MC9S12GC64MPBE - 16-bit 64KB Flash HCS12 MCU | NXP 52-LQFP
Артикул: MC9S12GC64MPBE ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $15.81 | $15,81 |
| 10 | $14.23 | $142,30 |
| 100 | $12.65 | $1.265,00 |
| 500 | $11.18 | $5.590,00 |
| 1.000 | $9.84 | $9.840,00 |
MC9S12GC64MPBE Обзор
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and programmable I/O peripherals into one device. The HCS12 is a 16-bit CISC core family introduced as the successor to the HC12, with full 16-bit internal data paths and a background debug mode (BDM) interface. Within the broader taxonomy, the HCS12 sits between 8-bit MCUs (e.g. HC08, S08) used for low-cost control and 32-bit MCUs (e.g. S32K, Cortex-M) used for higher-performance networked ECUs; the S12 line remains a workhorse for body controllers, sensor interfaces, and LIN-slave nodes in vehicles.
Key features of the MC9S12GC64MPBE include 64KB Flash, 4KB RAM, and 1KB EEPROM, an integrated phase-lock loop (PLL) for flexible bus-speed configuration, multiple serial interfaces (typically SCI and SPI), a timer module (TIM) with capture/compare/PWM capability, and an A/D converter on chip. The on-chip bandgap VREG with internal regulation simplifies board-level power design versus parts that demand a separate core supply.
From an architectural standpoint, the part uses the standard HCS12 core with a 16-bit ALU, X/Y index registers, and a BDM (Background Debug Mode) port for non-intrusive in-circuit programming and debug. The Flash array supports in-application reprogramming via standard NXP S12 programming routines. The 52-LQFP package is a JEDEC-standard plastic quad flatpack suited to automated SMT assembly.
Typical applications include automotive body controllers, instrument cluster subfunctions, HVAC actuators, LIN/J1850 network nodes, industrial sensor signal conditioning boards, and low-end motor control loops. The on-chip PWM and ADC simplify inverter or actuator drive designs at modest switching frequencies.
Designers should allocate adequate decoupling (typically 100nF ceramic close to each VDD/VSS pair plus a bulk 4.7-10uF) and connect the PLL filter components per the S12 reference manual; the BDM interface should be brought out to a header for field firmware updates.
This page synthesizes distributor pricing, drop-in alternatives, and S12-family design notes not always consolidated in the manufacturer datasheet, helping procurement and firmware engineers evaluate the MC9S12GC64MPBE quickly.
Аналоги без доработки для MC9S12GC64MPBE — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MC9S12GC64MPBE (тот же форм-фактор и посадочное место) — отличается по Package, Lifecycle Status, Core, Core Processor, Data Bus Width.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MC9S12C64MPBE
✅ Прямая замена✓ В наличии
Уточнить цену
Открыть даташит →MC9S12GC32MPBE
✅ Прямая замена✓ В наличии
$14.9905 / шт.
Открыть даташит →MC9S12GC96MPBE
✅ Прямая замена✓ В наличии
$6.05 / шт.
Открыть даташит →MC9S12GC128MPBE
✅ Прямая замена✓ В наличии
$7.9 / шт.
Открыть даташит →MC9S12GC64MPBE Максимальные параметры и электрические характеристики
| Core | HCS12 (16-bit CISC) |
| Series | S12GC (MC9S12GC family) |
| Program Memory | 64 KB Flash |
| RAM | 4 KB |
| EEPROM | 1 KB |
| Bus Speed (max) | 25 MHz |
| Operating Voltage (Vdd) | 2.97 V to 5.5 V |
| Internal Voltage Regulator | On-chip bandgap VREG generating VDD |
| Корпус | 52-LQFP (10x10 mm) |
| Тип монтажа | Surface Mount |
| Рабочая температура | -40C to +125C (industrial/automotive grade) |
| Debug Interface | Background Debug Mode (BDM) |
| Статус RoHS | Compliant |
| Статус жизненного цикла | NRND (Not Recommended for New Designs) |
Конфигурация выводов MC9S12GC64MPBE
| Контакт 1 | PP0/KWP0 — Port P pin 0 / Key Wakeup |
| Контакт 2 | PP1/KWP1 — Port P pin 1 / Key Wakeup |
| Контакт 3 | PP2/KWP2 — Port P pin 2 / Key Wakeup |
| Контакт 4 | PP3/KWP3 — Port P pin 3 / Key Wakeup |
| Контакт 5 | PP4/KWP4 — Port P pin 4 / Key Wakeup |
| Контакт 6 | PP5/KWP5 — Port P pin 5 / Key Wakeup |
| Контакт 7 | PP6/KWP6 — Port P pin 6 / Key Wakeup |
| Контакт 8 | PP7/KWP7 — Port P pin 7 / Key Wakeup |
| Контакт 9 | PS0/RXD0 — Port S / SCI0 RXD |
| Контакт 10 | PS1/TXD0 — Port S / SCI0 TXD |
| Контакт 11 | PS2/RXD1 — Port S / SCI1 RXD |
| Контакт 12 | PS3/TXD1 — Port S / SCI1 TXD |
| Контакт 13 | VDDR — Voltage Regulator Power |
| Контакт 14 | VDD1 — Digital Supply 1 (5V) |
| Контакт 15 | VSS1 — Digital Ground 1 |
| Контакт 16 | VDD2 — Digital Supply 2 (5V) |
| Контакт 17 | VSS2 — Digital Ground 2 |
| Контакт 18 | BKGD — Background Debug Mode pin |
| Контакт 19 | RESET — External Reset (active low) |
| Контакт 20 | PT0/IOC0 — Port T / Timer Channel 0 |
| Контакт 21 | PT1/IOC1 — Port T / Timer Channel 1 |
| Контакт 22 | PT2/IOC2 — Port T / Timer Channel 2 |
| Контакт 23 | PT3/IOC3 — Port T / Timer Channel 3 |
| Контакт 24 | PT4/IOC4 — Port T / Timer Channel 4 |
| Контакт 25 | PT5/IOC5 — Port T / Timer Channel 5 |
| Контакт 26 | PT6/IOC6 — Port T / Timer Channel 6 |
| Контакт 27 | PT7/IOC7 — Port T / Timer Channel 7 |
| Контакт 28 | PA0/AN0 — Port A / ADC Channel 0 |
| Контакт 29 | PA1/AN1 — Port A / ADC Channel 1 |
| Контакт 30 | PA2/AN2 — Port A / ADC Channel 2 |
| Контакт 31 | PA3/AN3 — Port A / ADC Channel 3 |
| Контакт 32 | PA4/AN4 — Port A / ADC Channel 4 |
| Контакт 33 | PA5/AN5 — Port A / ADC Channel 5 |
| Контакт 34 | PA6/AN6 — Port A / ADC Channel 6 |
| Контакт 35 | PA7/AN7 — Port A / ADC Channel 7 |
| Контакт 36 | PB0/MISO0 — Port B / SPI0 MISO |
| Контакт 37 | PB1/MOSI0 — Port B / SPI0 MOSI |
| Контакт 38 | PB2/SCK0 — Port B / SPI0 SCK |
| Контакт 39 | PB3/SS0 — Port B / SPI0 SS |
| Контакт 40 | PB4/MISO1 — Port B / SPI1 MISO |
| Контакт 41 | PB5/MOSI1 — Port B / SPI1 MOSI |
| Контакт 42 | PB6/SCK1 — Port B / SPI1 SCK |
| Контакт 43 | PB7/SS1 — Port B / SPI1 SS |
| Контакт 44 | PM0 — Port M pin 0 |
| Контакт 45 | PM1 — Port M pin 1 |
| Контакт 46 | PJ0 — Port J pin 0 |
| Контакт 47 | PJ1 — Port J pin 1 |
| Контакт 48 | XFC — PLL Filter Capacitor |
| Контакт 49 | VDDPLL — PLL Supply (5V) |
| Контакт 50 | VSSPLL — PLL Ground |
| Контакт 51 | EXTAL — External Crystal / Oscillator |
| Контакт 52 | XTAL — Crystal Connection |
Типичное применение
MC9S12GC64MPBE подходит для 6 применениеs: Automotive Body Control Modules, Industrial Sensor Signal Conditioning, HVAC Actuator and Damper Control, Instrument Cluster Subfunctions, LIN Network Slave Nodes, Low-End Motor Control (PWM Drivers).
Automotive Body Control Modules
The MC9S12GC64MPBE's 16-bit HCS12 core and 64KB Flash make it well-suited for automotive body control modules (BCMs) that manage lighting, wipers, door locks, and mirror positioning. The on-chip ADC (8/10-bit) reads switch and sensor inputs while TIM modules generate PWM outputs for lamp dimming and motor drive. The SCI/SPI peripherals connect to LIN transceivers for body networking. Operating from 2.97V to 5.5V handles automotive crank conditions from 6V to 18V transients via external regulator. The 52-LQFP footprint fits behind dashboard panels and the -40C to +125C temperature range survives under-hood environments.
Рекомендуется
Industrial Sensor Signal Conditioning
Industrial sensor signal conditioning boards leverage the MC9S12GC64MPBE's on-chip ADC and SCI to digitize analog sensor outputs and transmit via RS-232 or RS-485 for PLC/SCADA integration. The 25MHz bus provides ample throughput for moving-average filtering and linearization math within the 64KB Flash firmware budget. Built-in EEPROM (1KB) stores calibration coefficients, while BDM enables factory calibration via single-wire debug. The wide 2.97V-5.5V supply range handles 24V industrial bus rails with external LDO. Companion HCS12 family devices (MC9S12GC32/96) provide cost/feature scaling within the same pinout.
Рекомендуется
HVAC Actuator and Damper Control
HVAC actuator and damper control nodes use the MC9S12GC64MPBE's TIM module PWM outputs to drive small DC brushless motor drivers and servo actuators. The 16-bit HCS12 core executes PI/PID control loops faster than 8-bit MCUs, while 4KB RAM accommodates multi-axis state variables. SCI interfaces central climate controllers via LIN bus. The internal bandgap VREG simplifies board design and reduces external component count. Operating from 2.97V-5.5V at automotive 12V bus levels and -40C to +125C guarantees reliable performance behind vehicle HVAC panels.
Рекомендуется
Instrument Cluster Subfunctions
The MC9S12GC64MPBE handles instrument cluster subfunctions such as gauge pointer stepper control, telltale lamp driving, and odometer storage in its 1KB on-chip EEPROM. The 16-bit HCS12 core executes stepper acceleration profiles smoothly across the full -40C to +125C automotive range. SCI peripheral streams diagnostic data to the main cluster MCU via LIN or K-Line. The 52-LQFP footprint enables compact PCB placement behind gauge faces. Same-family MC9S12C64MPBE or MC9S12GC128MPBE allows code-size scaling without PCB changes.
Рекомендуется
LIN Network Slave Nodes
LIN network slave nodes for window lift, mirror adjust, and seat positioning make effective use of the MC9S12GC64MPBE's SCI peripheral with external LIN transceiver. The 16-bit core implements the LIN 2.x protocol stack with deterministic latency below 1ms, while 64KB Flash holds application + LIN diagnostic layers. Hardware BDM enables factory programming before the LIN node is network-addressed. The 52-LQFP 10x10 package fits inside door module and seat control enclosures and AEC-Q100 grade variants of the same die are available for safety-critical applications.
Рекомендуется
Low-End Motor Control (PWM Drivers)
Low-end motor control loops for small BLDC, stepper, and brushed-DC motors leverage the MC9S12GC64MPBE's TIM module PWM channels, ADC input, and SCI feedback interface. At 25MHz, the HCS12 core executes field-oriented control (FOC) or trapezoidal commutation at switching frequencies up to 20kHz, sufficient for sub-100W motors. The 4KB RAM holds FOC state buffers. Internal VREG simplifies the power section. The 52-LQFP footprint with 0.65mm pitch allows SMT manufacturing. Companion products from the same family (MC9S12GC64CFUE PQFP-80 variant) provide higher pin count for multi-axis control.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MC9S12GC64MPBE — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MC9S12C64MPBE | MC9S12GC32MPBE | MC9S12GC96MPBE | MC9S12GC128MPBE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 52-LQFP (10x10 mm) | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same |
| Core | HCS12 (16-bit) | HCS12 (16-bit) - same | HCS12 (16-bit) - same | HCS12 (16-bit) - same | HCS12 (16-bit) - same |
| Flash Memory | 64 KB | 64 KB | 32 KB (-50%) | 96 KB (+50%) | 128 KB (+100%) |
| Bus Speed (max) | 25 MHz | 25 MHz - same | 25 MHz - same | 25 MHz - same | 25 MHz - same |
| Operating Voltage | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
| Temperature Range | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Ключевые отличия
- Pin-compatible scaling across 32KB to 128KB Flash (против MC9S12GC128MPBE)
- Same package, smaller Flash option for cost-down (против MC9S12GC32MPBE)
- Identical HCS12 core as predecessors (против MC9S12C64MPBE)
Заметки по проектированию
The MC9S12GC64MPBE requires separate analog and digital supply decoupling: place a 100nF ceramic capacitor close to each VDD/VSS pair and a 4.7-10uF bulk capacitor on VDDR for the internal voltage regulator. VDDPLL also needs its own decoupling (100nF plus the PLL filter capacitor on XFC pin). The internal VREG output (about 2.5V typical) is not brought out externally; ensure VDDR is fed from 5V to enable the on-chip regulator.
For 52-LQFP (10x10 mm) PCB layout, use at least 4-layer stack-up with a continuous ground plane under the package for thermal dissipation and EMI. Keep BDM trace (pin 18) short and away from noisy signals; ESD protection (TVS diode) at the BKGD pin is recommended for production programming connectors. Route the EXTAL/XTAL crystal traces with guard ground and keep capacitance below 10pF on each side to avoid crystal load-pull.
When migrating from MC9S12C64 to MC9S12GC64, verify register names in the SCI, SPI, and TIM peripherals - the S12GC family introduced minor naming changes in the timer module and PWM registers. Existing firmware may need header-file updates. Also confirm Flash erase/program timing: S12GC parts have a 64-byte page size and similar algorithms to S12C, but in-application programming commands differ slightly - consult the S12GC reference manual.
At max 25MHz core frequency and 5V supply, the MC9S12GC64MPBE dissipates approximately 100-150mW typical (estimated: P = Vdd x I_run x activity_factor). With a 52-LQFP package theta_JA of roughly 60-75 C/W on a 4-layer PCB, junction temperature rise stays below 10C at room ambient. Verify by measuring Tj in your final application if operating at -40C cold-start with full peripheral activity.
Информация о соответствии
AEC-Q100 qualified per NXP automotive grade designation; RoHS compliant per NXP product page. Suitable for automotive body and chassis applications.
