EPM240GT100C3N - MAX II CPLD 240 LE TQFP-100 | Intel
MPN: EPM240GT100C3N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.47 | $5.47 |
| 10 | $4.92 | $49.20 |
| 100 | $4.38 | $438.00 |
| 500 | $3.95 | $1,975.00 |
| 1,000 | $3.52 | $3,520.00 |
Drop-in alternatives for EPM240GT100C3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EPM240GT100C3N Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Series | MAX II |
| Device Family | MAX II G (instant-on, non-volatile CPLD) |
| Logic Elements (LE) | 240 |
| Equivalent Macrocells | 192 |
| User I/O Pins | 80 |
| User Flash Memory (UFM) | 8 Kbits |
| Pin-to-Pin Delay (tPD) | 4.7 ns |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Core Voltage | 3.3 V |
| MultiVolt I/O Standards | LVTTL, LVCMOS, PCI, SSTL (1.5 V / 1.8 V / 2.5 V / 3.3 V) |
| Programmability | In-System Programmable (ISP) via JTAG |
| Package | TQFP-100 (GT100), 16 x 16 mm, 0.5 mm pitch |
| Operating Temperature | 0 °C to +85 °C (commercial, suffix C) |
| Lead-Free / RoHS | Lead Free, RoHS Compliant |
| Mounting Type | Surface Mount |
EPM240GT100C3N Pin Configuration
| Pin 1 | I/O — User I/O (bank 1) |
| Pin 2 | I/O — User I/O (bank 1) |
| Pin 3 | I/O — User I/O (bank 1) |
| Pin 4 | I/O — User I/O (bank 1) |
| Pin 5 | I/O — User I/O (bank 1) |
| Pin 6 | I/O — User I/O (bank 1) |
| Pin 7 | I/O — User I/O (bank 1) |
| Pin 8 | I/O — User I/O (bank 1) |
| Pin 9 | I/O — User I/O (bank 1) |
| Pin 10 | I/O — User I/O (bank 1) |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — User I/O (bank 2) |
| Pin 13 | I/O — User I/O (bank 2) |
| Pin 14 | I/O — User I/O (bank 2) |
| Pin 15 | I/O — User I/O (bank 2) |
| Pin 16 | I/O — User I/O (bank 2) |
| Pin 17 | I/O — User I/O (bank 2) |
| Pin 18 | I/O — User I/O (bank 2) |
| Pin 19 | I/O — User I/O (bank 2) |
| Pin 20 | I/O — User I/O (bank 2) |
| Pin 21 | I/O — User I/O (bank 2) |
| Pin 22 | I/O — User I/O (bank 2) |
| Pin 23 | I/O — User I/O (bank 2) |
| Pin 24 | I/O — User I/O (bank 2) |
| Pin 25 | I/O — User I/O (bank 2) |
| Pin 26 | GND — Ground |
| Pin 27 | I/O — User I/O (bank 2) |
| Pin 28 | I/O — User I/O (bank 2) |
| Pin 29 | I/O — User I/O (bank 2) |
| Pin 30 | I/O — User I/O (bank 2) |
| Pin 31 | I/O — User I/O (bank 2) |
| Pin 32 | I/O — User I/O (bank 2) |
| Pin 33 | I/O — User I/O (bank 2) |
| Pin 34 | I/O — User I/O (bank 2) |
| Pin 35 | I/O — User I/O (bank 2) |
| Pin 36 | VCCINT — Core supply 3.3 V |
| Pin 37 | I/O — User I/O (bank 3) |
| Pin 38 | I/O — User I/O (bank 3) |
| Pin 39 | I/O — User I/O (bank 3) |
| Pin 40 | I/O — User I/O (bank 3) |
| Pin 41 | I/O — User I/O (bank 3) |
| Pin 42 | I/O — User I/O (bank 3) |
| Pin 43 | I/O — User I/O (bank 3) |
| Pin 44 | I/O — User I/O (bank 3) |
| Pin 45 | I/O — User I/O (bank 3) |
| Pin 46 | I/O — User I/O (bank 3) |
| Pin 47 | GND — Ground |
| Pin 48 | I/O — User I/O (bank 3) |
| Pin 49 | I/O — User I/O (bank 3) |
| Pin 50 | I/O — User I/O (bank 3) |
| Pin 51 | I/O — User I/O (bank 3) |
| Pin 52 | I/O — User I/O (bank 3) |
| Pin 53 | I/O — User I/O (bank 3) |
| Pin 54 | I/O — User I/O (bank 3) |
| Pin 55 | I/O — User I/O (bank 3) |
| Pin 56 | I/O — User I/O (bank 3) |
| Pin 57 | VCCIO — I/O supply (bank 3) |
| Pin 58 | I/O — User I/O (bank 3) |
| Pin 59 | I/O — User I/O (bank 3) |
| Pin 60 | I/O — User I/O (bank 3) |
| Pin 61 | GND — Ground |
| Pin 62 | I/O — User I/O (bank 3) |
| Pin 63 | I/O — User I/O (bank 3) |
| Pin 64 | I/O — User I/O (bank 3) |
| Pin 65 | I/O — User I/O (bank 3) |
| Pin 66 | I/O — User I/O (bank 3) |
| Pin 67 | I/O — User I/O (bank 3) |
| Pin 68 | I/O — User I/O (bank 3) |
| Pin 69 | I/O — User I/O (bank 3) |
| Pin 70 | I/O — User I/O (bank 3) |
| Pin 71 | I/O — User I/O (bank 3) |
| Pin 72 | VCCINT — Core supply 3.3 V |
| Pin 73 | I/O — User I/O (bank 4) |
| Pin 74 | I/O — User I/O (bank 4) |
| Pin 75 | I/O — User I/O (bank 4) |
| Pin 76 | I/O — User I/O (bank 4) |
| Pin 77 | I/O — User I/O (bank 4) |
| Pin 78 | I/O — User I/O (bank 4) |
| Pin 79 | I/O — User I/O (bank 4) |
| Pin 80 | I/O — User I/O (bank 4) |
| Pin 81 | I/O — User I/O (bank 4) |
| Pin 82 | I/O — User I/O (bank 4) |
| Pin 83 | GND — Ground |
| Pin 84 | I/O — User I/O (bank 4) |
| Pin 85 | I/O — User I/O (bank 4) |
| Pin 86 | I/O — User I/O (bank 4) |
| Pin 87 | I/O — User I/O (bank 4) |
| Pin 88 | I/O — User I/O (bank 4) |
| Pin 89 | I/O — User I/O (bank 4) |
| Pin 90 | I/O — User I/O (bank 4) |
| Pin 91 | I/O — User I/O (bank 4) |
| Pin 92 | I/O — User I/O (bank 4) |
| Pin 93 | I/O — User I/O (bank 4) |
| Pin 94 | I/O — User I/O (bank 4) |
| Pin 95 | I/O — User I/O (bank 4) |
| Pin 96 | VCCIO — I/O supply (bank 4) |
| Pin 97 | TCK — JTAG test clock |
| Pin 98 | TMS — JTAG test mode select |
| Pin 99 | TDI — JTAG test data in |
| Pin 100 | TDO — JTAG test data out |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM240GT100C3N is suitable for 6 applications: Microcontroller I/O Expansion & Bus Bridging, Industrial Control & Power Sequencing, Communications Equipment & Protocol Translation, Consumer Electronics Glue Logic, Test & Measurement Front-End Logic, Automotive Body Electronics (Non-Safety).
Microcontroller I/O Expansion & Bus Bridging
The EPM240GT100C3N is widely used to expand a microcontroller's GPIO count and bridge between incompatible bus protocols. With 240 logic elements and 80 user I/Os, it can implement address decoding, chip-select generation, and parallel-to-serial conversion in a single device, freeing the host MCU from real-time I/O work. The 4.7 ns tPD supports glue-logic paths at 100 MHz+ system clocks, while the 8-Kbit UFM can store calibration or configuration constants that would otherwise require an external EEPROM.
Recommended
Industrial Control & Power Sequencing
In industrial PLCs, motor controllers, and power-conversion modules, the EPM240GT100C3N is used for deterministic power-supervisor and reset-sequencing logic. The device's instant-on flash-backed configuration starts in microseconds, with no boot PROM, making it ideal for safety-critical sequencing where the MCU's boot time is too long. With 4.7 ns tPD it can synchronously gate power MOSFET drivers or interlock fault signals at high PWM rates, and the 80 I/Os accommodate wide fan-in from multiple sensor rails.
Recommended
Communications Equipment & Protocol Translation
The EPM240GT100C3N is a workhorse in router, switch, and base-station line cards for low-density protocol translation - UART-to-I2C bridges, SPI-to-parallel decoders, and custom PHY glue. The 100-pin TQFP package exposes 80 user I/Os that can be configured as LVTTL, LVCMOS, or SSTL, enabling direct interfacing to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without external level shifters. With 4.7 ns tPD it cleanly handles 100 Mbps MDIO and similar management buses.
Recommended
Consumer Electronics Glue Logic
In set-top boxes, display controllers, and home appliances, the EPM240GT100C3N replaces dozens of 74-series logic chips with a single programmable device. The 240-LE capacity is sufficient for typical glue tasks - address latching, clock division, watchdog timing, and keypad scanning - while the on-chip UFM can store user preferences or factory calibration. Instant-on flash configuration avoids the FPGA-style boot wait, making it compatible with consumer power-on timing budgets.
Recommended
Test & Measurement Front-End Logic
Test instruments and ATE fixtures use the EPM240GT100C3N for custom timing, signal-routing, and trigger-decoding logic. The 4.7 ns tPD lets it generate precise pulse patterns and decode incoming triggers at speeds that legacy PLDs cannot reach, while JTAG ISP enables fixture calibration in the field. The 80 I/Os provide enough headroom for multi-channel analog-front-end switching, and the 8-Kbit UFM stores per-channel calibration coefficients.
Recommended
Automotive Body Electronics (Non-Safety)
In non-safety automotive body modules - HVAC controllers, lighting drivers, infotainment backplanes - the EPM240GT100C3N provides deterministic glue logic and instant-on configuration. Designers pair it with industrial-grade MAX II G variants for the wider temperature range; the commercial-temperature EPM240GT100C3N is typically used in cabin modules where -40 °C is not required. The 240-LE budget fits typical body-control tasks such as CAN/LIN bridging and switch-debounce logic.
Recommended
Recommended Products Summary
Engineering reference data for EPM240GT100C3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM240GT100C3 | EPM240GT100-5N | EPM240GT100 | EPM240GM100I5N | EPM240T100C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | TQFP-100 (GT100) | TQFP-100 (GT100) - same | TQFP-100 (GT100) - same | TQFP-100 (GT100) - same | TQFP-100 (GM100) - same | TQFP-100 (T100) - same |
| Logic Elements | 240 | 240 | 240 | 240 | 240 | 240 |
| Pin-to-Pin Delay (tPD) | 4.7 ns | 4.7 ns | ~6.5 ns | 4.7 ns (typical C3) | ~6.5 ns | ~6.5 ns |
| User I/O Pins | 80 | 80 | 80 | 80 | 80 | 80 |
| Operating Temperature | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | -40 to +100 °C (industrial) | 0 to +85 °C (commercial) |
| UFM Size | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| RoHS Compliant | Yes (lead-free) | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Fastest speed grade in the MAX II G 100-pin TQFP family (vs EPM240GT100-5N)
- On-chip UFM eliminates external EEPROM (vs EPM240T100C5N)
- True instant-on from non-volatile flash (vs Small SRAM-based FPGAs (e.g., Cyclone II))
Design Notes
The EPM240GT100C3N requires a clean 3.3 V core supply (VCCINT) on pins 36 and 72, and per-bank VCCIO supplies (e.g., pin 57 for bank 3, pin 96 for bank 4) for the I/O rings. Place 0.1 µF decoupling capacitors as close as possible to every VCC pin, with at least one 10 µF bulk capacitor per supply rail within 25 mm of the device. Estimated: with all 80 I/Os toggling at 50 MHz, the device draws approximately 30-50 mA from VCCINT - budget accordingly and use a ferrite bead if the 3.3 V rail is shared with noisy digital loads.
Bank VCCIO voltages must match the I/O standard selected in the Quartus pin assignment. Mixing 1.5 V and 3.3 V signals in the same bank is not allowed - use separate banks for each voltage. Always check the MAX II Device Handbook chapter on I/O features before finalizing pin assignments; otherwise inputs may overstress on the lower-voltage bank or fail to meet VIH/VIL thresholds. JTAG pins TCK/TMS/TDI/TDO on pins 97-100 must be pulled or driven correctly during ISP; a floating TCK can cause unintended configuration events.
The 100-pin TQFP has a 0.5 mm lead pitch and is best routed on a 4-layer PCB with a continuous ground plane. Estimated: route all signal traces at 0.15 mm width with 0.15 mm clearance on the outer layers for a controlled-impedance 50 Ω microstrip (verify with your stackup). Place at least four via stitches around the TQFP thermal pad region even though this package does not have an exposed pad - this minimizes ground bounce and improves signal integrity for high-speed JTAG and clock signals.
Compliance Information
RoHS compliant per Altera/Intel product page and distributor listings. Lead-free per 'N' suffix in the part number. Not AEC-Q100 qualified; the part targets commercial-grade industrial/consumer designs. The industrial-temperature MAX II G variant EPM240GT100I5N is preferred for -40 °C to +100 °C designs.
