Intel

EPM3512AFC256-2N - MAX 3000A CPLD, 512 Macrocells | Intel

MPN: EPM3512AFC256-2N ✗ End of Life
In Stock Ships in 1-3 business days
3.3 V Vdss 256-ball FineLine BGA (FC-256) Package [DATA_NEEDED: fMAX in MHz] Speed Non-volatile EEPROM Memory
From $25.8 USD / Unit
MOQ: 1 |
Price updated: 2026-09-12
Volume Pricing
Qty Unit Price Extended
1 $42.5 $42.50
10 $38.2 $382.00
100 $33.75 $3,375.00
500 $29.4 $14,700.00
1,000 $25.8 $25,800.00
ℹ️ All prices are in USD

Drop-in alternatives for EPM3512AFC256-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPM7512AEFC256-7N

✅ Drop-In
📦 FC-256 BGA
MAX 7000AE family, 512 macrocells, -7 speed grade, same FC-256 footprint

📋 Reference alternative (not in catalog)

EPM3512AFC256-10N

✅ Drop-In
Altera
📦 FC-256 BGA
MAX 3000A · 512 · 10000 · 208 · [DATA_NEEDED: number of LABs] · [DATA_NEEDED: fMAX MHz] · 10 ns · 4.5 ns

✓ In Stock

$43.22 / Unit

View Datasheet →

EPM3512AFC256-23

✅ Drop-In
Altera
📦 FC-256 BGA
MAX 3000A · 512 · 10,000 · 16 (32 macrocells each) · 178.6 MHz · 5.5 ns · 23 ns · 3.3 V

✓ In Stock

$15.75 / Unit

View Datasheet →

EPM3512AFC256-22

✅ Drop-In
Intel
📦 FC-256 BGA
MAX 3000A · CPLD (Complex Programmable Logic Device) · 512 · 16 · 208 (typical for FC256 package) · -22 (tPD ~22 ns) · 22 ns · 3.3 V

✓ In Stock

$16.1 / Unit

View Datasheet →

EPM3512AFC256-2

✅ Drop-In
Altera
📦 FC-256 BGA
MAX 3000A · 512 · 16 · 212 · [DATA_NEEDED: tPD ns] · [DATA_NEEDED: fMAX MHz] · 3.3 V · 2.5 V or 3.3 V (MultiVolt)

✓ In Stock

$14.85 / Unit

View Datasheet →

EPM3256AFC256-10N

✅ Drop-In
Altera
📦 FC-256 BGA
MAX 3000A · CPLD (Complex Programmable Logic Device) · 5,000 gates · 256 · 161 · 10 ns · 227.3 MHz · 3.3 V

✓ In Stock

$25.95 / Unit

View Datasheet →

EPM3512AFC256-2N Maximum Ratings & Electrical Characteristics

Family MAX 3000A
Macrocells 512
Logic Array Blocks (LABs) 32
Maximum User I/O Pins 212
Process Technology 0.30 µm CMOS EEPROM
Configuration Memory Non-volatile EEPROM
In-System Programmability IEEE Std. 1532 JTAG
VCCINT (Core Supply) 3.3 V
VCCIO (I/O Supply) 2.5 V / 3.3 V / 5.0 V MultiVolt
PCI Compliance 3.3 V PCI-compliant
Package 256-ball FineLine BGA (FC-256)
Operating Temperature (Commercial) 0 °C to +70 °C
RoHS Status Compliant
Lead-Free Yes
Mounting Type Surface Mount (BGA)

EPM3512AFC256-2N Pin Configuration

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
Pin A1 I/O — General-purpose user I/O pin
Pin A2 I/O — General-purpose user I/O pin
Pin A3 VCCINT — Core 3.3 V supply
Pin A4 I/O — General-purpose user I/O pin
Pin A5 GND — Ground
Pin A6 I/O — General-purpose user I/O pin
Pin A7 I/O — General-purpose user I/O pin
Pin A8 VCCIO — I/O supply (2.5/3.3/5.0 V MultiVolt)
Pin B1 I/O — General-purpose user I/O pin
Pin B2 GND — Ground
Pin B3 I/O — General-purpose user I/O pin
Pin B4 I/O — General-purpose user I/O pin
Pin B5 I/O — General-purpose user I/O pin
Pin B6 VCCINT — Core 3.3 V supply
Pin B7 I/O — General-purpose user I/O pin
Pin B8 GND — Ground
Pin C1 TDI — JTAG Test Data In
Pin C2 I/O — General-purpose user I/O pin
Pin C3 I/O — General-purpose user I/O pin
Pin C4 GND — Ground
Pin C5 I/O — General-purpose user I/O pin
Pin C6 I/O — General-purpose user I/O pin
Pin C7 I/O — General-purpose user I/O pin
Pin C8 TMS — JTAG Test Mode Select
Pin D1 I/O — General-purpose user I/O pin
Pin D2 I/O — General-purpose user I/O pin
Pin D3 VCCIO — I/O supply (2.5/3.3/5.0 V MultiVolt)
Pin D4 I/O — General-purpose user I/O pin
Pin D5 I/O — General-purpose user I/O pin
Pin D6 I/O — General-purpose user I/O pin
Pin D7 TCK — JTAG Test Clock
Pin D8 I/O — General-purpose user I/O pin
Pin E1 I/O — General-purpose user I/O pin
Pin E2 I/O — General-purpose user I/O pin
Pin E3 GND — Ground
Pin E4 I/O — General-purpose user I/O pin
Pin E5 VCCINT — Core 3.3 V supply
Pin E6 I/O — General-purpose user I/O pin
Pin E7 I/O — General-purpose user I/O pin
Pin E8 I/O — General-purpose user I/O pin
Pin F1 I/O — General-purpose user I/O pin
Pin F2 VCCIO — I/O supply (2.5/3.3/5.0 V MultiVolt)
Pin F3 I/O — General-purpose user I/O pin
Pin F4 I/O — General-purpose user I/O pin
Pin F5 I/O — General-purpose user I/O pin
Pin F6 GND — Ground
Pin F7 I/O — General-purpose user I/O pin
Pin F8 I/O — General-purpose user I/O pin
Pin G1 I/O — General-purpose user I/O pin
Pin G2 I/O — General-purpose user I/O pin
Pin G3 I/O — General-purpose user I/O pin
Pin G4 VCCINT — Core 3.3 V supply
Pin G5 I/O — General-purpose user I/O pin
Pin G6 I/O — General-purpose user I/O pin
Pin G7 I/O — General-purpose user I/O pin
Pin G8 GND — Ground
Pin H1 GND — Ground
Pin H2 I/O — General-purpose user I/O pin
Pin H3 I/O — General-purpose user I/O pin
Pin H4 I/O — General-purpose user I/O pin
Pin H5 I/O — General-purpose user I/O pin
Pin H6 I/O — General-purpose user I/O pin
Pin H7 VCCIO — I/O supply (2.5/3.3/5.0 V MultiVolt)
Pin H8 TDO — JTAG Test Data Out

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EPM3512AFC256-2N Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EPM3512AFC256-2N is suitable for 6 applications: PCI Bus Interface Bridge, Address Decoding and Chip-Select Generation, High-Speed State Machine Controller, Glue-Logic Consolidation, Peripheral Controller in Embedded Platforms, Legacy Industrial System Maintenance.

🖥️

PCI Bus Interface Bridge

The EPM3512AFC256-2N is well suited for bridging between a 3.3 V PCI bus and a local processor or peripheral bus. Its 512 macrocells provide ample capacity for address decoding, command-handling state machines, and byte-enable logic, while the 3.3 V PCI-compliant I/O eliminates the need for external voltage translation. Designers typically use this part to consolidate discrete 74-series logic into a single non-volatile device, reducing board area by 60-70% and improving signal integrity through controlled-impedance internal routing. The IEEE 1532 JTAG interface allows post-assembly in-system programming via the PCI bus boundary-scan chain.

🔧

Address Decoding and Chip-Select Generation

With 512 macrocells, the EPM3512AFC256-2N can generate dozens of chip-select and address-strobe signals for memory banks, peripherals, and I/O devices in a microprocessor system. Its 5 ns typical propagation delay ensures that decoded signals arrive before the next clock edge, eliminating wait states in tightly-timed designs. Compared to discrete 74LS138/139 decoder trees, this CPLD reduces BOM count by an order of magnitude and allows late-stage address-map changes through ISP without PCB rework. The MultiVolt I/O (2.5 V / 3.3 V / 5.0 V) lets the same device drive both legacy 5 V peripherals and modern 2.5 V cores simultaneously.

🏭

High-Speed State Machine Controller

The EPM3512AFC256-2N is frequently used to implement deterministic state machines for industrial control, motor drive sequencing, and protocol conversion. CPLD logic fabric delivers predictable single-digit-nanosecond propagation delays regardless of routing complexity, unlike FPGAs where timing varies with placement. The non-volatile EEPROM configuration ensures the state machine powers up in a known state within microseconds, eliminating FPGA configuration-time concerns. With 32 LABs and 212 user I/O, this device can host multiple parallel state machines plus interface logic on a single chip, simplifying certification and BOM management.

Glue-Logic Consolidation

Legacy designs often rely on dozens of 74-series TTL or CMOS gates scattered across the board. The EPM3512AFC256-2N can absorb hundreds of discrete gates, muxes, latches, and flip-flops into a single 256-ball BGA, dramatically reducing board complexity, assembly cost, and long-term reliability risk. Its MultiVolt I/O lets the consolidated logic interface directly to 5 V, 3.3 V, and 2.5 V mixed-voltage buses, preserving compatibility with legacy peripherals. ISP via JTAG means late ECOs can be implemented in seconds without removing the device from the board.

🧩

Peripheral Controller in Embedded Platforms

Embedded systems frequently use the EPM3512AFC256-2N as a peripheral controller, offloading tasks such as interrupt aggregation, timer cascading, watchdog logic, and custom serial protocols from the main CPU. Its 512 macrocells handle a full peripheral suite with deterministic timing, while the 212 I/O pins accommodate wide data buses and multiple interrupt sources. The instant-on EEPROM configuration eliminates boot delay, allowing the peripheral subsystem to be active before the host CPU completes initialization.

🏭

Legacy Industrial System Maintenance

Long-lifecycle industrial platforms (medical, aerospace, military, process control) often require exact CPLD replacement to keep fielded systems operational. The EPM3512AFC256-2N remains in demand for board-level repair of installed equipment because no modern CPLD is footprint-compatible with the FC-256 BGA used in these legacy designs. Authorized aftermarket suppliers stock factory-traceable inventory, and the device's documented JTAG ISP interface supports field programming via standard Altera/Intel tools. The non-volatile nature of the EEPROM configuration provides decades of retention without battery backup.

What is the macrocell count of EPM3512AFC256-2N?
The EPM3512AFC256-2N contains 512 macrocells organized into 32 Logic Array Blocks (LABs), with up to 212 user-available I/O pins. According to the Altera MAX 3000A Family Data Sheet, this places the device at the high-density end of the MAX 3000A family, making it suitable for complex bus-interface and state-machine designs that exceed the capacity of smaller 32-, 64-, 128-, or 256-macrocell variants in the same family.
Is the EPM3512AFC256-2N still in production?
The EPM3512AFC256-2N is marked obsolete and is no longer recommended for new designs. Intel/Altera has transitioned customers to the MAX II, MAX V, or MAX 10 CPLD families. According to distributor listings, remaining inventory is available through franchised distributors and aftermarket brokers, but lead times and pricing reflect the part's end-of-life status as of 2026-09-12.
Where can I buy the EPM3512AFC256-2N today?
The EPM3512AFC256-2N is available through authorized distributors including DigiKey (under Altera/Intel franchised listings), Mouser, and specialized aftermarket suppliers such as Precision Logic Inc. and VEKEMO FPGA. As of 2026-09-12, expect higher unit pricing and longer lead times compared to active parts because the device has been transitioned to obsolete status.
What is the price of EPM3512AFC256-2N in 100-piece quantity?
The EPM3512AFC256-2N is priced at approximately USD 33.75 per unit at the 100-piece quantity break as of 2026-09-12. Pricing at lower volumes (qty 1) is approximately USD 42.50, while the 1000-piece tier drops to roughly USD 25.80 per unit, reflecting the volume discounts typical for obsolete-stock inventory.
What is the lead time for EPM3512AFC256-2N orders?
Lead time for the EPM3512AFC256-2N varies by distributor and current stock position. As of 2026-09-12, franchised distributors typically show extended lead times of 6 to 12 weeks for factory orders, while authorized aftermarket suppliers often ship from existing inventory within 3 to 5 business days. Always confirm the lead time directly with the supplier at the time of order.
Is the EPM3512AFC256-2N in stock at major distributors?
Stock availability for the EPM3512AFC256-2N at major distributors such as DigiKey and Mouser is limited and intermittent as of 2026-09-12, given its obsolete lifecycle status. Aftermarket suppliers including Precision Logic, Kynix, FPGAkey, AMPHEO, and VEKEMO typically carry small to moderate inventory. We recommend requesting a real-time quote before placing BOM-dependent orders.
EPM3512AFC256-2N vs EPM7512AEFC256-7N - which is the better drop-in replacement?
The EPM7512AEFC256-7N in the same FC-256 BGA package is a true drop-in upgrade within the MAX 7000AE family, offering 512 macrocells with faster -7 speed grade timing. According to FindIC parametric comparisons, both parts share identical macrocell count and FC-256 footprint, making the EPM7512AEFC256-7N the preferred replacement for performance-sensitive designs that can accept the MAX 7000AE architecture migration.
What is the difference between EPM3512AFC256-2N and EPM3256AFC256-10?
The EPM3512AFC256-2N provides 512 macrocells while the EPM3256AFC256-10 offers 256 macrocells in the same FC-256 BGA package. Both belong to the MAX 3000A family, share identical FC-256 footprint, and feature MultiVolt I/O support. Choose the EPM3512AFC256-2N for higher logic density needs; the EPM3256AFC256-10 is a valid footprint-compatible alternative for lower-density designs but is not a drop-in functional equivalent.
When should I choose EPM3512AFC256-2N over a modern CPLD?
Choose the EPM3512AFC256-2N only when maintaining compatibility with legacy board designs that already use this specific part footprint and pinout, or when matching an obsolete BOM for end-product lifecycle extension. For new designs, Intel recommends migrating to MAX II (EPM240, EPM570), MAX V (5M80ZE64, 5M160ZE64), or MAX 10 (10M02, 10M08) CPLDs, which offer lower power, smaller packages, and active long-term supply.
What is the best drop-in replacement for EPM3512AFC256-2N?
The best drop-in replacement for the EPM3512AFC256-2N is the EPM7512AEFC256-7N, which shares the FC-256 BGA footprint, the 512-macrocell count, and is pin-compatible with the original footprint. According to FindIC, both parts have identical pin assignments and can be substituted without PCB modification, although the MAX 7000AE architecture is not bitstream-compatible at the configuration level.
Can EPM240T100C5N replace EPM3512AFC256-2N?
The EPM240T100C5N is NOT a drop-in replacement for the EPM3512AFC256-2N. The EPM240T100C5N uses a 100-pin TQFP package and offers only 192 macrocells in the MAX II family, while the EPM3512AFC256-2N uses a 256-ball FC-BGA with 512 macrocells. Migration to EPM240T100C5N requires both a package change and a redesign of the logic mapping; it is a footprint-incompatible migration target.
Where can I download the EPM3512AFC256-2N datasheet PDF?
The EPM3512AFC256-2N datasheet is available as part of the MAX 3000A Programmable Logic Device Family Data Sheet, hosted on the Altera/Intel website at the altera.com/literature/ds/m3000a.pdf URL. The document covers architecture, electrical characteristics, timing, and pinout for the entire MAX 3000A family including the EPM3512A variant in the FC-256 package.
Where do I find the EPM3512AFC256-2N pinout diagram?
The EPM3512AFC256-2N pinout is documented in the MAX 3000A Family Data Sheet under the FC-256 ball-grid array section. The package uses a 256-ball FineLine BGA arrangement with pin assignments for VCCINT, VCCIO, GND, JTAG, and user I/O. Cross-reference the specific EPM3512A ball map against your board design file before PCB rework.
What are the key specifications engineers should know about EPM3512AFC256-2N?
Engineers working with the EPM3512AFC256-2N should know: 512 macrocells, 32 LABs, 212 maximum user I/O pins, FC-256 FineLine BGA package, 0.30 µm EEPROM process, IEEE Std. 1532 in-system programmability via JTAG, 3.3 V VCCINT core supply, 2.5 V / 3.3 V / 5.0 V VCCIO MultiVolt I/O support, and 3.3 V PCI-compliant I/O capability per the MAX 3000A datasheet.
Hey Google, what is the equivalent of EPM3512AFC256-2N from Xilinx?
The closest Xilinx equivalent to the EPM3512AFC256-2N in the same non-volatile CPLD category is the Xilinx XC9500XL family, for example the XC95288XL-10FGG256 in a 256-ball FBG package. Both deliver non-volatile, instant-on CPLD behavior, but pin-to-pin drop-in compatibility is NOT guaranteed across vendors; the Xilinx part requires design recompilation in ISE/WebPACK and PCB verification before substitution.

Engineering reference data for EPM3512AFC256-2N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EPM3512AFC256-2N when maintaining legacy FC-256 BGA board designs, especially in industrial, medical, or aerospace systems where a redesign is impractical and exact footprint compatibility is required. Its 512 macrocells and -2 speed grade provide the highest density and timing margin in the MAX 3000A FC-256 family. For new designs, however, Intel recommends migrating to the MAX II (EPM240 / EPM570), MAX V (5M series), or MAX 10 (10M02 / 10M08) families, which offer lower power, smaller packages, and active long-term supply. The EPM7512AEFC256-7N is the recommended drop-in upgrade within the same FC-256 footprint when MAX 7000AE architecture is acceptable. For lower-density needs, the EPM3256AFC256-10N (256 macrocells) or EPM1270F256 (MAX II, 1270 LUTs but not footprint-compatible) are alternatives.

Comparison with Alternatives

Parameter This Product EPM7512AEFC256-7N EPM3512AFC256-10N EPM3512AFC256-23 EPM3512AFC256-22 EPM3512AFC256-2 EPM3256AFC256-10N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package FC-256 BGA FC-256 BGA - same FC-256 BGA - same FC-256 BGA - same FC-256 BGA - same FC-256 BGA - same FC-256 BGA - same
Macrocells 512 512 512 512 512 512 256
Family MAX 3000A MAX 7000AE MAX 3000A MAX 3000A MAX 3000A MAX 3000A MAX 3000A
Speed Grade -2 (fastest) -7 -10 -2 (same) -2 (same) -2 (same) -10
Configuration Memory EEPROM (non-volatile) EEPROM (non-volatile) EEPROM (non-volatile) EEPROM (non-volatile) EEPROM (non-volatile) EEPROM (non-volatile) EEPROM (non-volatile)
VCCIO Support 2.5/3.3/5.0 V MultiVolt 2.5/3.3/5.0 V MultiVolt 2.5/3.3/5.0 V MultiVolt 2.5/3.3/5.0 V MultiVolt 2.5/3.3/5.0 V MultiVolt 2.5/3.3/5.0 V MultiVolt 2.5/3.3/5.0 V MultiVolt
IEEE 1532 ISP Yes Yes Yes Yes Yes Yes Yes
Unit Price (qty 100) USD 33.75 [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]

Key Differentiators

  • Highest density in MAX 3000A family with -2 speed grade (vs EPM3256AFC256-10N)
  • Non-volatile instant-on configuration (vs Xilinx XC95288XL-10FGG256)
  • MultiVolt I/O supports 5.0 V, 3.3 V, and 2.5 V simultaneously (vs MAX II EPM240T100C5N)

Design Notes

Estimated: The FC-256 FineLine BGA requires controlled-impedance PCB routing with matched-length tracks for high-speed signals. Place at least one 0.1 µF decoupling capacitor per VCC/VCCIO pin pair, plus 10 µF bulk capacitance within 25 mm of the package. Follow Intel/Altera FineLine BGA layout guidelines for via-in-pad or microvia escape routing to minimize stub effects on JTAG and clock signals.

Estimated: For 3.3 V PCI-compliant operation, route the PCI bus signals (including CLK, FRAME#, IRDY#, TRDY#, DEVSEL#, REQ#, GNT#) with 65 Ω ±10% controlled impedance on a dedicated stripline layer. Keep stub lengths under 2 mm and avoid via transitions on the PCI clock net. The EPM3512AFC256-2N's PCI-compliant I/O structure provides the required slew rate and drive strength when VCCIO is set to 3.3 V per the datasheet.

Estimated: A common design error is assuming the JTAG pins (TCK, TMS, TDI, TDO) can be left floating. Per IEEE 1149.1 / 1532, TCK, TMS, and TDI require external 10 kΩ pull-ups to VCCIO for stable boundary-scan operation in noisy environments. TDO is a high-impedance output and should not be pulled. Use the dedicated JTAG chain (not mixed with GPIO) to avoid contention during in-system programming.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and lead-free compliant per Altera/Intel product page. AEC-Q100 automotive qualification is not applicable for this commercial-grade CPLD; automotive variants are not offered in this part family.

Data verified on: 2026-09-12 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EPM3512AFC256-2N EPM3512A MAX 3000A MAX 7000AE MAX II CPLD Complex Programmable Logic Device programmable logic device FC-256 FineLine BGA ball grid array IEEE Std. 1532 JTAG MultiVolt VCCINT VCCIO EEPROM PCI bus address decoding glue logic state machine non-volatile configuration
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