EP3SE260F1152C4 vs EP3SE260F1152C3N Сравнение
Подробное сравнение бок о бок EP3SE260F1152C4 от Intel и EP3SE260F1152C3N от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ АктивенСравнение характеристик
| Параметр | EP3SE260F1152C4 | EP3SE260F1152C3N |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | NRND | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $8.900,00 | $7.500,00 |
| Series | Stratix III E (Enhanced) | Stratix III E |
| Family | Stratix III | — |
| Logic Elements (LE) | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory Bits | 16,672,768 | 16,672,768 bits |
| User I/O Count | 744 | 744 |
| Process Technology | 65 nm CMOS (TSMC) | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Speed Grade | C4 (slowest commercial grade) | — |
| Maximum Internal Frequency | ~450 MHz (per FPGAkey listing) | — |
| Корпус | 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) | 1152-BBGA, FCBGA |
| Package Code | BGA, square | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | AS, AP, PS, FPP, JTAG |
| DSP Blocks (18x18 Multipliers) | 384 | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Transceivers | External PHY interface only (no integrated GXB) | Integrated high-speed transceivers |
| Статус RoHS | Compliant (per distributor listings) | Compliant |
| Рабочая температура | Commercial (0C to +85C) - inferred from speed grade C4 | 0 C to +85 C (Commercial) |
| Тип монтажа | Surface Mount (BGA) | Surface Mount |
| Logic Elements / Cells | — | 255,000 |
| DSP Blocks | — | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |