MC9S08AW16MPUE - 8-bit HCS08 MCU, 16KB Flash, 64-LQFP | NXP
부품 번호: MC9S08AW16MPUE ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.8 | $6.80 |
| 10 | $6.12 | $61.20 |
| 100 | $5.44 | $544.00 |
| 500 | $4.9 | $2,450.00 |
| 1,000 | $4.35 | $4,350.00 |
MC9S08AW16MPUE 개요
An 8-bit microcontroller is a single-chip computer that integrates a CPU, non-volatile program memory (Flash), volatile working memory (RAM), and a fixed set of peripherals (timers, ADC, communication ports, GPIO) into one package. The HCS08 core is NXP's enhanced 8-bit architecture using a Von Neumann bus with a 16-bit stack pointer, hardware multiply/divide, and BCD support, and represents the evolution of the HC08 family with a 3.6 V-to-5.5 V capable Flash-based platform. Within the broader taxonomy the AW16 sits at: 8-bit MCU -> HCS08 family -> AW sub-family -> low-cost general-purpose automotive/industrial tier.
Key features include 16KB Flash with security and in-application programming, 1KB SRAM, a 10-bit ADC with up to 54 available I/O channels (depending on package), 40 MHz bus frequency, multiple timers (TPM, MTIM, RTI), SCI/SPI/I2C communication, and an on-chip 1 kHz low-power oscillator plus full-PLL-capable clock. The device supports a 2.7 V to 5.5 V supply range, hardware watchdog, low-voltage detect (LVD), and a low-power Stop/Wait modes.
The S08 core uses a 32-bit HCS08 instruction set extension that adds BGND, CALL, and RTC instructions for foreground/background debugging while remaining object-code compatible with HC08. Internal Flash and EEPROM-like byte-erasable Flash allow field firmware updates via the integrated SCI bootloader.
Typical applications include automotive body controllers, HVAC panels, instrument clusters, sensor conditioning nodes, industrial PLC I/O modules, low-cost HMI panels, and battery management supervisory MCUs. The wide temperature range (Grade 1 automotive: -40C to +125C) and AEC-Q100-style qualification posture make it a common choice for under-hood and chassis electronics.
When designing with this MCU, leave room in the Flash budget for boot-loader sectors and verify the LVD level setting matches your supply tolerance. The 40 MHz bus requires the internal 1 kHz reference or external crystal; for low-EMI applications route the XTAL traces short and symmetric, and decouple VDD/VSS with one 100 nF per pair plus a bulk 4.7 uF tantalum close to the package.
This page synthesizes distributor pricing, AEC-Q context, package-aware drop-in alternatives from the AW family and cross-brand HCS08 competitors, and practical design notes not consolidated in any single manufacturer datasheet.
드롭인 대체품: MC9S08AW16MPUE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC9S08AW16MPUE (동일 폼 팩터 및 풋프린트) — 차이점: Debug Interface, Package, Core, Core Architecture, Data Bus Width.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC9S08AW32MPUE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S08AW48MPUE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S08AW60MPUE557
✅ 드롭인✓ 재고 있음
$6.1 / 개
데이터시트 보기 →MC9S08AW32MFGE
✅ 드롭인✓ 재고 있음
$3.15 / 개
데이터시트 보기 →S9S08AW16AE0CLDR
✅ 드롭인✓ 재고 있음
$2.6 / 개
데이터시트 보기 →MC9S08AW16MPUE 최대 정격 & 전기적 특성
| Core | HCS08 (enhanced S08) |
| 데이터 버스 폭 | 8 bit |
| Program Memory Size | 16 KB Flash |
| RAM Size | 1 KB |
| 최대 클록 주파수 | 40 MHz |
| ADC Resolution | 10 bit |
| Number of I/Os | 54 I/O |
| 동작 공급 전압 | 2.7 V to 5.5 V |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +125 C (Automotive Grade 1) |
| 장착 스타일 | SMD/SMT |
| 패키지 / 케이스 | 64-LQFP (10x10 mm, gull-wing) |
| Package Code (per JEDEC) | LFQFP |
| Series | MC9S08AW16 (S08AW family) |
| Communication Interfaces | SCI, SPI, I2C |
| Timers | TPM, MTIM, RTI |
| Watchdog | Yes (COP) |
| Low Voltage Detect (LVD) | Yes |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
MC9S08AW16MPUE lfqfp 핀 구성 가이드
MC9S08AW16MPUE(lfqfp 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MC9S08AW16MPUE.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MC9S08AW16MPUE 적합 용도: 6 애플리케이션s: Automotive Body Control Module, HVAC Control Panel MCU, Industrial PLC Digital I/O Module, Sensor Conditioning Node, Battery Management Supervisory MCU, Simple HMI / Keypad Scanner.
Automotive Body Control Module
The MC9S08AW16MPUE fits automotive body controllers because its Grade 1 -40 C to +125 C temperature range, 54 I/O count, and 16 KB Flash comfortably handle lighting, mirror, and door-lock logic plus small LIN slaves. Its 1 KB RAM and 40 MHz HCS08 core run simple state machines and the SCI peripherals drive LIN transceivers without needing a CAN node. Placed as the main ECU on a 12 V to 5 V regulated rail, the device uses 100 nF + 4.7 uF decoupling close to VDD/VSS pairs; versus a 32-bit Cortex-M0 the AW16 cuts cost and reduces firmware complexity for nodes that need deterministic 8-bit behavior rather than compute.
추천
HVAC Control Panel MCU
The MC9S08AW16MPUE's 54 I/O and 10-bit ADC make it a strong fit for HVAC control panels that drive character LCDs, scan keypads, read NTC thermistors, and switch triac-controlled blowers. Its 16 KB Flash holds UI strings plus a simple PID loop, and the 1 KB SRAM is sufficient for queued key-press buffers. Compared to a discrete 8051 solution, the AW16 integrates timers, ADC, and SCI in one chip, shrinking PCB area by 40 percent. Place a 100 nF bypass per supply pin and route the XTAL short; rated to Grade 1 temperature it survives under-dash mounting without thermal derating.
추천
Industrial PLC Digital I/O Module
For industrial 24 V PLC digital I/O modules, the MC9S08AW16MPUE's 2.7 V to 5.5 V supply range combined with the SCI/SPI interfaces enables drop-in compatibility with most 5 V PLC backplanes. The 40 MHz HCS08 core scans up to 32 inputs in microseconds and the 10-bit ADC supports analog input options without a second chip. The hardware COP watchdog and LVD meet IEC 61131-2 reliability requirements. Use opto-isolated inputs and 24 V to 5 V regulation; the AW16 costs roughly half of equivalent Cortex-M0 designs while meeting the same industrial -40 C to +85 C envelope.
추천
Sensor Conditioning Node
The MC9S08AW16MPUE suits battery-powered sensor conditioning nodes thanks to its low-power Stop/Wait modes and on-chip 1 kHz reference oscillator. With a 3 V lithium supply the part draws microamp-level standby current while still waking on interrupts from a sensor front-end. The 10-bit ADC digitizes thermocouple or strain-gauge signals, the SCI outputs Modbus-RTU frames, and 16 KB Flash holds calibration tables. Compared to a discrete op-amp + ADC design, integrating an MCU simplifies the BOM and adds diagnostics via watchdog and brown-out reset.
추천
Battery Management Supervisory MCU
As a battery-pack supervisory MCU, the MC9S08AW16MPUE monitors cell voltage via the 10-bit ADC, drives balancing FETs via GPIO, and reports state-of-charge over SCI or SPI to a higher-level BMS host. Its 16 KB Flash holds lookup tables for chemistry-specific SoC curves and 1 KB SRAM buffers instantaneous samples. The Grade 1 temperature rating allows mounting on the pack itself, and the wide 2.7 V to 5.5 V supply range lets the part run from a regulated 3.3 V rail while cells span 2 V to 4.2 V each. Add isolation if the pack voltage exceeds 60 V.
추천
Simple HMI / Keypad Scanner
The MC9S08AW16MPUE's 54 I/O pins support matrix-scanned keypads up to 8x8 plus an LED or character-LCD display with no external driver. The 16 KB Flash stores menu trees and the 1 KB SRAM buffers typed entries. The 40 MHz bus keeps scan latency below 10 ms, and the hardware TPM generates precise LED PWM. Compared to a 16-pin small MCU, the AW16 eliminates external shift-register expanders and the package's 0.5 mm pitch is hand-solderable for prototype builds. Use 100 nF decoupling per supply and a 32.768 kHz crystal for RTC if needed.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC9S08AW16MPUE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC9S08AW32MPUE | MC9S08AW48MPUE | MC9S08AW60MPUE | MC9S08AW32MFGE | S9S08AW16AE0CLDR |
|---|---|---|---|---|---|---|
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS08, 8-bit | HCS08, 8-bit | HCS08, 8-bit | HCS08, 8-bit | HCS08, 8-bit | S9S08 (scaled), 8-bit |
| Flash Size | 16 KB | 32 KB | 48 KB | 60 KB | 32 KB | 16 KB |
| RAM Size | 1 KB | 2 KB | 2 KB | 2 KB | 2 KB | 1 KB |
| Max Clock Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Operating Temperature | -40 C to +125 C (Automotive Grade 1) | -40 C to +125 C (Automotive Grade 1) | -40 C to +125 C (Automotive Grade 1) | -40 C to +125 C (Automotive Grade 1) | -40 C to +85 C (Industrial) | -40 C to +125 C (Automotive) |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Number of I/Os | 54 | 54 | 54 | 54 | 54 | 54 |
주요 차별점
- Lowest-cost AW16 family member with full Grade 1 automotive temperature (vs MC9S08AW32MPUE)
- Direct upgrade path to 32, 48, or 60 KB Flash on identical footprint (vs MC9S08AW60MPUE)
- Integrated 10-bit ADC and SCI/SPI/I2C peripherals versus competitors' external chains (vs Discrete 8051 + external ADC)
설계 노트
Estimated: at 5 V VDD with the CPU active at full 40 MHz, the MC9S08AW16MPUE draws roughly 20 mA. Use a 100 nF X7R ceramic bypass capacitor on every VDD/VSS pair placed within 2 mm of the pin, plus a single 4.7 uF X5R bulk capacitor on the package side closest to the regulator. For battery-powered nodes, leverage Stop mode which reduces current to a few microamp with RAM retained and wake on IRQ.
Route the XTAL traces symmetrically and keep them under 5 mm total length to avoid parasitic capacitance. Place the 32.768 kHz or high-frequency crystal on the same layer as the MCU, surrounded by a ground guard ring tied to VSSA. Avoid routing digital signals under the crystal; the exposed thermal pad on the LQFP-64 (if used) must be soldered to a continuous ground plane for thermal and electrical stability.
Do not assume the AW16 always runs at 40 MHz without wait states when reading Flash at lower VDD; verify the bus-divider and MCDIV settings in FCDIV register against the chosen VDD. A common pitfall is leaving the internal 1 kHz reference oscillator disabled while expecting the PLL to lock; enable ICG and confirm FLL stability before relying on the bus clock. Also note that the LQFP-64 pin 1 marker is the bevel/dot indicator; misaligning pin 1 will invert your GPIO mapping by 180 degrees.
Keep ADC reference and analog supply pins (VREF, VDDA) routed as a star from a dedicated 10 uF + 100 nF decoupling pair, separated from the digital VDD trace. The 10-bit ADC achieves full ENOB only with low source impedance; place an op-amp buffer on each high-impedance sensor. For SPI runs above 10 MHz, add 33 ohm series resistors near the driver to dampen ringing; verify against signal-integrity simulation if the bus exceeds 25 MHz.
규정 준수 정보
RoHS and lead-free per NXP product page. The MPUE suffix indicates automotive Grade 1 temperature range (-40C to +125C); confirm AEC-Q100 PPAP documentation with NXP for production automotive designs.
