M24C64-DRMF3TG/K - 64Kbit I2C EEPROM, 1MHz, AEC-Q100 | STMicroelectronics
Артикул: M24C64-DRMF3TG/K ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $1.05 | $1,05 |
| 10 | $0.92 | $9,20 |
| 100 | $0.78 | $78,00 |
| 500 | $0.66 | $330,00 |
| 1.000 | $0.55 | $550,00 |
M24C64-DRMF3TG/K Обзор
An EEPROM (Electrically Erasable Programmable Read-Only Memory) is a type of non-volatile memory that retains stored data when power is removed and supports individual byte-level electrical erasure and reprogramming. In the hierarchy of non-volatile memory (EEPROM -> NVM -> memory IC -> semiconductor), I2C EEPROMs such as the M24C64 family occupy the low-density, byte-addressable niche used for configuration storage, calibration constants, and small user data sets where simplicity, low pin count, and long retention are valued over speed or density.
Key features include a 1 MHz I2C / SMBus-compatible two-wire interface, a 32-byte page write buffer for fast bulk writes, hardware write-protect input, built-in ECC for single-bit error correction, and a dedicated supply monitoring block that in-progress write protection when VCC drops below threshold. The device supports both standard (100 kHz), fast (400 kHz), and fast-plus (1 MHz) I2C modes, and the selectable device address bits (A0-A2) allow up to 8 devices on a single bus.
The M24C64-DRMF3TG/K uses CMOS technology with a low-power design that draws sub-microamp standby current, making it well suited for always-on subsystems in automotive ECUs, body control modules, and infotainment head units. The MLP-8 (2x3 mm) Wettable Flank package provides both small PCB footprint and automated optical inspection (AOI) capability required by automotive PCB assembly lines.
Typical applications include automotive parameter storage in body and chassis modules, infotainment system configuration, smart junction box settings, battery management system (BMS) calibration data, and industrial IoT nodes requiring AEC-Q100 grade non-volatile memory. The wide 2.5V-5.5V supply range lets it interface directly with both 3.3V microcontrollers and legacy 5V systems without level translation.
When designing with this device, observe the 5 ms maximum write cycle time per page and add a small polling loop in firmware to verify completion via ACK polling on the write address. The WC pin must be tied to GND for normal write operation or to VCC to permanently lock the memory array against accidental modification. Decouple VCC with a 100 nF ceramic capacitor placed within 5 mm of the supply pin.
Аналоги без доработки для M24C64-DRMF3TG/K — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
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Для этого товара нет аналогов без доработки.
Запросить аналогиM24C64-DRMF3TG/K Максимальные параметры и электрические характеристики
| Тип памяти | EEPROM (Electrically Erasable Programmable Read-Only Memory) |
| Memory Density | 64 Kbit (8 Kbyte) |
| Memory Organization | 8K × 8 bits |
| Интерфейс | I2C (2-wire) / SMBus compatible |
| Максимальная тактовая частота | 1 MHz |
| Access Time | 450 ns |
| Supply Voltage (VCC) | 2.5 V to 5.5 V |
| Page Size | 32 bytes |
| Write Cycle Time (max) | 5 ms (per page) |
| Endurance | 4 million erase/write cycles |
| Data Retention | >200 years |
| Рабочая температура | -40 °C to +125 °C |
| Корпус | MLP-8 (WFDFPN 2x3 mm) Wettable Flank |
| Тип монтажа | Surface Mount |
| AEC-Q100 Grade | Grade 1 (qualified) |
| Hardware Write Protect | Yes (WC pin) |
| Статус RoHS | Compliant |
Конфигурация выводов M24C64-DRMF3TG/K
| Контакт 1 | A0 — Chip address input 0 (selects one of 8 bus addresses) |
| Контакт 2 | A1 — Chip address input 1 |
| Контакт 3 | A2 — Chip address input 2 |
| Контакт 4 | VSS — Ground reference |
| Контакт 5 | SDA — I2C serial data (bidirectional, open-drain) |
| Контакт 6 | SCL — I2C serial clock input |
| Контакт 7 | WC — Write control (tie to VCC to lock, GND for writes) |
| Контакт 8 | VCC — Supply voltage (2.5 V to 5.5 V) |
Типичное применение
M24C64-DRMF3TG/K подходит для 6 применениеs: Automotive Body Control Module (BCM) Configuration, Battery Management System (BMS) Calibration Storage, Automotive Infotainment Head Unit Settings, Industrial IoT Sensor Node Parameter Storage, Smart Junction Box (SJB) Feature Configuration, Automotive Lighting Module LED Calibration.
Automotive Body Control Module (BCM) Configuration
The M24C64-DRMF3TG/K's 8-Kbyte byte-addressable storage and AEC-Q100 Grade 1 qualification make it a natural fit for storing BCM parameters such as door-lock presets, window anti-pinch thresholds, lighting timer settings, and per-VIN calibration constants. The 1 MHz I2C interface minimizes bus contention when the BCM is also polling body sensors, and the 2.5V-5.5V supply lets the EEPROM share the BCM's 5V rail directly. The 8-MLP (2x3 mm) Wettable Flank package supports automotive PCB assembly with AOI inspection.
Рекомендуется
Battery Management System (BMS) Calibration Storage
Storing per-cell voltage offsets, current-sense gain trim, SoH/SoC tables, and pack-level serial numbers in a BMS demands a memory that survives +125 °C under-hood and retains data for the life of the vehicle. The M24C64-DRMF3TG/K delivers >200-year data retention, 4M erase/write cycles for learning cycles during formation, and AEC-Q100 Grade 1 for mission-critical ISO 26262 systems. Its 450 ns access time keeps the I2C transaction overhead well under the BMS sample loop, and the 32-byte page write buffer efficiently commits learned cell parameters.
Рекомендуется
Automotive Infotainment Head Unit Settings
Modern infotainment systems store user preferences (audio EQ, radio presets, navigation last-known location, paired Bluetooth devices, display brightness) in non-volatile memory accessible during early-boot before filesystem mount. The M24C64-DRMF3TG/K provides 8 Kbytes for these configuration blobs, operates directly from the head-unit's 3.3V or 5V rail, and survives the +105 °C head-unit ambient. The hardware WC pin lets designers permanently lock the device once factory settings are written, preventing accidental user corruption.
Рекомендуется
Industrial IoT Sensor Node Parameter Storage
Industrial wireless sensor nodes (vibration, pressure, flow) frequently need to retain calibration certificates, network credentials, and node-specific scaling factors even through power cycles. The M24C64-DRMF3TG/K's 8 Kbytes is more than enough for LoRaWAN/Thread/Modbus credentials and per-unit trim values, and its wide -40 °C to +125 °C range lets it survive outdoor enclosures, motor cabinets, and process plants. The 1 MHz I2C bus is fast enough to avoid blocking the radio MCU's main loop during parameter commits.
Рекомендуется
Smart Junction Box (SJB) Feature Configuration
Smart junction boxes consolidate fuses, relays, and power distribution logic and must remember per-trim current limits, sequencing rules, and load-failure diagnostics across key cycles. The M24C64-DRMF3TG/K is well matched to the SJB thermal environment, storing feature flags and last-fault codes that survive the +125 °C underhood operation. Its 1 MHz I2C keeps the diagnostic log fetch from blocking the SJB's higher-priority CAN traffic, and the 4M cycle endurance supports decades of in-field firmware updates.
Рекомендуется
Automotive Lighting Module LED Calibration
Adaptive headlight and matrix-LED modules must store per-LED brightness/colour trim values, project-specific beam-pattern curves, and thermal-foldback tables in non-volatile memory. The M24C64-DRMF3TG/K provides 8 Kbytes for these matrices and survives the +125 °C thermal load adjacent to high-current LED drivers. Its I2C multi-master capability lets multiple LED driver ICs share the same EEPROM for distributed trim data, and the 32-byte page buffer enables efficient bulk updates during LED aging compensation.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для M24C64-DRMF3TG/K — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | M24C64-DRMN3TP/K | M24C64-WMN6TP/K | M24C64-A125 |
|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | MLP-8 (2x3 mm) WFDFPN | SOIC-8 (different footprint) | SOIC-8 (different footprint) | SOIC-8 (different footprint) |
| Memory Density | 64 Kbit (8 Kbyte) | 64 Kbit (8 Kbyte) | 64 Kbit (8 Kbyte) | 64 Kbit (8 Kbyte) |
| Maximum Clock Frequency | 1 MHz | 1 MHz | 400 kHz | 1 MHz |
| Supply Voltage Range | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +85 °C | -40 °C to +125 °C |
| AEC-Q100 Grade | Grade 1 (qualified) | Grade 1 (qualified) | Not qualified | Grade 1 (qualified) |
| Endurance | 4 million cycles | 4 million cycles | 1 million cycles | 4 million cycles |
| Access Time | 450 ns | 450 ns | 450 ns | 450 ns |
Ключевые отличия
- Smallest AEC-Q100 Grade 1 I2C EEPROM footprint in the ST M24C64 family (против M24C64-DRMN3TP/K)
- AEC-Q100 Grade 1 qualification with full automotive temperature range (против M24C64-WMN6TP/K)
- Multi-master I2C capability with hardware WC write-protect pin (против M24C64-A125)
Заметки по проектированию
Place a 100 nF X7R decoupling capacitor within 5 mm of the VCC pin, routed directly to a clean ground via. The MLP-8 (2x3 mm) package has no dedicated thermal pad, so the VCC pin carries the supply input directly - ensure the trace is at least 0.2 mm wide. Keep SDA/SCL traces short and avoid running them parallel to switching converter nodes; route through a ground-guard if noise-sensitive analog is adjacent.
Always include 4.7 kohm pull-up resistors on both SDA and SCL; open-drain I2C lines never work without them, regardless of MCU internal pull-ups. Tie the WC pin to GND through a 10 kohm resistor (or directly to GND) for normal write operation, or to VCC to permanently lock the array. Forgetting this pin's state is one of the most common causes of 'writes don't stick' field returns.
Wait at least 5 ms after each page-write command before issuing the next I2C transaction, or poll the EEPROM with ACK polling on the slave address until it ACKs. Skipping this wait corrupts in-progress writes and is the root cause of intermittent parameter corruption. Use the driver's built-in ACK polling or a timer-based delay of 5-10 ms for safety margin.
The Wettable Flank DFN package exposes the side metallization of each lead to allow automated optical inspection (AOI) of solder joints - a hard requirement for most automotive PCB assembly lines. Do not over-trace under the package body, and avoid soldermask-defined (NSMD) pads smaller than the recommended land pattern in the manufacturer datasheet. Maintain a 0.3 mm soldermask expansion to ensure robust side-fillets.
Информация о соответствии
AEC-Q100 Grade 1 qualified per STMicroelectronics datasheet. RoHS and REACH compliant per DigiKey and Mouser product listings. Halogen-free and lead-free packaging per ST's automotive-grade reliability program. Conflict-minerals reporting available on request from ST's quality portal.
