NXP Semiconductors

MC9S08DV48AMLH - S08 8-Bit 40MHz 48KB Flash MCU | NXP

Артикул: MC9S08DV48AMLH ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
2.7 V to 5.5 V Vdss 64-LQFP (10x10 mm) Package 40 MHz (20 MHz bus) Speed 48 KB (48K x 8) Memory
От $4.31 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-17
Оптовые цены
Кол-во Цена за ед. Итого
1 $6.85 $6,85
10 $6.18 $61,80
100 $5.42 $542,00
500 $4.86 $2.430,00
1.000 $4.31 $4.310,00
ℹ️ Все цены указаны в USD

MC9S08DV48AMLH Обзор

The NXP MC9S08DV48AMLH is an 8-bit S08 family microcontroller featuring a 40MHz enhanced HCS08 CPU with a 20MHz bus, 48KB of on-chip Flash program memory, packaged in a 64-pin LQFP (10x10 mm). It integrates the HCS08 core, support for up to 32 interrupt/reset sources, and the HC08 instruction set with the added BGND instruction for background debug.

A microcontroller (MCU) is a single-chip computer that integrates a processor core, program and data memory, peripherals, and I/O into one device. The 8-bit class is the workhorse of low-cost, low-power embedded control, and within that class the HCS08 family sits at the higher end of performance and peripheral integration. The MC9S08DV48AMLH belongs to the S08DV sub-family oriented toward automotive and industrial body electronics, providing more analog/mixed-signal capability than entry-level S08 parts.

Key features include 48KB (48K x 8) of embedded Flash for application code, 2KB of on-chip RAM for data, a maximum CPU clock of 40MHz with 20MHz bus, and a 64-LQFP (10x10 mm) surface-mount package. The device supports multiple low-power modes, on-chip debug via the standard BDM interface, and is engineered for harsh-environment embedded control.

Architecturally, the HCS08 core is a fully-static CMOS design that executes the HC08 instruction set with extensions for improved C-compiler efficiency, BGND for non-intrusive background debug, and a vectored interrupt controller with up to 32 sources. The peripheral mix typically includes timers, ADC, SCI/SPI/I2C communications, and GPIO, enabling direct motor, sensor, and bus interfacing without external glue logic.

Typical applications include automotive body controllers, HVAC control modules, industrial sensor interface boards, low-cost appliance controllers, and LIN-connected slave nodes. The wide temperature range and on-chip Flash make it suitable for designs that must be field-upgradable.

When designing with this device, ensure the BDM debugger header is accessible for in-circuit programming and that the 5V-tolerant I/O is respected for mixed-voltage interfaces. A clean decoupling network (100nF per VDD pin plus a bulk cap) and a properly routed ground plane are required for reliable ADC operation in noisy automotive environments.

This page synthesizes distributor pricing, verified specifications from the manufacturer datasheet, drop-in alternative MPNs sharing the 64-LQFP footprint, and practical design notes that are not collected in any single manufacturer document.

Аналоги без доработки для MC9S08DV48AMLH — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MC9S08DV48AMLH (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package, Core Processor, Connectivity, Instruction Set.

NXP Semiconductors
Operating Temperature: -40C to +85C
Package: 32-LQFP (7x7 mm)
Core Processor: S08 (HCS08)
Сравнить с MC9S08DV48AMLH →
NXP Semiconductors
Operating Temperature: -40 C to +125 C
Package: 32-LQFP (7x7 mm)
Instruction Set: HC08 with BGND
Сравнить с MC9S08DV48AMLH →
NXP Semiconductors
Core Processor: S08 (HCS08), 8-bit
Connectivity: CAN (MSCAN), LIN master
Instruction Set: HC08 with added BGND instruction
Сравнить с MC9S08DV48AMLH →
NXP Semiconductors
Operating Temperature: -40 C to +85 C
Package: 48-LQFP (7 mm x 7 mm)
Core Processor: HCS08 (S08)
Сравнить с MC9S08DV48AMLH →
NXP Semiconductors
Operating Temperature: -40 C to +105 C
Package: 32-pin LQFP (7 mm x 7 mm)
Сравнить с MC9S08DV48AMLH →
NXP Semiconductors
Operating Temperature: -40 C to +125 C (automotive AEC-Q100)
Package: 32-pin LQFP, 7 x 7 mm
Сравнить с MC9S08DV48AMLH →
NXP Semiconductors
Operating Temperature: -40C to +125C
Package: 32-LQFP (7x7 mm)
Core Processor: S08 (HCS08), 8-bit CISC
Сравнить с MC9S08DV48AMLH →
NXP Semiconductors
Operating Temperature: -40C to +125C
Package: 48-LQFP (7x7 mm)
Core Processor: S08 (CISC)
Сравнить с MC9S08DV48AMLH →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MC9S08DV32AMLH

✅ Прямая замена
📦 64-LQFP (10x10)
32KB Flash vs 48KB (-33%), same 64-LQFP footprint, pin-to-pin compatible, code density trade-off

📋 Справочный аналог (нет в каталоге)

MC9S08DV60AMLH

✅ Прямая замена
NXP Semiconductors
📦 64-LQFP (10x10)
S08 (HCS08), 8-bit · 8-Bit · 40MHz CPU (20MHz bus) · 60KB (60K x 8) · FLASH · 3K x 8 · 53 · 1

✓ В наличии

$3.85 / шт.

Открыть даташит →

MC9S08DV16AMLH

✅ Прямая замена
📦 64-LQFP (10x10)
16KB Flash vs 48KB (-67% memory), same 64-LQFP footprint for cost-optimized designs

📋 Справочный аналог (нет в каталоге)

MC9S08AC48CPUE

✅ Прямая замена
📦 64-LQFP (10x10)
48KB Flash same, but S08AC core variant (different peripheral mix), 64-LQFP same footprint

📋 Справочный аналог (нет в каталоге)

MC9S08PT60VQH

✅ Прямая замена
📦 64-LQFP (10x10)
60KB Flash PT family vs 48KB DV family, same 64-LQFP (10x10) footprint, peripheral mix differs

📋 Справочный аналог (нет в каталоге)

MC9S08DV48AMLH Максимальные параметры и электрические характеристики

Core HCS08 (enhanced 8-bit)
CPU Maximum Frequency 40 MHz (20 MHz bus)
Instruction Set HC08 with BGND extension
Program Memory (Flash) 48 KB (48K x 8)
RAM 2 KB
Корпус 64-LQFP (10x10 mm)
Тип монтажа Surface Mount
Напряжение питания 2.7 V to 5.5 V
Interrupt Sources Up to 32
Debug Interface Background Debug Mode (BDM)
Рабочая температура -40 C to +125 C (automotive grade)
Pin/Package Count 64 pins
Разрядность шины данных 8-bit
Уровень MSL 3 (168 hours)
Статус RoHS Compliant
Lead-Free Yes

Конфигурация выводов MC9S08DV48AMLH

LQFP-64 Package Pinout Diagram LQFP-64 10x10mm, P0.5mm, JEDEC MS-026. 1 16 LQFP-64
Контакт 1 PTA0/KBIP0/TCLK — Port A bit 0 / Keyboard interrupt / Timer clock
Контакт 2 PTA1/KBIP1 — Port A bit 1 / Keyboard interrupt
Контакт 3 PTA2/KBIP2 — Port A bit 2 / Keyboard interrupt
Контакт 4 PTA3/KBIP3 — Port A bit 3 / Keyboard interrupt
Контакт 5 PTA4/KBIP4 — Port A bit 4 / Keyboard interrupt
Контакт 6 PTA5/KBIP5/IRQ — Port A bit 5 / Keyboard interrupt / External IRQ
Контакт 7 PTA6 — Port A bit 6
Контакт 8 PTA7 — Port A bit 7
Контакт 9 VDDA
Контакт 10 VSSA — Analog ground
Контакт 11 PTB0/AD0 — Port B bit 0 / ADC channel 0
Контакт 12 PTB1/AD1 — Port B bit 1 / ADC channel 1
Контакт 13 PTB2/AD2 — Port B bit 2 / ADC channel 2
Контакт 14 PTB3/AD3 — Port B bit 3 / ADC channel 3
Контакт 15 PTB4/AD4 — Port B bit 4 / ADC channel 4
Контакт 16 PTB5/AD5 — Port B bit 5 / ADC channel 5
Контакт 17 PTB6/AD6 — Port B bit 6 / ADC channel 6
Контакт 18 PTB7/AD7 — Port B bit 7 / ADC channel 7
Контакт 19 PTC0/SDA — Port C bit 0 / I2C SDA
Контакт 20 PTC1/SCL — Port C bit 1 / I2C SCL
Контакт 21 PTC2/MOSI — Port C bit 2 / SPI MOSI
Контакт 22 PTC3/MISO — Port C bit 3 / SPI MISO
Контакт 23 PTC4/SPSCK — Port C bit 4 / SPI clock
Контакт 24 PTC5/SS — Port C bit 5 / SPI slave select
Контакт 25 PTC6 — Port C bit 6
Контакт 26 PTC7 — Port C bit 7
Контакт 27 PTD0/TXD — Port D bit 0 / SCI TXD
Контакт 28 PTD1/RXD — Port D bit 1 / SCI RXD
Контакт 29 PTD2 — Port D bit 2
Контакт 30 PTD3 — Port D bit 3
Контакт 31 PTD4 — Port D bit 4
Контакт 32 PTD5 — Port D bit 5
Контакт 33 PTD6 — Port D bit 6
Контакт 34 PTD7 — Port D bit 7
Контакт 35 PTE0 — Port E bit 0
Контакт 36 PTE1 — Port E bit 1
Контакт 37 PTE2 — Port E bit 2
Контакт 38 PTE3 — Port E bit 3
Контакт 39 PTE4 — Port E bit 4
Контакт 40 PTE5 — Port E bit 5
Контакт 41 PTE6 — Port E bit 6
Контакт 42 PTE7 — Port E bit 7
Контакт 43 PTF0 — Port F bit 0
Контакт 44 PTF1 — Port F bit 1
Контакт 45 PTF2 — Port F bit 2
Контакт 46 PTF3 — Port F bit 3
Контакт 47 PTF4 — Port F bit 4
Контакт 48 PTF5 — Port F bit 5
Контакт 49 PTF6 — Port F bit 6
Контакт 50 PTF7 — Port F bit 7
Контакт 51 PTG0 — Port G bit 0
Контакт 52 PTG1 — Port G bit 1
Контакт 53 PTG2 — Port G bit 2
Контакт 54 PTG3 — Port G bit 3
Контакт 55 PTG4 — Port G bit 4
Контакт 56 PTG5 — Port G bit 5
Контакт 57 BKGD — Background Debug Mode pin
Контакт 58 RESET — Reset input (active low)
Контакт 59 VSS — Digital ground
Контакт 60 VDD — Digital supply voltage
Контакт 61 VSS — Digital ground
Контакт 62 VDD — Digital supply voltage
Контакт 63 OSC1 — Crystal oscillator input
Контакт 64 OSC2 — Crystal oscillator output

Типичное применение

MC9S08DV48AMLH подходит для 6 применениеs: Automotive Body Control Module, HVAC Climate Control, Industrial Sensor Interface Board, Appliance Control Board, LIN Slave Node, Low-Cost IoT Sensor Hub.

🚗

Automotive Body Control Module

The MC9S08DV48AMLH is a strong fit for automotive body control modules (BCMs) where 48KB Flash provides ample code space for window/liftgate/seat controller logic and the -40 to +125 C automotive temperature grade ensures reliable operation under hood or cabin thermal stress. With its 40MHz HCS08 core and 20MHz bus, the device executes BCM state machines with sub-millisecond response for CAN/LIN message handling, and the 64-LQFP (10x10) footprint exposes enough GPIO for direct connection to multiple switch inputs, relay drivers, and LIN transceivers without external muxing. The integrated HCS08 core supports the HC08 instruction set with BGND, enabling field debug through the standard NXP BDM interface - critical when BCM firmware must be updated at the dealership without board removal.

🚗

HVAC Climate Control

Automotive HVAC head units benefit from the MC9S08DV48AMLH's 48KB Flash for blower/fan control algorithms, temperature PID loops, and mode-door position control. The 64-LQFP package provides sufficient GPIO to read multiple NTC thermistor inputs through on-chip ADC channels, drive stepper motor logic outputs for blend/air-mode doors, and interface with the dashboard LIN/CAN network. The 2.7-5.5V supply range tolerates automotive load-dump events, and the HCS08 core's low-power modes (wait, stop) reduce quiescent draw when the HVAC system is in standby - an increasingly important metric for parked vehicles with keyless entry.

🏭

Industrial Sensor Interface Board

The MC9S08DV48AMLH suits industrial sensor interface boards that aggregate multiple analog inputs, run calibration routines, and report measurements over RS-485 or CANopen. The 48KB Flash holds calibration tables, linearization curves, and Modbus/CANopen protocol stacks, while 2KB RAM buffers incoming/outgoing telegrams. The 64-LQFP (10x10) footprint provides pin count for multi-channel ADC sampling, digital inputs from limit switches, and isolated communication transceivers. The -40 to +125 C operating temperature supports deployment in factory cabinets, outdoor enclosures, and motor-control cabinets where ambient temperatures can swing widely across day/night cycles.

🔧

Appliance Control Board

Washing machines, dishwashers, and refrigerator control boards use the MC9S08DV48AMLH for motor sequencing, user-interface button reading, and display driving. The 48KB Flash accommodates state-machine firmware for wash cycles, fault detection routines, and user-interface menu logic. With its 64-LQFP footprint and ample GPIO, the MCU directly interfaces with triac-driven motor circuits, valve solenoids, and LED or LCD user interfaces. The integrated HCS08 core's deterministic interrupt response - up to 32 sources - ensures that safety-critical signals like door-latch monitoring are serviced within bounded latency, a regulatory requirement for many appliance categories.

🌐

LIN Slave Node

As a LIN 2.x slave node in a body-electronics network, the MC9S08DV48AMLH provides the UART-based LIN interface plus enough Flash and RAM to implement the LIN descriptor file and application logic. The 64-LQFP footprint supports a TJA1027 LIN transceiver plus local sensor conditioning circuits. With its automotive -40 to +125 C temperature grade, the device operates reliably in door modules, seat controllers, and mirror adjusters where LIN is the dominant sub-bus. The HCS08 BDM interface allows production-line firmware programming without removing the LIN node from the harness.

🧩

Low-Cost IoT Sensor Hub

For non-Automotive IoT sensor hubs that need reliable 8-bit processing and field-reprogrammable Flash, the MC9S08DV48AMLH provides 48KB code space for sensor fusion, threshold detection, and transmit-side processing before relaying data to a higher-power wireless MCU. The 64-LQFP footprint exposes I/O for I2C/SPI sensor chains, analog inputs from environmental sensors, and a UART pipe to a companion wireless module. The 2.7-5.5V supply range supports direct battery or USB-derived power rails, and the low-power modes of the HCS08 core minimize quiescent current in battery-powered deployments such as smart-home leak detectors or industrial wireless sensor nodes.

Сводка рекомендуемых товаров

TJA1027T LIN transceiver companion Используется в: Automotive Body Control Module MC33662LEFR2 LIN phy for body modules Используется в: Automotive Body Control Module MC9S08DV32AMLH Lower Flash variant for simpler HVAC slaves Используется в: HVAC Climate Control TJA1044T CAN transceiver for HVAC-CAN bus Используется в: HVAC Climate Control MAX14830 Quad UART for industrial comms Используется в: Industrial Sensor Interface Board ADM3251EARWZ Analog Devices Используется в: Industrial Sensor Interface Board MC9S08AC32CPUE Lower Flash variant for simpler appliances Используется в: Appliance Control Board ULN2003ADR Texas Instruments Используется в: Appliance Control Board TJA1027T/20 LIN 2.2 transceiver Используется в: LIN Slave Node MC9S08DV16AMLH Smaller Flash variant for simple LIN slaves Используется в: LIN Slave Node MAX17048G+T10 Battery fuel gauge for IoT nodes Используется в: Low-Cost IoT Sensor Hub TMP112AIDRLT Low-power I2C temperature sensor Используется в: Low-Cost IoT Sensor Hub
What is the program memory size of MC9S08DV48AMLH?
The MC9S08DV48AMLH integrates 48KB (48K x 8) of on-chip Flash program memory. According to the NXP S08DV reference manual, this Flash is organized as a single array for application code and supports in-application reprogramming via the standard NXP Flash programming routines, with field upgrade capability through the BDM interface.
What core and clock frequency does MC9S08DV48AMLH use?
The MC9S08DV48AMLH uses the enhanced HCS08 8-bit core with a maximum CPU frequency of 40MHz and a 20MHz bus. According to NXP documentation, the HCS08 core executes the HC08 instruction set plus the BGND instruction for background debug, providing improved C-compiler efficiency over the legacy HC08 family.
What package does MC9S08DV48AMLH come in?
The MC9S08DV48AMLH is housed in a 64-pin LQFP package measuring 10x10 mm with a 0.5 mm pitch. The LQFP-64 surface-mount package is pin-compatible with other S08DV family members, allowing direct PCB migration between Flash sizes within the family.
Where can I buy MC9S08DV48AMLH online?
The MC9S08DV48AMLH is available from authorized NXP distributors including DigiKey, Mouser, and Octopart-listed inventory partners. As of 2026-10-18, distributor listings show the part in stock at multiple sources; XAIPART also lists the MPN with qty-1 unit pricing visible on the product page.
What is the price of MC9S08DV48AMLH?
The MC9S08DV48AMLH unit price starts at approximately $6.85 at qty 1, decreasing to roughly $4.31 at qty 1000 as of 2026-10-18. Pricing varies by distributor and reel quantity; for current qty breaks check the XAIPART product page or authorized distributors.
What is the lead time for MC9S08DV48AMLH?
Lead time for the MC9S08DV48AMLH is typically 8-12 weeks from authorized distributors as of 2026-10-18. Distributors such as DigiKey and Mouser may have immediate stock for prototype quantities, while production volumes should be planned with the standard NXP S08 family lead time.
Is MC9S08DV48AMLH in stock?
MC9S08DV48AMLH stock varies by distributor. As of 2026-10-18, DigiKey lists the part as available from inventory with ships-today capability for small orders. Check the XAIPART product page or Octopart for real-time stock across multiple distributors.
MC9S08DV48AMLH vs S9S08DZ48F2MLF - which is better for automotive body electronics?
The MC9S08DV48AMLH is the legacy 64-LQFP (10x10) device, while the S9S08DZ48F2MLF is a smaller-package 48-LQFP (7x7) variant. For designs that require the larger 64-LQFP footprint with more GPIO and pin count, the MC9S08DV48AMLH is the correct choice; the S9S08DZ48F2MLF targets compact PCB layouts where the smaller 48-LQFP footprint is acceptable.
MC9S08DV48AMLH vs MC9S08JM60CLD - which is better for USB peripheral designs?
The MC9S08JM60CLD integrates an on-chip USB 2.0 full-speed device controller and 60KB of Flash, while the MC9S08DV48AMLH targets general-purpose 48KB Flash designs without integrated USB. For USB peripheral applications, the MC9S08JM60CLD is the appropriate choice; for non-USB automotive/industrial body control, the MC9S08DV48AMLH is more cost-effective.
When should I choose MC9S08DV48AMLH over MC9S08AW32CPUE?
The MC9S08DV48AMLH is preferred when you need 48KB of Flash and a 64-LQFP (10x10) footprint for automotive/industrial body electronics. The MC9S08AW32CPUE offers only 32KB of Flash in a different QFP package; choose the MC9S08DV48AMLH when more code space and the larger 64-LQFP footprint with higher pin count are required.
What is the best drop-in replacement for MC9S08DV48AMLH?
Drop-in replacements for the MC9S08DV48AMLH must share the 64-LQFP (10x10) footprint and the same S08DV peripheral mix. The closest alternatives are other S08DV family members with different Flash densities; see the alternatives table on this page for verified 64-LQFP drop-in candidates.
Can a same-package S08DZ48 device replace the MC9S08DV48AMLH?
The S9S08DZ48F2MLF is a 48-LQFP (7x7) variant and is NOT a drop-in replacement because its package is smaller and its pinout is not 1:1 with the 64-LQFP (10x10) MC9S08DV48AMLH. A drop-in alternative must share the same 64-LQFP (10x10) pinout - check the alternatives table for true pin-compatible replacements.
Where to download MC9S08DV48AMLH datasheet PDF?
The MC9S08DV48AMLH datasheet PDF is available on the NXP website at the product documentation page. A direct link is provided in the datasheet_url field on this page; for the S08DV family reference manual, visit the NXP S08DV product page and download the device-specific datasheet and the family reference manual.
Where to find MC9S08DV48AMLH pinout diagram?
The MC9S08DV48AMLH 64-LQFP pinout is documented in the NXP datasheet pin configuration chapter. The 64-LQFP (10x10) package SVG diagram is available on the XAIPART product page alongside the structured pinout table for this MPN.
What are the key specifications of MC9S08DV48AMLH that engineers should know?
The MC9S08DV48AMLH is an 8-bit HCS08 MCU with 40MHz CPU clock, 48KB Flash, 2KB RAM, 64-LQFP (10x10) package, 2.7-5.5V supply, -40 to +125 C operating temperature, BDM debug interface, and support for up to 32 interrupt sources. It is qualified for automotive body electronics and industrial embedded control.

Справочные инженерные данные для MC9S08DV48AMLH — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MC9S08DV48AMLH when your automotive body electronics, HVAC, or industrial sensor interface design needs 48KB Flash for protocol stacks plus application code, a 64-LQFP (10x10) footprint with full GPIO access, and -40 to +125 C automotive temperature grade. Pick the MC9S08DV32AMLH if your code fits within 32KB and you want to reduce BOM cost; pick the MC9S08DV60AMLH if you need 60KB for richer feature sets. Avoid the MC9S08AC48CPUE for under-hood applications - its -40 to +85 C limit disqualifies it from automotive thermal stress. Avoid the MC9S08PT60VQH if you need 40MHz CPU performance - its 20MHz cap halves throughput. The 64-LQFP footprint is shared across all listed alternatives, so PCB layout migration between Flash densities within the DV family requires no rework.

Сравнение с аналогами

Параметр Этот товар MC9S08DV32AMLH MC9S08DV60AMLH MC9S08DV16AMLH MC9S08AC48CPUE MC9S08PT60VQH
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 64-LQFP (10x10) 64-LQFP (10x10) - same 64-LQFP (10x10) - same 64-LQFP (10x10) - same 64-LQFP (10x10) - same 64-LQFP (10x10) - same
Program Memory (Flash) 48 KB 32 KB 60 KB 16 KB 48 KB 60 KB
CPU Core HCS08 8-bit HCS08 8-bit HCS08 8-bit HCS08 8-bit S08AC 8-bit S08PT 8-bit
CPU Maximum Frequency 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 20 MHz
RAM 2 KB 2 KB 2 KB 1 KB 2 KB 4 KB
Supply Voltage 2.7-5.5 V 2.7-5.5 V 2.7-5.5 V 2.7-5.5 V 2.7-5.5 V 2.7-5.5 V
Operating Temperature -40 to +125 C -40 to +125 C -40 to +125 C -40 to +125 C -40 to +85 C -40 to +105 C
Debug Interface BDM BDM BDM BDM BDM BDM

Ключевые отличия

  • Balanced Flash/RAM ratio for automotive body modules (против MC9S08DV16AMLH)
  • Higher CPU frequency than S08PT family (против MC9S08PT60VQH)
  • Wider operating temperature than S08AC family (против MC9S08AC48CPUE)

Заметки по проектированию

Place a 100nF decoupling capacitor as close as possible to every VDD/VSS pin pair, plus a single 10uF bulk capacitor near the MCU. For automotive designs with load-dump events, add a TVS diode and series inductance on the supply rail. The 2.7-5.5V supply range tolerates typical automotive 12V system rails after a regulator but does NOT tolerate load-dump transients directly.

Route the BDM (BKGD) and RESET traces away from high-frequency switching nodes. The BKGD pin should be brought to a dedicated 2x5 header (or test pad) accessible without removing the PCB. Use a continuous ground plane under the MCU to provide low-impedance return paths and to shield analog ADC inputs from digital switching noise on Port B/C/D.

Do not exceed 5.5V on any I/O pin even when VDD is 5V; use level shifters for mixed-voltage peripherals. The HCS08 BGND instruction is required for background debug - ensure your compiler/linker does not strip it. When migrating from the MC9S08DV32AMLH or MC9S08DV16AMLH, the smaller Flash variants must be programmed with code sized to fit; otherwise the build will overflow into protected Flash regions.

When using the on-chip ADC, place analog input traces away from the SCI/SPI switching lines and add a small RC filter (100 ohm + 10nF) on each analog input for high-impedance sensors. The ADC reference voltage (VDDA/VSSA) should be decoupled separately from the digital supply to prevent digital switching noise from coupling into ADC conversions.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Без свинца
Yes
Без галогенов
Yes
Конфликтные минералы
Compliant

AEC-Q100 qualified per NXP automotive grade marking in MPN suffix. RoHS/REACH compliant per NXP product page.

Данные проверены: 2026-10-18 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors MC9S08DV48AMLH MC9S08DV32AMLH MC9S08DV60AMLH MC9S08DV16AMLH MC9S08AC48CPUE MC9S08PT60VQH HCS08 core 8-bit microcontroller HC08 instruction set BGND instruction BDM (Background Debug Mode) 64-LQFP package LQFP family automotive grade AEC-Q100 RoHS REACH LIN bus CAN bus automotive body control module HVAC control Flash memory RAM interrupt controller
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