NXP Semiconductors

MC9S08DV60AMLH - 8-bit MCU 60KB Flash 40MHz CAN LIN | NXP

Артикул: MC9S08DV60AMLH ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
3.3V/5V Vdss 64-LQFP (10x10 mm) Package 40MHz CPU (20MHz bus) Speed 60KB (60K x 8) Memory
От $3.85 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-18
Оптовые цены
Кол-во Цена за ед. Итого
1 $6.2 $6,20
10 $5.6 $56,00
100 $4.95 $495,00
500 $4.4 $2.200,00
1.000 $3.85 $3.850,00
ℹ️ Все цены указаны в USD

MC9S08DV60AMLH Обзор

The NXP Semiconductors MC9S08DV60AMLH is an 8-bit HCS08 microcontroller unit (MCU) with 60KB (60K x 8) Flash program memory, 3KB RAM, and a 40MHz HCS08 CPU core (20MHz internal bus clock), housed in a 64-pin LQFP (10x10 mm) surface-mount package.

A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, program memory, data RAM, and multiple peripheral functions such as timers, communication interfaces, and analog-to-digital converters on one die. MCUs sit at the heart of embedded systems within the broader hierarchy of semiconductors -> integrated circuits -> microcontrollers, providing complete, low-cost control logic for everything from automotive body modules to industrial sensors.

Key features of the MC9S08DV60AMLH include an on-chip MSCAN (Controller Area Network) module and LIN master support, making it a strong fit for automotive and industrial network nodes. The 16-channel, 12-bit ADC offers 2.5 microsecond conversion time, and the device provides 53 general-purpose I/O pins plus 1 input-only pin. The HCS08 core executes the HC08 instruction set with an added BGND instruction and supports up to 32 interrupt/reset sources.

Technically, the enhanced HCS08 family uses an external oscillator option and the CISC-style S08 architecture inherited from the HC08, with a background debug mode (BGND) for on-chip debugging without consuming target resources. The DV series integrates CAN and LIN communication peripherals that would otherwise require external transceiver-adjacent logic, reducing BOM count in networked nodes. Flash program memory is 60KB with 3KB of on-chip RAM for stack and variables.

Typical applications include automotive body electronics (door modules, seat control, lighting), LIN-master or CAN network gateways, industrial motor control panels, and building automation sensor nodes where a 3.3V/5V 8-bit MCU with on-chip CAN reduces system cost.

Design consideration: at 40MHz CPU operation the device is typically run from an external oscillator; verify ADC clocking and CAN bit-timing budgets early, as peripheral clock sources on S08 devices derive from the bus clock (20MHz).

This page synthesizes distributor pricing, drop-in same-family alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet.

Аналоги без доработки для MC9S08DV60AMLH — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MC9S08DV60AMLH (тот же форм-фактор и посадочное место) — отличается по Package, Instruction Set, Core, RAM Size, Core Processor.

NXP Semiconductors
Package: 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220)
Core Processor: S08
Сравнить с MC9S08DV60AMLH →
NXP Semiconductors
Package: 32-LQFP (7x7 mm)
Instruction Set: HC08 with added BGND
RAM Size: 2 KB
Сравнить с MC9S08DV60AMLH →
NXP Semiconductors
Instruction Set: HC08 + BGND instruction
Core: HCS08 (S08 core)
RAM Size: 2 KB (2K x 8)
Сравнить с MC9S08DV60AMLH →
NXP Semiconductors
Package: 32-LQFP (7 x 7 mm)
Core: S08 (HCS08) 8-bit CISC
Сравнить с MC9S08DV60AMLH →
NXP Semiconductors
Package: 64-LQFP (10x10 mm)
Instruction Set: HC08 with BGND extension
Core: HCS08 (enhanced 8-bit)
Сравнить с MC9S08DV60AMLH →
NXP Semiconductors
Package: 32-LQFP (7 x 7 mm)
RAM Size: 3 KB
Core Processor: S08 (HCS08)
Сравнить с MC9S08DV60AMLH →
NXP Semiconductors
Package: 48-LQFP (7x7 mm)
Instruction Set: HC08 instruction set with added BGND instruction
Core: HCS08 (8-bit CISC)
Сравнить с MC9S08DV60AMLH →
NXP Semiconductors
Package: 64-LQFP (10x10 mm), 0.5 mm pitch
Core: S08 (HCS08)
Сравнить с MC9S08DV60AMLH →
NXP Semiconductors
Package: 32-LQFP (7x7 mm)
RAM Size: 1KB
Core Processor: S08 (8-bit CISC)
Сравнить с MC9S08DV60AMLH →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MC9S08DV48AMLH

✅ Прямая замена ⚠️ Характеристики не проверены
NXP Semiconductors
📦 64-LQFP (10x10)
HCS08 (enhanced 8-bit) · 40 MHz (20 MHz bus) · HC08 with BGND extension · 48 KB (48K x 8) · 2 KB · 64-LQFP (10x10 mm) · Surface Mount · 2.7 V to 5.5 V

✓ В наличии

$4.31 / шт.

Открыть даташит →

MC9S08DV32AMLH

✅ Прямая замена ⚠️ Характеристики не проверены
📦 64-LQFP (10x10)
Program Flash 32KB vs 60KB (-47%), same core, ADC, CAN/LIN and pinout

📋 Справочный аналог (нет в каталоге)

MC9S08DV16AMLH

✅ Прямая замена ⚠️ Характеристики не проверены
📦 64-LQFP (10x10)
Program Flash 16KB vs 60KB (-73%), lowest-cost family member, same package and peripherals

📋 Справочный аналог (нет в каталоге)

MC9S08DZ60MLH

✅ Прямая замена
📦 64-LQFP (10x10)
DZ-series automotive variant, 60KB Flash, same 64-LQFP housing; peripheral register set differs slightly from DV series

📋 Справочный аналог (нет в каталоге)

S9S08DZ60F1VLH

✅ Прямая замена
📦 64-LQFP (10x10)
Automotive (AEC-Q100) DZ-series 60KB MCU in 64-LQFP; mask-programmed option, requires firmware revalidation

📋 Справочный аналог (нет в каталоге)

MC9S08DV60AMLH Максимальные параметры и электрические характеристики

Core Processor S08 (HCS08), 8-bit
Core Size 8-Bit
Speed 40MHz CPU (20MHz bus)
Program Memory Size 60KB (60K x 8)
Program Memory Type FLASH
RAM Size 3K x 8
Number of I/O 53
Input-Only Pins 1
ADC Resolution 12-bit
ADC Channels 16
ADC Conversion Time 2.5 us
Connectivity CAN (MSCAN), LIN master
Oscillator Type External
Interrupt/Reset Sources Up to 32
Напряжение питания 3.3V/5V
Корпус / Типоразмер 64-LQFP (10x10 mm)
Тип монтажа Surface Mount
Packaging Tray
Instruction Set HC08 with added BGND instruction

Руководство по цоколевке MC9S08DV60AMLH в корпусе 64-lqfp (10x10 mm)

Цоколевка для MC9S08DV60AMLH (корпус 64-lqfp (10x10 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.

Схема цоколевки корпуса 64-lqfp (10x10 mm) для MC9S08DV60AMLH

Нет подробных данных о распиновке для MC9S08DV60AMLH.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

MC9S08DV60AMLH подходит для 6 применениеs: Automotive Body Electronics, LIN Master Network Nodes, Industrial Motor Control Panels, Building Automation Sensor Nodes, CAN Gateways and Bridges, Lighting Control Modules.

🚗

Automotive Body Electronics

The MC9S08DV60AMLH fits automotive body modules such as door controllers, seat adjusters, and interior lighting because it combines the MSCAN controller and LIN master on a 5V-tolerant 8-bit core. Body nodes typically exchange small periodic messages on a LIN bus while reporting to a CAN backbone - exactly the dual-network capability this MCU provides on-chip. With 53 GPIO pins, one 64-LQFP device can directly drive relays, high-side switches, and LED loads without port expanders, and the 16-channel 12-bit ADC (2.5 us conversion) reads switch arrays, position sensors, and current-sense shunts. Flash of 60KB accommodates diagnostic stacks and failure logging that smaller DV variants cannot hold, making the DV60A the top-of-range choice for feature-rich body modules.

🔧

LIN Master Network Nodes

As a LIN master, the MC9S08DV60AMLH schedules and supervises up to a LIN cluster of slave nodes in applications such as seat modules, mirror controls, HVAC dampers, and wiper systems. The integrated LIN master support means the scheduling table, baud-rate generation, and break/sync handling run from on-chip peripherals with modest CPU load on the 40MHz HCS08 core, leaving headroom for application logic and diagnostics. Its 60KB Flash holds the master schedule tables, DBC-derived signal handling, and UDS-style diagnostic handlers that LIN masters commonly require. A single external LIN transceiver (such as an MC33661-class part) completes the physical layer; the 12-bit ADC then reads feedback currents from the slave-controlled actuators for plausibility checking at the master node.

🏭

Industrial Motor Control Panels

In industrial motor control panels, the MC9S08DV60AMLH sequences contactors, reads potentiometer speed commands, and communicates setpoints over CAN to drives and PLC I/O. The 20MHz bus clock executes PI-loop control code with deterministic latency, while the 16-channel 12-bit ADC samples current-shunt and back-EMF feedback at microsecond-scale conversion times (2.5 us per conversion) suitable for per-phase current monitoring. The 53 GPIO directly drive opto-isolated gate drivers and relay coils through transistor buffers. Because the device tolerates 3.3V/5V operation, it interfaces cleanly with both legacy 5V industrial signal levels and modern 3.3V logic. The 60KB Flash leaves ample room for fault tables, Modbus/CAN bridging firmware, and field-updatable parameter storage.

🧩

Building Automation Sensor Nodes

Building automation nodes benefit from the MC9S08DV60AMLH's combination of a 12-bit ADC for temperature, humidity, and occupancy sensors and CAN/LIN networking for daisy-chained room controllers. The HCS08 core's low peripheral-driven interrupt overhead allows the MCU to sleep between scheduled samples, and the external oscillator supports accurate timekeeping for scheduling logic. Sixteen ADC channels let a single node aggregate multiple sensor inputs - for example, four temperature probes, a CO2 sensor, and a setpoint potentiometer - without a separate analog front end. The 64-LQFP 10x10mm footprint suits compact wall-box and ceiling-mount housings, and 60KB Flash supports BACnet-style message handling or proprietary CAN application layers with room for OTA-style firmware updates.

🌐

CAN Gateways and Bridges

The MC9S08DV60AMLH serves as a compact CAN-to-LIN or CAN-to-UART gateway, translating between an automotive/industrial CAN backbone and low-cost LIN or serial sub-networks. The on-chip MSCAN module handles full CAN 2.0A/B frame buffering in hardware, while LIN master support manages the schedule-driven lower bus; the 40MHz HCS08 core performs the translation layer in between. Gateway code - frame filters, signal remapping, and timeout supervision - fits comfortably in 60KB Flash with 3KB RAM for message queues. Because the DV60A is a single-chip solution, gateway nodes can be built without external protocol controllers, reducing BOM cost and PCB area. Its 5V operation also simplifies interfacing with legacy 5V CAN transceivers common in industrial installations.

💡

Lighting Control Modules

Automotive and architectural LED lighting controllers use the MC9S08DV60AMLH to generate PWM dimming from its timer channels while monitoring LED current via the 12-bit ADC. The 53 GPIO outputs support per-string enable lines and diagnostic multiplexing, and the 60KB Flash stores dimming curves, temperature-derating tables, and fault latching logic required by automotive lighting specifications. Communication with the vehicle or building controller runs over the on-chip CAN or LIN master, receiving color/intensity commands and reporting open-circuit or over-temperature faults detected by the ADC. The device's 5V-tolerant I/O drives external high-side LED drivers directly, and the 20MHz bus gives sufficient headroom for closed-loop current regulation on multiple channels simultaneously.

Сводка рекомендуемых товаров

MC33907 System basis chip power supply for automotive MCU Используется в: Automotive Body Electronics, LIN Master Network Nodes TJA1055 Fault-tolerant CAN transceiver Используется в: Automotive Body Electronics, Lighting Control Modules MC33661 LIN physical layer transceiver Используется в: LIN Master Network Nodes, CAN Gateways and Bridges TJA1050 NXP Semiconductors Используется в: Industrial Motor Control Panels, CAN Gateways and Bridges MC34167 Step-down switching regulator for 5V rail Используется в: Industrial Motor Control Panels MCP9700 Analog temperature sensor for ADC channel Используется в: Building Automation Sensor Nodes TJA1054 Fault-tolerant CAN transceiver Используется в: Building Automation Sensor Nodes MC33883 H-bridge / LED driver interface Используется в: Lighting Control Modules
What is the MC9S08DV60AMLH microcontroller?
The MC9S08DV60AMLH is an NXP Semiconductors 8-bit HCS08 microcontroller with 60KB Flash, 3KB RAM, a 40MHz CPU (20MHz bus), on-chip CAN (MSCAN) and LIN master peripherals, a 16-channel 12-bit ADC, and 53 general-purpose I/O pins in a 64-pin LQFP package. According to the NXP MC9S08DV60 datasheet, the DV series targets automotive and industrial networked control nodes requiring CAN and LIN connectivity on a low-cost 8-bit platform.
What is the price of MC9S08DV60AMLH?
Pricing on this page shows approximately $6.20 at quantity 1, stepping down to about $3.85 at 1000 units, as of 2026-10-18. Final XAIPART pricing is confirmed at quote time because inventory for this NXP part fluctuates with authorized-distributor stock. For a formal quotation, request pricing at your required quantity and lead time; volume tiers at 500 and 1000 pieces deliver the best unit economics for production builds.
Where to buy MC9S08DV60AMLH online?
You can buy the MC9S08DV60AMLH directly on this XAIPART product page, or verify stock at authorized distributors such as Mouser (mouser.com) and DigiKey (digikey.com), both of which list the part as an NXP 8-bit MCU with 60K Flash and CAN/LIN support. Independent stock (for example Heisener listing 7,680 pieces) is also available. Always purchase through authorized channels for traceability on automotive programs.
What is the difference between MC9S08DV60AMLH and MC9S08DZ60MLH?
The MC9S08DV60AMLH belongs to the DV series (CAN plus LIN master, general-purpose automotive/industrial MCU), while the MC9S08DZ60MLH belongs to the DZ series, which is an automotive-focused family with additional system features. Both use the same S08 core and 64-LQFP housing. According to comparison listings, the DV60A emphasizes CAN/LIN master networking in a simpler peripheral set, whereas DZ60 adds automotive-qualified integration. Verify your required peripheral mix against both datasheets before substitution.
What is the best drop-in replacement for MC9S08DV60AMLH?
The best drop-in replacements are same-family DV-series variants in the same 64-LQFP package: the MC9S08DV48AMLH (48KB Flash, pin-to-pin), MC9S08DV32AMLH (32KB Flash), and MC9S08DV16AMLH (16KB Flash). These share the identical HCS08 core, peripheral set, and 64-LQFP footprint, so PCB rework is not needed - only Flash-size headroom differs. If your firmware fits in 48KB or less, the DV48 variant is the closest economical substitute.
Is the S9S08DZ60F1VLH a suitable alternative to MC9S08DV60AMLH?
The S9S08DZ60F1VLH is an NXP automotive-grade (AEC-Q100) S08 MCU with 60KB program memory in a 64-LQFP package, frequently cross-compared with the MC9S08DV60AMLH on distributor comparison sites. It is a strong candidate when automotive qualification matters, but it is a DZ-series part, so peripheral mappings and register sets differ from the DV series - firmware must be re-validated and pin functions checked against the DZ60 datasheet. It is not a true drop-in; treat it as a redesign-level alternative.
When should I choose the MC9S08DV60AMLH over an alternative?
Choose the MC9S08DV60AMLH when your design needs on-chip CAN and LIN-master networking, 12-bit ADC, and 60KB Flash in a 5V-tolerant 8-bit platform, without the cost of a 32-bit MCU. Choose the smaller DV48/DV32/DV16 variants when Flash needs are lower and cost matters; choose the DZ-series (DZ60) when automotive qualification per AEC-Q100 is mandatory; choose an S12 or Kinetis family part when you need 16/32-bit performance. The DV60A sits at the top of the DV Flash range.
What are the key specifications of MC9S08DV60AMLH that engineers should know?
Key specifications: 40MHz HCS08 CPU with 20MHz bus; 60KB (60K x 8) Flash; 3KB RAM; 53 GPIO plus 1 input-only pin; 16-channel 12-bit ADC with 2.5 microsecond conversion; MSCAN controller and LIN master support; external oscillator; up to 32 interrupt/reset sources; 3.3V/5V operation; 64-pin LQFP 10x10mm surface-mount package; HC08 instruction set with BGND background-debug instruction. Per the NXP MC9S08DV60 datasheet, these parameters define the family ceiling for Flash-dense CAN/LIN 8-bit designs.
Where to download the MC9S08DV60AMLH datasheet PDF?
The official datasheet PDF for the MC9S08DV60AMLH is the NXP document 'MC9S08DV60, MC9S08DV48, MC9S08DV32, MC9S08DV16 - Data Sheet', downloadable from nxp.com at https://www.nxp.com/docs/en/data-sheet/MC9S08DV60.pdf. A linked datasheet PDF is also available on this page. The same document covers the whole DV16/32/48/60 family, which is convenient when evaluating same-package Flash-size variants for cost reduction.
Is the MC9S08DV60AMLH still in production and available?
As of 2026-10-18, the MC9S08DV60AMLH is listed as an active NXP part with stock available at authorized distributors (Mouser, DigiKey) and independent sources (for example, Heisener showing 7,680 pieces). NXP continues to serve the automotive S08 installed base, but for long-life automotive programs we recommend confirming lifetime status via NXP's product page and considering the S9S08DZ60 automotive variant in your dual-sourcing strategy.
Does MC9S08DV60AMLH support CAN and LIN?
Yes. The MC9S08DV60AMLH integrates NXP's MSCAN (Motorola Scalable Controller Area Network) module for 2.0A/B CAN communication and LIN master support, as stated in the Mouser product listing ('60K FL, 3K RAM, CAN LIN MASTER'). Note that both buses require external physical-layer transceivers (for example, an MC33661 LIN transceiver or TJA1050-family CAN transceiver) since the MCU provides only the protocol controllers.
What supply voltage does the MC9S08DV60AMLH require?
The MC9S08DV60AMLH operates from a 3.3V or 5V supply per distributor specification data. The wide 3.3V/5V operating window lets the same firmware design serve both 5V automotive sensor rails and 3.3V industrial logic domains. Verify the exact minimum/maximum operating voltage range and ADC reference behavior at your chosen rail in the NXP MC9S08DV60 datasheet electrical characteristics chapter before finalizing the power architecture.
How many GPIO pins does the MC9S08DV60AMLH have?
The MC9S08DV60AMLH provides 53 general-purpose input/output pins plus 1 input-only pin, per the NXP MC9S08DV60 datasheet development support and I/O section. In the 64-LQFP package, the remaining pins are allocated to power, ground, oscillator, reset, background debug, and peripheral functions such as the ADC channels and CAN/LIN ports. Many GPIO pins are multiplexed with peripheral functions, so pin assignment must be planned against your peripheral usage.
Is MC9S08DV60AMLH the same as MC9S08DV60AMLF or other suffixes?
No - the suffix encodes package and packaging variant. The 'LH' suffix of MC9S08DV60AMLH indicates the 64-LQFP (10x10 mm) package in tray packaging. Other suffixes denote different packages (for example QFN-style housings) or tape-and-reel packing; those variants are not pin-compatible across package types even though the die and firmware are identical. Always match the full suffix, or confirm package equivalence, before substituting suffix variants on an existing PCB.
What is the best cross-brand equivalent for MC9S08DV60AMLH?
There is no verified pin-to-pin cross-brand drop-in equivalent for the MC9S08DV60AMLH in current distributor cross-reference data; NXP's S08 automotive MCUs have no direct footprint-identical competitor part. The nearest functional equivalents are Microchip PIC18 or Renesas 78K/RL78 CAN-enabled 8-bit MCUs, but those require new PCB layouts and firmware ports. For footprint-compatible options, stay within the NXP S08 DV/DZ families; cross-brand migration should be treated as a redesign project with full requalification.

Справочные инженерные данные для MC9S08DV60AMLH — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MC9S08DV60AMLH when your design needs the maximum 60KB Flash in the S08 DV family together with on-chip CAN and LIN master support - typical for body controllers, gateways, and lighting modules with diagnostic stacks. If your firmware fits within 48KB or 32KB, the pin-compatible MC9S08DV48AMLH or MC9S08DV32AMLH deliver identical peripherals in the same 64-LQFP footprint at lower cost; they are true drop-in downgrades. Select the MC9S08DZ60MLH or S9S08DZ60F1VLH when formal automotive qualification (AEC-Q100) and the DZ-series system features are contractual requirements - but budget for firmware revalidation since register maps differ from the DV series. There is no verified cross-brand pin-compatible drop-in; migrating to Microchip PIC18 or Renesas RL78 CAN MCUs is a redesign with new layout and ported firmware. For 16/32-bit processing needs, step up to the S12 or Kinetis families instead.

Сравнение с аналогами

Параметр Этот товар MC9S08DV48AMLH MC9S08DV32AMLH MC9S08DZ60MLH S9S08DZ60F1VLH
Package 64-LQFP (10x10 mm) 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Program Flash 60KB (60K x 8) 48KB 32KB 60KB 60KB (mask/program)
CPU Speed 40MHz (20MHz bus) 40MHz (20MHz bus) 40MHz (20MHz bus) 40MHz (20MHz bus) S08 core, 40MHz class
CAN / LIN MSCAN + LIN master MSCAN + LIN master MSCAN + LIN master MSCAN + LIN MSCAN + LIN
Automotive Grade Automotive-oriented DV series (AEC-Q100 not confirmed in provided data) Same family Same family Automotive DZ series Yes (automotive S9 prefix)

Ключевые отличия

  • Largest Flash in the DV family (против MC9S08DV48AMLH)
  • Single-chip CAN + LIN master integration (против MC9S08DV32AMLH)
  • DV-series simplicity vs DZ-series automotive overhead (против MC9S08DZ60MLH)

Заметки по проектированию

The 64-LQFP (10x10 mm) footprint requires a standard 0.5mm-pitch land pattern per the NXP datasheet package drawing. Place the VDD/VSS decoupling pair (typically 100nF ceramic plus bulk capacitance) directly adjacent to each power pin pair, with a solid ground plane on layer 2. Route the CAN and LIN transceiver connections with short traces and place the transceiver close to the MCU pins; keep the crystal/oscillator traces short and guarded by ground. Expose adequate thermal relief via the ground plane - the LQFP has no thermal pad but the ground plane handles dissipation at this power level.

Do not confuse DV-series and DZ-series register maps: although the MC9S08DZ60MLH shares the 64-LQFP footprint and S08 core, peripheral register addresses differ, so existing DV60 firmware will not run unmodified on DZ silicon. Also verify oscillator startup: the MC9S08DV60AMLH uses an external oscillator option, and incorrect load capacitors are a common cause of unreliable boot in automotive environments. Finally, the ADC reference should be routed cleanly from VDDA with local filtering to preserve 12-bit accuracy.

The MC9S08DV60AMLH operates from 3.3V or 5V rails. Estimated: at 40MHz CPU / 20MHz bus with all peripherals clocked, S08-family core current is in the tens of milliamps (consult the datasheet electrical characteristics table for the exact IDD vs bus-frequency curve); size the 5V regulator accordingly and add margin for GPIO sink current driving LEDs or relays through buffers. Use a local LDO or system basis chip (for example MC33907-class) in automotive designs to handle load-dump and crank profiles on the supply rail.

For CAN networks, match the physical layer to the network type: use a high-speed transceiver (TJA1050-class) for 500kbps HS-CAN backbones or a fault-tolerant transceiver (TJA1055-class) for low-speed body CAN. Keep the split-termination and common-mode choke layout symmetrical, and route the MCU's CAN TX/RX traces away from the oscillator and ADC reference lines. LIN bus lines should reach the connector with a series pull-up/suppression network per the LIN specification to meet automotive EMI requirements.

Информация о соответствии

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Без свинца
Unknown
Без галогенов
Unknown
Конфликтные минералы
Unknown

Compliance data not explicitly stated in the provided web data. The MC prefix denotes a standard (non-automotive-suffix) part; the S9S08DZ60F1VLH alternative carries the automotive designation. Verify RoHS/REACH status on the official NXP product page.

Данные проверены: 2026-10-18 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors MC9S08DV60AMLH HCS08 S08 core 8-bit microcontroller microcontroller unit (MCU) embedded processor MSCAN Controller Area Network (CAN) LIN master 12-bit ADC 64-LQFP LQFP package family surface mount (SMD) RoHS AEC-Q100 MC9S08DZ60MLH S9S08DZ60F1VLH MC9S08DV48AMLH automotive body electronics MC9S08DV60 Freescale Semiconductor BGND instruction 3KB RAM
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