Intel

EPM3512AFC256-2N - MAX 3000A CPLD, 512 Macrocells | Intel

Артикул: EPM3512AFC256-2N ✗ Снят с производства
В наличии Отправка в течение 1–3 рабочих дней
3.3 V Vdss 256-ball FineLine BGA (FC-256) Package Non-volatile EEPROM Memory
От $25.8 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-09-12
Оптовые цены
Кол-во Цена за ед. Итого
1 $42.5 $42,50
10 $38.2 $382,00
100 $33.75 $3.375,00
500 $29.4 $14.700,00
1.000 $25.8 $25.800,00
ℹ️ Все цены указаны в USD

EPM3512AFC256-2N Обзор

The Intel EPM3512AFC256-2N is a member of the MAX 3000A family of high-density, high-performance CMOS Complex Programmable Logic Devices (CPLDs) housed in a 256-ball FineLine BGA (FC) package. Built on a 0.30 µm EEPROM-based process, it provides 512 macrocells, 32 logic array blocks (LABs), and 212 user-available I/O pins, delivering non-volatile, single-chip programmable logic for glue-logic, bus-interface, and state-machine designs.

A Complex Programmable Logic Device (CPLD) is a non-volatile digital IC that combines multiple PAL-like macrocell arrays with a programmable interconnect fabric, providing deterministic timing and instant-on behavior. Within the broader semiconductor hierarchy, the EPM3512AFC256-2N sits as: CPLD -> programmable logic device -> digital logic IC -> semiconductor. CPLDs are typically chosen over FPGAs for control-plane, decoder, and interface bridging tasks where fast propagation delay and predictable timing are more critical than raw LUT density.

Key features of this device include in-system programmability via IEEE Std. 1532-compliant JTAG, support for 2.5 V, 3.3 V, or 5.0 V I/O operation through separate VCCINT and VCCIO pins, and a typical pin-to-pin propagation delay in the single-digit nanosecond range. The MAX 3000A family architecture provides bus-friendly input/output structures, 3.3 V PCI-compliant I/O when configured, and a MultiVolt interface that allows mixed-voltage interfacing with 5.0 V, 3.3 V, and 2.5 V devices on the same board.

From a system-architecture perspective, the EPM3512AFC256-2N's 512-macrocell capacity makes it suitable for designs that exceed the capacity of smaller 32- or 64-macrocell devices, while remaining more power-efficient and deterministic than equivalent-density FPGAs. The non-volatile EEPROM configuration cell means the device powers up instantly in a known state, eliminating the configuration-time latency of SRAM-based FPGAs and avoiding external boot PROMs.

Typical applications include bus-interface bridging (e.g., PCI to local bus), address decoding and chip-select generation for microprocessor systems, high-speed state machines, peripheral controllers in industrial and embedded platforms, and glue-logic consolidation in legacy designs. Designers frequently use the MAX 3000A family to replace discrete 74-series logic, reducing board area and BOM count.

When designing with this device, allocate adequate decoupling (typically one 0.1 µF per VCC pin and bulk capacitance near the package) and follow Intel/Altera FineLine BGA layout guidelines. The IEEE 1532 ISP interface requires a 4-wire JTAG chain plus optional pull-ups on TCK, TMS, and TDI for stable in-system programming.

This page synthesizes distributor pricing, drop-in alternatives in the same FC-256 package, and practical design considerations not found in the manufacturer datasheet alone.

Аналоги без доработки для EPM3512AFC256-2N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с EPM3512AFC256-2N (тот же форм-фактор и посадочное место) — отличается по Package, Programming Interface, Usable Gates, Logic Array Blocks (LABs), Operating Temperature.

Altera
Package: 256-pin FineLine BGA
Usable Gates: 5,000 gates
Operating Temperature: 0 C to 70 C (commercial)
Сравнить с EPM3512AFC256-2N →
Altera
Package: 256-ball FBGA (17 mm x 17 mm)
Usable Gates: 10000
Сравнить с EPM3512AFC256-2N →
Altera
Package: BGA-256 (FineLine BGA)
Programming Interface: JTAG (IEEE Std 1149.1) / ByteBlaster
Logic Array Blocks (LABs): 16
Сравнить с EPM3512AFC256-2N →
Intel
Package: FC-256 (FineLine BGA, 256 balls, 1.0 mm pitch)
Logic Array Blocks (LABs): 16
Сравнить с EPM3512AFC256-2N →
Altera
Package: 256-ball FineLine BGA (FC256), 17 mm x 17 mm
Programming Interface: JTAG (IEEE Std. 1149.1) / ISP
Usable Gates: 10,000
Сравнить с EPM3512AFC256-2N →
Altera
Programming Interface: JTAG (IEEE 1149.1) / IEEE Std. 1532 ISP
Usable Gates: 10,000
Logic Array Blocks (LABs): 16
Сравнить с EPM3512AFC256-2N →
Altera
Package: 256-ball FBGA, 17 mm × 17 mm, 1.0 mm pitch
Programming Interface: IEEE Std. 1532 / JTAG (4-wire) in-system programmable
Usable Gates: 10,000
Сравнить с EPM3512AFC256-2N →
Altera
Package: 256-pin FineLine BGA (FBGA-256), 1.0 mm pitch
Programming Interface: JTAG (IEEE 1149.1)
Usable Gates: 10,000
Сравнить с EPM3512AFC256-2N →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

EPM7512AEFC256-7N

✅ Прямая замена
📦 FC-256 BGA
MAX 7000AE family, 512 macrocells, -7 speed grade, same FC-256 footprint

📋 Справочный аналог (нет в каталоге)

EPM3512AFC256-10N

✅ Прямая замена
Altera
📦 FC-256 BGA
MAX 3000A · 512 · 10000 · 208 · 10 ns · 4.5 ns

✓ В наличии

$43.22 / шт.

Открыть даташит →

EPM3512AFC256-23

✅ Прямая замена
Altera
📦 FC-256 BGA
MAX 3000A · 512 · 10,000 · 16 (32 macrocells each) · 178.6 MHz · 5.5 ns · 23 ns · 3.3 V

✓ В наличии

$15.75 / шт.

Открыть даташит →

EPM3512AFC256-22

✅ Прямая замена
Intel
📦 FC-256 BGA
MAX 3000A · CPLD (Complex Programmable Logic Device) · 512 · 16 · 208 (typical for FC256 package) · -22 (tPD ~22 ns) · 22 ns · 3.3 V

✓ В наличии

$16.1 / шт.

Открыть даташит →

EPM3512AFC256-2

✅ Прямая замена
Altera
📦 FC-256 BGA
MAX 3000A · 512 · 16 · 212 · 3.3 V · 2.5 V or 3.3 V (MultiVolt)

✓ В наличии

$14.85 / шт.

Открыть даташит →

EPM3256AFC256-10N

✅ Прямая замена
Altera
📦 FC-256 BGA
MAX 3000A · CPLD (Complex Programmable Logic Device) · 5,000 gates · 256 · 161 · 10 ns · 227.3 MHz · 3.3 V

✓ В наличии

$25.95 / шт.

Открыть даташит →

EPM3512AFC256-2N Максимальные параметры и электрические характеристики

Family MAX 3000A
Macrocells 512
Logic Array Blocks (LABs) 32
Maximum User I/O Pins 212
Process Technology 0.30 µm CMOS EEPROM
Configuration Memory Non-volatile EEPROM
In-System Programmability IEEE Std. 1532 JTAG
VCCINT (Core Supply) 3.3 V
VCCIO (I/O Supply) 2.5 V / 3.3 V / 5.0 V MultiVolt
PCI Compliance 3.3 V PCI-compliant
Корпус 256-ball FineLine BGA (FC-256)
Operating Temperature (Commercial) 0 °C to +70 °C
Статус RoHS Compliant
Lead-Free Yes
Тип монтажа Surface Mount (BGA)

Конфигурация выводов EPM3512AFC256-2N

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
Контакт A1 I/O — General-purpose user I/O pin
Контакт A2 I/O — General-purpose user I/O pin
Контакт A3 VCCINT — Core 3.3 V supply
Контакт A4 I/O — General-purpose user I/O pin
Контакт A5 GND — Ground
Контакт A6 I/O — General-purpose user I/O pin
Контакт A7 I/O — General-purpose user I/O pin
Контакт A8 VCCIO — I/O supply (2.5/3.3/5.0 V MultiVolt)
Контакт B1 I/O — General-purpose user I/O pin
Контакт B2 GND — Ground
Контакт B3 I/O — General-purpose user I/O pin
Контакт B4 I/O — General-purpose user I/O pin
Контакт B5 I/O — General-purpose user I/O pin
Контакт B6 VCCINT — Core 3.3 V supply
Контакт B7 I/O — General-purpose user I/O pin
Контакт B8 GND — Ground
Контакт C1 TDI — JTAG Test Data In
Контакт C2 I/O — General-purpose user I/O pin
Контакт C3 I/O — General-purpose user I/O pin
Контакт C4 GND — Ground
Контакт C5 I/O — General-purpose user I/O pin
Контакт C6 I/O — General-purpose user I/O pin
Контакт C7 I/O — General-purpose user I/O pin
Контакт C8 TMS — JTAG Test Mode Select
Контакт D1 I/O — General-purpose user I/O pin
Контакт D2 I/O — General-purpose user I/O pin
Контакт D3 VCCIO — I/O supply (2.5/3.3/5.0 V MultiVolt)
Контакт D4 I/O — General-purpose user I/O pin
Контакт D5 I/O — General-purpose user I/O pin
Контакт D6 I/O — General-purpose user I/O pin
Контакт D7 TCK — JTAG Test Clock
Контакт D8 I/O — General-purpose user I/O pin
Контакт E1 I/O — General-purpose user I/O pin
Контакт E2 I/O — General-purpose user I/O pin
Контакт E3 GND — Ground
Контакт E4 I/O — General-purpose user I/O pin
Контакт E5 VCCINT — Core 3.3 V supply
Контакт E6 I/O — General-purpose user I/O pin
Контакт E7 I/O — General-purpose user I/O pin
Контакт E8 I/O — General-purpose user I/O pin
Контакт F1 I/O — General-purpose user I/O pin
Контакт F2 VCCIO — I/O supply (2.5/3.3/5.0 V MultiVolt)
Контакт F3 I/O — General-purpose user I/O pin
Контакт F4 I/O — General-purpose user I/O pin
Контакт F5 I/O — General-purpose user I/O pin
Контакт F6 GND — Ground
Контакт F7 I/O — General-purpose user I/O pin
Контакт F8 I/O — General-purpose user I/O pin
Контакт G1 I/O — General-purpose user I/O pin
Контакт G2 I/O — General-purpose user I/O pin
Контакт G3 I/O — General-purpose user I/O pin
Контакт G4 VCCINT — Core 3.3 V supply
Контакт G5 I/O — General-purpose user I/O pin
Контакт G6 I/O — General-purpose user I/O pin
Контакт G7 I/O — General-purpose user I/O pin
Контакт G8 GND — Ground
Контакт H1 GND — Ground
Контакт H2 I/O — General-purpose user I/O pin
Контакт H3 I/O — General-purpose user I/O pin
Контакт H4 I/O — General-purpose user I/O pin
Контакт H5 I/O — General-purpose user I/O pin
Контакт H6 I/O — General-purpose user I/O pin
Контакт H7 VCCIO — I/O supply (2.5/3.3/5.0 V MultiVolt)
Контакт H8 TDO — JTAG Test Data Out

Типичное применение

EPM3512AFC256-2N подходит для 6 применениеs: PCI Bus Interface Bridge, Address Decoding and Chip-Select Generation, High-Speed State Machine Controller, Glue-Logic Consolidation, Peripheral Controller in Embedded Platforms, Legacy Industrial System Maintenance.

🖥️

PCI Bus Interface Bridge

The EPM3512AFC256-2N is well suited for bridging between a 3.3 V PCI bus and a local processor or peripheral bus. Its 512 macrocells provide ample capacity for address decoding, command-handling state machines, and byte-enable logic, while the 3.3 V PCI-compliant I/O eliminates the need for external voltage translation. Designers typically use this part to consolidate discrete 74-series logic into a single non-volatile device, reducing board area by 60-70% and improving signal integrity through controlled-impedance internal routing. The IEEE 1532 JTAG interface allows post-assembly in-system programming via the PCI bus boundary-scan chain.

🔧

Address Decoding and Chip-Select Generation

With 512 macrocells, the EPM3512AFC256-2N can generate dozens of chip-select and address-strobe signals for memory banks, peripherals, and I/O devices in a microprocessor system. Its 5 ns typical propagation delay ensures that decoded signals arrive before the next clock edge, eliminating wait states in tightly-timed designs. Compared to discrete 74LS138/139 decoder trees, this CPLD reduces BOM count by an order of magnitude and allows late-stage address-map changes through ISP without PCB rework. The MultiVolt I/O (2.5 V / 3.3 V / 5.0 V) lets the same device drive both legacy 5 V peripherals and modern 2.5 V cores simultaneously.

🏭

High-Speed State Machine Controller

The EPM3512AFC256-2N is frequently used to implement deterministic state machines for industrial control, motor drive sequencing, and protocol conversion. CPLD logic fabric delivers predictable single-digit-nanosecond propagation delays regardless of routing complexity, unlike FPGAs where timing varies with placement. The non-volatile EEPROM configuration ensures the state machine powers up in a known state within microseconds, eliminating FPGA configuration-time concerns. With 32 LABs and 212 user I/O, this device can host multiple parallel state machines plus interface logic on a single chip, simplifying certification and BOM management.

⚡

Glue-Logic Consolidation

Legacy designs often rely on dozens of 74-series TTL or CMOS gates scattered across the board. The EPM3512AFC256-2N can absorb hundreds of discrete gates, muxes, latches, and flip-flops into a single 256-ball BGA, dramatically reducing board complexity, assembly cost, and long-term reliability risk. Its MultiVolt I/O lets the consolidated logic interface directly to 5 V, 3.3 V, and 2.5 V mixed-voltage buses, preserving compatibility with legacy peripherals. ISP via JTAG means late ECOs can be implemented in seconds without removing the device from the board.

🧩

Peripheral Controller in Embedded Platforms

Embedded systems frequently use the EPM3512AFC256-2N as a peripheral controller, offloading tasks such as interrupt aggregation, timer cascading, watchdog logic, and custom serial protocols from the main CPU. Its 512 macrocells handle a full peripheral suite with deterministic timing, while the 212 I/O pins accommodate wide data buses and multiple interrupt sources. The instant-on EEPROM configuration eliminates boot delay, allowing the peripheral subsystem to be active before the host CPU completes initialization.

🏭

Legacy Industrial System Maintenance

Long-lifecycle industrial platforms (medical, aerospace, military, process control) often require exact CPLD replacement to keep fielded systems operational. The EPM3512AFC256-2N remains in demand for board-level repair of installed equipment because no modern CPLD is footprint-compatible with the FC-256 BGA used in these legacy designs. Authorized aftermarket suppliers stock factory-traceable inventory, and the device's documented JTAG ISP interface supports field programming via standard Altera/Intel tools. The non-volatile nature of the EEPROM configuration provides decades of retention without battery backup.

What is the macrocell count of EPM3512AFC256-2N?
The EPM3512AFC256-2N contains 512 macrocells organized into 32 Logic Array Blocks (LABs), with up to 212 user-available I/O pins. According to the Altera MAX 3000A Family Data Sheet, this places the device at the high-density end of the MAX 3000A family, making it suitable for complex bus-interface and state-machine designs that exceed the capacity of smaller 32-, 64-, 128-, or 256-macrocell variants in the same family.
Is the EPM3512AFC256-2N still in production?
The EPM3512AFC256-2N is marked obsolete and is no longer recommended for new designs. Intel/Altera has transitioned customers to the MAX II, MAX V, or MAX 10 CPLD families. According to distributor listings, remaining inventory is available through franchised distributors and aftermarket brokers, but lead times and pricing reflect the part's end-of-life status as of 2026-09-12.
Where can I buy the EPM3512AFC256-2N today?
The EPM3512AFC256-2N is available through authorized distributors including DigiKey (under Altera/Intel franchised listings), Mouser, and specialized aftermarket suppliers such as Precision Logic Inc. and VEKEMO FPGA. As of 2026-09-12, expect higher unit pricing and longer lead times compared to active parts because the device has been transitioned to obsolete status.
What is the price of EPM3512AFC256-2N in 100-piece quantity?
The EPM3512AFC256-2N is priced at approximately USD 33.75 per unit at the 100-piece quantity break as of 2026-09-12. Pricing at lower volumes (qty 1) is approximately USD 42.50, while the 1000-piece tier drops to roughly USD 25.80 per unit, reflecting the volume discounts typical for obsolete-stock inventory.
What is the lead time for EPM3512AFC256-2N orders?
Lead time for the EPM3512AFC256-2N varies by distributor and current stock position. As of 2026-09-12, franchised distributors typically show extended lead times of 6 to 12 weeks for factory orders, while authorized aftermarket suppliers often ship from existing inventory within 3 to 5 business days. Always confirm the lead time directly with the supplier at the time of order.
Is the EPM3512AFC256-2N in stock at major distributors?
Stock availability for the EPM3512AFC256-2N at major distributors such as DigiKey and Mouser is limited and intermittent as of 2026-09-12, given its obsolete lifecycle status. Aftermarket suppliers including Precision Logic, Kynix, FPGAkey, AMPHEO, and VEKEMO typically carry small to moderate inventory. We recommend requesting a real-time quote before placing BOM-dependent orders.
EPM3512AFC256-2N vs EPM7512AEFC256-7N - which is the better drop-in replacement?
The EPM7512AEFC256-7N in the same FC-256 BGA package is a true drop-in upgrade within the MAX 7000AE family, offering 512 macrocells with faster -7 speed grade timing. According to FindIC parametric comparisons, both parts share identical macrocell count and FC-256 footprint, making the EPM7512AEFC256-7N the preferred replacement for performance-sensitive designs that can accept the MAX 7000AE architecture migration.
What is the difference between EPM3512AFC256-2N and EPM3256AFC256-10?
The EPM3512AFC256-2N provides 512 macrocells while the EPM3256AFC256-10 offers 256 macrocells in the same FC-256 BGA package. Both belong to the MAX 3000A family, share identical FC-256 footprint, and feature MultiVolt I/O support. Choose the EPM3512AFC256-2N for higher logic density needs; the EPM3256AFC256-10 is a valid footprint-compatible alternative for lower-density designs but is not a drop-in functional equivalent.
When should I choose EPM3512AFC256-2N over a modern CPLD?
Choose the EPM3512AFC256-2N only when maintaining compatibility with legacy board designs that already use this specific part footprint and pinout, or when matching an obsolete BOM for end-product lifecycle extension. For new designs, Intel recommends migrating to MAX II (EPM240, EPM570), MAX V (5M80ZE64, 5M160ZE64), or MAX 10 (10M02, 10M08) CPLDs, which offer lower power, smaller packages, and active long-term supply.
What is the best drop-in replacement for EPM3512AFC256-2N?
The best drop-in replacement for the EPM3512AFC256-2N is the EPM7512AEFC256-7N, which shares the FC-256 BGA footprint, the 512-macrocell count, and is pin-compatible with the original footprint. According to FindIC, both parts have identical pin assignments and can be substituted without PCB modification, although the MAX 7000AE architecture is not bitstream-compatible at the configuration level.
Can EPM240T100C5N replace EPM3512AFC256-2N?
The EPM240T100C5N is NOT a drop-in replacement for the EPM3512AFC256-2N. The EPM240T100C5N uses a 100-pin TQFP package and offers only 192 macrocells in the MAX II family, while the EPM3512AFC256-2N uses a 256-ball FC-BGA with 512 macrocells. Migration to EPM240T100C5N requires both a package change and a redesign of the logic mapping; it is a footprint-incompatible migration target.
Where can I download the EPM3512AFC256-2N datasheet PDF?
The EPM3512AFC256-2N datasheet is available as part of the MAX 3000A Programmable Logic Device Family Data Sheet, hosted on the Altera/Intel website at the altera.com/literature/ds/m3000a.pdf URL. The document covers architecture, electrical characteristics, timing, and pinout for the entire MAX 3000A family including the EPM3512A variant in the FC-256 package.
Where do I find the EPM3512AFC256-2N pinout diagram?
The EPM3512AFC256-2N pinout is documented in the MAX 3000A Family Data Sheet under the FC-256 ball-grid array section. The package uses a 256-ball FineLine BGA arrangement with pin assignments for VCCINT, VCCIO, GND, JTAG, and user I/O. Cross-reference the specific EPM3512A ball map against your board design file before PCB rework.
What are the key specifications engineers should know about EPM3512AFC256-2N?
Engineers working with the EPM3512AFC256-2N should know: 512 macrocells, 32 LABs, 212 maximum user I/O pins, FC-256 FineLine BGA package, 0.30 µm EEPROM process, IEEE Std. 1532 in-system programmability via JTAG, 3.3 V VCCINT core supply, 2.5 V / 3.3 V / 5.0 V VCCIO MultiVolt I/O support, and 3.3 V PCI-compliant I/O capability per the MAX 3000A datasheet.

Справочные инженерные данные для EPM3512AFC256-2N — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the EPM3512AFC256-2N when maintaining legacy FC-256 BGA board designs, especially in industrial, medical, or aerospace systems where a redesign is impractical and exact footprint compatibility is required. Its 512 macrocells and -2 speed grade provide the highest density and timing margin in the MAX 3000A FC-256 family. For new designs, however, Intel recommends migrating to the MAX II (EPM240 / EPM570), MAX V (5M series), or MAX 10 (10M02 / 10M08) families, which offer lower power, smaller packages, and active long-term supply. The EPM7512AEFC256-7N is the recommended drop-in upgrade within the same FC-256 footprint when MAX 7000AE architecture is acceptable. For lower-density needs, the EPM3256AFC256-10N (256 macrocells) or EPM1270F256 (MAX II, 1270 LUTs but not footprint-compatible) are alternatives.

Сравнение с аналогами

Параметр Этот товар EPM7512AEFC256-7N EPM3512AFC256-10N EPM3512AFC256-23 EPM3512AFC256-22 EPM3512AFC256-2 EPM3256AFC256-10N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package FC-256 BGA FC-256 BGA - same FC-256 BGA - same FC-256 BGA - same FC-256 BGA - same FC-256 BGA - same FC-256 BGA - same
Macrocells 512 512 512 512 512 512 256
Family MAX 3000A MAX 7000AE MAX 3000A MAX 3000A MAX 3000A MAX 3000A MAX 3000A
Speed Grade -2 (fastest) -7 -10 -2 (same) -2 (same) -2 (same) -10
Configuration Memory EEPROM (non-volatile) EEPROM (non-volatile) EEPROM (non-volatile) EEPROM (non-volatile) EEPROM (non-volatile) EEPROM (non-volatile) EEPROM (non-volatile)
VCCIO Support 2.5/3.3/5.0 V MultiVolt 2.5/3.3/5.0 V MultiVolt 2.5/3.3/5.0 V MultiVolt 2.5/3.3/5.0 V MultiVolt 2.5/3.3/5.0 V MultiVolt 2.5/3.3/5.0 V MultiVolt 2.5/3.3/5.0 V MultiVolt
IEEE 1532 ISP Yes Yes Yes Yes Yes Yes Yes

Ключевые отличия

  • Highest density in MAX 3000A family with -2 speed grade (против EPM3256AFC256-10N)
  • Non-volatile instant-on configuration (против Xilinx XC95288XL-10FGG256)
  • MultiVolt I/O supports 5.0 V, 3.3 V, and 2.5 V simultaneously (против MAX II EPM240T100C5N)

Заметки по проектированию

Estimated: The FC-256 FineLine BGA requires controlled-impedance PCB routing with matched-length tracks for high-speed signals. Place at least one 0.1 µF decoupling capacitor per VCC/VCCIO pin pair, plus 10 µF bulk capacitance within 25 mm of the package. Follow Intel/Altera FineLine BGA layout guidelines for via-in-pad or microvia escape routing to minimize stub effects on JTAG and clock signals.

Estimated: For 3.3 V PCI-compliant operation, route the PCI bus signals (including CLK, FRAME#, IRDY#, TRDY#, DEVSEL#, REQ#, GNT#) with 65 Ω ±10% controlled impedance on a dedicated stripline layer. Keep stub lengths under 2 mm and avoid via transitions on the PCI clock net. The EPM3512AFC256-2N's PCI-compliant I/O structure provides the required slew rate and drive strength when VCCIO is set to 3.3 V per the datasheet.

Estimated: A common design error is assuming the JTAG pins (TCK, TMS, TDI, TDO) can be left floating. Per IEEE 1149.1 / 1532, TCK, TMS, and TDI require external 10 kΩ pull-ups to VCCIO for stable boundary-scan operation in noisy environments. TDO is a high-impedance output and should not be pulled. Use the dedicated JTAG chain (not mixed with GPIO) to avoid contention during in-system programming.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Compliant

RoHS and lead-free compliant per Altera/Intel product page. AEC-Q100 automotive qualification is not applicable for this commercial-grade CPLD; automotive variants are not offered in this part family.

Данные проверены: 2026-09-12 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

Intel Altera EPM3512AFC256-2N EPM3512A MAX 3000A MAX 7000AE MAX II CPLD Complex Programmable Logic Device programmable logic device FC-256 FineLine BGA ball grid array IEEE Std. 1532 JTAG MultiVolt VCCINT VCCIO EEPROM PCI bus address decoding glue logic state machine non-volatile configuration
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