EPF6024ATC114-3 - FLEX 6000 FPGA 24K Gates | Altera
부품 번호: EPF6024ATC114-3 ✗ 단종EPF6024ATC114-3 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing configurable logic blocks (CLBs), programmable routing, and I/O cells that engineers can program after manufacture using a hardware description language (HDL). In the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), sitting alongside CPLDs and structured ASICs; the FLEX 6000 family represents Altera's earlier-generation, SRAM-based, look-up-table (LUT) architecture that was widely adopted in the late 1990s and early 2000s for ASIC prototyping and low-density glue logic.
Key features of the EPF6024ATC114-3 include approximately 24,000 typical gates, 1,960 logic elements (LEs), 117 user I/O pins, and SRAM-based configuration with a 5.0 V tolerant I/O supply option. The device is built on a 0.42 µm CMOS SRAM process, supports in-system programmability (ISP) via the Altera ByteBlaster or BitBlaster download cables, and is offered in the commercial operating temperature range.
Architecturally, the FLEX 6000 device uses a row-and-column interconnect structure with embedded array blocks (EABs) for memory and arithmetic functions. Each logic element contains a 4-input look-up table (LUT), a programmable flip-flop, and fast carry-chain logic for arithmetic. This is a different architecture from MAX 7000 (CPLD) and from the more modern Cyclone series, so designers porting designs between families must re-target HDL and re-pin assignments.
Typical applications include bus-interface bridging, peripheral controllers, ASIC prototyping, industrial control glue logic, and legacy telecommunications backplane interfaces. The wide operating temperature range and PQFP/TQFP packaging also make it suitable for industrial automation systems and embedded instrumentation where surface-mount rework is straightforward.
When designing with this part, note that the EPF6024ATC114-3 is now in an obsolete/EOL lifecycle state. Engineers targeting new designs should consider the modern Cyclone series or MAX II CPLDs, while existing production designs should verify long-term supply arrangements with distributors and consider last-time-buy opportunities. Configuration must be loaded from an external serial PROM at power-up because the SRAM-based configuration is volatile.
This page synthesizes verified distributor inventory, drop-in pin-compatible alternatives from the FLEX 6000 family, and practical design notes for legacy ASIC replacement, providing context not aggregated in any single manufacturer or distributor datasheet.
드롭인 대체품: EPF6024ATC114-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청EPF6024ATC114-3 최대 정격 & 전기적 특성
| Family | FLEX 6000 |
| Typical Gates | 24,000 |
| Logic Elements (LEs) | 1,960 |
| User I/O Pins | 117 |
| 패키지 | TQFP-114 |
| 실장 유형 | Surface Mount |
| Configuration Technology | SRAM-based (volatile) |
| Process | 0.42 µm CMOS |
| Supply Voltage (Core) | 5.0 V |
| 동작 온도 | 0C to +70C (Commercial) |
| Speed Grade | -3 |
| In-System Programmability | Yes (ByteBlaster/BitBlaster) |
| Logic Element Structure | 4-input LUT + programmable flip-flop |
| 수명 주기 상태 | Obsolete |
EPF6024ATC114-3 핀 구성
| 핀 1 | I/O — User I/O pin |
| 핀 2 | I/O — User I/O pin |
| 핀 3 | I/O — User I/O pin |
| 핀 4 | I/O — User I/O pin |
| 핀 5 | VCCIO — I/O supply voltage |
| 핀 6 | I/O — User I/O pin |
| 핀 7 | I/O — User I/O pin |
| 핀 8 | I/O — User I/O pin |
| 핀 9 | I/O — User I/O pin |
| 핀 10 | GND — Ground |
| 핀 11 | I/O — User I/O pin |
| 핀 12 | I/O — User I/O pin |
| 핀 13 | I/O — User I/O pin |
| 핀 14 | I/O — User I/O pin |
| 핀 15 | I/O — User I/O pin |
| 핀 16 | I/O — User I/O pin |
| 핀 17 | I/O — User I/O pin |
| 핀 18 | I/O — User I/O pin |
| 핀 19 | I/O — User I/O pin |
| 핀 20 | VCCINT — Core supply voltage (5.0 V) |
| 핀 21 | I/O — User I/O pin |
| 핀 22 | I/O — User I/O pin |
| 핀 23 | I/O — User I/O pin |
| 핀 24 | I/O — User I/O pin |
| 핀 25 | I/O — User I/O pin |
| 핀 26 | I/O — User I/O pin |
| 핀 27 | I/O — User I/O pin |
| 핀 28 | I/O — User I/O pin |
| 핀 29 | I/O — User I/O pin |
| 핀 30 | I/O — User I/O pin |
| 핀 31 | GND — Ground |
| 핀 32 | I/O — User I/O pin |
| 핀 33 | I/O — User I/O pin |
| 핀 34 | I/O — User I/O pin |
| 핀 35 | I/O — User I/O pin |
| 핀 36 | I/O — User I/O pin |
| 핀 37 | I/O — User I/O pin |
| 핀 38 | I/O — User I/O pin |
| 핀 39 | I/O — User I/O pin |
| 핀 40 | I/O — User I/O pin |
| 핀 41 | I/O — User I/O pin |
| 핀 42 | VCCIO — I/O supply voltage |
| 핀 43 | I/O — User I/O pin |
| 핀 44 | I/O — User I/O pin |
| 핀 45 | I/O — User I/O pin |
| 핀 46 | I/O — User I/O pin |
| 핀 47 | I/O — User I/O pin |
| 핀 48 | I/O — User I/O pin |
| 핀 49 | I/O — User I/O pin |
| 핀 50 | I/O — User I/O pin |
| 핀 51 | GND — Ground |
| 핀 52 | I/O — User I/O pin |
| 핀 53 | I/O — User I/O pin |
| 핀 54 | I/O — User I/O pin |
| 핀 55 | I/O — User I/O pin |
| 핀 56 | I/O — User I/O pin |
| 핀 57 | I/O — User I/O pin |
| 핀 58 | I/O — User I/O pin |
| 핀 59 | I/O — User I/O pin |
| 핀 60 | I/O — User I/O pin |
| 핀 61 | I/O — User I/O pin |
| 핀 62 | VCCINT — Core supply voltage (5.0 V) |
| 핀 63 | I/O — User I/O pin |
| 핀 64 | I/O — User I/O pin |
| 핀 65 | I/O — User I/O pin |
| 핀 66 | I/O — User I/O pin |
| 핀 67 | I/O — User I/O pin |
| 핀 68 | I/O — User I/O pin |
| 핀 69 | I/O — User I/O pin |
| 핀 70 | I/O — User I/O pin |
| 핀 71 | I/O — User I/O pin |
| 핀 72 | I/O — User I/O pin |
| 핀 73 | GND — Ground |
| 핀 74 | I/O — User I/O pin |
| 핀 75 | I/O — User I/O pin |
| 핀 76 | I/O — User I/O pin |
| 핀 77 | I/O — User I/O pin |
| 핀 78 | I/O — User I/O pin |
| 핀 79 | I/O — User I/O pin |
| 핀 80 | I/O — User I/O pin |
| 핀 81 | I/O — User I/O pin |
| 핀 82 | I/O — User I/O pin |
| 핀 83 | I/O — User I/O pin |
| 핀 84 | VCCIO — I/O supply voltage |
| 핀 85 | I/O — User I/O pin |
| 핀 86 | I/O — User I/O pin |
| 핀 87 | I/O — User I/O pin |
| 핀 88 | I/O — User I/O pin |
| 핀 89 | I/O — User I/O pin |
| 핀 90 | I/O — User I/O pin |
| 핀 91 | I/O — User I/O pin |
| 핀 92 | I/O — User I/O pin |
| 핀 93 | I/O — User I/O pin |
| 핀 94 | I/O — User I/O pin |
| 핀 95 | GND — Ground |
| 핀 96 | nSTATUS — Configuration status (open-drain) |
| 핀 97 | nCONFIG — Configuration control (active-low) |
| 핀 98 | DCLK — Configuration clock |
| 핀 99 | DATA0 — Configuration data input |
| 핀 100 | CONF_DONE — Configuration done (open-drain) |
| 핀 101 | I/O — User I/O pin |
| 핀 102 | I/O — User I/O pin |
| 핀 103 | I/O — User I/O pin |
| 핀 104 | I/O — User I/O pin |
| 핀 105 | I/O — User I/O pin |
| 핀 106 | I/O — User I/O pin |
| 핀 107 | I/O — User I/O pin |
| 핀 108 | I/O — User I/O pin |
| 핀 109 | I/O — User I/O pin |
| 핀 110 | VCCINT — Core supply voltage (5.0 V) |
| 핀 111 | I/O — User I/O pin |
| 핀 112 | I/O — User I/O pin |
| 핀 113 | I/O — User I/O pin |
| 핀 114 | I/O — User I/O pin |
일반적인 애플리케이션
EPF6024ATC114-3 적합 용도: 6 애플리케이션s: ASIC Prototyping and Pre-Silicon Validation, Bus-Bridge and Protocol Conversion, Industrial Glue Logic and State-Machine Controllers, Legacy Telecommunications Backplane Interfaces, Consumer Electronics Peripheral Controllers, Test and Measurement Front-End Logic.
ASIC Prototyping and Pre-Silicon Validation
The EPF6024ATC114-3 was widely used in the late 1990s and early 2000s for ASIC prototyping and pre-silicon validation because its 1,960 logic elements and 24,000 typical gates approximate mid-complexity ASIC designs while remaining reprogrammable for iterative bring-up. Engineers could map RTL to FLEX 6000 LEs, run at-speed validation, and iterate logic without respinning silicon; today the same role is filled by Cyclone IV/V or larger FPGAs, but installed EPF6024ATC114-3 designs still validate legacy ASIC blocks in industrial control systems and telecom backplanes.
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Bus-Bridge and Protocol Conversion
With 117 user I/Os and 1,960 LEs, the EPF6024ATC114-3 fits bus-bridge and protocol-conversion applications such as ISA-to-PCI bridges, UART-to-parallel converters, and legacy peripheral glue logic. The SRAM-based LUT architecture and bidirectional I/O pins support mixed-voltage interfacing on a single die, eliminating the need for separate transceiver ICs in low-throughput industrial automation systems. Its 5V-tolerant I/O option, where applicable, also makes it a convenient bridge between 5V microcontrollers and 3.3V peripherals.
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Industrial Glue Logic and State-Machine Controllers
Industrial glue-logic designs benefit from the EPF6024ATC114-3's 4-input LUT structure, fast carry chain for counters and arithmetic, and 117 user I/Os for interfacing to many sensors and actuators simultaneously. Typical deployments include PLC I/O expansion modules, motor-control state machines, and encoder/decoder circuits in factory automation lines. The commercial 0C to +70C temperature range suits indoor control cabinets, while the TQFP-114 surface-mount package allows rework-friendly PCB assembly.
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Legacy Telecommunications Backplane Interfaces
The EPF6024ATC114-3 was deployed in legacy telecom backplane interface cards where its 117 I/Os handled multiple low-speed T1/E1 framing channels, HDLC controllers, and time-slot interchangers in a single device. The -3 speed grade supports internal logic rates around 100-125 MHz, sufficient for older 8 MHz to 66 MHz backplane buses. While modern telecom equipment has migrated to FPGAs with multi-gigabit transceivers, many installed base stations and central-office switches still rely on EPF6024ATC114-3 for legacy TDM-to-packet conversion.
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Consumer Electronics Peripheral Controllers
In consumer electronics, the EPF6024ATC114-3 served as a peripheral controller for printers, set-top boxes, and DVD players, offloading I/O management and display timing from the main CPU. Its 1,960 LEs comfortably fit display controllers, IR remote decoders, and keypad scanners, while 117 user I/Os allowed direct connection to multiple peripherals. Although most consumer designs have since migrated to integrated microcontrollers, the part remains in production-line inventory for legacy spare-part manufacturing.
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Test and Measurement Front-End Logic
Test and measurement instruments used the EPF6024ATC114-3 as front-end logic for signal routing, trigger generation, and time-base control in oscilloscopes, logic analyzers, and data-acquisition systems. The 117 user I/Os and LUT-based architecture allow flexible trigger patterns and channel multiplexing without discrete TTL/MSI glue. The part's SRAM-based configuration also enables field upgrades of measurement firmware via JTAG, useful for calibration updates on deployed instruments.
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추천 제품 요약
엔지니어링 참조 데이터: EPF6024ATC114-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF6024ATC100-10 | EPF6016ATC144-3 | EPF6024AQC240-3 | EPF6024AFC256-3 | EPF6024ABC256-3 |
|---|---|---|---|---|---|---|
| Package | TQFP-114 | TQFP-100 | TQFP-144 | QFP-240 | FBGA-256 | BGA-256 |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements (LEs) | 1,960 | 1,960 | 1,320 | 1,960 | 1,960 | 1,960 |
| Typical Gates | 24,000 | 24,000 | 16,000 | 24,000 | 24,000 | 24,000 |
| Speed Grade | -3 | -10 | -3 | -3 | -3 | -3 |
| Configuration Technology | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) |
| User I/O Pins | 117 | 81 | 117 | 199 | 199 | 199 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest I/O count within 100-pin FLEX 6000 family (vs EPF6024ATC100-10)
- Faster speed grade (-3) compared to -10 variants (vs EPF6024ATC100-10)
- More logic capacity than EPF6016 family sibling (vs EPF6016ATC144-3)
설계 노트
The EPF6024ATC114-3 requires two separate supply rails: VCCINT (5.0 V core) and VCCIO (3.3 V or 5.0 V I/O, depending on bank configuration). Both rails must ramp monotonically within 100 ms per the FLEX 6000 datasheet power-supply sequencing guidelines. Decoupling: place one 0.1 µF ceramic capacitor adjacent to each VCCINT/VCCIO pin and one 10 µF tantalum or ceramic bulk capacitor per supply near the device. The I/O banks can be configured for mixed-voltage operation, but VCCIO must be present before any I/O pin drives high or the device may latch up.
Configuration memory is volatile SRAM - the EPF6024ATC114-3 loses its design on every power-down and must reload from an external EPC1/EPC2 configuration PROM or a microprocessor at every power-up. Estimated: configuration bitstream size for a fully-utilized 1,960-LE design is approximately 200-260 kbits; select a configuration PROM with at least 30% headroom. Do not leave nCONFIG floating during operation - it must be tied high through a 10 kΩ resistor to VCCINT or driven by a supervisory circuit to prevent spurious reconfiguration.
The TQFP-114 package has a 0.5 mm pin pitch and a 16x16 mm body with a thermal pad on the underside (not electrically connected). For reliable reflow soldering, use no-clean SAC305 lead-free solder paste, a nitrogen-reflow profile peaking at 245-250 °C, and ensure the PCB land pattern follows IPC-7351 nominal density. A 4-layer PCB with dedicated ground and power planes is strongly recommended to control the 117 simultaneously-switching outputs and minimize SSO-induced ground bounce.
규정 준수 정보
Compliance information not present in the verified web data. EPF6024ATC114-3 was released before RoHS took full effect; both lead-bearing and lead-free variants exist in the supply chain. Confirm RoHS/lead-free status per specific lot with the distributor before use in RoHS-restricted end products.