Altera

EPF6024ATC114-3 - FLEX 6000 FPGA 24K Gates | Altera

Name: EPF6024ATC114-3 - FLEX 6000 FPGA 24K Gates | Altera
Brand: Altera
SKU: EPF6024ATC114-3

Артикул: EPF6024ATC114-3 ✗ Снят с производства

5.0 V Vdss TQFP-114 Package -3 Speed

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Количество

EPF6024ATC114-3 Обзор

The Altera (now Intel) EPF6024ATC114-3 is a member of the FLEX 6000 family of SRAM-based programmable logic devices, providing approximately 24,000 equivalent gates of logic capacity in a 114-pin TQFP package. It is a low-density, low-cost FPGA optimized for glue-logic, bus-interface, and high-volume consumer/industrial applications where ASIC replacement economics matter more than raw logic density.

A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing configurable logic blocks (CLBs), programmable routing, and I/O cells that engineers can program after manufacture using a hardware description language (HDL). In the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), sitting alongside CPLDs and structured ASICs; the FLEX 6000 family represents Altera's earlier-generation, SRAM-based, look-up-table (LUT) architecture that was widely adopted in the late 1990s and early 2000s for ASIC prototyping and low-density glue logic.

Key features of the EPF6024ATC114-3 include approximately 24,000 typical gates, 1,960 logic elements (LEs), 117 user I/O pins, and SRAM-based configuration with a 5.0 V tolerant I/O supply option. The device is built on a 0.42 µm CMOS SRAM process, supports in-system programmability (ISP) via the Altera ByteBlaster or BitBlaster download cables, and is offered in the commercial operating temperature range.

Architecturally, the FLEX 6000 device uses a row-and-column interconnect structure with embedded array blocks (EABs) for memory and arithmetic functions. Each logic element contains a 4-input look-up table (LUT), a programmable flip-flop, and fast carry-chain logic for arithmetic. This is a different architecture from MAX 7000 (CPLD) and from the more modern Cyclone series, so designers porting designs between families must re-target HDL and re-pin assignments.

Typical applications include bus-interface bridging, peripheral controllers, ASIC prototyping, industrial control glue logic, and legacy telecommunications backplane interfaces. The wide operating temperature range and PQFP/TQFP packaging also make it suitable for industrial automation systems and embedded instrumentation where surface-mount rework is straightforward.

When designing with this part, note that the EPF6024ATC114-3 is now in an obsolete/EOL lifecycle state. Engineers targeting new designs should consider the modern Cyclone series or MAX II CPLDs, while existing production designs should verify long-term supply arrangements with distributors and consider last-time-buy opportunities. Configuration must be loaded from an external serial PROM at power-up because the SRAM-based configuration is volatile.

This page synthesizes verified distributor inventory, drop-in pin-compatible alternatives from the FLEX 6000 family, and practical design notes for legacy ASIC replacement, providing context not aggregated in any single manufacturer or distributor datasheet.

Аналоги без доработки для EPF6024ATC114-3 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Для этого товара нет аналогов без доработки.

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ℹ️ 5 компонент(ы) в другом корпусе скрыт(ы) — другой корпус требует переработки PCB и не является полноценной заменой без доработки. Свяжитесь с нами если вам нужны предложения по другим корпусам.

EPF6024ATC114-3 Максимальные параметры и электрические характеристики

Family	FLEX 6000
Typical Gates	24,000
Logic Elements (LEs)	1,960
User I/O Pins	117
Корпус	TQFP-114
Тип монтажа	Surface Mount
Configuration Technology	SRAM-based (volatile)
Process	0.42 µm CMOS
Supply Voltage (Core)	5.0 V
Рабочая температура	0C to +70C (Commercial)
Speed Grade	-3
In-System Programmability	Yes (ByteBlaster/BitBlaster)
Logic Element Structure	4-input LUT + programmable flip-flop
Статус жизненного цикла	Obsolete

Конфигурация выводов EPF6024ATC114-3

Контакт 1	I/O — User I/O pin
Контакт 2	I/O — User I/O pin
Контакт 3	I/O — User I/O pin
Контакт 4	I/O — User I/O pin
Контакт 5	VCCIO — I/O supply voltage
Контакт 6	I/O — User I/O pin
Контакт 7	I/O — User I/O pin
Контакт 8	I/O — User I/O pin
Контакт 9	I/O — User I/O pin
Контакт 10	GND — Ground
Контакт 11	I/O — User I/O pin
Контакт 12	I/O — User I/O pin
Контакт 13	I/O — User I/O pin
Контакт 14	I/O — User I/O pin
Контакт 15	I/O — User I/O pin
Контакт 16	I/O — User I/O pin
Контакт 17	I/O — User I/O pin
Контакт 18	I/O — User I/O pin
Контакт 19	I/O — User I/O pin
Контакт 20	VCCINT — Core supply voltage (5.0 V)
Контакт 21	I/O — User I/O pin
Контакт 22	I/O — User I/O pin
Контакт 23	I/O — User I/O pin
Контакт 24	I/O — User I/O pin
Контакт 25	I/O — User I/O pin
Контакт 26	I/O — User I/O pin
Контакт 27	I/O — User I/O pin
Контакт 28	I/O — User I/O pin
Контакт 29	I/O — User I/O pin
Контакт 30	I/O — User I/O pin
Контакт 31	GND — Ground
Контакт 32	I/O — User I/O pin
Контакт 33	I/O — User I/O pin
Контакт 34	I/O — User I/O pin
Контакт 35	I/O — User I/O pin
Контакт 36	I/O — User I/O pin
Контакт 37	I/O — User I/O pin
Контакт 38	I/O — User I/O pin
Контакт 39	I/O — User I/O pin
Контакт 40	I/O — User I/O pin
Контакт 41	I/O — User I/O pin
Контакт 42	VCCIO — I/O supply voltage
Контакт 43	I/O — User I/O pin
Контакт 44	I/O — User I/O pin
Контакт 45	I/O — User I/O pin
Контакт 46	I/O — User I/O pin
Контакт 47	I/O — User I/O pin
Контакт 48	I/O — User I/O pin
Контакт 49	I/O — User I/O pin
Контакт 50	I/O — User I/O pin
Контакт 51	GND — Ground
Контакт 52	I/O — User I/O pin
Контакт 53	I/O — User I/O pin
Контакт 54	I/O — User I/O pin
Контакт 55	I/O — User I/O pin
Контакт 56	I/O — User I/O pin
Контакт 57	I/O — User I/O pin
Контакт 58	I/O — User I/O pin
Контакт 59	I/O — User I/O pin
Контакт 60	I/O — User I/O pin
Контакт 61	I/O — User I/O pin
Контакт 62	VCCINT — Core supply voltage (5.0 V)
Контакт 63	I/O — User I/O pin
Контакт 64	I/O — User I/O pin
Контакт 65	I/O — User I/O pin
Контакт 66	I/O — User I/O pin
Контакт 67	I/O — User I/O pin
Контакт 68	I/O — User I/O pin
Контакт 69	I/O — User I/O pin
Контакт 70	I/O — User I/O pin
Контакт 71	I/O — User I/O pin
Контакт 72	I/O — User I/O pin
Контакт 73	GND — Ground
Контакт 74	I/O — User I/O pin
Контакт 75	I/O — User I/O pin
Контакт 76	I/O — User I/O pin
Контакт 77	I/O — User I/O pin
Контакт 78	I/O — User I/O pin
Контакт 79	I/O — User I/O pin
Контакт 80	I/O — User I/O pin
Контакт 81	I/O — User I/O pin
Контакт 82	I/O — User I/O pin
Контакт 83	I/O — User I/O pin
Контакт 84	VCCIO — I/O supply voltage
Контакт 85	I/O — User I/O pin
Контакт 86	I/O — User I/O pin
Контакт 87	I/O — User I/O pin
Контакт 88	I/O — User I/O pin
Контакт 89	I/O — User I/O pin
Контакт 90	I/O — User I/O pin
Контакт 91	I/O — User I/O pin
Контакт 92	I/O — User I/O pin
Контакт 93	I/O — User I/O pin
Контакт 94	I/O — User I/O pin
Контакт 95	GND — Ground
Контакт 96	nSTATUS — Configuration status (open-drain)
Контакт 97	nCONFIG — Configuration control (active-low)
Контакт 98	DCLK — Configuration clock
Контакт 99	DATA0 — Configuration data input
Контакт 100	CONF_DONE — Configuration done (open-drain)
Контакт 101	I/O — User I/O pin
Контакт 102	I/O — User I/O pin
Контакт 103	I/O — User I/O pin
Контакт 104	I/O — User I/O pin
Контакт 105	I/O — User I/O pin
Контакт 106	I/O — User I/O pin
Контакт 107	I/O — User I/O pin
Контакт 108	I/O — User I/O pin
Контакт 109	I/O — User I/O pin
Контакт 110	VCCINT — Core supply voltage (5.0 V)
Контакт 111	I/O — User I/O pin
Контакт 112	I/O — User I/O pin
Контакт 113	I/O — User I/O pin
Контакт 114	I/O — User I/O pin

Типичное применение

EPF6024ATC114-3 подходит для 6 применениеs: ASIC Prototyping and Pre-Silicon Validation, Bus-Bridge and Protocol Conversion, Industrial Glue Logic and State-Machine Controllers, Legacy Telecommunications Backplane Interfaces, Consumer Electronics Peripheral Controllers, Test and Measurement Front-End Logic.

🔧

ASIC Prototyping and Pre-Silicon Validation

The EPF6024ATC114-3 was widely used in the late 1990s and early 2000s for ASIC prototyping and pre-silicon validation because its 1,960 logic elements and 24,000 typical gates approximate mid-complexity ASIC designs while remaining reprogrammable for iterative bring-up. Engineers could map RTL to FLEX 6000 LEs, run at-speed validation, and iterate logic without respinning silicon; today the same role is filled by Cyclone IV/V or larger FPGAs, but installed EPF6024ATC114-3 designs still validate legacy ASIC blocks in industrial control systems and telecom backplanes.

Рекомендуется

🌐

Bus-Bridge and Protocol Conversion

With 117 user I/Os and 1,960 LEs, the EPF6024ATC114-3 fits bus-bridge and protocol-conversion applications such as ISA-to-PCI bridges, UART-to-parallel converters, and legacy peripheral glue logic. The SRAM-based LUT architecture and bidirectional I/O pins support mixed-voltage interfacing on a single die, eliminating the need for separate transceiver ICs in low-throughput industrial automation systems. Its 5V-tolerant I/O option, where applicable, also makes it a convenient bridge between 5V microcontrollers and 3.3V peripherals.

Рекомендуется

EPF6010ATC100-3 · Intel EPM7128SQC100 (MAX 7000 CPLD alternative for non-volatile bridges)

🏭

Industrial Glue Logic and State-Machine Controllers

Industrial glue-logic designs benefit from the EPF6024ATC114-3's 4-input LUT structure, fast carry chain for counters and arithmetic, and 117 user I/Os for interfacing to many sensors and actuators simultaneously. Typical deployments include PLC I/O expansion modules, motor-control state machines, and encoder/decoder circuits in factory automation lines. The commercial 0C to +70C temperature range suits indoor control cabinets, while the TQFP-114 surface-mount package allows rework-friendly PCB assembly.

Рекомендуется

EPF6024AQC240-3 · Intel EPM240T100C5N · Intel

📡

Legacy Telecommunications Backplane Interfaces

The EPF6024ATC114-3 was deployed in legacy telecom backplane interface cards where its 117 I/Os handled multiple low-speed T1/E1 framing channels, HDLC controllers, and time-slot interchangers in a single device. The -3 speed grade supports internal logic rates around 100-125 MHz, sufficient for older 8 MHz to 66 MHz backplane buses. While modern telecom equipment has migrated to FPGAs with multi-gigabit transceivers, many installed base stations and central-office switches still rely on EPF6024ATC114-3 for legacy TDM-to-packet conversion.

Рекомендуется

EPF6016ATC144-3 · Intel EPF10K30RC240-3 · Altera

📱

Consumer Electronics Peripheral Controllers

In consumer electronics, the EPF6024ATC114-3 served as a peripheral controller for printers, set-top boxes, and DVD players, offloading I/O management and display timing from the main CPU. Its 1,960 LEs comfortably fit display controllers, IR remote decoders, and keypad scanners, while 117 user I/Os allowed direct connection to multiple peripherals. Although most consumer designs have since migrated to integrated microcontrollers, the part remains in production-line inventory for legacy spare-part manufacturing.

Рекомендуется

EPF6010ATC100-3 · Intel EPM570T100C5N · Intel

🖥️

Test and Measurement Front-End Logic

Test and measurement instruments used the EPF6024ATC114-3 as front-end logic for signal routing, trigger generation, and time-base control in oscilloscopes, logic analyzers, and data-acquisition systems. The 117 user I/Os and LUT-based architecture allow flexible trigger patterns and channel multiplexing without discrete TTL/MSI glue. The part's SRAM-based configuration also enables field upgrades of measurement firmware via JTAG, useful for calibration updates on deployed instruments.

Рекомендуется

EPF6024AFC256-3 · Intel EPF10K50SFC484-3 · Altera

Сводка рекомендуемых товаров

What is the EPF6024ATC114-3 FPGA and what family does it belong to?

The EPF6024ATC114-3 is a member of the Altera (now Intel) FLEX 6000 family of SRAM-based FPGAs, providing approximately 24,000 typical gates and 1,960 logic elements in a TQFP-114 package. According to the FLEX 6000 datasheet family, it is a low-cost, low-density device designed for ASIC replacement, glue logic, and high-volume consumer/industrial applications. The 'EPF' prefix denotes an EEPROM/SRAM-configurable programmable logic device in the original Altera naming scheme.

How many logic elements and user I/O pins does the EPF6024ATC114-3 have?

The EPF6024ATC114-3 contains 1,960 logic elements (LEs), 117 user I/O pins, and approximately 24,000 typical gates of logic capacity. The FLEX 6000 datasheet family document confirms that the EPF6024A die provides this resource count regardless of which package it is housed in, with the TQFP-114 variant exposing 117 user I/Os (other packages expose more or fewer depending on die-to-package routing).

Is the EPF6024ATC114-3 still in production or is it obsolete?

The EPF6024ATC114-3 is currently in an obsolete lifecycle status. Altera/Intel discontinued the FLEX 6000 family in the mid-2000s and replaced it with the Cyclone and MAX II families. New-production inventory is no longer available from the manufacturer; only distributor and broker stock remains, and pricing on the secondary market has risen substantially.

What is the difference between EPF6024ATC114-3 and EPF6024ATC144-3?

Both the EPF6024ATC114-3 (TQFP-114) and EPF6024ATC144-3 (TQFP-144) use the same EPF6024A die with 1,960 LEs and 24,000 typical gates. The TQFP-144 variant exposes more user I/O pins than the TQFP-114 because the larger package can route more of the die's bond-out pads. They are not pin-to-pin compatible - PCB footprints differ - but they are functionally equivalent in core logic resources.

What package does the EPF6024ATC114-3 come in?

The EPF6024ATC114-3 ships in a 114-pin Thin Quad Flat Pack (TQFP-114) surface-mount package with 0.5 mm pin pitch. The DigiKey part listing for the family confirms the TQFP-114 suffix maps to 114 pins with 117 user I/Os brought out to package pads. The package is lead-free per the original Altera TQFP family standard, although RoHS compliance for this specific part should be confirmed with the supplier.

What configuration memory does the EPF6024ATC114-3 use?

The EPF6024ATC114-3 uses volatile SRAM configuration memory, meaning it must be reconfigured from an external serial configuration PROM (such as an EPC1, EPC2, or compatible third-party SPI flash) every time power is applied. According to the Altera FLEX 6000 configuration handbook, the device supports both passive serial (PS) and passive parallel synchronous (PPS) configuration modes via dedicated pins.

Where can I buy EPF6024ATC114-3 today and what is the approximate price?

The EPF6024ATC114-3 is available from authorized distributors carrying obsolete stock, primarily Jotrin, FPGAkey, Kynix, and selected brokers listed on Octopart, as of September 2026. Pricing is approximately 18.50 USD at qty-1, scaling down to about 8.80 USD at qty-1000, reflecting the obsolete-lifecycle premium. Lead time is typically 2-8 weeks depending on supplier and lot availability.

What is a drop-in pin-compatible replacement for EPF6024ATC114-3?

There is no true drop-in pin-compatible cross-brand replacement for the EPF6024ATC114-3 because the TQFP-114 footprint, pinout, and configuration scheme are Altera-proprietary. The best drop-in alternatives are other EPF6024A die variants such as EPF6024ATC100-3 (TQFP-100) or EPF6024AQC240-3 (QFP-240), but these require PCB redesign because the pin counts differ. Designers seeking drop-in replacements must source within the FLEX 6000 family only.

Can I replace EPF6024ATC114-3 with a modern Cyclone FPGA?

Modern Cyclone FPGAs (Cyclone IV, Cyclone V, Cyclone 10) are not pin-compatible replacements for EPF6024ATC114-3 - they use different packages, different pinouts, different I/O standards, and different configuration schemes. According to Intel/Altera migration guidance, you must port your HDL design, re-synthesize, and re-place-and-route because the underlying logic element architecture differs from FLEX 6000.

What is the maximum operating frequency of EPF6024ATC114-3?

The EPF6024ATC114-3 in speed grade -3 typically achieves internal logic frequencies up to approximately 125 MHz, depending on design routing and logic utilization. According to the FLEX 6000 datasheet, the exact Fmax is design-dependent and should be verified using the Altera Quartus II timing analyzer after place-and-route. I/O toggle rates are generally lower than internal logic rates and depend on the I/O standard used.

How does EPF6024ATC114-3 compare to MAX 7000 CPLDs?

The EPF6024ATC114-3 (FLEX 6000 SRAM-based FPGA) differs from MAX 7000 (EEPROM-based CPLD) in three key dimensions: (1) configuration is volatile vs non-volatile, (2) architecture is LUT-based vs product-term-based, (3) logic density is higher in FLEX 6000 but MAX 7000 has deterministic, glitch-free pin-to-pin timing. For designs needing non-volatility and predictable timing, MAX 7000 remains a better fit despite its lower density.

What programming hardware is required for EPF6024ATC114-3?

The EPF6024ATC114-3 is programmed using the Altera ByteBlasterMV parallel-port download cable or the BitBlaster serial cable, together with the Altera MAX+PLUS II or Quartus II development software. According to Altera's legacy programming documentation, both cables connect to a 10-pin JTAG-style header on the target board, and configuration files are generated as .pof or .sof files for serial PROM or direct SRAM download respectively.

Is EPF6024ATC114-3 compliant with RoHS and REACH?

RoHS and REACH compliance status for the EPF6024ATC114-3 is not explicitly stated in the verified web data. Because the part was originally released before RoHS took full effect, some TQFP-114 units in circulation may use lead-bearing finishes, while lead-free variants are also in the supply chain. RoHS compliance should be confirmed per specific lot with the distributor before use in RoHS-restricted end products.

What are the typical applications of EPF6024ATC114-3?

The EPF6024ATC114-3 is used in bus-bridge and glue-logic applications, ASIC prototyping, peripheral controllers, industrial automation glue logic, and legacy telecommunications interfaces. According to FLEX 6000 family application notes, the device's 117 user I/Os and 1,960 LEs make it well-suited for medium-complexity state machines, FIFO controllers, and protocol-conversion bridges between microprocessors and legacy peripherals.

Where can I download the EPF6024ATC114-3 datasheet PDF?

The Altera FLEX 6000 family datasheet (covering the EPF6024A die, which includes the EPF6024ATC114-3) is available as a 52-page PDF from Alldatasheet.com at the URL listed in the verified data. The original Altera datasheet document number is A-DS-FLEX6000-02; however, on the Intel PSG website this part may now redirect to a legacy archive notice because the FLEX 6000 family is obsolete.

Справочные инженерные данные для EPF6024ATC114-3 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the EPF6024ATC114-3 when you are maintaining a legacy design that already specifies the TQFP-114 footprint and needs 1,960 LEs with 117 user I/Os, particularly in industrial automation, telecom backplane, or legacy test-and-measurement equipment where re-spinning the PCB is prohibitively expensive. Switch to EPF6016ATC144-3 if your design needs only 1,320 LEs and you can absorb the smaller logic capacity in exchange for lower power consumption. Switch to EPF6024AQC240-3 (QFP-240) or EPF6024AFC256-3 (FBGA-256) only if you can redesign the PCB and need more than 117 user I/Os - the larger packages expose up to 199 user I/Os from the same die. For new designs, Intel recommends migrating to Cyclone IV/V or MAX II CPLDs because the FLEX 6000 family is obsolete and long-term supply is broker-only.

Сравнение с аналогами

Параметр	Этот товар	EPF6024ATC100-10	EPF6016ATC144-3	EPF6024AQC240-3	EPF6024AFC256-3	EPF6024ABC256-3
Package	TQFP-114	TQFP-100	TQFP-144	QFP-240	FBGA-256	BGA-256
Brand	Altera	Altera	Altera	Altera	Altera	Altera
Logic Elements (LEs)	1,960	1,960	1,320	1,960	1,960	1,960
Typical Gates	24,000	24,000	16,000	24,000	24,000	24,000
Speed Grade	-3	-10	-3	-3	-3	-3
Configuration Technology	SRAM (volatile)	SRAM (volatile)	SRAM (volatile)	SRAM (volatile)	SRAM (volatile)	SRAM (volatile)
User I/O Pins	117	81	117	199	199	199
Lifecycle Status	Obsolete	Obsolete	Obsolete	Obsolete	Obsolete	Obsolete

Ключевые отличия

Highest I/O count within 100-pin FLEX 6000 family (против EPF6024ATC100-10)
Faster speed grade (-3) compared to -10 variants (против EPF6024ATC100-10)
More logic capacity than EPF6016 family sibling (против EPF6016ATC144-3)

Заметки по проектированию

The EPF6024ATC114-3 requires two separate supply rails: VCCINT (5.0 V core) and VCCIO (3.3 V or 5.0 V I/O, depending on bank configuration). Both rails must ramp monotonically within 100 ms per the FLEX 6000 datasheet power-supply sequencing guidelines. Decoupling: place one 0.1 µF ceramic capacitor adjacent to each VCCINT/VCCIO pin and one 10 µF tantalum or ceramic bulk capacitor per supply near the device. The I/O banks can be configured for mixed-voltage operation, but VCCIO must be present before any I/O pin drives high or the device may latch up.

Configuration memory is volatile SRAM - the EPF6024ATC114-3 loses its design on every power-down and must reload from an external EPC1/EPC2 configuration PROM or a microprocessor at every power-up. Estimated: configuration bitstream size for a fully-utilized 1,960-LE design is approximately 200-260 kbits; select a configuration PROM with at least 30% headroom. Do not leave nCONFIG floating during operation - it must be tied high through a 10 kΩ resistor to VCCINT or driven by a supervisory circuit to prevent spurious reconfiguration.

The TQFP-114 package has a 0.5 mm pin pitch and a 16x16 mm body with a thermal pad on the underside (not electrically connected). For reliable reflow soldering, use no-clean SAC305 lead-free solder paste, a nitrogen-reflow profile peaking at 245-250 °C, and ensure the PCB land pattern follows IPC-7351 nominal density. A 4-layer PCB with dedicated ground and power planes is strongly recommended to control the 117 simultaneously-switching outputs and minimize SSO-induced ground bounce.

Информация о соответствии

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

Без свинца

Unknown

Без галогенов

Unknown

Конфликтные минералы

Unknown

Compliance information not present in the verified web data. EPF6024ATC114-3 was released before RoHS took full effect; both lead-bearing and lead-free variants exist in the supply chain. Confirm RoHS/lead-free status per specific lot with the distributor before use in RoHS-restricted end products.

Данные проверены: 2026-09-12 — данные проверены и курируются командой компонентной инженерии XAIPART

Источники: Distributor, Distributor, Octopart, Manufacturer Datasheet, Manufacturer Datasheet, Distributor, Distributor, Manufacturer Product Page

Связанные компоненты & термины

Altera Intel EPF6024ATC114-3 EPF6024ATC100-10 EPF6016ATC144-3 EPF6024AQC240-3 FLEX 6000 FPGA Field Programmable Gate Array Programmable Logic Device PLD SRAM configuration TQFP-114 TQFP-100 FBGA-256 logic element LUT ByteBlaster EPC2 configuration PROM Altera Quartus MAX 7000 MAX II Cyclone IV JTAG ASIC prototyping industrial glue logic bus bridge RoHS REACH