user design) |
| Broche 25 | I/O — User I/O bank (function defined by user design) |
| Broche 26 | I/O — User I/O bank (function defined by user design) |
| Broche 27 | GND — Ground |
| Broche 28 | I/O — User I/O bank (function defined by user design) |
| Broche 29 | I/O — User I/O bank (function defined by user design) |
| Broche 30 | I/O — User I/O bank (function defined by user design) |
| Broche 31 | I/O — User I/O bank (function defined by user design) |
| Broche 32 | I/O — User I/O bank (function defined by user design) |
| Broche 33 | I/O — User I/O bank (function defined by user design) |
| Broche 34 | I/O — User I/O bank (function defined by user design) |
| Broche 35 | I/O — User I/O bank (function defined by user design) |
| Broche 36 | VCCIO — I/O supply voltage |
| Broche 37 | I/O — User I/O bank (function defined by user design) |
| Broche 38 | I/O — User I/O bank (function defined by user design) |
| Broche 39 | I/O — User I/O bank (function defined by user design) |
| Broche 40 | I/O — User I/O bank (function defined by user design) |
| Broche 41 | GND — Ground |
| Broche 42 | I/O — User I/O bank (function defined by user design) |
| Broche 43 | I/O — User I/O bank (function defined by user design) |
| Broche 44 | I/O — User I/O bank (function defined by user design) |
| Broche 45 | I/O — User I/O bank (function defined by user design) |
| Broche 46 | I/O — User I/O bank (function defined by user design) |
| Broche 47 | I/O — User I/O bank (function defined by user design) |
| Broche 48 | I/O — User I/O bank (function defined by user design) |
| Broche 49 | I/O — User I/O bank (function defined by user design) |
| Broche 50 | VCCINT — Core supply voltage (1.8 V) |
| Broche 51 | I/O — User I/O bank (function defined by user design) |
| Broche 52 | I/O — User I/O bank (function defined by user design) |
| Broche 53 | I/O — User I/O bank (function defined by user design) |
| Broche 54 | I/O — User I/O bank (function defined by user design) |
| Broche 55 | I/O — User I/O bank (function defined by user design) |
| Broche 56 | I/O — User I/O bank (function defined by user design) |
| Broche 57 | GND — Ground |
| Broche 58 | I/O — User I/O bank (function defined by user design) |
| Broche 59 | I/O — User I/O bank (function defined by user design) |
| Broche 60 | I/O — User I/O bank (function defined by user design) |
| Broche 61 | I/O — User I/O bank (function defined by user design) |
| Broche 62 | I/O — User I/O bank (function defined by user design) |
| Broche 63 | I/O — User I/O bank (function defined by user design) |
| Broche 64 | I/O — User I/O bank (function defined by user design) |
| Broche 65 | I/O — User I/O bank (function defined by user design) |
| Broche 66 | VCCIO — I/O supply voltage |
| Broche 67 | I/O — User I/O bank (function defined by user design) |
| Broche 68 | I/O — User I/O bank (function defined by user design) |
| Broche 69 | I/O — User I/O bank (function defined by user design) |
| Broche 70 | I/O — User I/O bank (function defined by user design) |
| Broche 71 | GND — Ground |
| Broche 72 | I/O — User I/O bank (function defined by user design) |
| Broche 73 | I/O — User I/O bank (function defined by user design) |
| Broche 74 | I/O — User I/O bank (function defined by user design) |
| Broche 75 | I/O — User I/O bank (function defined by user design) |
| Broche 76 | I/O — User I/O bank (function defined by user design) |
| Broche 77 | I/O — User I/O bank (function defined by user design) |
| Broche 78 | I/O — User I/O bank (function defined by user design) |
| Broche 79 | I/O — User I/O bank (function defined by user design) |
| Broche 80 | VCCINT — Core supply voltage (1.8 V) |
| Broche 81 | I/O — User I/O bank (function defined by user design) |
| Broche 82 | I/O — User I/O bank (function defined by user design) |
| Broche 83 | I/O — User I/O bank (function defined by user design) |
| Broche 84 | I/O — User I/O bank (function defined by user design) |
| Broche 85 | I/O — User I/O bank (function defined by user design) |
| Broche 86 | I/O — User I/O bank (function defined by user design) |
| Broche 87 | GND — Ground |
| Broche 88 | I/O — User I/O bank (function defined by user design) |
| Broche 89 | I/O — User I/O bank (function defined by user design) |
| Broche 90 | I/O — User I/O bank (function defined by user design) |
| Broche 91 | I/O — User I/O bank (function defined by user design) |
| Broche 92 | I/O — User I/O bank (function defined by user design) |
| Broche 93 | I/O — User I/O bank (function defined by user design) |
| Broche 94 | I/O — User I/O bank (function defined by user design) |
| Broche 95 | I/O — User I/O bank (function defined by user design) |
| Broche 96 | VCCIO — I/O supply voltage |
| Broche 97 | I/O — User I/O bank (function defined by user design) |
| Broche 98 | I/O — User I/O bank (function defined by user design) |
| Broche 99 | I/O — User I/O bank (function defined by user design) |
| Broche 100 | I/O — User I/O bank (function defined by user design) |
| Broche 101 | GND — Ground |
| Broche 102 | I/O — User I/O bank (function defined by user design) |
| Broche 103 | I/O — User I/O bank (function defined by user design) |
| Broche 104 | I/O — User I/O bank (function defined by user design) |
| Broche 105 | I/O — User I/O bank (function defined by user design) |
| Broche 106 | I/O — User I/O bank (function defined by user design) |
| Broche 107 | I/O — User I/O bank (function defined by user design) |
| Broche 108 | I/O — User I/O bank (function defined by user design) |
| Broche 109 | I/O — User I/O bank (function defined by user design) |
| Broche 110 | VCCINT — Core supply voltage (1.8 V) |
| Broche 111 | I/O — User I/O bank (function defined by user design) |
| Broche 112 | I/O — User I/O bank (function defined by user design) |
| Broche 113 | I/O — User I/O bank (function defined by user design) |
| Broche 114 | I/O — User I/O bank (function defined by user design) |
| Broche 115 | I/O — User I/O bank (function defined by user design) |
| Broche 116 | I/O — User I/O bank (function defined by user design) |
| Broche 117 | GND — Ground |
| Broche 118 | I/O — User I/O bank (function defined by user design) |
| Broche 119 | I/O — User I/O bank (function defined by user design) |
| Broche 120 | I/O — User I/O bank (function defined by user design) |
| Broche 121 | I/O — User I/O bank (function defined by user design) |
| Broche 122 | I/O — User I/O bank (function defined by user design) |
| Broche 123 | I/O — User I/O bank (function defined by user design) |
| Broche 124 | I/O — User I/O bank (function defined by user design) |
| Broche 125 | I/O — User I/O bank (function defined by user design) |
| Broche 126 | VCCIO — I/O supply voltage |
| Broche 127 | I/O — User I/O bank (function defined by user design) |
| Broche 128 | I/O — User I/O bank (function defined by user design) |
| Broche 129 | I/O — User I/O bank (function defined by user design) |
| Broche 130 | I/O — User I/O bank (function defined by user design) |
| Broche 131 | GND — Ground |
| Broche 132 | TDI — JTAG Test Data In |
| Broche 133 | TMS — JTAG Test Mode Select |
| Broche 134 | TCK — JTAG Test Clock |
| Broche 135 | TDO — JTAG Test Data Out |
| Broche 136 | nCONFIG — Configuration control (active-low) |
| Broche 137 | nSTATUS — Configuration status (active-low) |
| Broche 138 | CONF_DONE — Configuration-done indicator |
| Broche 139 | DCLK — Configuration clock input |
| Broche 140 | DATA0 — Configuration data input |
| Broche 141 | DEV_OE — Device-wide output enable |
| Broche 142 | DEV_CLRn — Device-wide clear (active-low) |
| Broche 143 | VCCINT — Core supply voltage (1.8 V) |
| Broche 144 | GND — Ground |
Applications typiques
EP20K60EFI144-2X convient pour 6 applications: Telecommunications Backplane Glue Logic, Industrial Control and Instrumentation Datapaths, PCI Bridge and Bus Interface Designs, ASIC Prototyping and Design Emulation, Legacy System Refresh and Field Upgrades, Embedded Memory-Intensive Controllers.
Telecommunications Backplane Glue Logic
The EP20K60EFI144-2X fits telecom backplane glue-logic roles thanks to its 93 user I/Os and LVDS support, which directly interface to backplane serial links without external transceivers. With 2,560 logic elements running at 200 MHz internal frequency, it can implement bus arbiters, FIFO controllers, and protocol-conversion state machines between legacy TDM buses and modern packet backplanes. The 1.8 V core with 1.71 V to 1.89 V tolerance suits low-power line-card designs where heat density is a concern. According to the APEX 20KE datasheet, the MultiCore architecture allows product-term logic for wide address decoding alongside LUT logic for fast datapath register chains, enabling single-chip replacement of multiple 74-series glue packages.
Recommandé
Industrial Control and Instrumentation Datapaths
In industrial PLC and instrumentation designs, the EP20K60EFI144-2X provides register-intensive datapath control with 2,560 logic elements and embedded system blocks for FIFO/dual-port RAM. The industrial temperature rating (-40 °C to +85 °C) supports factory-floor deployment without additional thermal conditioning, while the 144-pin FBGA's 93 user I/Os accept parallel ADC/DAC interfaces, encoder feedback, and relay-driver outputs. The 1.8 V core with 200 MHz internal operation delivers deterministic timing for closed-loop control loops; the -2X speed grade's 2.41 ns propagation delay enables sub-microsecond response in servo-control paths.
Recommandé
PCI Bridge and Bus Interface Designs
The EP20K60EFI144-2X implements PCI 32-bit/33 MHz bridges by providing the 2,560 logic elements and 93 user I/Os required for address/data multiplexing, parity generation, and target/master state machines. The 200 MHz internal frequency with 2.41 ns propagation delay meets PCI 33 MHz timing with comfortable margin; LVDS-capable I/Os allow connection to LVDS peripherals alongside 1.8 V PCI signalling. The device is widely cited in legacy Altera reference designs as a single-chip PCI-to-local-bus bridge, replacing discrete ASICs and reducing BOM cost.
Recommandé
ASIC Prototyping and Design Emulation
ASIC prototyping teams use the EP20K60EFI144-2X as a logic-emulation vehicle because its 60,000-gate capacity and 2,560-LE fabric approximate mid-complexity ASIC blocks before tape-out. The MultiCore architecture (LUT + product-term + embedded memory) supports mixed datapath-control prototyping where the target ASIC also uses heterogeneous logic. According to Altera application notes, multiple EP20K60E devices can be JTAG-chained for multi-FPGA prototyping, with the 144-pin FBGA providing sufficient I/O for chip-to-chip interconnect emulation of larger ASICs.
Recommandé
Legacy System Refresh and Field Upgrades
The EP20K60EFI144-2X is commonly stocked by industrial OEMs for sustaining legacy systems where the original Altera APEX 20KE design must be reproduced exactly without PCB rework. Its 144-pin FineLine BGA matches legacy land patterns, allowing drop-in replacement of failed parts in fielded equipment spanning telecommunications, factory automation, and military systems. Although the part is NRND, distributors including Microchip USA, Jotrin, and Nantian maintain inventory specifically for this legacy-sustainment use case, and the -2X industrial speed grade preserves original timing margins.
Recommandé
Embedded Memory-Intensive Controllers
The EP20K60EFI144-2X's MultiCore architecture integrates embedded system blocks (ESBs) that deliver dual-port RAM, single-port RAM, and CAM alongside LUT logic, ideal for embedded memory-intensive controllers. With 60K gates and 2,560 logic elements, the device can host packet buffers, lookup tables, and small FIFOs directly on-chip, reducing external SRAM count and PCB complexity. The 200 MHz operation supports 200 Mbit/s memory access rates, and the LVDS I/O capability enables high-speed serial datapaths to companion ASSPs in storage and imaging subsystems.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K60EFI144-2X — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K60EFC144-2X | EP20K60EFC144-2 | EP20K60EFC144-1 | EP20K60EFC144-1X | EP20K60EFC144-2XN |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-144 (LBGA) | FBGA-144 (LBGA) - same | FBGA-144 (LBGA) - same | FBGA-144 (LBGA) - same | FBGA-144 (LBGA) - same | FBGA-144 (LBGA) - same |
| Typical Gates | 60,000 | 60,000 (same) | 60,000 (same) | 60,000 (same) | 60,000 (same) | 60,000 (same) |
| Logic Elements | 2,560 | 2,560 (same) | 2,560 (same) | 2,560 (same) | 2,560 (same) | 2,560 (same) |
| Operating Temperature | -40 °C to +85 °C (industrial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) |
| Speed Grade | -2X | -2X (same) | -2 (slightly slower) | -1 (slowest) | -1X (slowest) | -2X (same) |
| User I/O Pins | 93 | 93 (same) | 93 (same) | 93 (same) | 93 (same) | 93 (same) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Industrial temperature qualification in FBGA-144 (vs EP20K60EFC144-2X)
- Faster -2X speed grade (vs EP20K60EFC144-2)
- Same die as EP20K60 family - no design rework required (vs EP20K400EFC672-2X)
Notes de conception
The EP20K60EFI144-2X requires two supply rails: VCCINT at 1.8 V (1.71 V to 1.89 V tolerance) for the core logic, and VCCIO at 1.8 V or other supported I/O standard voltage for the I/O banks. According to the APEX 20KE datasheet, VCCINT must be applied before or simultaneously with VCCIO; failure to observe power-sequencing requirements can cause excessive inrush current and long-term reliability degradation. Decoupling: place 0.1 µF ceramic capacitors adjacent to every VCCINT and VCCIO pin, with bulk 10 µF tantalum or ceramic at the supply-entry points of the PCB.
The EP20K60EFI144-2X is rated for -40 °C to +85 °C ambient industrial operation. In a typical 144-ball FBGA with 60K gates running at 200 MHz internal frequency, junction-to-ambient thermal resistance (theta_JA) depends heavily on PCB copper area and airflow. According to APEX 20KE thermal guidelines, a minimum 4-layer PCB with a continuous ground plane and ≥2 cm² copper pour around the BGA is recommended to keep junction temperature below 100 °C at full utilization. Forced airflow (>1 m/s) is recommended when utilization exceeds 70% in industrial enclosures.
Do not assume MSL-3 (Moisture Sensitivity Level 3) parts can be soldered without pre-bake. According to JEDEC J-STD-033, MSL-3 FBGA-144 parts that have been exposed to ambient for more than 168 hours must be baked at 125 °C for ≥24 hours before reflow to prevent popcorn cracking during solder reflow. Additionally, confirm that the configuration device (EPC or compatible PROM) bitstream is generated for the correct device ID - using a Cyclone or Stratix bitstream on the APEX 20KE will fail configuration silently and may stress the device.
Informations de conformité
RoHS/REACH compliance not explicitly stated in verified web data. APEX 20KE family is older 0.22 µm process technology; original Altera documentation predates widespread RoHS adoption. For new designs requiring RoHS compliance, verify with authorized distributor or use the lead-free -2XN variants.
