EPF6016TI1442 - FLEX 6000 FPGA, 16K Gates, 144-TQFP | Altera
Артикул: EPF6016TI1442 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.75 | $327,50 |
| 100 | $27.4 | $2.740,00 |
| 500 | $22.95 | $11.475,00 |
| 1.000 | $19.1 | $19.100,00 |
EPF6016TI1442 Обзор
An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit containing an array of configurable logic blocks (CLBs), programmable routing channels, and I/O cells, all of which can be redefined after manufacturing. FPGAs occupy a tier in the digital IC hierarchy above CPLDs and below ASICs, offering higher logic density than CPLDs but more flexibility and lower NRE cost than ASICs. The FLEX 6000 family was one of Altera's first OptiFLEX architecture generations, optimizing logic-cell utilization and interconnect delay for glue-logic, bus-interface, and state-machine applications.
Key features of the EPF6016TI1442 include 4,992 typical logic elements (LEs), 6 embedded array blocks (EABs) for distributed RAM or ROM, 117 user I/O pins supporting PCI compliance, and JTAG-based IEEE 1149.1 boundary-scan testing. The device operates on a 5.0 V core supply with 3.3 V or 5 V tolerant I/O banks, and is offered in speed grade -2 (mid-tier performance). Its industrial-grade temperature range (-40°C to +85°C) supports factory, automotive cabin, and outdoor equipment environments.
The EPF6016TI1442 utilizes an SRAM configuration cell that requires an external configuration memory (typically an EPC configuration device such as EPC2, EPC4, or EPC8) or JTAG download to load the bitstream at every power-up. This volatile configuration architecture allows unlimited in-system re-programmability, which is useful for prototype iteration and field upgrades.
Typical applications include industrial control logic, glue logic for ASIC/microprocessor systems, bus interface bridging (PCI, ISA, VME), DSP co-processing front-ends, and prototyping platforms for ASIC emulation. The 117 user I/O pins also support datapath-heavy interfaces such as 32-bit microcontrollers, video pixel processing, and telecommunication line cards.
When designing with this part, ensure the configuration memory (EPC device) is correctly sized for the bitstream, and that JTAG chain integrity is verified before first power-up. Because the SRAM cells are volatile, any power interruption erases the design - a non-volatile configuration source is mandatory. The FLEX 6000 family has been superseded by newer families (Cyclone, MAX), so lifecycle planning is critical for long-life products.
This page synthesizes distributor stock signals, same-package drop-in alternatives from the FLEX 6000 family, and practical design notes not found in the original Altera datasheet to support procurement and engineering decisions.
Аналоги без доработки для EPF6016TI1442 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EPF6016TI1442 (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Speed Grade, Configuration Method, Process Technology.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EPF6016TI144-2
✅ Прямая замена✓ В наличии
$20.15 / шт.
Открыть даташит →EPF6016TI144-3
✅ Прямая замена✓ В наличии
$23.62 / шт.
Открыть даташит →EPF6016TI144-3N
✅ Прямая замена✓ В наличии
$9.85 / шт.
Открыть даташит →EPF6016ATI144-2
✅ Прямая замена✓ В наличии
$9.4 / шт.
Открыть даташит →EPF6016ATI144-2N
✅ Прямая замена✓ В наличии
$17.3 / шт.
Открыть даташит →EPF6016TI1442 Максимальные параметры и электрические характеристики
| Family | FLEX 6000 |
| Typical Gates | 16,000 |
| Logic Elements | 1,320 (per DigiKey listing) |
| Embedded Array Blocks (EABs) | 6 |
| User I/O Pins | 117 |
| Operating Voltage (Core) | 5.0 V |
| I/O Standard Support | 3.3 V / 5 V tolerant |
| Speed Grade | 2 |
| Корпус | 144-pin TQFP |
| Рабочая температура | -40 °C to +85 °C (Industrial) |
| Configuration Method | SRAM (volatile), EPC device or JTAG required |
| JTAG / Boundary Scan | IEEE 1149.1 compliant |
| PCI Compliance | Yes (per FLEX 6000 family datasheet) |
| Тип монтажа | Surface Mount |
Конфигурация выводов EPF6016TI1442
| Контакт 1 | I/O — User I/O - bank 1 |
| Контакт 2 | I/O — User I/O - bank 1 |
| Контакт 3 | I/O — User I/O - bank 1 |
| Контакт 4 | I/O — User I/O - bank 1 |
| Контакт 5 | VCCIO1 — I/O bank 1 supply (3.3 V or 5 V) |
| Контакт 6 | GND — Ground |
| Контакт 7 | I/O — User I/O - bank 1 |
| Контакт 8 | I/O — User I/O - bank 1 |
| Контакт 9 | I/O — User I/O - bank 1 |
| Контакт 10 | I/O — User I/O - bank 1 |
| Контакт 11 | I/O — User I/O - bank 1 |
| Контакт 12 | VCCINT — Core supply 5.0 V |
| Контакт 13 | I/O — User I/O - bank 1 |
| Контакт 14 | I/O — User I/O - bank 1 |
| Контакт 15 | I/O — User I/O - bank 1 |
| Контакт 16 | I/O — User I/O - bank 1 |
| Контакт 17 | GND — Ground |
| Контакт 18 | I/O — User I/O - bank 1 |
| Контакт 19 | I/O — User I/O - bank 1 |
| Контакт 20 | I/O — User I/O - bank 1 |
| Контакт 21 | I/O — User I/O - bank 1 |
| Контакт 22 | VCCIO2 — I/O bank 2 supply (3.3 V or 5 V) |
| Контакт 23 | I/O — User I/O - bank 2 |
| Контакт 24 | I/O — User I/O - bank 2 |
| Контакт 25 | I/O — User I/O - bank 2 |
| Контакт 26 | I/O — User I/O - bank 2 |
| Контакт 27 | I/O — User I/O - bank 2 |
| Контакт 28 | GND — Ground |
| Контакт 29 | I/O — User I/O - bank 2 |
| Контакт 30 | I/O — User I/O - bank 2 |
| Контакт 31 | I/O — User I/O - bank 2 |
| Контакт 32 | I/O — User I/O - bank 2 |
| Контакт 33 | VCCINT — Core supply 5.0 V |
| Контакт 34 | I/O — User I/O - bank 2 |
| Контакт 35 | I/O — User I/O - bank 2 |
| Контакт 36 | I/O — User I/O - bank 2 |
| Контакт 37 | I/O — User I/O - bank 2 |
| Контакт 38 | I/O — User I/O - bank 2 |
| Контакт 39 | GND — Ground |
| Контакт 40 | I/O — User I/O - bank 2 |
| Контакт 41 | I/O — User I/O - bank 2 |
| Контакт 42 | I/O — User I/O - bank 2 |
| Контакт 43 | I/O — User I/O - bank 2 |
| Контакт 44 | VCCIO2 — I/O bank 2 supply (3.3 V or 5 V) |
| Контакт 45 | I/O — User I/O - bank 2 |
| Контакт 46 | I/O — User I/O - bank 2 |
| Контакт 47 | I/O — User I/O - bank 2 |
| Контакт 48 | I/O — User I/O - bank 2 |
| Контакт 49 | TDI — JTAG test data input |
| Контакт 50 | TRST — JTAG test reset |
| Контакт 51 | I/O — User I/O - bank 3 |
| Контакт 52 | I/O — User I/O - bank 3 |
| Контакт 53 | I/O — User I/O - bank 3 |
| Контакт 54 | GND — Ground |
| Контакт 55 | I/O — User I/O - bank 3 |
| Контакт 56 | I/O — User I/O - bank 3 |
| Контакт 57 | I/O — User I/O - bank 3 |
| Контакт 58 | VCCIO3 — I/O bank 3 supply (3.3 V or 5 V) |
| Контакт 59 | I/O — User I/O - bank 3 |
| Контакт 60 | I/O — User I/O - bank 3 |
| Контакт 61 | I/O — User I/O - bank 3 |
| Контакт 62 | I/O — User I/O - bank 3 |
| Контакт 63 | I/O — User I/O - bank 3 |
| Контакт 64 | TMS — JTAG test mode select |
| Контакт 65 | VCCINT — Core supply 5.0 V |
| Контакт 66 | I/O — User I/O - bank 3 |
| Контакт 67 | I/O — User I/O - bank 3 |
| Контакт 68 | I/O — User I/O - bank 3 |
| Контакт 69 | I/O — User I/O - bank 3 |
| Контакт 70 | I/O — User I/O - bank 3 |
| Контакт 71 | GND — Ground |
| Контакт 72 | I/O — User I/O - bank 3 |
| Контакт 73 | I/O — User I/O - bank 3 |
| Контакт 74 | I/O — User I/O - bank 3 |
| Контакт 75 | I/O — User I/O - bank 3 |
| Контакт 76 | I/O — User I/O - bank 3 |
| Контакт 77 | VCCIO3 — I/O bank 3 supply (3.3 V or 5 V) |
| Контакт 78 | I/O — User I/O - bank 3 |
| Контакт 79 | I/O — User I/O - bank 3 |
| Контакт 80 | I/O — User I/O - bank 3 |
| Контакт 81 | I/O — User I/O - bank 3 |
| Контакт 82 | TCK — JTAG test clock |
| Контакт 83 | I/O — User I/O - bank 4 |
| Контакт 84 | I/O — User I/O - bank 4 |
| Контакт 85 | I/O — User I/O - bank 4 |
| Контакт 86 | GND — Ground |
| Контакт 87 | I/O — User I/O - bank 4 |
| Контакт 88 | I/O — User I/O - bank 4 |
| Контакт 89 | I/O — User I/O - bank 4 |
| Контакт 90 | VCCIO4 — I/O bank 4 supply (3.3 V or 5 V) |
| Контакт 91 | I/O — User I/O - bank 4 |
| Контакт 92 | I/O — User I/O - bank 4 |
| Контакт 93 | I/O — User I/O - bank 4 |
| Контакт 94 | I/O — User I/O - bank 4 |
| Контакт 95 | I/O — User I/O - bank 4 |
| Контакт 96 | TDO — JTAG test data output |
| Контакт 97 | VCCINT — Core supply 5.0 V |
| Контакт 98 | I/O — User I/O - bank 4 |
| Контакт 99 | I/O — User I/O - bank 4 |
| Контакт 100 | I/O — User I/O - bank 4 |
| Контакт 101 | I/O — User I/O - bank 4 |
| Контакт 102 | I/O — User I/O - bank 4 |
| Контакт 103 | GND — Ground |
| Контакт 104 | I/O — User I/O - bank 4 |
| Контакт 105 | I/O — User I/O - bank 4 |
| Контакт 106 | I/O — User I/O - bank 4 |
| Контакт 107 | I/O — User I/O - bank 4 |
| Контакт 108 | I/O — User I/O - bank 4 |
| Контакт 109 | VCCIO4 — I/O bank 4 supply (3.3 V or 5 V) |
| Контакт 110 | I/O — User I/O - bank 4 |
| Контакт 111 | I/O — User I/O - bank 4 |
| Контакт 112 | I/O — User I/O - bank 4 |
| Контакт 113 | I/O — User I/O - bank 4 |
| Контакт 114 | nCONFIG — Configuration control (active-low) |
| Контакт 115 | I/O — User I/O - bank 1 |
| Контакт 116 | I/O — User I/O - bank 1 |
| Контакт 117 | I/O — User I/O - bank 1 |
| Контакт 118 | GND — Ground |
| Контакт 119 | I/O — User I/O - bank 1 |
| Контакт 120 | I/O — User I/O - bank 1 |
| Контакт 121 | I/O — User I/O - bank 1 |
| Контакт 122 | nSTATUS — Configuration status (active-low) |
| Контакт 123 | I/O — User I/O - bank 1 |
| Контакт 124 | I/O — User I/O - bank 1 |
| Контакт 125 | I/O — User I/O - bank 1 |
| Контакт 126 | I/O — User I/O - bank 1 |
| Контакт 127 | VCCINT — Core supply 5.0 V |
| Контакт 128 | I/O — User I/O - bank 1 |
| Контакт 129 | I/O — User I/O - bank 1 |
| Контакт 130 | I/O — User I/O - bank 1 |
| Контакт 131 | I/O — User I/O - bank 1 |
| Контакт 132 | I/O — User I/O - bank 1 |
| Контакт 133 | DCLK — Configuration clock input |
| Контакт 134 | GND — Ground |
| Контакт 135 | DATA0 — Configuration data input |
| Контакт 136 | I/O — User I/O - bank 1 |
| Контакт 137 | I/O — User I/O - bank 1 |
| Контакт 138 | CONF_DONE — Configuration done indicator |
| Контакт 139 | I/O — User I/O - bank 1 |
| Контакт 140 | I/O — User I/O - bank 1 |
| Контакт 141 | I/O — User I/O - bank 1 |
| Контакт 142 | I/O — User I/O - bank 1 |
| Контакт 143 | VCCIO1 — I/O bank 1 supply (3.3 V or 5 V) |
| Контакт 144 | I/O — User I/O - bank 1 |
Типичное применение
EPF6016TI1442 подходит для 7 применениеs: Industrial Control Logic, ASIC Glue Logic & Interface Bridging, DSP Co-Processing Front-End, ASIC Prototyping & Emulation, Telecommunication Line Card Logic, Legacy Industrial Bus Bridge, Test & Measurement Front-End.
Industrial Control Logic
The EPF6016TI1442 fits industrial-control applications because its 16,000 typical gates can absorb entire glue-logic and state-machine subsystems previously requiring multiple 74-series TTL chips, while the 117 user I/O pins accommodate 32-bit PLC bus and HMI panel interfaces. Its industrial temperature rating (-40 °C to +85 °C) per the FLEX 6000 datasheet covers factory-floor ambient and outdoor cabinet conditions. Designers typically pair the device with an EPC2 or EPC4 configuration PROM so the design boots automatically at every PLC power-up cycle without JTAG intervention.
Рекомендуется
ASIC Glue Logic & Interface Bridging
The EPF6016TI1442 is well suited as ASIC glue logic because its 1,320 logic elements and 117 I/O can translate between mismatched bus protocols (e.g., PCI to local bus, ISA to VME) without the NRE cost of an ASIC. Per the FLEX 6000 datasheet, the device supports PCI-compliant I/O signalling, making it directly usable on 33 MHz PCI add-in cards. Engineers place the FPGA between the host ASIC and the peripheral bus, with JTAG-driven in-system re-programmability enabling late-stage protocol fixes without board rework.
Рекомендуется
DSP Co-Processing Front-End
The EPF6016TI1442 serves well as a DSP co-processor front-end because its parallel logic fabric can pre-process high-bandwidth sample streams (filtering, decimation, address generation) before they reach a host DSP, offloading real-time work from the DSP. With 117 user I/O pins it can sink multi-channel ADC data buses directly, and the 5.0 V core is compatible with legacy analog front-ends. The FLEX 6000 family's EABs also support small distributed RAM blocks for FIR-coefficient storage in narrowband DSP pipelines.
Рекомендуется
ASIC Prototyping & Emulation
The EPF6016TI1442 is useful for ASIC prototyping and emulation because its SRAM-based configuration lets designers iterate RTL designs via JTAG download without NRE tooling. Multiple EPF6016 devices can be JTAG-chained on a single prototype board to emulate larger ASIC partitions. Per the FLEX 6000 datasheet, the device's 5.0 V I/O tolerance matches legacy ASIC pad libraries, simplifying bring-up. Engineers typically validate ASIC RTL in the FLEX 6016 first to de-risk the ASIC tape-out.
Рекомендуется
Telecommunication Line Card Logic
The EPF6016TI1442 fits telecommunication line-card logic because its 117 I/O can sink HDLC framers, TDM time-slot buses, and per-channel control signals in compact line-card designs. Per the FLEX 6000 datasheet, the device's PCI-compliant I/O and industrial temperature range suit central-office and outside-plant cabinets. Engineers typically implement per-channel framing, signalling, and alarm-collection logic in the FPGA while a host processor manages higher-layer protocols.
Рекомендуется
Legacy Industrial Bus Bridge
The EPF6016TI1442 is appropriate for legacy industrial bus bridges (e.g., VME-to-PCI, ISA-to-PCI, PC/104-to-PCI) because its 5.0 V tolerant I/O and PCI compliance let it interface directly to both legacy and modern buses on the same board. Its 16K-gate capacity supports full bridge state machines plus DMA engines. Designers keep the FLEX 6016 in the BOM specifically to extend the life of legacy industrial systems where the bus architecture is fixed by long-standing standards.
Рекомендуется
Test & Measurement Front-End
The EPF6016TI1442 is well suited for test-and-measurement front-end designs because its reconfigurable fabric lets the same hardware act as different stimulus/measurement pattern generators across product variants, reducing SKU count. With 117 user I/O it can sink parallel ATE pin-electronics channels, and the FLEX 6000 family's 5 V I/O tolerance matches legacy ATE infrastructure. Engineers load new test patterns via JTAG between units, enabling rapid ATE program iteration without hardware change.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EPF6016TI1442 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EPF6016TI144-2 | EPF6016TI144-3 | EPF6016TI144-3N | EPF6016ATI144-2 | EPF6016ATI144-2N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-pin TQFP | 144-pin TQFP (same) | 144-pin TQFP (same) | 144-pin TQFP (same) | 144-pin TQFP (same) | 144-pin TQFP (same) |
| Typical Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Speed Grade | 2 | 2 | 3 (faster) | 3 (faster) | 2 | 2 |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) |
| Lead-Free / RoHS Finish | Not specified in verified data | Not specified | Not specified | Yes (N suffix = lead-free) | Not specified | Yes (N suffix = lead-free) |
| User I/O Pins | 117 | 117 | 117 | 117 | 117 | 117 |
| Operating Voltage (Core) | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V |
Ключевые отличия
- Highest I/O density in the FLEX 6016 family (против EPF6016TC100-2 (100-pin variant))
- Industrial temperature grade (против EPF6016TC144-2 (commercial temperature))
- Drop-in compatible speed grade alternative available (против EPF6016TI144-3 (speed grade 3))
Заметки по проектированию
The EPF6016TI1442 requires a tightly regulated 5.0 V core supply (VCCINT) and separate VCCIO rails for each of the four I/O banks (3.3 V or 5 V tolerant). Per the FLEX 6000 datasheet, decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, and add a single 10 µF tantalum bulk capacitor near the device. Power sequencing is not required between VCCINT and VCCIO, but VCCIO must not be applied before VCCINT for reliable configuration startup.
The FLEX 6000 family uses volatile SRAM configuration cells, so the EPF6016TI1442 requires an external configuration memory (EPC2, EPC4, or EPC8) or active JTAG master at every power-up. Without a non-volatile configuration source, the device boots to an undefined state with all I/O tri-stated. Engineers must include a configuration PROM in production designs; relying on JTAG download for production deployment leaves the board non-functional on every power-cycle.
The 144-pin TQFP package has 0.5 mm pitch leads, requiring careful PCB layout with 0.15 mm/0.15 mm trace/spacing rules for the fanout. Per the FLEX 6000 datasheet, the user I/O pins are arranged in four banks with shared VCCIO rails, so place the I/O bank supply decoupling at each bank corner. A solid ground plane on the layer beneath the FPGA is essential for clean JTAG operation at the recommended 10 MHz TCK.
Информация о соответствии
Compliance status not explicitly stated in the verified distributor listings. Altera FLEX 6000 family parts were originally manufactured with both leaded and lead-free finishes; the 'N' suffix on related variants (e.g., EPF6016ATI144-2N) indicates lead-free RoHS-compliant finish. For procurement requiring compliance, request a Certificate of Conformity from the broker or distributor.