EP3SE260F1152C4 vs EP3SE260F1152C3 Сравнение
Подробное сравнение бок о бок EP3SE260F1152C4 от Intel и EP3SE260F1152C3 от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Intel
EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera
EP3SE260F1152C3 ⚠ Последняя закупкаСравнение характеристик
| Параметр | EP3SE260F1152C4 | EP3SE260F1152C3 |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | NRND | Последняя закупка |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $8.900,00 | $12.500,00 |
| Series | Stratix III E (Enhanced) | Stratix III E |
| Family | Stratix III | — |
| Logic Elements (LE) | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory Bits | 16,672,768 | — |
| User I/O Count | 744 | — |
| Process Technology | 65 nm CMOS (TSMC) | 40 nm |
| Core Voltage | 1.1 V | 0.9 V to 1.1 V |
| Speed Grade | C4 (slowest commercial grade) | C3 |
| Maximum Internal Frequency | ~450 MHz (per FPGAkey listing) | — |
| Корпус | 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) | 1152-ball FCBGA (Flip-Chip BGA) |
| Package Code | BGA, square | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| DSP Blocks (18x18 Multipliers) | 384 | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Transceivers | External PHY interface only (no integrated GXB) | — |
| Статус RoHS | Compliant (per distributor listings) | Compliant |
| Рабочая температура | Commercial (0C to +85C) - inferred from speed grade C4 | 0C to +85C (Commercial) |
| Тип монтажа | Surface Mount (BGA) | Surface Mount |
| Logic Elements | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/Os | — | 744 |
| Embedded 18x18 Multipliers | — | 384 |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG |
| PLLs | — | 12 |