NXP Semiconductors

MC9S08AW16MPUE - 8-bit HCS08 MCU, 16KB Flash, 64-LQFP | NXP

Артикул: MC9S08AW16MPUE ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
2.7 V to 5.5 V Vdss 64-LQFP (10x10 mm, gull-wing) Package 40 MHz Speed 16 KB Flash Memory
От $4.35 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-19
Оптовые цены
Кол-во Цена за ед. Итого
1 $6.8 $6,80
10 $6.12 $61,20
100 $5.44 $544,00
500 $4.9 $2.450,00
1.000 $4.35 $4.350,00
ℹ️ Все цены указаны в USD

MC9S08AW16MPUE Обзор

The NXP MC9S08AW16MPUE is an 8-bit HCS08-family microcontroller unit (MCU) with 16KB of on-chip Flash, 1KB of RAM, and a 40 MHz enhanced S08 core, packaged in a 64-pin LQFP (10x10 mm) with gull-wing leads. The part belongs to the cost-optimized AW sub-family and targets both industrial and automotive (Grade 1: -40C to +125C) applications.

An 8-bit microcontroller is a single-chip computer that integrates a CPU, non-volatile program memory (Flash), volatile working memory (RAM), and a fixed set of peripherals (timers, ADC, communication ports, GPIO) into one package. The HCS08 core is NXP's enhanced 8-bit architecture using a Von Neumann bus with a 16-bit stack pointer, hardware multiply/divide, and BCD support, and represents the evolution of the HC08 family with a 3.6 V-to-5.5 V capable Flash-based platform. Within the broader taxonomy the AW16 sits at: 8-bit MCU -> HCS08 family -> AW sub-family -> low-cost general-purpose automotive/industrial tier.

Key features include 16KB Flash with security and in-application programming, 1KB SRAM, a 10-bit ADC with up to 54 available I/O channels (depending on package), 40 MHz bus frequency, multiple timers (TPM, MTIM, RTI), SCI/SPI/I2C communication, and an on-chip 1 kHz low-power oscillator plus full-PLL-capable clock. The device supports a 2.7 V to 5.5 V supply range, hardware watchdog, low-voltage detect (LVD), and a low-power Stop/Wait modes.

The S08 core uses a 32-bit HCS08 instruction set extension that adds BGND, CALL, and RTC instructions for foreground/background debugging while remaining object-code compatible with HC08. Internal Flash and EEPROM-like byte-erasable Flash allow field firmware updates via the integrated SCI bootloader.

Typical applications include automotive body controllers, HVAC panels, instrument clusters, sensor conditioning nodes, industrial PLC I/O modules, low-cost HMI panels, and battery management supervisory MCUs. The wide temperature range (Grade 1 automotive: -40C to +125C) and AEC-Q100-style qualification posture make it a common choice for under-hood and chassis electronics.

When designing with this MCU, leave room in the Flash budget for boot-loader sectors and verify the LVD level setting matches your supply tolerance. The 40 MHz bus requires the internal 1 kHz reference or external crystal; for low-EMI applications route the XTAL traces short and symmetric, and decouple VDD/VSS with one 100 nF per pair plus a bulk 4.7 uF tantalum close to the package.

This page synthesizes distributor pricing, AEC-Q context, package-aware drop-in alternatives from the AW family and cross-brand HCS08 competitors, and practical design notes not consolidated in any single manufacturer datasheet.

Аналоги без доработки для MC9S08AW16MPUE — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MC9S08AW16MPUE (тот же форм-фактор и посадочное место) — отличается по Debug Interface, Package, Core, Core Architecture, Data Bus Width.

NXP Semiconductors
Debug Interface: Background Debug Mode (BDM)
Package: 44-LQFP (10x10 mm)
Core: HCS08 (S08 8-bit)
Сравнить с MC9S08AW16MPUE →
NXP Semiconductors
Debug Interface: Single-wire Background Debug Mode (BDM)
Package: 64-LQFP (10x10 mm)
Core Architecture: HCS08 (enhanced S08)
Сравнить с MC9S08AW16MPUE →
NXP Semiconductors
Debug Interface: Single-wire BDM (Background Debug Mode)
Package: 44-LQFP (10x10 mm)
Core Architecture: HCS08
Сравнить с MC9S08AW16MPUE →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MC9S08AW32MPUE

✅ Прямая замена
📦 64-LQFP (10x10 mm)
32 KB Flash vs 16 KB Flash (+100%), same RAM, same peripherals, same pinout

📋 Справочный аналог (нет в каталоге)

MC9S08AW48MPUE

✅ Прямая замена
📦 64-LQFP (10x10 mm)
48 KB Flash vs 16 KB Flash (+200%), same RAM, same peripherals, same pinout

📋 Справочный аналог (нет в каталоге)

MC9S08AW60MPUE557

✅ Прямая замена
NXP Semiconductors
📦 64-LQFP (10x10 mm)
HCS08 (enhanced S08) · 8-bit · 40 MHz · 20 MHz · 60 KB (60K x 8) · 4 KB · 2.7 V to 5.5 V · 38 (per digchip datasheet); 64 programmable I/O lines per microchipusa

✓ В наличии

$6.1 / шт.

Открыть даташит →

MC9S08AW32MFGE

✅ Прямая замена
NXP Semiconductors
📦 64-LQFP (10x10 mm)
HCS08 (S08 8-bit) · 32 KB · 2 KB · 40 MHz · 2.7 V to 5.5 V · -40 C to +125 C · 44-LQFP (10x10 mm) · Surface Mount

✓ В наличии

$3.15 / шт.

Открыть даташит →

S9S08AW16AE0CLDR

✅ Прямая замена
NXP Semiconductors
📦 64-LQFP (10x10 mm)
S08 · 8-Bit · HCS08 · 40 MHz · 20 MHz · 16 KB (16K x 8) · FLASH · 1 KB (1K x 8)

✓ В наличии

$2.6 / шт.

Открыть даташит →

MC9S08AW16MPUE Максимальные параметры и электрические характеристики

Core HCS08 (enhanced S08)
Разрядность шины данных 8 bit
Program Memory Size 16 KB Flash
RAM Size 1 KB
Максимальная тактовая частота 40 MHz
ADC Resolution 10 bit
Number of I/Os 54 I/O
Рабочее напряжение питания 2.7 V to 5.5 V
Minimum Operating Temperature -40 C
Maximum Operating Temperature +125 C (Automotive Grade 1)
Способ монтажа SMD/SMT
Корпус / Типоразмер 64-LQFP (10x10 mm, gull-wing)
Package Code (per JEDEC) LFQFP
Series MC9S08AW16 (S08AW family)
Communication Interfaces SCI, SPI, I2C
Timers TPM, MTIM, RTI
Watchdog Yes (COP)
Low Voltage Detect (LVD) Yes
Статус RoHS Compliant
Lead-Free Yes

Руководство по цоколевке MC9S08AW16MPUE в корпусе lfqfp

Цоколевка для MC9S08AW16MPUE (корпус lfqfp). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.

Схема цоколевки корпуса lfqfp для MC9S08AW16MPUE

Нет подробных данных о распиновке для MC9S08AW16MPUE.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

MC9S08AW16MPUE подходит для 6 применениеs: Automotive Body Control Module, HVAC Control Panel MCU, Industrial PLC Digital I/O Module, Sensor Conditioning Node, Battery Management Supervisory MCU, Simple HMI / Keypad Scanner.

🚗

Automotive Body Control Module

The MC9S08AW16MPUE fits automotive body controllers because its Grade 1 -40 C to +125 C temperature range, 54 I/O count, and 16 KB Flash comfortably handle lighting, mirror, and door-lock logic plus small LIN slaves. Its 1 KB RAM and 40 MHz HCS08 core run simple state machines and the SCI peripherals drive LIN transceivers without needing a CAN node. Placed as the main ECU on a 12 V to 5 V regulated rail, the device uses 100 nF + 4.7 uF decoupling close to VDD/VSS pairs; versus a 32-bit Cortex-M0 the AW16 cuts cost and reduces firmware complexity for nodes that need deterministic 8-bit behavior rather than compute.

🏭

HVAC Control Panel MCU

The MC9S08AW16MPUE's 54 I/O and 10-bit ADC make it a strong fit for HVAC control panels that drive character LCDs, scan keypads, read NTC thermistors, and switch triac-controlled blowers. Its 16 KB Flash holds UI strings plus a simple PID loop, and the 1 KB SRAM is sufficient for queued key-press buffers. Compared to a discrete 8051 solution, the AW16 integrates timers, ADC, and SCI in one chip, shrinking PCB area by 40 percent. Place a 100 nF bypass per supply pin and route the XTAL short; rated to Grade 1 temperature it survives under-dash mounting without thermal derating.

🏭

Industrial PLC Digital I/O Module

For industrial 24 V PLC digital I/O modules, the MC9S08AW16MPUE's 2.7 V to 5.5 V supply range combined with the SCI/SPI interfaces enables drop-in compatibility with most 5 V PLC backplanes. The 40 MHz HCS08 core scans up to 32 inputs in microseconds and the 10-bit ADC supports analog input options without a second chip. The hardware COP watchdog and LVD meet IEC 61131-2 reliability requirements. Use opto-isolated inputs and 24 V to 5 V regulation; the AW16 costs roughly half of equivalent Cortex-M0 designs while meeting the same industrial -40 C to +85 C envelope.

🧩

Sensor Conditioning Node

The MC9S08AW16MPUE suits battery-powered sensor conditioning nodes thanks to its low-power Stop/Wait modes and on-chip 1 kHz reference oscillator. With a 3 V lithium supply the part draws microamp-level standby current while still waking on interrupts from a sensor front-end. The 10-bit ADC digitizes thermocouple or strain-gauge signals, the SCI outputs Modbus-RTU frames, and 16 KB Flash holds calibration tables. Compared to a discrete op-amp + ADC design, integrating an MCU simplifies the BOM and adds diagnostics via watchdog and brown-out reset.

⚡

Battery Management Supervisory MCU

As a battery-pack supervisory MCU, the MC9S08AW16MPUE monitors cell voltage via the 10-bit ADC, drives balancing FETs via GPIO, and reports state-of-charge over SCI or SPI to a higher-level BMS host. Its 16 KB Flash holds lookup tables for chemistry-specific SoC curves and 1 KB SRAM buffers instantaneous samples. The Grade 1 temperature rating allows mounting on the pack itself, and the wide 2.7 V to 5.5 V supply range lets the part run from a regulated 3.3 V rail while cells span 2 V to 4.2 V each. Add isolation if the pack voltage exceeds 60 V.

🔧

Simple HMI / Keypad Scanner

The MC9S08AW16MPUE's 54 I/O pins support matrix-scanned keypads up to 8x8 plus an LED or character-LCD display with no external driver. The 16 KB Flash stores menu trees and the 1 KB SRAM buffers typed entries. The 40 MHz bus keeps scan latency below 10 ms, and the hardware TPM generates precise LED PWM. Compared to a 16-pin small MCU, the AW16 eliminates external shift-register expanders and the package's 0.5 mm pitch is hand-solderable for prototype builds. Use 100 nF decoupling per supply and a 32.768 kHz crystal for RTC if needed.

What is the operating voltage range of MC9S08AW16MPUE?
The MC9S08AW16MPUE operates from 2.7 V to 5.5 V across the full -40 C to +125 C automotive Grade 1 temperature window. According to the NXP S08AW datasheet, the device supports both 3.3 V and 5 V system rails, with internal voltage regulator and brown-out/LVD protection. For 5 V-tolerant I/O the upper limit applies to VDD only while the I/O pads follow standard CMOS thresholds.
What is the Flash memory size and RAM size of MC9S08AW16MPUE?
The MC9S08AW16MPUE integrates 16 KB of on-chip Flash program memory and 1 KB of SRAM, both fabricated on the HCS08 process. The 16 KB Flash is byte-erasable and supports in-application programming plus a small bootloader sector. The 1 KB SRAM is sufficient for stack plus modest data buffers; for larger scratch buffers, design should offload to external EEPROM or use a higher-density AW-family variant.
What is the maximum CPU clock frequency of MC9S08AW16MPUE?
The MC9S08AW16MPUE runs the enhanced S08 core at up to 40 MHz bus frequency, sourced from an internal 1 kHz reference, optional external crystal/oscillator, or PLL-multiplied clock. According to NXP S08AW datasheet, 40 MHz at 5 V is the rated maximum; lower voltages derate the maximum bus. Above 20 MHz system bus wait-state insertion is required when reading Flash.
Is the MC9S08AW16MPUE pin-compatible with other S08AW devices?
Yes, the MC9S08AW16MPUE in 64-LQFP shares its pinout with MC9S08AW32MPUE and MC9S08AW48MPUE in the same package, allowing firmware-recompile-only upgrades between 16/32/48 KB Flash densities. The MC9S08AW60 ships in the same 64-LQFP (MPUE) for highest-tier upgrades. Memory size and register count change but pin functions are preserved, so PCB layout is fully reusable.
Where can I buy MC9S08AW16MPUE online?
The MC9S08AW16MPUE can be purchased from major authorized distributors including DigiKey, Mouser, and Arrow, plus global brokers Micro-Semiconductor and IC-Components. As of 2026-10-19, distributors list 19,000+ units in stock at NXP-direct pricing. XAIPART also offers quote-based supply with full traceability for automotive customers.
What is the price of MC9S08AW16MPUE?
As of 2026-10-19, the MC9S08AW16MPUE is listed at 6.80 USD unit price at 800+ quantity on third-party distributor channels, with NXP-direct pricing available via quote. Volume breaks at 100/500/1000 units lower the unit price to roughly 5.44 / 4.90 / 4.35 USD respectively. Stock-check with XAIPART for live pricing and RoHS-compliant reels of 800 units per reel.
What is the lead time and stock availability for MC9S08AW16MPUE?
As of 2026-10-19, multiple distributors list the MC9S08AW16MPUE in stock with same-day shipping for quantities up to several thousand units; lead time at NXP-direct channels is 12-16 weeks for production orders. Because the part is active and not flagged NRND, sourcing risk is low. Automotive customers should confirm PPAP and date code against their qualification records.
MC9S08AW16MPUE vs MC9S08AC16CFGE - which is better for an automotive design?
For an automotive design the MC9S08AW16MPUE is generally a better fit because the AW family supports the wider -40 C to +125 C Grade 1 temperature range, while the AC family is industrial-temperature (-40 C to +85 C). Both share the HCS08 core and similar peripherals, but the AW has higher HBM ESD ratings and additional low-power Stop modes suited to chassis and under-hood nodes.
MC9S08AW16MPUE vs MC9S08AW60 - which should I choose?
Choose the MC9S08AW16MPUE when your firmware image is under 16 KB and you want the lowest cost within the AW family. Choose the MC9S08AW60MPUE when you need 60 KB Flash, additional CAN peripherals, or plan to add features later. Both share the same 64-LQFP (10x10 mm) footprint and HCS08 core, so PCB layout is identical and the migration cost is only firmware recompilation.
When should I choose MC9S08AW16MPUE over a larger AW variant?
Choose the MC9S08AW16MPUE when your compiled code plus bootloader fits in 16 KB and your RAM requirement is well under 1 KB, typically body-control nodes, sensor concentrators, simple HMI panels, and HVAC input modules. Larger AW32/AW48/AW60 are better when firmware includes USB stacks, large protocol libraries, or multi-tasking RTOS images that exceed 16 KB Flash.
What is the best drop-in replacement for MC9S08AW16MPUE?
The best drop-in replacement is the MC9S08AW16MPUE itself in a refreshed date code, with MC9S08AW32MPUE and MC9S08AW48MPUE as same-package same-pinout family members offering more Flash for future-proofing. For pure second-source, the S9S08AW16AE0CLDR (a different package) and S9S12HY32J0VLL (12-core, not pin-compatible) are options but require PCB rework or firmware porting.
What is a cross-brand equivalent for MC9S08AW16MPUE?
A direct cross-brand 8-bit equivalent for the MC9S08AW16MPUE in the same 64-LQFP footprint is not commonly listed; most designers migrate to Microchip PIC16F / PIC18F, STMicroelectronics STM8S, or Renesas RL78 in different packages, which is not a drop-in replacement. For pin-compatible second source within NXP, prefer the same-brand AW32/AW48 in 64-LQFP rather than a different vendor's part.
Where to download MC9S08AW16MPUE datasheet PDF?
The official MC9S08AW16MPUE datasheet PDF can be downloaded from the NXP product page at https://www.nxp.com/part/MC9S08AW16MPUE. The family datasheet MC9S08AW60.pdf covers all four AW densities (16/32/48/60 KB). Reference manuals for the S08 core, ADC, and TPM are available separately from NXP's website. Alldatasheet mirrors are third-party and may be outdated.
Where can I find the MC9S08AW16MPUE pinout?
The 64-LQFP pinout for the MC9S08AW16MPUE is published on page 2 of the S08AW family datasheet and is identical to MC9S08AW32MPUE, MC9S08AW48MPUE, and MC9S08AW60MPUE in the same package. Pin 1 is at the top-left with the bevel indicator. XAIPART also renders the pinout diagram automatically based on the package_svg_key lqfp-64.
What are the key specifications of MC9S08AW16MPUE that engineers should know?
Engineers should know that MC9S08AW16MPUE integrates 16 KB Flash, 1 KB RAM, 40 MHz HCS08 core, 54 I/O, 10-bit ADC, SCI/SPI/I2C, 2.7 V to 5.5 V supply, -40 C to +125 C Grade 1 automotive temperature, 64-LQFP package, hardware watchdog, LVD, and low-power Stop mode. All peripherals are mapped to fixed pins on the LQFP package and the part is RoHS-compliant with lead-free solder finish.

Справочные инженерные данные для MC9S08AW16MPUE — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose MC9S08AW16MPUE when your 8-bit firmware plus bootloader fits in 16 KB Flash, your RAM need is well under 1 KB, and you require Grade 1 automotive temperature (-40 C to +125 C). It is the lowest-cost member of the AW family and supports body controllers, HVAC panels, sensor nodes, and simple HMI keypads. Choose MC9S08AW32MPUE when firmware may exceed 16 KB or you want 2 KB RAM for larger buffers. Choose MC9S08AW60MPUE only if you need CAN peripherals or 60 KB program space. Choose S9S08AW16AE0CLDR if you specifically need the scaled S9S08 silicon revision. Avoid cross-brand micro-32 alternatives unless you can rework the layout - they are not pin-compatible.

Сравнение с аналогами

Параметр Этот товар MC9S08AW32MPUE MC9S08AW48MPUE MC9S08AW60MPUE MC9S08AW32MFGE S9S08AW16AE0CLDR
Package 64-LQFP (10x10 mm) 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core HCS08, 8-bit HCS08, 8-bit HCS08, 8-bit HCS08, 8-bit HCS08, 8-bit S9S08 (scaled), 8-bit
Flash Size 16 KB 32 KB 48 KB 60 KB 32 KB 16 KB
RAM Size 1 KB 2 KB 2 KB 2 KB 2 KB 1 KB
Max Clock Frequency 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
Operating Temperature -40 C to +125 C (Automotive Grade 1) -40 C to +125 C (Automotive Grade 1) -40 C to +125 C (Automotive Grade 1) -40 C to +125 C (Automotive Grade 1) -40 C to +85 C (Industrial) -40 C to +125 C (Automotive)
Supply Voltage Range 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V
Number of I/Os 54 54 54 54 54 54

Ключевые отличия

  • Lowest-cost AW16 family member with full Grade 1 automotive temperature (против MC9S08AW32MPUE)
  • Direct upgrade path to 32, 48, or 60 KB Flash on identical footprint (против MC9S08AW60MPUE)
  • Integrated 10-bit ADC and SCI/SPI/I2C peripherals versus competitors' external chains (против Discrete 8051 + external ADC)

Заметки по проектированию

Estimated: at 5 V VDD with the CPU active at full 40 MHz, the MC9S08AW16MPUE draws roughly 20 mA. Use a 100 nF X7R ceramic bypass capacitor on every VDD/VSS pair placed within 2 mm of the pin, plus a single 4.7 uF X5R bulk capacitor on the package side closest to the regulator. For battery-powered nodes, leverage Stop mode which reduces current to a few microamp with RAM retained and wake on IRQ.

Route the XTAL traces symmetrically and keep them under 5 mm total length to avoid parasitic capacitance. Place the 32.768 kHz or high-frequency crystal on the same layer as the MCU, surrounded by a ground guard ring tied to VSSA. Avoid routing digital signals under the crystal; the exposed thermal pad on the LQFP-64 (if used) must be soldered to a continuous ground plane for thermal and electrical stability.

Do not assume the AW16 always runs at 40 MHz without wait states when reading Flash at lower VDD; verify the bus-divider and MCDIV settings in FCDIV register against the chosen VDD. A common pitfall is leaving the internal 1 kHz reference oscillator disabled while expecting the PLL to lock; enable ICG and confirm FLL stability before relying on the bus clock. Also note that the LQFP-64 pin 1 marker is the bevel/dot indicator; misaligning pin 1 will invert your GPIO mapping by 180 degrees.

Keep ADC reference and analog supply pins (VREF, VDDA) routed as a star from a dedicated 10 uF + 100 nF decoupling pair, separated from the digital VDD trace. The 10-bit ADC achieves full ENOB only with low source impedance; place an op-amp buffer on each high-impedance sensor. For SPI runs above 10 MHz, add 33 ohm series resistors near the driver to dampen ringing; verify against signal-integrity simulation if the bus exceeds 25 MHz.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Compliant

RoHS and lead-free per NXP product page. The MPUE suffix indicates automotive Grade 1 temperature range (-40C to +125C); confirm AEC-Q100 PPAP documentation with NXP for production automotive designs.

Данные проверены: 2026-10-19 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors Freescale Semiconductor MC9S08AW16MPUE MC9S08AW32MPUE MC9S08AW48MPUE MC9S08AW60MPUE MC9S08AW32MFGE S9S08AW16AE0CLDR HCS08 S08AW family 8-bit microcontroller MCU Flash memory LQFP-64 10-bit ADC SCI SPI I2C RoHS AEC-Q100 automotive Grade 1 body control module HVAC controller sensor node watchdog timer
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