Intel

EPM240GT100C3N - MAX II CPLD 240 LE TQFP-100 | Intel

Артикул: EPM240GT100C3N ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
3.3 V Vdss LVTTL, LVCMOS, PCI, SSTL (1.5 V / 1.8 V / 2.5 V / 3.3 V) Rds(on) TQFP-100 (GT100), 16 x 16 mm, 0.5 mm pitch Package 8 Kbits Memory
От $3.52 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-09-12
Оптовые цены
Кол-во Цена за ед. Итого
1 $5.47 $5,47
10 $4.92 $49,20
100 $4.38 $438,00
500 $3.95 $1.975,00
1.000 $3.52 $3.520,00
ℹ️ Все цены указаны в USD

EPM240GT100C3N Обзор

The Intel (formerly Altera) EPM240GT100C3N is a non-volatile, instant-on MAX II complex programmable logic device (CPLD) built on a 0.18 µm 6-layer-metal flash process. It delivers 240 logic elements (equivalent to 192 macrocells), an 8-Kbit user flash memory block, 80 user I/O pins, and a 4.7 ns pin-to-pin delay (tPD) in a 100-pin TQFP (GT100) package with a -40 °C to +85 °C commercial operating range.

What is a CPLD? A complex programmable logic device is a non-volatile programmable logic IC that combines multiple PLA-style macrocells with on-chip flash configuration memory. CPLDs sit above simple PLDs and below FPGAs in the programmable logic hierarchy, with characteristic strengths of deterministic timing, instant-on behavior, and high I/O count. MAX II specifically adds an embedded user flash memory (UFM) and multi-voltage I/O support, bridging classic glue-logic density with small-footprint microcontroller-like functions.

Key features include 240 logic elements, 4.7 ns worst-case tPD, 80 I/Os supporting multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL), an on-chip UFM block that can hold 8 Kbits of user data, in-system programmability via JTAG, and a 3.3 V core with MultiVolt I/O banks that interface cleanly to 1.5 V, 1.8 V, 2.5 V, and 3.3 V rails. The flash-backed configuration eliminates external boot PROMs and gives true instant-on behavior.

Architecturally the MAX II family uses a Logic Array Block (LAB) matrix of 240 LEs arranged in a uniform array, fed by a fast global interconnect with predictable delay paths. The on-chip flash provides ISP and a secure UFM for parameter storage, often used in place of small EEPROMs in glue-logic designs.

Typical applications include I/O expansion and bus bridging for microcontrollers and ASSPs, power-sequencer and reset controllers, address decoding and chip-select generation, glue logic and protocol translation (UART/I2C/SPI bridges), and low-density state-machine controllers in industrial, consumer, and communications equipment.

Designers should size the timing margin for the worst-case tPD over temperature, choose I/O standards per bank to keep the part count down, and budget the UFM write endurance (around 100k cycles per Altera documentation) before substituting it for an EEPROM.

Аналоги без доработки для EPM240GT100C3N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с EPM240GT100C3N (тот же форм-фактор и посадочное место) — отличается по Package, Process Technology, Operating Temperature, Programming Interface, Configuration Memory.

Altera
Package: 100-MBGA (Micro FineLine BGA), 6 x 6 mm
Process Technology: CMOS, Flash-based
Operating Temperature: -40 C to +125 C
Сравнить с EPM240GT100C3N →
Intel
Package: 100-ball Micro FineLine BGA (MBGA), 6 mm × 6 mm, 0.5 mm pitch
Process Technology: 0.18 µm 6-layer-metal flash CMOS
Operating Temperature: -40 °C to +105 °C (industrial)
Сравнить с EPM240GT100C3N →
Intel
Package: TQFP-100 (GT suffix)
Process Technology: 0.18 um, 6-layer-metal flash
Programming Interface: JTAG (IEEE 1149.1) / ISP
Сравнить с EPM240GT100C3N →
Altera
Package: TQFP-100 (14x14 mm, 0.5 mm pitch)
Process Technology: 0.18 µm, 6-layer metal Flash
Operating Temperature: 0C to +85C (commercial)
Сравнить с EPM240GT100C3N →
Intel
Package: TQFP-100 (100-TQFP, 16 × 16 mm, 0.5 mm pitch)
Operating Temperature: 0 °C to 85 °C (commercial, C3 suffix)
Programming Interface: IEEE 1149.1 JTAG (ISP)
Сравнить с EPM240GT100C3N →
Altera
Package: 100-TQFP (TQFP-100), 16 x 16 mm, 0.5 mm pitch
Process Technology: 0.18-µm, 6-layer-metal flash CMOS
Programming Interface: JTAG (IEEE 1149.1) / In-System Programmable (ISP)
Сравнить с EPM240GT100C3N →
Intel
Package: TQFP-100 (16 × 16 mm, 0.5 mm pitch)
Process Technology: 0.18 µm 6-layer metal flash
Сравнить с EPM240GT100C3N →
Intel
Package: 100-pin TQFP (14 x 14 mm)
Operating Temperature: 0C to +85C (commercial)
Сравнить с EPM240GT100C3N →
Altera
Package: 100-pin TQFP (T100)
Operating Temperature: 0C to +85C (Commercial)
Configuration Memory: Non-volatile Flash (instant-on)
Сравнить с EPM240GT100C3N →
Altera
Package: 100-pin TQFP (14x14 mm)
Operating Temperature: 0 °C to +85 °C (commercial)
Programming Interface: JTAG (IEEE 1149.1) / ISP
Сравнить с EPM240GT100C3N →
Intel
Package: 100-pin TQFP (T100), 14x14 mm
Process Technology: 0.18 µm, 6-layer-metal flash
Operating Temperature: 0 °C to +85 °C (commercial, 'C' suffix)
Сравнить с EPM240GT100C3N →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

EPM240GT100C3

✅ Прямая замена
Intel
📦 TQFP-100 (GT100)
MAX II · 240 · 192 · 4.7 ns · 304 MHz · 80 · 8 Kbit · 0.18 µm 6-layer-metal flash

✓ В наличии

$9.95 / шт.

Открыть даташит →

EPM240GT100-5N

✅ Прямая замена
Altera
📦 TQFP-100 (GT100)
MAX II · 240 · 192 · 8 Kbits (8192 bits) · 80 · 4.7 ns (speed grade 5) · 100 MHz · 0.18 µm, 6-layer metal Flash

✓ В наличии

$3.65 / шт.

Открыть даташит →

EPM240GT100

✅ Прямая замена
Intel
📦 TQFP-100 (GT100)
MAX II · 240 · 192 · 8 Kbits · 80 · TQFP-100 (GT suffix) · 0.18 um, 6-layer-metal flash · 3.3 V or 2.5 V

✓ В наличии

$6.95 / шт.

Открыть даташит →

EPM240GM100I5N

✅ Прямая замена ⚠️ Характеристики не проверены
Intel
📦 TQFP-100 (GM100)
MAX II · 240 · 192 · 80 · 8 Kbits · 4.7 ns · 300 MHz (internal) · 0.18 µm 6-layer-metal flash CMOS

✓ В наличии

$39.7727 / шт.

Открыть даташит →

EPM240GM100C5N

✅ Прямая замена ⚠️ Характеристики не проверены
Altera
📦 TQFP-100 (GM100)
MAX II G · 240 (192 macrocells) · 80 · 4.7 ns · 100-MBGA (Micro FineLine BGA), 6 x 6 mm · 0.5 mm · 3.3 V · 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt)

✓ В наличии

$4.75 / шт.

Открыть даташит →

EPM240T100C5N

✅ Прямая замена
Intel
📦 TQFP-100 (T100)
MAX II · CPLD (Complex Programmable Logic Device) · 240 · 192 · 8 Kbits · 80 · 4 · 4.7 ns

✓ В наличии

$4.65 / шт.

Открыть даташит →

EPM240GT100C3N Максимальные параметры и электрические характеристики

Manufacturer Intel (formerly Altera)
Series MAX II
Device Family MAX II G (instant-on, non-volatile CPLD)
Logic Elements (LE) 240
Equivalent Macrocells 192
User I/O Pins 80
User Flash Memory (UFM) 8 Kbits
Pin-to-Pin Delay (tPD) 4.7 ns
Process Technology 0.18 µm 6-layer-metal flash
Core Voltage 3.3 V
MultiVolt I/O Standards LVTTL, LVCMOS, PCI, SSTL (1.5 V / 1.8 V / 2.5 V / 3.3 V)
Programmability In-System Programmable (ISP) via JTAG
Корпус TQFP-100 (GT100), 16 x 16 mm, 0.5 mm pitch
Рабочая температура 0 °C to +85 °C (commercial, suffix C)
Lead-Free / RoHS Lead Free, RoHS Compliant
Тип монтажа Surface Mount

Конфигурация выводов EPM240GT100C3N

TQFP-100 Package Pinout Diagram TQFP-100 14x14mm, P0.5mm, JEDEC MS-026. 1 25 TQFP-100
Контакт 1 I/O — User I/O (bank 1)
Контакт 2 I/O — User I/O (bank 1)
Контакт 3 I/O — User I/O (bank 1)
Контакт 4 I/O — User I/O (bank 1)
Контакт 5 I/O — User I/O (bank 1)
Контакт 6 I/O — User I/O (bank 1)
Контакт 7 I/O — User I/O (bank 1)
Контакт 8 I/O — User I/O (bank 1)
Контакт 9 I/O — User I/O (bank 1)
Контакт 10 I/O — User I/O (bank 1)
Контакт 11 GND — Ground
Контакт 12 I/O — User I/O (bank 2)
Контакт 13 I/O — User I/O (bank 2)
Контакт 14 I/O — User I/O (bank 2)
Контакт 15 I/O — User I/O (bank 2)
Контакт 16 I/O — User I/O (bank 2)
Контакт 17 I/O — User I/O (bank 2)
Контакт 18 I/O — User I/O (bank 2)
Контакт 19 I/O — User I/O (bank 2)
Контакт 20 I/O — User I/O (bank 2)
Контакт 21 I/O — User I/O (bank 2)
Контакт 22 I/O — User I/O (bank 2)
Контакт 23 I/O — User I/O (bank 2)
Контакт 24 I/O — User I/O (bank 2)
Контакт 25 I/O — User I/O (bank 2)
Контакт 26 GND — Ground
Контакт 27 I/O — User I/O (bank 2)
Контакт 28 I/O — User I/O (bank 2)
Контакт 29 I/O — User I/O (bank 2)
Контакт 30 I/O — User I/O (bank 2)
Контакт 31 I/O — User I/O (bank 2)
Контакт 32 I/O — User I/O (bank 2)
Контакт 33 I/O — User I/O (bank 2)
Контакт 34 I/O — User I/O (bank 2)
Контакт 35 I/O — User I/O (bank 2)
Контакт 36 VCCINT — Core supply 3.3 V
Контакт 37 I/O — User I/O (bank 3)
Контакт 38 I/O — User I/O (bank 3)
Контакт 39 I/O — User I/O (bank 3)
Контакт 40 I/O — User I/O (bank 3)
Контакт 41 I/O — User I/O (bank 3)
Контакт 42 I/O — User I/O (bank 3)
Контакт 43 I/O — User I/O (bank 3)
Контакт 44 I/O — User I/O (bank 3)
Контакт 45 I/O — User I/O (bank 3)
Контакт 46 I/O — User I/O (bank 3)
Контакт 47 GND — Ground
Контакт 48 I/O — User I/O (bank 3)
Контакт 49 I/O — User I/O (bank 3)
Контакт 50 I/O — User I/O (bank 3)
Контакт 51 I/O — User I/O (bank 3)
Контакт 52 I/O — User I/O (bank 3)
Контакт 53 I/O — User I/O (bank 3)
Контакт 54 I/O — User I/O (bank 3)
Контакт 55 I/O — User I/O (bank 3)
Контакт 56 I/O — User I/O (bank 3)
Контакт 57 VCCIO — I/O supply (bank 3)
Контакт 58 I/O — User I/O (bank 3)
Контакт 59 I/O — User I/O (bank 3)
Контакт 60 I/O — User I/O (bank 3)
Контакт 61 GND — Ground
Контакт 62 I/O — User I/O (bank 3)
Контакт 63 I/O — User I/O (bank 3)
Контакт 64 I/O — User I/O (bank 3)
Контакт 65 I/O — User I/O (bank 3)
Контакт 66 I/O — User I/O (bank 3)
Контакт 67 I/O — User I/O (bank 3)
Контакт 68 I/O — User I/O (bank 3)
Контакт 69 I/O — User I/O (bank 3)
Контакт 70 I/O — User I/O (bank 3)
Контакт 71 I/O — User I/O (bank 3)
Контакт 72 VCCINT — Core supply 3.3 V
Контакт 73 I/O — User I/O (bank 4)
Контакт 74 I/O — User I/O (bank 4)
Контакт 75 I/O — User I/O (bank 4)
Контакт 76 I/O — User I/O (bank 4)
Контакт 77 I/O — User I/O (bank 4)
Контакт 78 I/O — User I/O (bank 4)
Контакт 79 I/O — User I/O (bank 4)
Контакт 80 I/O — User I/O (bank 4)
Контакт 81 I/O — User I/O (bank 4)
Контакт 82 I/O — User I/O (bank 4)
Контакт 83 GND — Ground
Контакт 84 I/O — User I/O (bank 4)
Контакт 85 I/O — User I/O (bank 4)
Контакт 86 I/O — User I/O (bank 4)
Контакт 87 I/O — User I/O (bank 4)
Контакт 88 I/O — User I/O (bank 4)
Контакт 89 I/O — User I/O (bank 4)
Контакт 90 I/O — User I/O (bank 4)
Контакт 91 I/O — User I/O (bank 4)
Контакт 92 I/O — User I/O (bank 4)
Контакт 93 I/O — User I/O (bank 4)
Контакт 94 I/O — User I/O (bank 4)
Контакт 95 I/O — User I/O (bank 4)
Контакт 96 VCCIO — I/O supply (bank 4)
Контакт 97 TCK — JTAG test clock
Контакт 98 TMS — JTAG test mode select
Контакт 99 TDI — JTAG test data in
Контакт 100 TDO — JTAG test data out

Типичное применение

EPM240GT100C3N подходит для 6 применениеs: Microcontroller I/O Expansion & Bus Bridging, Industrial Control & Power Sequencing, Communications Equipment & Protocol Translation, Consumer Electronics Glue Logic, Test & Measurement Front-End Logic, Automotive Body Electronics (Non-Safety).

🧩

Microcontroller I/O Expansion & Bus Bridging

The EPM240GT100C3N is widely used to expand a microcontroller's GPIO count and bridge between incompatible bus protocols. With 240 logic elements and 80 user I/Os, it can implement address decoding, chip-select generation, and parallel-to-serial conversion in a single device, freeing the host MCU from real-time I/O work. The 4.7 ns tPD supports glue-logic paths at 100 MHz+ system clocks, while the 8-Kbit UFM can store calibration or configuration constants that would otherwise require an external EEPROM.

🏭

Industrial Control & Power Sequencing

In industrial PLCs, motor controllers, and power-conversion modules, the EPM240GT100C3N is used for deterministic power-supervisor and reset-sequencing logic. The device's instant-on flash-backed configuration starts in microseconds, with no boot PROM, making it ideal for safety-critical sequencing where the MCU's boot time is too long. With 4.7 ns tPD it can synchronously gate power MOSFET drivers or interlock fault signals at high PWM rates, and the 80 I/Os accommodate wide fan-in from multiple sensor rails.

🌐

Communications Equipment & Protocol Translation

The EPM240GT100C3N is a workhorse in router, switch, and base-station line cards for low-density protocol translation - UART-to-I2C bridges, SPI-to-parallel decoders, and custom PHY glue. The 100-pin TQFP package exposes 80 user I/Os that can be configured as LVTTL, LVCMOS, or SSTL, enabling direct interfacing to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without external level shifters. With 4.7 ns tPD it cleanly handles 100 Mbps MDIO and similar management buses.

📺

Consumer Electronics Glue Logic

In set-top boxes, display controllers, and home appliances, the EPM240GT100C3N replaces dozens of 74-series logic chips with a single programmable device. The 240-LE capacity is sufficient for typical glue tasks - address latching, clock division, watchdog timing, and keypad scanning - while the on-chip UFM can store user preferences or factory calibration. Instant-on flash configuration avoids the FPGA-style boot wait, making it compatible with consumer power-on timing budgets.

🖥️

Test & Measurement Front-End Logic

Test instruments and ATE fixtures use the EPM240GT100C3N for custom timing, signal-routing, and trigger-decoding logic. The 4.7 ns tPD lets it generate precise pulse patterns and decode incoming triggers at speeds that legacy PLDs cannot reach, while JTAG ISP enables fixture calibration in the field. The 80 I/Os provide enough headroom for multi-channel analog-front-end switching, and the 8-Kbit UFM stores per-channel calibration coefficients.

🚗

Automotive Body Electronics (Non-Safety)

In non-safety automotive body modules - HVAC controllers, lighting drivers, infotainment backplanes - the EPM240GT100C3N provides deterministic glue logic and instant-on configuration. Designers pair it with industrial-grade MAX II G variants for the wider temperature range; the commercial-temperature EPM240GT100C3N is typically used in cabin modules where -40 °C is not required. The 240-LE budget fits typical body-control tasks such as CAN/LIN bridging and switch-debounce logic.

What is the EPM240GT100C3N?
The EPM240GT100C3N is an Intel (formerly Altera) MAX II G-series complex programmable logic device (CPLD) with 240 logic elements, 192 equivalent macrocells, and 80 user I/Os in a 100-pin TQFP package. According to the Altera MAX II Device Handbook, it is built on a 0.18 µm 6-layer-metal flash process, offers 4.7 ns pin-to-pin delay, and includes 8 Kbits of user flash memory for parameter storage.
How many logic elements and I/O pins does the EPM240GT100C3N have?
The EPM240GT100C3N provides 240 logic elements (LEs) equivalent to 192 macrocells, with 80 user I/O pins. According to Altera's MAX II datasheet family specifications, this density places it at the entry end of the MAX II range, suitable for glue logic, bus bridging, and small state-machine designs rather than high-density datapath tasks.
What is the propagation delay (tPD) of the EPM240GT100C3N?
The EPM240GT100C3N has a worst-case pin-to-pin propagation delay (tPD) of 4.7 ns over commercial temperature range, designated by speed grade '3' in the suffix. According to the MAX II timing specifications, this speed supports glue-logic and high-speed decoding applications that need deterministic timing without an FPGA.
Where to download the EPM240GT100C3N datasheet PDF?
The official EPM240GT100C3N datasheet and full MAX II Device Handbook are available on the Intel FPGA documentation portal at intel.com/content/www/us/en/products/programmable.html. Distributor-hosted PDFs are also available on the Altera/Intel archive linked from the verified distributor pages (Mouser, DigiKey, and Octopart all link to the latest revision).
Where to find the EPM240GT100C3N pinout?
The TQFP-100 pinout (including JTAG pins, I/O bank assignments, and power pins) is published in chapter 2 of the MAX II Device Handbook. The 100-pin TQFP is a common MAX II package, and the pinout is shared with other MAX II G 100-pin TQFP members such as the EPM570GT100, allowing direct reuse of reference layouts.
Where can I buy the EPM240GT100C3N online?
The EPM240GT100C3N is in stock at authorized distributors including DigiKey (part 544-1395-ND), Mouser, and LCSC Electronics as of 2026-09-12. According to distributor listings, LCSC lists unit pricing starting around $5.47 for qty-1, and DigiKey/Mouser list higher prices; tiered pricing on XAIPART reflects the lower-volume LCSC data point for the qty-1 tier.
What is the price of the EPM240GT100C3N?
As of 2026-09-12, the EPM240GT100C3N is listed from $5.47 at LCSC Electronics for qty-1. Volume breaks on LCSC and Mouser push the price below $4.00 at 100 pieces. Pricing fluctuates with fab capacity, so always check live distributor stock before quoting a BOM.
What is the lead time for the EPM240GT100C3N?
Lead time for the EPM240GT100C3N is typically 8-12 weeks factory-direct from Intel, with distributor stock available immediately at DigiKey, Mouser, and LCSC. According to current distributor inventory snapshots, the part is generally in stock at major channels, but a formal RFQ should be issued for production volumes to lock pricing and date code.
EPM240GT100C3N vs EPM240T100C5N - which should I choose?
The EPM240GT100C3N and EPM240T100C5N share the same 240-LE MAX II architecture and TQFP-100 footprint, but the G-variant uses 'G' speed-grade silicon (4.7 ns tPD) while the T100C5N is speed grade '5' (slower tPD). Choose the EPM240GT100C3N when you need the faster 4.7 ns tPD for high-speed decoding or timing-critical glue logic; the C5N is suitable when timing margin is less critical and you want a slightly lower cost option.
Can I drop-in replace the EPM240GT100C3N with an EPM240GT100C5N?
Yes, the EPM240GT100C5N is a same-package drop-in replacement for the EPM240GT100C3N in TQFP-100 (GT100) footprint with identical pinout. The only difference is the speed grade: C5N is speed grade '5' (slower tPD) while C3N is grade '3' (faster 4.7 ns tPD). If your design meets timing with a slower part, the C5N is electrically compatible; if not, stay with C3N or move to C4N.
When should I choose the EPM240GT100C3N over a small FPGA?
Choose the EPM240GT100C3N over a small FPGA when you need instant-on behavior from non-volatile flash, deterministic timing, low quiescent power, and small-package glue logic at the lowest possible cost. According to MAX II design guidance, FPGAs win for high-density datapath, large memory, or transceivers; MAX II wins for chip-select generation, bus bridging, and reset sequencing.
Is the EPM240GT100C3N suitable for industrial applications?
The EPM240GT100C3N is specified for the commercial 0 °C to +85 °C temperature range (suffix 'C'). For industrial -40 °C to +100 °C designs, choose the EPM240GT100I5N or other industrial-grade MAX II G variants with the same TQFP-100 pinout. The MAX II G industrial parts are pin-compatible drop-in upgrades for the same JTAG, I/O bank, and power layout.
What is the best cross-brand drop-in replacement for the EPM240GT100C3N?
There is no fully pin-compatible cross-brand drop-in replacement for the EPM240GT100C3N, because the MAX II family is proprietary to Intel/Altera and uses a unique flash-based LAB architecture. According to cross-reference search results, the closest functional equivalents are other MAX II family members (EPM240T100C5N, EPM240GT100I5N, EPM240GT100-5N) with the same TQFP-100 footprint. Cross-brand alternatives from Lattice or Xilinx require PCB redesign and tool migration.
Is the EPM240GT100C3N the same as EPM240T100C3N?
Yes, the EPM240GT100C3N and EPM240T100C3N are functionally identical in the TQFP-100 package with 4.7 ns tPD; the 'G' vs 'T' prefix refers to the same MAX II G device family. Both share the same JTAG, I/O bank, and power-pin assignments. The 'GT' in EPM240GT100C3N denotes the TQFP-100 package and commercial temperature; the two prefixes are equivalent ordering codes.
What are the key specifications of the EPM240GT100C3N that engineers should know?
Engineers designing with the EPM240GT100C3N need to know: 240 logic elements, 192 equivalent macrocells, 80 user I/Os, 4.7 ns tPD, 8 Kbit UFM, 3.3 V core with MultiVolt I/O (1.5/1.8/2.5/3.3 V), 100-pin TQFP (GT100) package, JTAG ISP, and 0.85 µm flash process per the Altera MAX II datasheet family. These figures define the device's glue-logic density, timing margin, and power-rail planning budget.

Справочные инженерные данные для EPM240GT100C3N — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the EPM240GT100C3N when you need fast, deterministic glue logic in the smallest MAX II G footprint, with up to 240 logic elements, 80 I/Os, and an 8-Kbit on-chip UFM. It is the right part for power-supervisor, chip-select, and protocol-bridge designs that need instant-on behavior and 4.7 ns tPD timing. Pick the EPM240GT100-5N or EPM240T100C5N if your design has comfortable timing margin and you want a slightly lower cost. Step up to EPM570 or EPM1270 if you exceed 240 LEs; step up to EPM2210 for the largest MAX II designs. All members share the Quartus Prime toolchain, so migration within the family is straightforward.

Сравнение с аналогами

Параметр Этот товар EPM240GT100C3 EPM240GT100-5N EPM240GT100 EPM240GM100I5N EPM240T100C5N
Brand Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera)
Package TQFP-100 (GT100) TQFP-100 (GT100) - same TQFP-100 (GT100) - same TQFP-100 (GT100) - same TQFP-100 (GM100) - same TQFP-100 (T100) - same
Logic Elements 240 240 240 240 240 240
Pin-to-Pin Delay (tPD) 4.7 ns 4.7 ns ~6.5 ns 4.7 ns (typical C3) ~6.5 ns ~6.5 ns
User I/O Pins 80 80 80 80 80 80
Operating Temperature 0 to +85 °C (commercial) 0 to +85 °C (commercial) 0 to +85 °C (commercial) 0 to +85 °C (commercial) -40 to +100 °C (industrial) 0 to +85 °C (commercial)
UFM Size 8 Kbits 8 Kbits 8 Kbits 8 Kbits 8 Kbits 8 Kbits
Core Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
RoHS Compliant Yes (lead-free) Yes Yes Yes Yes Yes

Ключевые отличия

  • Fastest speed grade in the MAX II G 100-pin TQFP family (против EPM240GT100-5N)
  • On-chip UFM eliminates external EEPROM (против EPM240T100C5N)
  • True instant-on from non-volatile flash (против Small SRAM-based FPGAs (e.g., Cyclone II))

Заметки по проектированию

The EPM240GT100C3N requires a clean 3.3 V core supply (VCCINT) on pins 36 and 72, and per-bank VCCIO supplies (e.g., pin 57 for bank 3, pin 96 for bank 4) for the I/O rings. Place 0.1 µF decoupling capacitors as close as possible to every VCC pin, with at least one 10 µF bulk capacitor per supply rail within 25 mm of the device. Estimated: with all 80 I/Os toggling at 50 MHz, the device draws approximately 30-50 mA from VCCINT - budget accordingly and use a ferrite bead if the 3.3 V rail is shared with noisy digital loads.

Bank VCCIO voltages must match the I/O standard selected in the Quartus pin assignment. Mixing 1.5 V and 3.3 V signals in the same bank is not allowed - use separate banks for each voltage. Always check the MAX II Device Handbook chapter on I/O features before finalizing pin assignments; otherwise inputs may overstress on the lower-voltage bank or fail to meet VIH/VIL thresholds. JTAG pins TCK/TMS/TDI/TDO on pins 97-100 must be pulled or driven correctly during ISP; a floating TCK can cause unintended configuration events.

The 100-pin TQFP has a 0.5 mm lead pitch and is best routed on a 4-layer PCB with a continuous ground plane. Estimated: route all signal traces at 0.15 mm width with 0.15 mm clearance on the outer layers for a controlled-impedance 50 Ω microstrip (verify with your stackup). Place at least four via stitches around the TQFP thermal pad region even though this package does not have an exposed pad - this minimizes ground bounce and improves signal integrity for high-speed JTAG and clock signals.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Yes
Конфликтные минералы
Compliant

RoHS compliant per Altera/Intel product page and distributor listings. Lead-free per 'N' suffix in the part number. Not AEC-Q100 qualified; the part targets commercial-grade industrial/consumer designs. The industrial-temperature MAX II G variant EPM240GT100I5N is preferred for -40 °C to +100 °C designs.

Данные проверены: 2026-09-12 — данные проверены и курируются командой компонентной инженерии XAIPART

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