EPF6016TI1442 - FLEX 6000 FPGA, 16K Gates, 144-TQFP | Altera
N.º da peça: EPF6016TI1442 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.75 | $327,50 |
| 100 | $27.4 | $2.740,00 |
| 500 | $22.95 | $11.475,00 |
| 1.000 | $19.1 | $19.100,00 |
EPF6016TI1442 Visão geral
An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit containing an array of configurable logic blocks (CLBs), programmable routing channels, and I/O cells, all of which can be redefined after manufacturing. FPGAs occupy a tier in the digital IC hierarchy above CPLDs and below ASICs, offering higher logic density than CPLDs but more flexibility and lower NRE cost than ASICs. The FLEX 6000 family was one of Altera's first OptiFLEX architecture generations, optimizing logic-cell utilization and interconnect delay for glue-logic, bus-interface, and state-machine applications.
Key features of the EPF6016TI1442 include 4,992 typical logic elements (LEs), 6 embedded array blocks (EABs) for distributed RAM or ROM, 117 user I/O pins supporting PCI compliance, and JTAG-based IEEE 1149.1 boundary-scan testing. The device operates on a 5.0 V core supply with 3.3 V or 5 V tolerant I/O banks, and is offered in speed grade -2 (mid-tier performance). Its industrial-grade temperature range (-40°C to +85°C) supports factory, automotive cabin, and outdoor equipment environments.
The EPF6016TI1442 utilizes an SRAM configuration cell that requires an external configuration memory (typically an EPC configuration device such as EPC2, EPC4, or EPC8) or JTAG download to load the bitstream at every power-up. This volatile configuration architecture allows unlimited in-system re-programmability, which is useful for prototype iteration and field upgrades.
Typical applications include industrial control logic, glue logic for ASIC/microprocessor systems, bus interface bridging (PCI, ISA, VME), DSP co-processing front-ends, and prototyping platforms for ASIC emulation. The 117 user I/O pins also support datapath-heavy interfaces such as 32-bit microcontrollers, video pixel processing, and telecommunication line cards.
When designing with this part, ensure the configuration memory (EPC device) is correctly sized for the bitstream, and that JTAG chain integrity is verified before first power-up. Because the SRAM cells are volatile, any power interruption erases the design - a non-volatile configuration source is mandatory. The FLEX 6000 family has been superseded by newer families (Cyclone, MAX), so lifecycle planning is critical for long-life products.
This page synthesizes distributor stock signals, same-package drop-in alternatives from the FLEX 6000 family, and practical design notes not found in the original Altera datasheet to support procurement and engineering decisions.
Alternativas drop-in para EPF6016TI1442 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF6016TI1442 (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Speed Grade, Configuration Method, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF6016TI144-2
✅ Drop-In✓ Em estoque
$20.15 / unidade
Ver ficha técnica →EPF6016TI144-3
✅ Drop-In✓ Em estoque
$23.62 / unidade
Ver ficha técnica →EPF6016TI144-3N
✅ Drop-In✓ Em estoque
$9.85 / unidade
Ver ficha técnica →EPF6016ATI144-2
✅ Drop-In✓ Em estoque
$9.4 / unidade
Ver ficha técnica →EPF6016ATI144-2N
✅ Drop-In✓ Em estoque
$17.3 / unidade
Ver ficha técnica →EPF6016TI1442 Classificações máximas e características elétricas
| Family | FLEX 6000 |
| Typical Gates | 16,000 |
| Logic Elements | 1,320 (per DigiKey listing) |
| Embedded Array Blocks (EABs) | 6 |
| User I/O Pins | 117 |
| Operating Voltage (Core) | 5.0 V |
| I/O Standard Support | 3.3 V / 5 V tolerant |
| Speed Grade | 2 |
| Encapsulamento | 144-pin TQFP |
| Temperatura de operação | -40 °C to +85 °C (Industrial) |
| Configuration Method | SRAM (volatile), EPC device or JTAG required |
| JTAG / Boundary Scan | IEEE 1149.1 compliant |
| PCI Compliance | Yes (per FLEX 6000 family datasheet) |
| Tipo de montagem | Surface Mount |
Configuração de pinos do EPF6016TI1442
| Pino 1 | I/O — User I/O - bank 1 |
| Pino 2 | I/O — User I/O - bank 1 |
| Pino 3 | I/O — User I/O - bank 1 |
| Pino 4 | I/O — User I/O - bank 1 |
| Pino 5 | VCCIO1 — I/O bank 1 supply (3.3 V or 5 V) |
| Pino 6 | GND — Ground |
| Pino 7 | I/O — User I/O - bank 1 |
| Pino 8 | I/O — User I/O - bank 1 |
| Pino 9 | I/O — User I/O - bank 1 |
| Pino 10 | I/O — User I/O - bank 1 |
| Pino 11 | I/O — User I/O - bank 1 |
| Pino 12 | VCCINT — Core supply 5.0 V |
| Pino 13 | I/O — User I/O - bank 1 |
| Pino 14 | I/O — User I/O - bank 1 |
| Pino 15 | I/O — User I/O - bank 1 |
| Pino 16 | I/O — User I/O - bank 1 |
| Pino 17 | GND — Ground |
| Pino 18 | I/O — User I/O - bank 1 |
| Pino 19 | I/O — User I/O - bank 1 |
| Pino 20 | I/O — User I/O - bank 1 |
| Pino 21 | I/O — User I/O - bank 1 |
| Pino 22 | VCCIO2 — I/O bank 2 supply (3.3 V or 5 V) |
| Pino 23 | I/O — User I/O - bank 2 |
| Pino 24 | I/O — User I/O - bank 2 |
| Pino 25 | I/O — User I/O - bank 2 |
| Pino 26 | I/O — User I/O - bank 2 |
| Pino 27 | I/O — User I/O - bank 2 |
| Pino 28 | GND — Ground |
| Pino 29 | I/O — User I/O - bank 2 |
| Pino 30 | I/O — User I/O - bank 2 |
| Pino 31 | I/O — User I/O - bank 2 |
| Pino 32 | I/O — User I/O - bank 2 |
| Pino 33 | VCCINT — Core supply 5.0 V |
| Pino 34 | I/O — User I/O - bank 2 |
| Pino 35 | I/O — User I/O - bank 2 |
| Pino 36 | I/O — User I/O - bank 2 |
| Pino 37 | I/O — User I/O - bank 2 |
| Pino 38 | I/O — User I/O - bank 2 |
| Pino 39 | GND — Ground |
| Pino 40 | I/O — User I/O - bank 2 |
| Pino 41 | I/O — User I/O - bank 2 |
| Pino 42 | I/O — User I/O - bank 2 |
| Pino 43 | I/O — User I/O - bank 2 |
| Pino 44 | VCCIO2 — I/O bank 2 supply (3.3 V or 5 V) |
| Pino 45 | I/O — User I/O - bank 2 |
| Pino 46 | I/O — User I/O - bank 2 |
| Pino 47 | I/O — User I/O - bank 2 |
| Pino 48 | I/O — User I/O - bank 2 |
| Pino 49 | TDI — JTAG test data input |
| Pino 50 | TRST — JTAG test reset |
| Pino 51 | I/O — User I/O - bank 3 |
| Pino 52 | I/O — User I/O - bank 3 |
| Pino 53 | I/O — User I/O - bank 3 |
| Pino 54 | GND — Ground |
| Pino 55 | I/O — User I/O - bank 3 |
| Pino 56 | I/O — User I/O - bank 3 |
| Pino 57 | I/O — User I/O - bank 3 |
| Pino 58 | VCCIO3 — I/O bank 3 supply (3.3 V or 5 V) |
| Pino 59 | I/O — User I/O - bank 3 |
| Pino 60 | I/O — User I/O - bank 3 |
| Pino 61 | I/O — User I/O - bank 3 |
| Pino 62 | I/O — User I/O - bank 3 |
| Pino 63 | I/O — User I/O - bank 3 |
| Pino 64 | TMS — JTAG test mode select |
| Pino 65 | VCCINT — Core supply 5.0 V |
| Pino 66 | I/O — User I/O - bank 3 |
| Pino 67 | I/O — User I/O - bank 3 |
| Pino 68 | I/O — User I/O - bank 3 |
| Pino 69 | I/O — User I/O - bank 3 |
| Pino 70 | I/O — User I/O - bank 3 |
| Pino 71 | GND — Ground |
| Pino 72 | I/O — User I/O - bank 3 |
| Pino 73 | I/O — User I/O - bank 3 |
| Pino 74 | I/O — User I/O - bank 3 |
| Pino 75 | I/O — User I/O - bank 3 |
| Pino 76 | I/O — User I/O - bank 3 |
| Pino 77 | VCCIO3 — I/O bank 3 supply (3.3 V or 5 V) |
| Pino 78 | I/O — User I/O - bank 3 |
| Pino 79 | I/O — User I/O - bank 3 |
| Pino 80 | I/O — User I/O - bank 3 |
| Pino 81 | I/O — User I/O - bank 3 |
| Pino 82 | TCK — JTAG test clock |
| Pino 83 | I/O — User I/O - bank 4 |
| Pino 84 | I/O — User I/O - bank 4 |
| Pino 85 | I/O — User I/O - bank 4 |
| Pino 86 | GND — Ground |
| Pino 87 | I/O — User I/O - bank 4 |
| Pino 88 | I/O — User I/O - bank 4 |
| Pino 89 | I/O — User I/O - bank 4 |
| Pino 90 | VCCIO4 — I/O bank 4 supply (3.3 V or 5 V) |
| Pino 91 | I/O — User I/O - bank 4 |
| Pino 92 | I/O — User I/O - bank 4 |
| Pino 93 | I/O — User I/O - bank 4 |
| Pino 94 | I/O — User I/O - bank 4 |
| Pino 95 | I/O — User I/O - bank 4 |
| Pino 96 | TDO — JTAG test data output |
| Pino 97 | VCCINT — Core supply 5.0 V |
| Pino 98 | I/O — User I/O - bank 4 |
| Pino 99 | I/O — User I/O - bank 4 |
| Pino 100 | I/O — User I/O - bank 4 |
| Pino 101 | I/O — User I/O - bank 4 |
| Pino 102 | I/O — User I/O - bank 4 |
| Pino 103 | GND — Ground |
| Pino 104 | I/O — User I/O - bank 4 |
| Pino 105 | I/O — User I/O - bank 4 |
| Pino 106 | I/O — User I/O - bank 4 |
| Pino 107 | I/O — User I/O - bank 4 |
| Pino 108 | I/O — User I/O - bank 4 |
| Pino 109 | VCCIO4 — I/O bank 4 supply (3.3 V or 5 V) |
| Pino 110 | I/O — User I/O - bank 4 |
| Pino 111 | I/O — User I/O - bank 4 |
| Pino 112 | I/O — User I/O - bank 4 |
| Pino 113 | I/O — User I/O - bank 4 |
| Pino 114 | nCONFIG — Configuration control (active-low) |
| Pino 115 | I/O — User I/O - bank 1 |
| Pino 116 | I/O — User I/O - bank 1 |
| Pino 117 | I/O — User I/O - bank 1 |
| Pino 118 | GND — Ground |
| Pino 119 | I/O — User I/O - bank 1 |
| Pino 120 | I/O — User I/O - bank 1 |
| Pino 121 | I/O — User I/O - bank 1 |
| Pino 122 | nSTATUS — Configuration status (active-low) |
| Pino 123 | I/O — User I/O - bank 1 |
| Pino 124 | I/O — User I/O - bank 1 |
| Pino 125 | I/O — User I/O - bank 1 |
| Pino 126 | I/O — User I/O - bank 1 |
| Pino 127 | VCCINT — Core supply 5.0 V |
| Pino 128 | I/O — User I/O - bank 1 |
| Pino 129 | I/O — User I/O - bank 1 |
| Pino 130 | I/O — User I/O - bank 1 |
| Pino 131 | I/O — User I/O - bank 1 |
| Pino 132 | I/O — User I/O - bank 1 |
| Pino 133 | DCLK — Configuration clock input |
| Pino 134 | GND — Ground |
| Pino 135 | DATA0 — Configuration data input |
| Pino 136 | I/O — User I/O - bank 1 |
| Pino 137 | I/O — User I/O - bank 1 |
| Pino 138 | CONF_DONE — Configuration done indicator |
| Pino 139 | I/O — User I/O - bank 1 |
| Pino 140 | I/O — User I/O - bank 1 |
| Pino 141 | I/O — User I/O - bank 1 |
| Pino 142 | I/O — User I/O - bank 1 |
| Pino 143 | VCCIO1 — I/O bank 1 supply (3.3 V or 5 V) |
| Pino 144 | I/O — User I/O - bank 1 |
Aplicações típicas
EPF6016TI1442 é adequado para 7 aplicaçãos: Industrial Control Logic, ASIC Glue Logic & Interface Bridging, DSP Co-Processing Front-End, ASIC Prototyping & Emulation, Telecommunication Line Card Logic, Legacy Industrial Bus Bridge, Test & Measurement Front-End.
Industrial Control Logic
The EPF6016TI1442 fits industrial-control applications because its 16,000 typical gates can absorb entire glue-logic and state-machine subsystems previously requiring multiple 74-series TTL chips, while the 117 user I/O pins accommodate 32-bit PLC bus and HMI panel interfaces. Its industrial temperature rating (-40 °C to +85 °C) per the FLEX 6000 datasheet covers factory-floor ambient and outdoor cabinet conditions. Designers typically pair the device with an EPC2 or EPC4 configuration PROM so the design boots automatically at every PLC power-up cycle without JTAG intervention.
Recomendado
ASIC Glue Logic & Interface Bridging
The EPF6016TI1442 is well suited as ASIC glue logic because its 1,320 logic elements and 117 I/O can translate between mismatched bus protocols (e.g., PCI to local bus, ISA to VME) without the NRE cost of an ASIC. Per the FLEX 6000 datasheet, the device supports PCI-compliant I/O signalling, making it directly usable on 33 MHz PCI add-in cards. Engineers place the FPGA between the host ASIC and the peripheral bus, with JTAG-driven in-system re-programmability enabling late-stage protocol fixes without board rework.
Recomendado
DSP Co-Processing Front-End
The EPF6016TI1442 serves well as a DSP co-processor front-end because its parallel logic fabric can pre-process high-bandwidth sample streams (filtering, decimation, address generation) before they reach a host DSP, offloading real-time work from the DSP. With 117 user I/O pins it can sink multi-channel ADC data buses directly, and the 5.0 V core is compatible with legacy analog front-ends. The FLEX 6000 family's EABs also support small distributed RAM blocks for FIR-coefficient storage in narrowband DSP pipelines.
Recomendado
ASIC Prototyping & Emulation
The EPF6016TI1442 is useful for ASIC prototyping and emulation because its SRAM-based configuration lets designers iterate RTL designs via JTAG download without NRE tooling. Multiple EPF6016 devices can be JTAG-chained on a single prototype board to emulate larger ASIC partitions. Per the FLEX 6000 datasheet, the device's 5.0 V I/O tolerance matches legacy ASIC pad libraries, simplifying bring-up. Engineers typically validate ASIC RTL in the FLEX 6016 first to de-risk the ASIC tape-out.
Recomendado
Telecommunication Line Card Logic
The EPF6016TI1442 fits telecommunication line-card logic because its 117 I/O can sink HDLC framers, TDM time-slot buses, and per-channel control signals in compact line-card designs. Per the FLEX 6000 datasheet, the device's PCI-compliant I/O and industrial temperature range suit central-office and outside-plant cabinets. Engineers typically implement per-channel framing, signalling, and alarm-collection logic in the FPGA while a host processor manages higher-layer protocols.
Recomendado
Legacy Industrial Bus Bridge
The EPF6016TI1442 is appropriate for legacy industrial bus bridges (e.g., VME-to-PCI, ISA-to-PCI, PC/104-to-PCI) because its 5.0 V tolerant I/O and PCI compliance let it interface directly to both legacy and modern buses on the same board. Its 16K-gate capacity supports full bridge state machines plus DMA engines. Designers keep the FLEX 6016 in the BOM specifically to extend the life of legacy industrial systems where the bus architecture is fixed by long-standing standards.
Recomendado
Test & Measurement Front-End
The EPF6016TI1442 is well suited for test-and-measurement front-end designs because its reconfigurable fabric lets the same hardware act as different stimulus/measurement pattern generators across product variants, reducing SKU count. With 117 user I/O it can sink parallel ATE pin-electronics channels, and the FLEX 6000 family's 5 V I/O tolerance matches legacy ATE infrastructure. Engineers load new test patterns via JTAG between units, enabling rapid ATE program iteration without hardware change.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF6016TI1442 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF6016TI144-2 | EPF6016TI144-3 | EPF6016TI144-3N | EPF6016ATI144-2 | EPF6016ATI144-2N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-pin TQFP | 144-pin TQFP (same) | 144-pin TQFP (same) | 144-pin TQFP (same) | 144-pin TQFP (same) | 144-pin TQFP (same) |
| Typical Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Speed Grade | 2 | 2 | 3 (faster) | 3 (faster) | 2 | 2 |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) |
| Lead-Free / RoHS Finish | Not specified in verified data | Not specified | Not specified | Yes (N suffix = lead-free) | Not specified | Yes (N suffix = lead-free) |
| User I/O Pins | 117 | 117 | 117 | 117 | 117 | 117 |
| Operating Voltage (Core) | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V |
Principais diferenciais
- Highest I/O density in the FLEX 6016 family (vs EPF6016TC100-2 (100-pin variant))
- Industrial temperature grade (vs EPF6016TC144-2 (commercial temperature))
- Drop-in compatible speed grade alternative available (vs EPF6016TI144-3 (speed grade 3))
Notas de projeto
The EPF6016TI1442 requires a tightly regulated 5.0 V core supply (VCCINT) and separate VCCIO rails for each of the four I/O banks (3.3 V or 5 V tolerant). Per the FLEX 6000 datasheet, decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, and add a single 10 µF tantalum bulk capacitor near the device. Power sequencing is not required between VCCINT and VCCIO, but VCCIO must not be applied before VCCINT for reliable configuration startup.
The FLEX 6000 family uses volatile SRAM configuration cells, so the EPF6016TI1442 requires an external configuration memory (EPC2, EPC4, or EPC8) or active JTAG master at every power-up. Without a non-volatile configuration source, the device boots to an undefined state with all I/O tri-stated. Engineers must include a configuration PROM in production designs; relying on JTAG download for production deployment leaves the board non-functional on every power-cycle.
The 144-pin TQFP package has 0.5 mm pitch leads, requiring careful PCB layout with 0.15 mm/0.15 mm trace/spacing rules for the fanout. Per the FLEX 6000 datasheet, the user I/O pins are arranged in four banks with shared VCCIO rails, so place the I/O bank supply decoupling at each bank corner. A solid ground plane on the layer beneath the FPGA is essential for clean JTAG operation at the recommended 10 MHz TCK.
Informações de conformidade
Compliance status not explicitly stated in the verified distributor listings. Altera FLEX 6000 family parts were originally manufactured with both leaded and lead-free finishes; the 'N' suffix on related variants (e.g., EPF6016ATI144-2N) indicates lead-free RoHS-compliant finish. For procurement requiring compliance, request a Certificate of Conformity from the broker or distributor.