EPM3512AFC256-2N - MAX 3000A CPLD, 512 Macrocells | Intel
Référence : EPM3512AFC256-2N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.2 | $382,00 |
| 100 | $33.75 | $3 375,00 |
| 500 | $29.4 | $14 700,00 |
| 1 000 | $25.8 | $25 800,00 |
EPM3512AFC256-2N Présentation
A Complex Programmable Logic Device (CPLD) is a non-volatile digital IC that combines multiple PAL-like macrocell arrays with a programmable interconnect fabric, providing deterministic timing and instant-on behavior. Within the broader semiconductor hierarchy, the EPM3512AFC256-2N sits as: CPLD -> programmable logic device -> digital logic IC -> semiconductor. CPLDs are typically chosen over FPGAs for control-plane, decoder, and interface bridging tasks where fast propagation delay and predictable timing are more critical than raw LUT density.
Key features of this device include in-system programmability via IEEE Std. 1532-compliant JTAG, support for 2.5 V, 3.3 V, or 5.0 V I/O operation through separate VCCINT and VCCIO pins, and a typical pin-to-pin propagation delay in the single-digit nanosecond range. The MAX 3000A family architecture provides bus-friendly input/output structures, 3.3 V PCI-compliant I/O when configured, and a MultiVolt interface that allows mixed-voltage interfacing with 5.0 V, 3.3 V, and 2.5 V devices on the same board.
From a system-architecture perspective, the EPM3512AFC256-2N's 512-macrocell capacity makes it suitable for designs that exceed the capacity of smaller 32- or 64-macrocell devices, while remaining more power-efficient and deterministic than equivalent-density FPGAs. The non-volatile EEPROM configuration cell means the device powers up instantly in a known state, eliminating the configuration-time latency of SRAM-based FPGAs and avoiding external boot PROMs.
Typical applications include bus-interface bridging (e.g., PCI to local bus), address decoding and chip-select generation for microprocessor systems, high-speed state machines, peripheral controllers in industrial and embedded platforms, and glue-logic consolidation in legacy designs. Designers frequently use the MAX 3000A family to replace discrete 74-series logic, reducing board area and BOM count.
When designing with this device, allocate adequate decoupling (typically one 0.1 µF per VCC pin and bulk capacitance near the package) and follow Intel/Altera FineLine BGA layout guidelines. The IEEE 1532 ISP interface requires a 4-wire JTAG chain plus optional pull-ups on TCK, TMS, and TDI for stable in-system programming.
This page synthesizes distributor pricing, drop-in alternatives in the same FC-256 package, and practical design considerations not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EPM3512AFC256-2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM3512AFC256-2N (même facteur de forme et même empreinte) — différant par Package, Programming Interface, Usable Gates, Logic Array Blocks (LABs), Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM7512AEFC256-7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM3512AFC256-10N
✅ Remplacement direct✓ En stock
$43.22 / unité
Voir la fiche technique →EPM3512AFC256-23
✅ Remplacement direct✓ En stock
$15.75 / unité
Voir la fiche technique →EPM3512AFC256-22
✅ Remplacement direct✓ En stock
$16.1 / unité
Voir la fiche technique →EPM3512AFC256-2
✅ Remplacement direct✓ En stock
$14.85 / unité
Voir la fiche technique →EPM3256AFC256-10N
✅ Remplacement direct✓ En stock
$25.95 / unité
Voir la fiche technique →EPM3512AFC256-2N Valeurs maximales et caractéristiques électriques
| Family | MAX 3000A |
| Macrocells | 512 |
| Logic Array Blocks (LABs) | 32 |
| Maximum User I/O Pins | 212 |
| Process Technology | 0.30 µm CMOS EEPROM |
| Configuration Memory | Non-volatile EEPROM |
| In-System Programmability | IEEE Std. 1532 JTAG |
| VCCINT (Core Supply) | 3.3 V |
| VCCIO (I/O Supply) | 2.5 V / 3.3 V / 5.0 V MultiVolt |
| PCI Compliance | 3.3 V PCI-compliant |
| Boîtier | 256-ball FineLine BGA (FC-256) |
| Operating Temperature (Commercial) | 0 °C to +70 °C |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| Type de montage | Surface Mount (BGA) |
Configuration des broches de EPM3512AFC256-2N
| Broche A1 | I/O — General-purpose user I/O pin |
| Broche A2 | I/O — General-purpose user I/O pin |
| Broche A3 | VCCINT — Core 3.3 V supply |
| Broche A4 | I/O — General-purpose user I/O pin |
| Broche A5 | GND — Ground |
| Broche A6 | I/O — General-purpose user I/O pin |
| Broche A7 | I/O — General-purpose user I/O pin |
| Broche A8 | VCCIO — I/O supply (2.5/3.3/5.0 V MultiVolt) |
| Broche B1 | I/O — General-purpose user I/O pin |
| Broche B2 | GND — Ground |
| Broche B3 | I/O — General-purpose user I/O pin |
| Broche B4 | I/O — General-purpose user I/O pin |
| Broche B5 | I/O — General-purpose user I/O pin |
| Broche B6 | VCCINT — Core 3.3 V supply |
| Broche B7 | I/O — General-purpose user I/O pin |
| Broche B8 | GND — Ground |
| Broche C1 | TDI — JTAG Test Data In |
| Broche C2 | I/O — General-purpose user I/O pin |
| Broche C3 | I/O — General-purpose user I/O pin |
| Broche C4 | GND — Ground |
| Broche C5 | I/O — General-purpose user I/O pin |
| Broche C6 | I/O — General-purpose user I/O pin |
| Broche C7 | I/O — General-purpose user I/O pin |
| Broche C8 | TMS — JTAG Test Mode Select |
| Broche D1 | I/O — General-purpose user I/O pin |
| Broche D2 | I/O — General-purpose user I/O pin |
| Broche D3 | VCCIO — I/O supply (2.5/3.3/5.0 V MultiVolt) |
| Broche D4 | I/O — General-purpose user I/O pin |
| Broche D5 | I/O — General-purpose user I/O pin |
| Broche D6 | I/O — General-purpose user I/O pin |
| Broche D7 | TCK — JTAG Test Clock |
| Broche D8 | I/O — General-purpose user I/O pin |
| Broche E1 | I/O — General-purpose user I/O pin |
| Broche E2 | I/O — General-purpose user I/O pin |
| Broche E3 | GND — Ground |
| Broche E4 | I/O — General-purpose user I/O pin |
| Broche E5 | VCCINT — Core 3.3 V supply |
| Broche E6 | I/O — General-purpose user I/O pin |
| Broche E7 | I/O — General-purpose user I/O pin |
| Broche E8 | I/O — General-purpose user I/O pin |
| Broche F1 | I/O — General-purpose user I/O pin |
| Broche F2 | VCCIO — I/O supply (2.5/3.3/5.0 V MultiVolt) |
| Broche F3 | I/O — General-purpose user I/O pin |
| Broche F4 | I/O — General-purpose user I/O pin |
| Broche F5 | I/O — General-purpose user I/O pin |
| Broche F6 | GND — Ground |
| Broche F7 | I/O — General-purpose user I/O pin |
| Broche F8 | I/O — General-purpose user I/O pin |
| Broche G1 | I/O — General-purpose user I/O pin |
| Broche G2 | I/O — General-purpose user I/O pin |
| Broche G3 | I/O — General-purpose user I/O pin |
| Broche G4 | VCCINT — Core 3.3 V supply |
| Broche G5 | I/O — General-purpose user I/O pin |
| Broche G6 | I/O — General-purpose user I/O pin |
| Broche G7 | I/O — General-purpose user I/O pin |
| Broche G8 | GND — Ground |
| Broche H1 | GND — Ground |
| Broche H2 | I/O — General-purpose user I/O pin |
| Broche H3 | I/O — General-purpose user I/O pin |
| Broche H4 | I/O — General-purpose user I/O pin |
| Broche H5 | I/O — General-purpose user I/O pin |
| Broche H6 | I/O — General-purpose user I/O pin |
| Broche H7 | VCCIO — I/O supply (2.5/3.3/5.0 V MultiVolt) |
| Broche H8 | TDO — JTAG Test Data Out |
Applications typiques
EPM3512AFC256-2N convient pour 6 applications: PCI Bus Interface Bridge, Address Decoding and Chip-Select Generation, High-Speed State Machine Controller, Glue-Logic Consolidation, Peripheral Controller in Embedded Platforms, Legacy Industrial System Maintenance.
PCI Bus Interface Bridge
The EPM3512AFC256-2N is well suited for bridging between a 3.3 V PCI bus and a local processor or peripheral bus. Its 512 macrocells provide ample capacity for address decoding, command-handling state machines, and byte-enable logic, while the 3.3 V PCI-compliant I/O eliminates the need for external voltage translation. Designers typically use this part to consolidate discrete 74-series logic into a single non-volatile device, reducing board area by 60-70% and improving signal integrity through controlled-impedance internal routing. The IEEE 1532 JTAG interface allows post-assembly in-system programming via the PCI bus boundary-scan chain.
Recommandé
Address Decoding and Chip-Select Generation
With 512 macrocells, the EPM3512AFC256-2N can generate dozens of chip-select and address-strobe signals for memory banks, peripherals, and I/O devices in a microprocessor system. Its 5 ns typical propagation delay ensures that decoded signals arrive before the next clock edge, eliminating wait states in tightly-timed designs. Compared to discrete 74LS138/139 decoder trees, this CPLD reduces BOM count by an order of magnitude and allows late-stage address-map changes through ISP without PCB rework. The MultiVolt I/O (2.5 V / 3.3 V / 5.0 V) lets the same device drive both legacy 5 V peripherals and modern 2.5 V cores simultaneously.
Recommandé
High-Speed State Machine Controller
The EPM3512AFC256-2N is frequently used to implement deterministic state machines for industrial control, motor drive sequencing, and protocol conversion. CPLD logic fabric delivers predictable single-digit-nanosecond propagation delays regardless of routing complexity, unlike FPGAs where timing varies with placement. The non-volatile EEPROM configuration ensures the state machine powers up in a known state within microseconds, eliminating FPGA configuration-time concerns. With 32 LABs and 212 user I/O, this device can host multiple parallel state machines plus interface logic on a single chip, simplifying certification and BOM management.
Recommandé
Glue-Logic Consolidation
Legacy designs often rely on dozens of 74-series TTL or CMOS gates scattered across the board. The EPM3512AFC256-2N can absorb hundreds of discrete gates, muxes, latches, and flip-flops into a single 256-ball BGA, dramatically reducing board complexity, assembly cost, and long-term reliability risk. Its MultiVolt I/O lets the consolidated logic interface directly to 5 V, 3.3 V, and 2.5 V mixed-voltage buses, preserving compatibility with legacy peripherals. ISP via JTAG means late ECOs can be implemented in seconds without removing the device from the board.
Recommandé
Peripheral Controller in Embedded Platforms
Embedded systems frequently use the EPM3512AFC256-2N as a peripheral controller, offloading tasks such as interrupt aggregation, timer cascading, watchdog logic, and custom serial protocols from the main CPU. Its 512 macrocells handle a full peripheral suite with deterministic timing, while the 212 I/O pins accommodate wide data buses and multiple interrupt sources. The instant-on EEPROM configuration eliminates boot delay, allowing the peripheral subsystem to be active before the host CPU completes initialization.
Recommandé
Legacy Industrial System Maintenance
Long-lifecycle industrial platforms (medical, aerospace, military, process control) often require exact CPLD replacement to keep fielded systems operational. The EPM3512AFC256-2N remains in demand for board-level repair of installed equipment because no modern CPLD is footprint-compatible with the FC-256 BGA used in these legacy designs. Authorized aftermarket suppliers stock factory-traceable inventory, and the device's documented JTAG ISP interface supports field programming via standard Altera/Intel tools. The non-volatile nature of the EEPROM configuration provides decades of retention without battery backup.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM3512AFC256-2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM7512AEFC256-7N | EPM3512AFC256-10N | EPM3512AFC256-23 | EPM3512AFC256-22 | EPM3512AFC256-2 | EPM3256AFC256-10N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FC-256 BGA | FC-256 BGA - same | FC-256 BGA - same | FC-256 BGA - same | FC-256 BGA - same | FC-256 BGA - same | FC-256 BGA - same |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 512 | 256 |
| Family | MAX 3000A | MAX 7000AE | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A |
| Speed Grade | -2 (fastest) | -7 | -10 | -2 (same) | -2 (same) | -2 (same) | -10 |
| Configuration Memory | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) |
| VCCIO Support | 2.5/3.3/5.0 V MultiVolt | 2.5/3.3/5.0 V MultiVolt | 2.5/3.3/5.0 V MultiVolt | 2.5/3.3/5.0 V MultiVolt | 2.5/3.3/5.0 V MultiVolt | 2.5/3.3/5.0 V MultiVolt | 2.5/3.3/5.0 V MultiVolt |
| IEEE 1532 ISP | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Highest density in MAX 3000A family with -2 speed grade (vs EPM3256AFC256-10N)
- Non-volatile instant-on configuration (vs Xilinx XC95288XL-10FGG256)
- MultiVolt I/O supports 5.0 V, 3.3 V, and 2.5 V simultaneously (vs MAX II EPM240T100C5N)
Notes de conception
Estimated: The FC-256 FineLine BGA requires controlled-impedance PCB routing with matched-length tracks for high-speed signals. Place at least one 0.1 µF decoupling capacitor per VCC/VCCIO pin pair, plus 10 µF bulk capacitance within 25 mm of the package. Follow Intel/Altera FineLine BGA layout guidelines for via-in-pad or microvia escape routing to minimize stub effects on JTAG and clock signals.
Estimated: For 3.3 V PCI-compliant operation, route the PCI bus signals (including CLK, FRAME#, IRDY#, TRDY#, DEVSEL#, REQ#, GNT#) with 65 Ω ±10% controlled impedance on a dedicated stripline layer. Keep stub lengths under 2 mm and avoid via transitions on the PCI clock net. The EPM3512AFC256-2N's PCI-compliant I/O structure provides the required slew rate and drive strength when VCCIO is set to 3.3 V per the datasheet.
Estimated: A common design error is assuming the JTAG pins (TCK, TMS, TDI, TDO) can be left floating. Per IEEE 1149.1 / 1532, TCK, TMS, and TDI require external 10 kΩ pull-ups to VCCIO for stable boundary-scan operation in noisy environments. TDO is a high-impedance output and should not be pulled. Use the dedicated JTAG chain (not mixed with GPIO) to avoid contention during in-system programming.
Informations de conformité
RoHS and lead-free compliant per Altera/Intel product page. AEC-Q100 automotive qualification is not applicable for this commercial-grade CPLD; automotive variants are not offered in this part family.
