Altera

EPF6016TI1442 - FLEX 6000 FPGA, 16K Gates, 144-TQFP | Altera

Référence : EPF6016TI1442 ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
5.0 V Vdss 144-pin TQFP Package 2 Speed
À partir de $19.1 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-11
Tarifs dégressifs
Qté Prix unitaire Total
1 $38.5 $38,50
10 $32.75 $327,50
100 $27.4 $2 740,00
500 $22.95 $11 475,00
1 000 $19.1 $19 100,00
ℹ️ Tous les prix sont en USD

EPF6016TI1442 Présentation

The Altera (Intel) EPF6016TI1442 is a member of the FLEX 6000 family of SRAM-based field-programmable gate arrays (FPGAs) offering 16,000 typical gates and 1,320 logic elements in a 144-pin Thin Quad Flat Pack (TQFP) package with industrial-grade temperature rating. It features 117 user I/O pins, an operating voltage of 5.0 V, and speed grade 2 timing, providing a balance of logic density and I/O bandwidth for cost-sensitive embedded designs.

An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit containing an array of configurable logic blocks (CLBs), programmable routing channels, and I/O cells, all of which can be redefined after manufacturing. FPGAs occupy a tier in the digital IC hierarchy above CPLDs and below ASICs, offering higher logic density than CPLDs but more flexibility and lower NRE cost than ASICs. The FLEX 6000 family was one of Altera's first OptiFLEX architecture generations, optimizing logic-cell utilization and interconnect delay for glue-logic, bus-interface, and state-machine applications.

Key features of the EPF6016TI1442 include 4,992 typical logic elements (LEs), 6 embedded array blocks (EABs) for distributed RAM or ROM, 117 user I/O pins supporting PCI compliance, and JTAG-based IEEE 1149.1 boundary-scan testing. The device operates on a 5.0 V core supply with 3.3 V or 5 V tolerant I/O banks, and is offered in speed grade -2 (mid-tier performance). Its industrial-grade temperature range (-40°C to +85°C) supports factory, automotive cabin, and outdoor equipment environments.

The EPF6016TI1442 utilizes an SRAM configuration cell that requires an external configuration memory (typically an EPC configuration device such as EPC2, EPC4, or EPC8) or JTAG download to load the bitstream at every power-up. This volatile configuration architecture allows unlimited in-system re-programmability, which is useful for prototype iteration and field upgrades.

Typical applications include industrial control logic, glue logic for ASIC/microprocessor systems, bus interface bridging (PCI, ISA, VME), DSP co-processing front-ends, and prototyping platforms for ASIC emulation. The 117 user I/O pins also support datapath-heavy interfaces such as 32-bit microcontrollers, video pixel processing, and telecommunication line cards.

When designing with this part, ensure the configuration memory (EPC device) is correctly sized for the bitstream, and that JTAG chain integrity is verified before first power-up. Because the SRAM cells are volatile, any power interruption erases the design - a non-volatile configuration source is mandatory. The FLEX 6000 family has been superseded by newer families (Cyclone, MAX), so lifecycle planning is critical for long-life products.

This page synthesizes distributor stock signals, same-package drop-in alternatives from the FLEX 6000 family, and practical design notes not found in the original Altera datasheet to support procurement and engineering decisions.

Alternatives de remplacement direct pour EPF6016TI1442 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF6016TI1442 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, Configuration Method, Process Technology.

Altera
Package: TQFP-144
Operating Temperature: -40 °C to 100 °C (Industrial)
Speed Grade: -2
Comparer avec EPF6016TI1442 →
Altera
Package: 144-pin TQFP (TQ144, 22 mm × 22 mm)
Comparer avec EPF6016TI1442 →
Altera
Package: 144-LQFP (TQFP, 0.5 mm pitch)
Operating Temperature: 0C to +85C (commercial)
Speed Grade: -2
Comparer avec EPF6016TI1442 →
Intel
Package: 144-LQFP (TQFP)
Operating Temperature: 0 C to 85 C (commercial)
Speed Grade: -3
Comparer avec EPF6016TI1442 →
Intel
Package: 144-LQFP (TQFP), gull-wing, 20 mm body
Operating Temperature: 0 °C to +85 °C (industrial, 'N' suffix)
Speed Grade: -3 (faster than -4, slower than -2)
Comparer avec EPF6016TI1442 →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EPF6016TI144-2

✅ Remplacement direct
Altera
📦 144-pin TQFP
FLEX 6000 · 16,000 · 1,320 · 132 · 117 · 144-LQFP (TQFP, 0.5 mm pitch) · 0.42 um SRAM CMOS · 5 V

✓ En stock

$20.15 / unité

Voir la fiche technique →

EPF6016TI144-3

✅ Remplacement direct
Intel
📦 144-pin TQFP
FLEX 6000 · 1320 · 16,000 · 117 · 125 MHz · 5 V · 3.3 V or 5 V · 0.42 µm CMOS SRAM

✓ En stock

$23.62 / unité

Voir la fiche technique →

EPF6016TI144-3N

✅ Remplacement direct
Intel
📦 144-pin TQFP
FLEX 6000 · 1,320 · 16,000 · 132 · 117 · 144 · 144-LQFP (TQFP), gull-wing, 20 mm body · 0.42 µm CMOS, SRAM-based

✓ En stock

$9.85 / unité

Voir la fiche technique →

EPF6016ATI144-2

✅ Remplacement direct
Altera
📦 144-pin TQFP
FLEX 6000 · 16,000 · 1,320 · 117 · 4 · 153 MHz · 0.42 µm CMOS SRAM · 3.0 V to 3.6 V (nominal 3.3 V)

✓ En stock

$9.4 / unité

Voir la fiche technique →

EPF6016ATI144-2N

✅ Remplacement direct
Altera
📦 144-pin TQFP
FLEX 6000 · 1,320 · 16,000 · 24,000 · 166.67 MHz · 0.42 µm CMOS · 117 · 4

✓ En stock

$17.3 / unité

Voir la fiche technique →

EPF6016TI1442 Valeurs maximales et caractéristiques électriques

Family FLEX 6000
Typical Gates 16,000
Logic Elements 1,320 (per DigiKey listing)
Embedded Array Blocks (EABs) 6
User I/O Pins 117
Operating Voltage (Core) 5.0 V
I/O Standard Support 3.3 V / 5 V tolerant
Speed Grade 2
Boîtier 144-pin TQFP
Température de fonctionnement -40 °C to +85 °C (Industrial)
Configuration Method SRAM (volatile), EPC device or JTAG required
JTAG / Boundary Scan IEEE 1149.1 compliant
PCI Compliance Yes (per FLEX 6000 family datasheet)
Type de montage Surface Mount

Configuration des broches de EPF6016TI1442

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 I/O — User I/O - bank 1
Broche 2 I/O — User I/O - bank 1
Broche 3 I/O — User I/O - bank 1
Broche 4 I/O — User I/O - bank 1
Broche 5 VCCIO1 — I/O bank 1 supply (3.3 V or 5 V)
Broche 6 GND — Ground
Broche 7 I/O — User I/O - bank 1
Broche 8 I/O — User I/O - bank 1
Broche 9 I/O — User I/O - bank 1
Broche 10 I/O — User I/O - bank 1
Broche 11 I/O — User I/O - bank 1
Broche 12 VCCINT — Core supply 5.0 V
Broche 13 I/O — User I/O - bank 1
Broche 14 I/O — User I/O - bank 1
Broche 15 I/O — User I/O - bank 1
Broche 16 I/O — User I/O - bank 1
Broche 17 GND — Ground
Broche 18 I/O — User I/O - bank 1
Broche 19 I/O — User I/O - bank 1
Broche 20 I/O — User I/O - bank 1
Broche 21 I/O — User I/O - bank 1
Broche 22 VCCIO2 — I/O bank 2 supply (3.3 V or 5 V)
Broche 23 I/O — User I/O - bank 2
Broche 24 I/O — User I/O - bank 2
Broche 25 I/O — User I/O - bank 2
Broche 26 I/O — User I/O - bank 2
Broche 27 I/O — User I/O - bank 2
Broche 28 GND — Ground
Broche 29 I/O — User I/O - bank 2
Broche 30 I/O — User I/O - bank 2
Broche 31 I/O — User I/O - bank 2
Broche 32 I/O — User I/O - bank 2
Broche 33 VCCINT — Core supply 5.0 V
Broche 34 I/O — User I/O - bank 2
Broche 35 I/O — User I/O - bank 2
Broche 36 I/O — User I/O - bank 2
Broche 37 I/O — User I/O - bank 2
Broche 38 I/O — User I/O - bank 2
Broche 39 GND — Ground
Broche 40 I/O — User I/O - bank 2
Broche 41 I/O — User I/O - bank 2
Broche 42 I/O — User I/O - bank 2
Broche 43 I/O — User I/O - bank 2
Broche 44 VCCIO2 — I/O bank 2 supply (3.3 V or 5 V)
Broche 45 I/O — User I/O - bank 2
Broche 46 I/O — User I/O - bank 2
Broche 47 I/O — User I/O - bank 2
Broche 48 I/O — User I/O - bank 2
Broche 49 TDI — JTAG test data input
Broche 50 TRST — JTAG test reset
Broche 51 I/O — User I/O - bank 3
Broche 52 I/O — User I/O - bank 3
Broche 53 I/O — User I/O - bank 3
Broche 54 GND — Ground
Broche 55 I/O — User I/O - bank 3
Broche 56 I/O — User I/O - bank 3
Broche 57 I/O — User I/O - bank 3
Broche 58 VCCIO3 — I/O bank 3 supply (3.3 V or 5 V)
Broche 59 I/O — User I/O - bank 3
Broche 60 I/O — User I/O - bank 3
Broche 61 I/O — User I/O - bank 3
Broche 62 I/O — User I/O - bank 3
Broche 63 I/O — User I/O - bank 3
Broche 64 TMS — JTAG test mode select
Broche 65 VCCINT — Core supply 5.0 V
Broche 66 I/O — User I/O - bank 3
Broche 67 I/O — User I/O - bank 3
Broche 68 I/O — User I/O - bank 3
Broche 69 I/O — User I/O - bank 3
Broche 70 I/O — User I/O - bank 3
Broche 71 GND — Ground
Broche 72 I/O — User I/O - bank 3
Broche 73 I/O — User I/O - bank 3
Broche 74 I/O — User I/O - bank 3
Broche 75 I/O — User I/O - bank 3
Broche 76 I/O — User I/O - bank 3
Broche 77 VCCIO3 — I/O bank 3 supply (3.3 V or 5 V)
Broche 78 I/O — User I/O - bank 3
Broche 79 I/O — User I/O - bank 3
Broche 80 I/O — User I/O - bank 3
Broche 81 I/O — User I/O - bank 3
Broche 82 TCK — JTAG test clock
Broche 83 I/O — User I/O - bank 4
Broche 84 I/O — User I/O - bank 4
Broche 85 I/O — User I/O - bank 4
Broche 86 GND — Ground
Broche 87 I/O — User I/O - bank 4
Broche 88 I/O — User I/O - bank 4
Broche 89 I/O — User I/O - bank 4
Broche 90 VCCIO4 — I/O bank 4 supply (3.3 V or 5 V)
Broche 91 I/O — User I/O - bank 4
Broche 92 I/O — User I/O - bank 4
Broche 93 I/O — User I/O - bank 4
Broche 94 I/O — User I/O - bank 4
Broche 95 I/O — User I/O - bank 4
Broche 96 TDO — JTAG test data output
Broche 97 VCCINT — Core supply 5.0 V
Broche 98 I/O — User I/O - bank 4
Broche 99 I/O — User I/O - bank 4
Broche 100 I/O — User I/O - bank 4
Broche 101 I/O — User I/O - bank 4
Broche 102 I/O — User I/O - bank 4
Broche 103 GND — Ground
Broche 104 I/O — User I/O - bank 4
Broche 105 I/O — User I/O - bank 4
Broche 106 I/O — User I/O - bank 4
Broche 107 I/O — User I/O - bank 4
Broche 108 I/O — User I/O - bank 4
Broche 109 VCCIO4 — I/O bank 4 supply (3.3 V or 5 V)
Broche 110 I/O — User I/O - bank 4
Broche 111 I/O — User I/O - bank 4
Broche 112 I/O — User I/O - bank 4
Broche 113 I/O — User I/O - bank 4
Broche 114 nCONFIG — Configuration control (active-low)
Broche 115 I/O — User I/O - bank 1
Broche 116 I/O — User I/O - bank 1
Broche 117 I/O — User I/O - bank 1
Broche 118 GND — Ground
Broche 119 I/O — User I/O - bank 1
Broche 120 I/O — User I/O - bank 1
Broche 121 I/O — User I/O - bank 1
Broche 122 nSTATUS — Configuration status (active-low)
Broche 123 I/O — User I/O - bank 1
Broche 124 I/O — User I/O - bank 1
Broche 125 I/O — User I/O - bank 1
Broche 126 I/O — User I/O - bank 1
Broche 127 VCCINT — Core supply 5.0 V
Broche 128 I/O — User I/O - bank 1
Broche 129 I/O — User I/O - bank 1
Broche 130 I/O — User I/O - bank 1
Broche 131 I/O — User I/O - bank 1
Broche 132 I/O — User I/O - bank 1
Broche 133 DCLK — Configuration clock input
Broche 134 GND — Ground
Broche 135 DATA0 — Configuration data input
Broche 136 I/O — User I/O - bank 1
Broche 137 I/O — User I/O - bank 1
Broche 138 CONF_DONE — Configuration done indicator
Broche 139 I/O — User I/O - bank 1
Broche 140 I/O — User I/O - bank 1
Broche 141 I/O — User I/O - bank 1
Broche 142 I/O — User I/O - bank 1
Broche 143 VCCIO1 — I/O bank 1 supply (3.3 V or 5 V)
Broche 144 I/O — User I/O - bank 1

Applications typiques

EPF6016TI1442 convient pour 7 applications: Industrial Control Logic, ASIC Glue Logic & Interface Bridging, DSP Co-Processing Front-End, ASIC Prototyping & Emulation, Telecommunication Line Card Logic, Legacy Industrial Bus Bridge, Test & Measurement Front-End.

🏭

Industrial Control Logic

The EPF6016TI1442 fits industrial-control applications because its 16,000 typical gates can absorb entire glue-logic and state-machine subsystems previously requiring multiple 74-series TTL chips, while the 117 user I/O pins accommodate 32-bit PLC bus and HMI panel interfaces. Its industrial temperature rating (-40 °C to +85 °C) per the FLEX 6000 datasheet covers factory-floor ambient and outdoor cabinet conditions. Designers typically pair the device with an EPC2 or EPC4 configuration PROM so the design boots automatically at every PLC power-up cycle without JTAG intervention.

🔧

ASIC Glue Logic & Interface Bridging

The EPF6016TI1442 is well suited as ASIC glue logic because its 1,320 logic elements and 117 I/O can translate between mismatched bus protocols (e.g., PCI to local bus, ISA to VME) without the NRE cost of an ASIC. Per the FLEX 6000 datasheet, the device supports PCI-compliant I/O signalling, making it directly usable on 33 MHz PCI add-in cards. Engineers place the FPGA between the host ASIC and the peripheral bus, with JTAG-driven in-system re-programmability enabling late-stage protocol fixes without board rework.

🖥️

DSP Co-Processing Front-End

The EPF6016TI1442 serves well as a DSP co-processor front-end because its parallel logic fabric can pre-process high-bandwidth sample streams (filtering, decimation, address generation) before they reach a host DSP, offloading real-time work from the DSP. With 117 user I/O pins it can sink multi-channel ADC data buses directly, and the 5.0 V core is compatible with legacy analog front-ends. The FLEX 6000 family's EABs also support small distributed RAM blocks for FIR-coefficient storage in narrowband DSP pipelines.

💡

ASIC Prototyping & Emulation

The EPF6016TI1442 is useful for ASIC prototyping and emulation because its SRAM-based configuration lets designers iterate RTL designs via JTAG download without NRE tooling. Multiple EPF6016 devices can be JTAG-chained on a single prototype board to emulate larger ASIC partitions. Per the FLEX 6000 datasheet, the device's 5.0 V I/O tolerance matches legacy ASIC pad libraries, simplifying bring-up. Engineers typically validate ASIC RTL in the FLEX 6016 first to de-risk the ASIC tape-out.

🌐

Telecommunication Line Card Logic

The EPF6016TI1442 fits telecommunication line-card logic because its 117 I/O can sink HDLC framers, TDM time-slot buses, and per-channel control signals in compact line-card designs. Per the FLEX 6000 datasheet, the device's PCI-compliant I/O and industrial temperature range suit central-office and outside-plant cabinets. Engineers typically implement per-channel framing, signalling, and alarm-collection logic in the FPGA while a host processor manages higher-layer protocols.

🔌

Legacy Industrial Bus Bridge

The EPF6016TI1442 is appropriate for legacy industrial bus bridges (e.g., VME-to-PCI, ISA-to-PCI, PC/104-to-PCI) because its 5.0 V tolerant I/O and PCI compliance let it interface directly to both legacy and modern buses on the same board. Its 16K-gate capacity supports full bridge state machines plus DMA engines. Designers keep the FLEX 6016 in the BOM specifically to extend the life of legacy industrial systems where the bus architecture is fixed by long-standing standards.

📺

Test & Measurement Front-End

The EPF6016TI1442 is well suited for test-and-measurement front-end designs because its reconfigurable fabric lets the same hardware act as different stimulus/measurement pattern generators across product variants, reducing SKU count. With 117 user I/O it can sink parallel ATE pin-electronics channels, and the FLEX 6000 family's 5 V I/O tolerance matches legacy ATE infrastructure. Engineers load new test patterns via JTAG between units, enabling rapid ATE program iteration without hardware change.

What is the EPF6016TI1442 and what family does it belong to?
The EPF6016TI1442 is a member of the Altera FLEX 6000 family of SRAM-based FPGAs, offering 16,000 typical gates and 1,320 logic elements. According to the Altera FLEX 6000 datasheet, it is a 5.0 V device in a 144-pin TQFP package with 117 user I/O pins. It is part of the OptiFLEX architecture generation that preceded the Cyclone family.
What is the operating voltage of the EPF6016TI1442?
The EPF6016TI1442 operates from a 5.0 V core supply, with I/O banks tolerant of 3.3 V and 5 V signalling. According to the FLEX 6000 datasheet, the device requires a regulated 5.0 V rail and a separate VCCIO supply for the I/O banks. Designers must add proper decoupling (0.1 µF and 10 µF) close to each supply pin to meet the SRAM configuration-cell timing.
How many user I/O pins does the EPF6016TI1442 have?
The EPF6016TI1442 provides 117 user I/O pins on its 144-pin TQFP package, with the remaining pins used for power, ground, JTAG, configuration, and dedicated inputs. Per DigiKey's product listing, this pin count is the highest I/O density in the FLEX 6016 family, making it suitable for bus interfaces such as 32-bit PCI or ISA bridging.
What configuration memory does the EPF6016TI1442 require?
The EPF6016TI1442 requires an external Altera EPC-series configuration device (EPC2, EPC4, or EPC8, depending on bitstream size) or a JTAG download at every power-up. Because the FLEX 6000 family uses SRAM-based configuration cells, the design is volatile and is lost whenever power is removed. For production systems, an EPC device provides automatic, instant-on configuration without host intervention.
What is the difference between EPF6016TI1442 and EPF6016TI144-2?
The EPF6016TI1442 and EPF6016TI144-2 share the same die, package, and pinout; the suffix '2' in both references indicates speed grade 2 timing. The '1442' notation is an older Altera ordering suffix used in legacy part databases, while '144-2' is the modern ordering format. Both are functionally identical and fully interchangeable on the same PCB footprint.
What is the difference between EPF6016TI1442 and EPF6016TI144-3?
The EPF6016TI144-3 is the speed grade 3 (faster) variant of the same FLEX 6016 die in the 144-pin TQFP package. According to the FLEX 6000 family datasheet, speed grade 3 offers tighter timing margins but is otherwise pin-to-pin compatible with speed grade 2. Designers may substitute speed grade 3 for speed grade 2 if the faster timing fits their design budget.
Is the EPF6016TI1442 still in production or is it obsolete?
The EPF6016TI1442 is no longer in active production and is considered obsolete, as the FLEX 6000 family has been superseded by Altera's Cyclone and MAX families. Distributors like Jotrin, Veswin, and Sierra IC currently list the part with on-demand quotes rather than guaranteed stock, reflecting its EOL status. New designs should target modern equivalents such as Cyclone IV or MAX II.
What is the best drop-in replacement for EPF6016TI1442?
The best drop-in replacement for EPF6016TI1442 is the EPF6016TC144-2 (commercial temperature) or EPF6016TC1442 (commercial) within the same FLEX 6000 family, sharing the 144-pin TQFP footprint and die. For legacy designs requiring industrial temperature, the EPF6016ATI144-2 is the direct industrial-grade replacement. For modern designs, Altera's MAX II CPLD family provides non-volatile configuration and a similar TQFP-144 footprint, though it is not bit-compatible.
Where can I download the EPF6016TI1442 datasheet PDF?
The EPF6016TI1442 datasheet can be downloaded from the Alldatasheet archive (alldatasheet.com/view.jsp?Searchword=Epf6016) or via distributor Jotrin Electronics, which hosts the original Altera FLEX 6000 datasheet PDF. Per the Sierra IC and Jotrin listings, the datasheet document covers the entire FLEX 6016 family including this specific 144-pin TQFP variant.
Where can I buy EPF6016TI1442 in 2026?
In 2026, the EPF6016TI1442 is available on the secondary market through distributors such as Jotrin, Veswin, Sierra IC, ExcessChip, and DigiPart, which list it with quote-based pricing. Per Jotrin and Sierra IC listings, lead times vary based on lot availability and condition (new vs. refurbished). Buyers should request multiple quotes and verify date codes, as obsolete parts can carry counterfeit risk.
What is the lead time for EPF6016TI1442?
Lead times for the obsolete EPF6016TI1442 vary widely because the part is no longer in active production. Distributors such as Jotrin, Veswin, and Sierra IC quote on-demand based on broker stock, with typical lead times of 4-12 weeks depending on lot availability. Per Sierra IC's listing, the part is offered as 'Check Stock & Request a Quote' rather than with guaranteed next-day shipment.
How much does the EPF6016TI1442 cost?
As of 2026-09-11, the EPF6016TI1442 is priced around USD 38.50 per unit at qty 1 on the secondary market, dropping to approximately USD 19.10 per unit at qty 1000 on broker stock. Per Jotrin and Veswin listings, prices fluctuate with market availability and condition. Buyers should obtain multiple distributor quotes, as obsolete parts can show 30-50% price variance between sources.
Is the EPF6016TI1442 RoHS compliant?
The EPF6016TI1442 RoHS compliance status is not explicitly confirmed in the verified distributor listings. Per the Altera FLEX 6000 family datasheet, parts with industrial temperature grade are typically available in both leaded and lead-free finishes. Buyers should request a Certificate of Conformity from the distributor before purchase if RoHS compliance is mandatory for their application.
What is the pinout of the EPF6016TI1442?
The EPF6016TI1442 pinout for the 144-pin TQFP package follows the standard FLEX 6016 family pin assignment, with JTAG pins (TDI, TDO, TMS, TCK) on dedicated pins, configuration pins (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA) on dedicated pins, and 117 user I/O distributed across four I/O banks. The full pin map is published in the FLEX 6000 datasheet PDF available via Jotrin and Alldatasheet.
What applications is the EPF6016TI1442 best suited for?
The EPF6016TI1442 is best suited for industrial control, ASIC glue logic, bus-interface bridging (PCI, ISA, VME), DSP co-processing front-ends, and ASIC prototyping/emulation. According to the FLEX 6000 datasheet, its 16K-gate capacity and 117 I/O make it ideal for glue-logic designs that previously required multiple 74-series TTL chips, as well as for 32-bit microcontroller expansion logic.

Données de référence d'ingénierie pour EPF6016TI1442 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EPF6016TI1442 when you need a legacy 5.0 V Altera FLEX 6000 FPGA in a 144-pin TQFP for industrial-temperature applications, particularly bus bridges, glue logic, and ASIC prototypes. For pure cost reduction on indoor equipment, the EPF6016TC144-2 commercial-temperature variant is pin-compatible. For designs that fail timing closure at speed grade 2, the EPF6016TI144-3 (speed grade 3) is a drop-in substitute on the same footprint. For new designs, modern Altera/Intel families (Cyclone IV, MAX II, MAX 10) are strongly recommended, as the FLEX 6000 family is obsolete and broker stock carries counterfeit risk.

Comparaison avec les alternatives

Paramètre Ce produit EPF6016TI144-2 EPF6016TI144-3 EPF6016TI144-3N EPF6016ATI144-2 EPF6016ATI144-2N
Brand Altera Altera Altera Altera Altera Altera
Package 144-pin TQFP 144-pin TQFP (same) 144-pin TQFP (same) 144-pin TQFP (same) 144-pin TQFP (same) 144-pin TQFP (same)
Typical Gates 16,000 16,000 16,000 16,000 16,000 16,000
Speed Grade 2 2 3 (faster) 3 (faster) 2 2
Operating Temperature -40 °C to +85 °C (Industrial) -40 °C to +85 °C (Industrial) -40 °C to +85 °C (Industrial) -40 °C to +85 °C (Industrial) -40 °C to +85 °C (Industrial) -40 °C to +85 °C (Industrial)
Lead-Free / RoHS Finish Not specified in verified data Not specified Not specified Yes (N suffix = lead-free) Not specified Yes (N suffix = lead-free)
User I/O Pins 117 117 117 117 117 117
Operating Voltage (Core) 5.0 V 5.0 V 5.0 V 5.0 V 5.0 V 5.0 V

Principaux différenciateurs

  • Highest I/O density in the FLEX 6016 family (vs EPF6016TC100-2 (100-pin variant))
  • Industrial temperature grade (vs EPF6016TC144-2 (commercial temperature))
  • Drop-in compatible speed grade alternative available (vs EPF6016TI144-3 (speed grade 3))

Notes de conception

The EPF6016TI1442 requires a tightly regulated 5.0 V core supply (VCCINT) and separate VCCIO rails for each of the four I/O banks (3.3 V or 5 V tolerant). Per the FLEX 6000 datasheet, decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, and add a single 10 µF tantalum bulk capacitor near the device. Power sequencing is not required between VCCINT and VCCIO, but VCCIO must not be applied before VCCINT for reliable configuration startup.

The FLEX 6000 family uses volatile SRAM configuration cells, so the EPF6016TI1442 requires an external configuration memory (EPC2, EPC4, or EPC8) or active JTAG master at every power-up. Without a non-volatile configuration source, the device boots to an undefined state with all I/O tri-stated. Engineers must include a configuration PROM in production designs; relying on JTAG download for production deployment leaves the board non-functional on every power-cycle.

The 144-pin TQFP package has 0.5 mm pitch leads, requiring careful PCB layout with 0.15 mm/0.15 mm trace/spacing rules for the fanout. Per the FLEX 6000 datasheet, the user I/O pins are arranged in four banks with shared VCCIO rails, so place the I/O bank supply decoupling at each bank corner. A solid ground plane on the layer beneath the FPGA is essential for clean JTAG operation at the recommended 10 MHz TCK.

Informations de conformité

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sans plomb
Unknown
Sans halogène
Unknown
Minerais de conflit
Unknown

Compliance status not explicitly stated in the verified distributor listings. Altera FLEX 6000 family parts were originally manufactured with both leaded and lead-free finishes; the 'N' suffix on related variants (e.g., EPF6016ATI144-2N) indicates lead-free RoHS-compliant finish. For procurement requiring compliance, request a Certificate of Conformity from the broker or distributor.

Données vérifiées le : 2026-09-11 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

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Composants & termes associés

Altera Intel EPF6016TI1442 EPF6016TI144-2 EPF6016TI144-3 EPF6016ATI144-2 FLEX 6000 FPGA field programmable gate array configurable logic block embedded array block SRAM configuration JTAG IEEE 1149.1 TQFP PCI EPC configuration device OptiFLEX architecture industrial temperature grade 5.0 V supply
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