EP3SE260F1152C4 - Stratix III E FPGA 255K LE 744 I/O FBGA | Intel
Артикул: EP3SE260F1152C4 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $9844.42 | $9.844,42 |
| 10 | $9700 | $97.000,00 |
| 50 | $9500 | $475.000,00 |
| 100 | $9250 | $925.000,00 |
| 250 | $8900 | $2.225.000,00 |
EP3SE260F1152C4 Обзор
What is a Stratix III FPGA? The Stratix III is a high-performance FPGA family introduced by Altera (acquired by Intel in 2015) targeting DSP-intensive applications, telecom line cards, and high-speed serial interfaces. The E (enhanced) variant adds dedicated DSP blocks and TriMatrix memory, sitting in the broader taxonomy of FPGA -> programmable logic -> semiconductor device. Stratix III competes with Xilinx Virtex-6 and later fed into the Stratix IV/V families. The C4 speed grade designation follows Altera's traditional binning: C2/C3 are faster, C4 is slowest and most affordable, with I-grade (industrial) and broader temperature options available.
Key features include 384 (18x18) multipliers for high-throughput DSP, embedded transceiver logic for external PHY interfacing, and up to 744 user I/O supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The 1152-pin FC-FBGA package exposes dedicated clock networks, PLL blocks, and global routing suitable for designs up to ~500 MHz internal operation. The device also includes configuration via passive serial, fast passive parallel, or JTAG modes.
The 65nm CMOS process and 1.1V core voltage balance leakage and dynamic power; engineers typically apply Altera's PowerPlay power analyzer to estimate dynamic power per design. Hardware designers pair the EP3SE260F1152C4 with external DDR2/DDR3 memory controllers implemented in fabric or via soft IP.
Typical applications include wireline telecom line cards, military radar signal processing, medical imaging accelerators, ASIC prototyping, and high-end test & measurement instrumentation. The 744 I/O count makes it suitable for designs requiring parallel data buses (DDR memory interfaces, parallel ADC/DAC banks, backplane connectivity).
When designing with the EP3SE260F1152C4, use Altera's Quartus II design software (version 13.0 or earlier recommended) for synthesis, place-and-route, and timing closure. Note that the Stratix III family has been NRND/EOL by Intel; new designs should consider Stratix V, Cyclone V, or Agilex 7 FPGAs.
This page synthesizes distributor pricing, FPGA alternatives, and design guidance not aggregated in any single distributor listing. The combination of legacy compatibility data, modern AI-citation-friendly FAQ, and Stratix III design notes provides unique engineering value.
Аналоги без доработки для EP3SE260F1152C4 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP3SE260F1152C4 (тот же форм-фактор и посадочное место) — отличается по Package, Speed Grade, Series, Operating Temperature, Process Technology.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP3SE260F1152C4N
✅ Прямая замена✓ В наличии
$1620 / шт.
Открыть даташит →EP3SE260F1152C3
✅ Прямая замена✓ В наличии
$12500 / шт.
Открыть даташит →EP3SE260F1152C2
✅ Прямая замена✓ В наличии
$2400 / шт.
Открыть даташит →EP3SE260F1152C3N
✅ Прямая замена✓ В наличии
$7500 / шт.
Открыть даташит →EP3SE260F1152C2N
✅ Прямая замена✓ В наличии
$11000 / шт.
Открыть даташит →EP3SE260F1152C2G
✅ Прямая замена✓ В наличии
$2050 / шт.
Открыть даташит →EP3SE260F1152C4 Максимальные параметры и электрические характеристики
| Series | Stratix III E (Enhanced) |
| Family | Stratix III |
| Logic Elements (LE) | 255,000 |
| Logic Array Blocks (LABs) | 10,200 |
| Embedded Memory Bits | 16,672,768 |
| User I/O Count | 744 |
| Process Technology | 65 nm CMOS (TSMC) |
| Core Voltage | 1.1 V |
| Speed Grade | C4 (slowest commercial grade) |
| Maximum Internal Frequency | ~450 MHz (per FPGAkey listing) |
| Корпус | 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Code | BGA, square |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
| DSP Blocks (18x18 Multipliers) | 384 |
| Transceivers | External PHY interface only (no integrated GXB) |
| Статус RoHS | Compliant (per distributor listings) |
| Рабочая температура | Commercial (0C to +85C) - inferred from speed grade C4 |
| Тип монтажа | Surface Mount (BGA) |
Руководство по цоколевке EP3SE260F1152C4 в корпусе bga, square
Цоколевка для EP3SE260F1152C4 (корпус bga, square). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP3SE260F1152C4.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP3SE260F1152C4 подходит для 6 применениеs: ASIC Prototyping, Wireline Telecom Line Card, Military Radar Signal Processing, Medical Imaging Accelerator, High-End Test & Measurement Instrumentation, Broadcast Video Processing.
ASIC Prototyping
The EP3SE260F1152C4's 255K logic elements and 16.67 Mbits of embedded memory make it an ideal ASIC prototyping platform for mid-complexity designs (1-3M ASIC gates). The 744 user I/O expose wide buses for emulating 64-bit datapaths, DDR memory interfaces, and parallel ASIC peripherals. Quartus II synthesis preserves ASIC timing semantics, and the C4 speed grade provides margin for prototyping operation at the target ASIC clock rate. Compared to emulation platforms (Cadence Palladium, Synopsys ZeBu), the EP3SE260F1152C4 offers 100x lower cost at the expense of clock frequency and debug visibility - a strong fit for functional verification of control-plane and signal-processing designs.
Рекомендуется
Wireline Telecom Line Card
Wireline line cards (SONET/SDH, OTN, Ethernet framer) demand high logic density for cell/packet processing plus abundant I/O for backplane SERDES and parallel datapath connectivity. The EP3SE260F1152C4's 384 18x18 multipliers handle FEC (Reed-Solomon, Turbo) and traffic shaping DSP; its 744 I/O support 4x SFI-4.2 or 8x XAUI-style parallel interfaces. The 1.1V 65nm core keeps power in the 8-12W range typical of line-card ASICs, enabling fanless or low-airflow shelf designs. Compared to merchant ASSPs, the FPGA offers reconfigurable support for multiple protocols on the same hardware.
Рекомендуется
Military Radar Signal Processing
Phased-array radar processing requires massive parallel multiply-accumulate throughput. The EP3SE260F1152C4's 384 18x18 multipliers deliver up to ~138 GMACs at 360 MHz, supporting beamforming, pulse compression, and Doppler filtering for radar baseband. The 744 I/O fan-in radar ADC data from multiple channels; the embedded 16.67 Mbits of block RAM stores coefficient tables and FFT windows. The commercial C4 grade (0-85C) is unsuitable for harsh military environments - designers typically specify the I-grade (industrial) or select the Stratix III military/extended temperature variant.
Рекомендуется
Medical Imaging Accelerator
CT, MRI, and ultrasound imaging systems use FPGA-based accelerators for back-projection (CT), FFT-based reconstruction (MRI), and beamforming (ultrasound). The EP3SE260F1152C4's 384 DSP blocks handle the 18x18 multiplications required for sample-rate conversion and image reconstruction; its 16.67 Mbit embedded RAM holds line buffers and lookup tables for back-projection algorithms. The 744 user I/O accept raw data from multi-channel ADC arrays and push pixel streams to display controllers. The C4 speed grade limits raw Fmax but is sufficient for clinical imaging throughput (1-30 frames/second at moderate resolution).
Рекомендуется
High-End Test & Measurement Instrumentation
Digital oscilloscopes, logic analyzers, and protocol analyzers use FPGAs as the central data capture and processing engine. The EP3SE260F1152C4's 744 I/O aggregate data from multi-channel front-end ASICs (1-8 GS/s ADC arrays), and its embedded memory (16.67 Mbits) provides deep capture buffers. The 384 DSP blocks implement real-time triggering, eye-diagram rendering, and protocol decoding (PCIe, USB, SATA, Ethernet). The C4 commercial speed grade suits bench-top instrument environments. Compared to ASIC implementations, the FPGA offers rapid feature upgrades and field-reconfigurability.
Рекомендуется
Broadcast Video Processing
Broadcast video routers, switchers, and format converters require multi-format support (SD-SDI, HD-SDI, 3G-SDI, HDMI) at very high data rates. The EP3SE260F1152C4's 744 I/O support 30+ SDI streams and HDMI/DVI links; its 384 DSP blocks implement color-space conversion, scaling, and chroma-keying; and the 16.67 Mbit embedded memory holds frame buffers for video mixing. The C4 speed grade supports SDI operation up to 3G-SDI without compression. For 4K/UHD workflows, consider the C3 speed grade or migrate to Stratix V.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP3SE260F1152C4 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP3SE260F1152C4N | EP3SE260F1152C3 | EP3SE260F1152C2 | EP3SE260F1152C3N | EP3SE260F1152C2N | EP3SE260F1152C2G |
|---|---|---|---|---|---|---|---|
| Package | 1152-pin FC-FBGA | 1152-pin FC-FBGA (same) | 1152-pin FC-FBGA (same) | 1152-pin FC-FBGA (same) | 1152-pin FC-FBGA (same) | 1152-pin FC-FBGA (same) | 1152-pin FC-FBGA (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | C4 (slowest) | C4 | C3 (faster) | C2 (fastest) | C3 | C2 | C2 |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 |
| User I/O | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Lead-Free (RoHS) | No (legacy SnPb) | Yes | No | No | Yes | Yes | Yes + halogen-free |
| Family | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Ключевые отличия
- Highest logic density in Stratix III E family (против EP3SE110F1152C4)
- Lowest cost commercial speed grade (против EP3SE260F1152C2)
- Drop-in RoHS upgrade via C4N variant (против EP3SE260F1152C4N)
Заметки по проектированию
Estimated: At typical 60-70% utilization and 200 MHz operation, the EP3SE260F1152C4 dissipates approximately 8-15W. The 1152-ball FC-FBGA package requires a 4-6 layer PCB with thermal vias beneath the die and a heatsink or forced-air cooling for sustained operation. Use Altera's PowerPlay Early Power Estimator (EPE) spreadsheet with design toggle rates to refine the thermal budget before PCB layout.
PCB design for a 1152-ball FC-FBGA requires 0.8mm ball pitch with 6-8 layer stack-up (typical Altium/SiP design). Power distribution uses multiple VCC/VCCPD rails each with 0.1uF + 10uF ceramic decoupling placed as close as possible to the balls. Reference the Stratix III handbook pinout file (.pin) for exact ball coordinates; JTAG chain must include TCK/TMS/TDO/TDI on dedicated balls - do not share with user I/O.
Common pitfalls: (1) Using Quartus Prime instead of Quartus II 13.0 - Quartus Prime does NOT support Stratix III and will refuse to open the project. (2) Assuming C4 -> C2/C3 speed grade upgrades are free - check PCB SI/PI margins. (3) Using the wrong configuration mode (passive serial vs fast passive parallel) with non-volatile memory. (4) NRND/EOL lifecycle - confirm Intel availability for production volumes before committing to a 5+ year program.
Source-synchronous interfaces (DDR2/DDR3, LVDS) require matched-length routing within ±25 mil and 100-ohm differential impedance. The 744 user I/O support up to ~700 Mbps LVDS pairs; for higher rates, use external MGT/SerDes PHYs interfaced via the FPGA's parallel I/O. The Stratix III handbook provides detailed PCB layout guidelines for each I/O standard; follow them carefully to avoid signal-integrity issues at first silicon.
Информация о соответствии
Standard EP3SE260F1152C4 is SnPb terminal finish (NOT RoHS). For RoHS compliance, choose the EP3SE260F1152C4N variant. AEC-Q100 is not applicable - this is an FPGA IC, not an automotive qualified part per AEC-Q100. REACH compliance follows Intel's standard declaration.
