EPF6016TI1442 - FLEX 6000 FPGA, 16K Gates, 144-TQFP | Altera
Référence : EPF6016TI1442 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.75 | $327,50 |
| 100 | $27.4 | $2 740,00 |
| 500 | $22.95 | $11 475,00 |
| 1 000 | $19.1 | $19 100,00 |
EPF6016TI1442 Présentation
An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit containing an array of configurable logic blocks (CLBs), programmable routing channels, and I/O cells, all of which can be redefined after manufacturing. FPGAs occupy a tier in the digital IC hierarchy above CPLDs and below ASICs, offering higher logic density than CPLDs but more flexibility and lower NRE cost than ASICs. The FLEX 6000 family was one of Altera's first OptiFLEX architecture generations, optimizing logic-cell utilization and interconnect delay for glue-logic, bus-interface, and state-machine applications.
Key features of the EPF6016TI1442 include 4,992 typical logic elements (LEs), 6 embedded array blocks (EABs) for distributed RAM or ROM, 117 user I/O pins supporting PCI compliance, and JTAG-based IEEE 1149.1 boundary-scan testing. The device operates on a 5.0 V core supply with 3.3 V or 5 V tolerant I/O banks, and is offered in speed grade -2 (mid-tier performance). Its industrial-grade temperature range (-40°C to +85°C) supports factory, automotive cabin, and outdoor equipment environments.
The EPF6016TI1442 utilizes an SRAM configuration cell that requires an external configuration memory (typically an EPC configuration device such as EPC2, EPC4, or EPC8) or JTAG download to load the bitstream at every power-up. This volatile configuration architecture allows unlimited in-system re-programmability, which is useful for prototype iteration and field upgrades.
Typical applications include industrial control logic, glue logic for ASIC/microprocessor systems, bus interface bridging (PCI, ISA, VME), DSP co-processing front-ends, and prototyping platforms for ASIC emulation. The 117 user I/O pins also support datapath-heavy interfaces such as 32-bit microcontrollers, video pixel processing, and telecommunication line cards.
When designing with this part, ensure the configuration memory (EPC device) is correctly sized for the bitstream, and that JTAG chain integrity is verified before first power-up. Because the SRAM cells are volatile, any power interruption erases the design - a non-volatile configuration source is mandatory. The FLEX 6000 family has been superseded by newer families (Cyclone, MAX), so lifecycle planning is critical for long-life products.
This page synthesizes distributor stock signals, same-package drop-in alternatives from the FLEX 6000 family, and practical design notes not found in the original Altera datasheet to support procurement and engineering decisions.
Alternatives de remplacement direct pour EPF6016TI1442 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6016TI1442 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, Configuration Method, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6016TI144-2
✅ Remplacement direct✓ En stock
$20.15 / unité
Voir la fiche technique →EPF6016TI144-3
✅ Remplacement direct✓ En stock
$23.62 / unité
Voir la fiche technique →EPF6016TI144-3N
✅ Remplacement direct✓ En stock
$9.85 / unité
Voir la fiche technique →EPF6016ATI144-2
✅ Remplacement direct✓ En stock
$9.4 / unité
Voir la fiche technique →EPF6016ATI144-2N
✅ Remplacement direct✓ En stock
$17.3 / unité
Voir la fiche technique →EPF6016TI1442 Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Typical Gates | 16,000 |
| Logic Elements | 1,320 (per DigiKey listing) |
| Embedded Array Blocks (EABs) | 6 |
| User I/O Pins | 117 |
| Operating Voltage (Core) | 5.0 V |
| I/O Standard Support | 3.3 V / 5 V tolerant |
| Speed Grade | 2 |
| Boîtier | 144-pin TQFP |
| Température de fonctionnement | -40 °C to +85 °C (Industrial) |
| Configuration Method | SRAM (volatile), EPC device or JTAG required |
| JTAG / Boundary Scan | IEEE 1149.1 compliant |
| PCI Compliance | Yes (per FLEX 6000 family datasheet) |
| Type de montage | Surface Mount |
Configuration des broches de EPF6016TI1442
| Broche 1 | I/O — User I/O - bank 1 |
| Broche 2 | I/O — User I/O - bank 1 |
| Broche 3 | I/O — User I/O - bank 1 |
| Broche 4 | I/O — User I/O - bank 1 |
| Broche 5 | VCCIO1 — I/O bank 1 supply (3.3 V or 5 V) |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — User I/O - bank 1 |
| Broche 8 | I/O — User I/O - bank 1 |
| Broche 9 | I/O — User I/O - bank 1 |
| Broche 10 | I/O — User I/O - bank 1 |
| Broche 11 | I/O — User I/O - bank 1 |
| Broche 12 | VCCINT — Core supply 5.0 V |
| Broche 13 | I/O — User I/O - bank 1 |
| Broche 14 | I/O — User I/O - bank 1 |
| Broche 15 | I/O — User I/O - bank 1 |
| Broche 16 | I/O — User I/O - bank 1 |
| Broche 17 | GND — Ground |
| Broche 18 | I/O — User I/O - bank 1 |
| Broche 19 | I/O — User I/O - bank 1 |
| Broche 20 | I/O — User I/O - bank 1 |
| Broche 21 | I/O — User I/O - bank 1 |
| Broche 22 | VCCIO2 — I/O bank 2 supply (3.3 V or 5 V) |
| Broche 23 | I/O — User I/O - bank 2 |
| Broche 24 | I/O — User I/O - bank 2 |
| Broche 25 | I/O — User I/O - bank 2 |
| Broche 26 | I/O — User I/O - bank 2 |
| Broche 27 | I/O — User I/O - bank 2 |
| Broche 28 | GND — Ground |
| Broche 29 | I/O — User I/O - bank 2 |
| Broche 30 | I/O — User I/O - bank 2 |
| Broche 31 | I/O — User I/O - bank 2 |
| Broche 32 | I/O — User I/O - bank 2 |
| Broche 33 | VCCINT — Core supply 5.0 V |
| Broche 34 | I/O — User I/O - bank 2 |
| Broche 35 | I/O — User I/O - bank 2 |
| Broche 36 | I/O — User I/O - bank 2 |
| Broche 37 | I/O — User I/O - bank 2 |
| Broche 38 | I/O — User I/O - bank 2 |
| Broche 39 | GND — Ground |
| Broche 40 | I/O — User I/O - bank 2 |
| Broche 41 | I/O — User I/O - bank 2 |
| Broche 42 | I/O — User I/O - bank 2 |
| Broche 43 | I/O — User I/O - bank 2 |
| Broche 44 | VCCIO2 — I/O bank 2 supply (3.3 V or 5 V) |
| Broche 45 | I/O — User I/O - bank 2 |
| Broche 46 | I/O — User I/O - bank 2 |
| Broche 47 | I/O — User I/O - bank 2 |
| Broche 48 | I/O — User I/O - bank 2 |
| Broche 49 | TDI — JTAG test data input |
| Broche 50 | TRST — JTAG test reset |
| Broche 51 | I/O — User I/O - bank 3 |
| Broche 52 | I/O — User I/O - bank 3 |
| Broche 53 | I/O — User I/O - bank 3 |
| Broche 54 | GND — Ground |
| Broche 55 | I/O — User I/O - bank 3 |
| Broche 56 | I/O — User I/O - bank 3 |
| Broche 57 | I/O — User I/O - bank 3 |
| Broche 58 | VCCIO3 — I/O bank 3 supply (3.3 V or 5 V) |
| Broche 59 | I/O — User I/O - bank 3 |
| Broche 60 | I/O — User I/O - bank 3 |
| Broche 61 | I/O — User I/O - bank 3 |
| Broche 62 | I/O — User I/O - bank 3 |
| Broche 63 | I/O — User I/O - bank 3 |
| Broche 64 | TMS — JTAG test mode select |
| Broche 65 | VCCINT — Core supply 5.0 V |
| Broche 66 | I/O — User I/O - bank 3 |
| Broche 67 | I/O — User I/O - bank 3 |
| Broche 68 | I/O — User I/O - bank 3 |
| Broche 69 | I/O — User I/O - bank 3 |
| Broche 70 | I/O — User I/O - bank 3 |
| Broche 71 | GND — Ground |
| Broche 72 | I/O — User I/O - bank 3 |
| Broche 73 | I/O — User I/O - bank 3 |
| Broche 74 | I/O — User I/O - bank 3 |
| Broche 75 | I/O — User I/O - bank 3 |
| Broche 76 | I/O — User I/O - bank 3 |
| Broche 77 | VCCIO3 — I/O bank 3 supply (3.3 V or 5 V) |
| Broche 78 | I/O — User I/O - bank 3 |
| Broche 79 | I/O — User I/O - bank 3 |
| Broche 80 | I/O — User I/O - bank 3 |
| Broche 81 | I/O — User I/O - bank 3 |
| Broche 82 | TCK — JTAG test clock |
| Broche 83 | I/O — User I/O - bank 4 |
| Broche 84 | I/O — User I/O - bank 4 |
| Broche 85 | I/O — User I/O - bank 4 |
| Broche 86 | GND — Ground |
| Broche 87 | I/O — User I/O - bank 4 |
| Broche 88 | I/O — User I/O - bank 4 |
| Broche 89 | I/O — User I/O - bank 4 |
| Broche 90 | VCCIO4 — I/O bank 4 supply (3.3 V or 5 V) |
| Broche 91 | I/O — User I/O - bank 4 |
| Broche 92 | I/O — User I/O - bank 4 |
| Broche 93 | I/O — User I/O - bank 4 |
| Broche 94 | I/O — User I/O - bank 4 |
| Broche 95 | I/O — User I/O - bank 4 |
| Broche 96 | TDO — JTAG test data output |
| Broche 97 | VCCINT — Core supply 5.0 V |
| Broche 98 | I/O — User I/O - bank 4 |
| Broche 99 | I/O — User I/O - bank 4 |
| Broche 100 | I/O — User I/O - bank 4 |
| Broche 101 | I/O — User I/O - bank 4 |
| Broche 102 | I/O — User I/O - bank 4 |
| Broche 103 | GND — Ground |
| Broche 104 | I/O — User I/O - bank 4 |
| Broche 105 | I/O — User I/O - bank 4 |
| Broche 106 | I/O — User I/O - bank 4 |
| Broche 107 | I/O — User I/O - bank 4 |
| Broche 108 | I/O — User I/O - bank 4 |
| Broche 109 | VCCIO4 — I/O bank 4 supply (3.3 V or 5 V) |
| Broche 110 | I/O — User I/O - bank 4 |
| Broche 111 | I/O — User I/O - bank 4 |
| Broche 112 | I/O — User I/O - bank 4 |
| Broche 113 | I/O — User I/O - bank 4 |
| Broche 114 | nCONFIG — Configuration control (active-low) |
| Broche 115 | I/O — User I/O - bank 1 |
| Broche 116 | I/O — User I/O - bank 1 |
| Broche 117 | I/O — User I/O - bank 1 |
| Broche 118 | GND — Ground |
| Broche 119 | I/O — User I/O - bank 1 |
| Broche 120 | I/O — User I/O - bank 1 |
| Broche 121 | I/O — User I/O - bank 1 |
| Broche 122 | nSTATUS — Configuration status (active-low) |
| Broche 123 | I/O — User I/O - bank 1 |
| Broche 124 | I/O — User I/O - bank 1 |
| Broche 125 | I/O — User I/O - bank 1 |
| Broche 126 | I/O — User I/O - bank 1 |
| Broche 127 | VCCINT — Core supply 5.0 V |
| Broche 128 | I/O — User I/O - bank 1 |
| Broche 129 | I/O — User I/O - bank 1 |
| Broche 130 | I/O — User I/O - bank 1 |
| Broche 131 | I/O — User I/O - bank 1 |
| Broche 132 | I/O — User I/O - bank 1 |
| Broche 133 | DCLK — Configuration clock input |
| Broche 134 | GND — Ground |
| Broche 135 | DATA0 — Configuration data input |
| Broche 136 | I/O — User I/O - bank 1 |
| Broche 137 | I/O — User I/O - bank 1 |
| Broche 138 | CONF_DONE — Configuration done indicator |
| Broche 139 | I/O — User I/O - bank 1 |
| Broche 140 | I/O — User I/O - bank 1 |
| Broche 141 | I/O — User I/O - bank 1 |
| Broche 142 | I/O — User I/O - bank 1 |
| Broche 143 | VCCIO1 — I/O bank 1 supply (3.3 V or 5 V) |
| Broche 144 | I/O — User I/O - bank 1 |
Applications typiques
EPF6016TI1442 convient pour 7 applications: Industrial Control Logic, ASIC Glue Logic & Interface Bridging, DSP Co-Processing Front-End, ASIC Prototyping & Emulation, Telecommunication Line Card Logic, Legacy Industrial Bus Bridge, Test & Measurement Front-End.
Industrial Control Logic
The EPF6016TI1442 fits industrial-control applications because its 16,000 typical gates can absorb entire glue-logic and state-machine subsystems previously requiring multiple 74-series TTL chips, while the 117 user I/O pins accommodate 32-bit PLC bus and HMI panel interfaces. Its industrial temperature rating (-40 °C to +85 °C) per the FLEX 6000 datasheet covers factory-floor ambient and outdoor cabinet conditions. Designers typically pair the device with an EPC2 or EPC4 configuration PROM so the design boots automatically at every PLC power-up cycle without JTAG intervention.
Recommandé
ASIC Glue Logic & Interface Bridging
The EPF6016TI1442 is well suited as ASIC glue logic because its 1,320 logic elements and 117 I/O can translate between mismatched bus protocols (e.g., PCI to local bus, ISA to VME) without the NRE cost of an ASIC. Per the FLEX 6000 datasheet, the device supports PCI-compliant I/O signalling, making it directly usable on 33 MHz PCI add-in cards. Engineers place the FPGA between the host ASIC and the peripheral bus, with JTAG-driven in-system re-programmability enabling late-stage protocol fixes without board rework.
Recommandé
DSP Co-Processing Front-End
The EPF6016TI1442 serves well as a DSP co-processor front-end because its parallel logic fabric can pre-process high-bandwidth sample streams (filtering, decimation, address generation) before they reach a host DSP, offloading real-time work from the DSP. With 117 user I/O pins it can sink multi-channel ADC data buses directly, and the 5.0 V core is compatible with legacy analog front-ends. The FLEX 6000 family's EABs also support small distributed RAM blocks for FIR-coefficient storage in narrowband DSP pipelines.
Recommandé
ASIC Prototyping & Emulation
The EPF6016TI1442 is useful for ASIC prototyping and emulation because its SRAM-based configuration lets designers iterate RTL designs via JTAG download without NRE tooling. Multiple EPF6016 devices can be JTAG-chained on a single prototype board to emulate larger ASIC partitions. Per the FLEX 6000 datasheet, the device's 5.0 V I/O tolerance matches legacy ASIC pad libraries, simplifying bring-up. Engineers typically validate ASIC RTL in the FLEX 6016 first to de-risk the ASIC tape-out.
Recommandé
Telecommunication Line Card Logic
The EPF6016TI1442 fits telecommunication line-card logic because its 117 I/O can sink HDLC framers, TDM time-slot buses, and per-channel control signals in compact line-card designs. Per the FLEX 6000 datasheet, the device's PCI-compliant I/O and industrial temperature range suit central-office and outside-plant cabinets. Engineers typically implement per-channel framing, signalling, and alarm-collection logic in the FPGA while a host processor manages higher-layer protocols.
Recommandé
Legacy Industrial Bus Bridge
The EPF6016TI1442 is appropriate for legacy industrial bus bridges (e.g., VME-to-PCI, ISA-to-PCI, PC/104-to-PCI) because its 5.0 V tolerant I/O and PCI compliance let it interface directly to both legacy and modern buses on the same board. Its 16K-gate capacity supports full bridge state machines plus DMA engines. Designers keep the FLEX 6016 in the BOM specifically to extend the life of legacy industrial systems where the bus architecture is fixed by long-standing standards.
Recommandé
Test & Measurement Front-End
The EPF6016TI1442 is well suited for test-and-measurement front-end designs because its reconfigurable fabric lets the same hardware act as different stimulus/measurement pattern generators across product variants, reducing SKU count. With 117 user I/O it can sink parallel ATE pin-electronics channels, and the FLEX 6000 family's 5 V I/O tolerance matches legacy ATE infrastructure. Engineers load new test patterns via JTAG between units, enabling rapid ATE program iteration without hardware change.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6016TI1442 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6016TI144-2 | EPF6016TI144-3 | EPF6016TI144-3N | EPF6016ATI144-2 | EPF6016ATI144-2N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-pin TQFP | 144-pin TQFP (same) | 144-pin TQFP (same) | 144-pin TQFP (same) | 144-pin TQFP (same) | 144-pin TQFP (same) |
| Typical Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Speed Grade | 2 | 2 | 3 (faster) | 3 (faster) | 2 | 2 |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) |
| Lead-Free / RoHS Finish | Not specified in verified data | Not specified | Not specified | Yes (N suffix = lead-free) | Not specified | Yes (N suffix = lead-free) |
| User I/O Pins | 117 | 117 | 117 | 117 | 117 | 117 |
| Operating Voltage (Core) | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V |
Principaux différenciateurs
- Highest I/O density in the FLEX 6016 family (vs EPF6016TC100-2 (100-pin variant))
- Industrial temperature grade (vs EPF6016TC144-2 (commercial temperature))
- Drop-in compatible speed grade alternative available (vs EPF6016TI144-3 (speed grade 3))
Notes de conception
The EPF6016TI1442 requires a tightly regulated 5.0 V core supply (VCCINT) and separate VCCIO rails for each of the four I/O banks (3.3 V or 5 V tolerant). Per the FLEX 6000 datasheet, decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, and add a single 10 µF tantalum bulk capacitor near the device. Power sequencing is not required between VCCINT and VCCIO, but VCCIO must not be applied before VCCINT for reliable configuration startup.
The FLEX 6000 family uses volatile SRAM configuration cells, so the EPF6016TI1442 requires an external configuration memory (EPC2, EPC4, or EPC8) or active JTAG master at every power-up. Without a non-volatile configuration source, the device boots to an undefined state with all I/O tri-stated. Engineers must include a configuration PROM in production designs; relying on JTAG download for production deployment leaves the board non-functional on every power-cycle.
The 144-pin TQFP package has 0.5 mm pitch leads, requiring careful PCB layout with 0.15 mm/0.15 mm trace/spacing rules for the fanout. Per the FLEX 6000 datasheet, the user I/O pins are arranged in four banks with shared VCCIO rails, so place the I/O bank supply decoupling at each bank corner. A solid ground plane on the layer beneath the FPGA is essential for clean JTAG operation at the recommended 10 MHz TCK.
Informations de conformité
Compliance status not explicitly stated in the verified distributor listings. Altera FLEX 6000 family parts were originally manufactured with both leaded and lead-free finishes; the 'N' suffix on related variants (e.g., EPF6016ATI144-2N) indicates lead-free RoHS-compliant finish. For procurement requiring compliance, request a Certificate of Conformity from the broker or distributor.