MC9S12GC64MPBE - 16-bit 64KB Flash HCS12 MCU | NXP 52-LQFP
Référence : MC9S12GC64MPBE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $15.81 | $15,81 |
| 10 | $14.23 | $142,30 |
| 100 | $12.65 | $1 265,00 |
| 500 | $11.18 | $5 590,00 |
| 1 000 | $9.84 | $9 840,00 |
MC9S12GC64MPBE Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and programmable I/O peripherals into one device. The HCS12 is a 16-bit CISC core family introduced as the successor to the HC12, with full 16-bit internal data paths and a background debug mode (BDM) interface. Within the broader taxonomy, the HCS12 sits between 8-bit MCUs (e.g. HC08, S08) used for low-cost control and 32-bit MCUs (e.g. S32K, Cortex-M) used for higher-performance networked ECUs; the S12 line remains a workhorse for body controllers, sensor interfaces, and LIN-slave nodes in vehicles.
Key features of the MC9S12GC64MPBE include 64KB Flash, 4KB RAM, and 1KB EEPROM, an integrated phase-lock loop (PLL) for flexible bus-speed configuration, multiple serial interfaces (typically SCI and SPI), a timer module (TIM) with capture/compare/PWM capability, and an A/D converter on chip. The on-chip bandgap VREG with internal regulation simplifies board-level power design versus parts that demand a separate core supply.
From an architectural standpoint, the part uses the standard HCS12 core with a 16-bit ALU, X/Y index registers, and a BDM (Background Debug Mode) port for non-intrusive in-circuit programming and debug. The Flash array supports in-application reprogramming via standard NXP S12 programming routines. The 52-LQFP package is a JEDEC-standard plastic quad flatpack suited to automated SMT assembly.
Typical applications include automotive body controllers, instrument cluster subfunctions, HVAC actuators, LIN/J1850 network nodes, industrial sensor signal conditioning boards, and low-end motor control loops. The on-chip PWM and ADC simplify inverter or actuator drive designs at modest switching frequencies.
Designers should allocate adequate decoupling (typically 100nF ceramic close to each VDD/VSS pair plus a bulk 4.7-10uF) and connect the PLL filter components per the S12 reference manual; the BDM interface should be brought out to a header for field firmware updates.
This page synthesizes distributor pricing, drop-in alternatives, and S12-family design notes not always consolidated in the manufacturer datasheet, helping procurement and firmware engineers evaluate the MC9S12GC64MPBE quickly.
Alternatives de remplacement direct pour MC9S12GC64MPBE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12GC64MPBE (même facteur de forme et même empreinte) — différant par Package, Core, Core Processor, Data Bus Width, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12C64MPBE
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S12GC32MPBE
✅ Remplacement direct✓ En stock
$14.9905 / unité
Voir la fiche technique →MC9S12GC96MPBE
✅ Remplacement direct✓ En stock
$6.05 / unité
Voir la fiche technique →MC9S12GC128MPBE
✅ Remplacement direct✓ En stock
$7.9 / unité
Voir la fiche technique →MC9S12GC64MPBE Valeurs maximales et caractéristiques électriques
| Core | HCS12 (16-bit CISC) |
| Series | S12GC (MC9S12GC family) |
| Program Memory | 64 KB Flash |
| RAM | 4 KB |
| EEPROM | 1 KB |
| Bus Speed (max) | 25 MHz |
| Operating Voltage (Vdd) | 2.97 V to 5.5 V |
| Internal Voltage Regulator | On-chip bandgap VREG generating VDD |
| Boîtier | 52-LQFP (10x10 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +125C (industrial/automotive grade) |
| Debug Interface | Background Debug Mode (BDM) |
| Statut RoHS | Compliant |
| Statut du cycle de vie | NRND (Not Recommended for New Designs) |
Configuration des broches de MC9S12GC64MPBE
| Broche 1 | PP0/KWP0 — Port P pin 0 / Key Wakeup |
| Broche 2 | PP1/KWP1 — Port P pin 1 / Key Wakeup |
| Broche 3 | PP2/KWP2 — Port P pin 2 / Key Wakeup |
| Broche 4 | PP3/KWP3 — Port P pin 3 / Key Wakeup |
| Broche 5 | PP4/KWP4 — Port P pin 4 / Key Wakeup |
| Broche 6 | PP5/KWP5 — Port P pin 5 / Key Wakeup |
| Broche 7 | PP6/KWP6 — Port P pin 6 / Key Wakeup |
| Broche 8 | PP7/KWP7 — Port P pin 7 / Key Wakeup |
| Broche 9 | PS0/RXD0 — Port S / SCI0 RXD |
| Broche 10 | PS1/TXD0 — Port S / SCI0 TXD |
| Broche 11 | PS2/RXD1 — Port S / SCI1 RXD |
| Broche 12 | PS3/TXD1 — Port S / SCI1 TXD |
| Broche 13 | VDDR — Voltage Regulator Power |
| Broche 14 | VDD1 — Digital Supply 1 (5V) |
| Broche 15 | VSS1 — Digital Ground 1 |
| Broche 16 | VDD2 — Digital Supply 2 (5V) |
| Broche 17 | VSS2 — Digital Ground 2 |
| Broche 18 | BKGD — Background Debug Mode pin |
| Broche 19 | RESET — External Reset (active low) |
| Broche 20 | PT0/IOC0 — Port T / Timer Channel 0 |
| Broche 21 | PT1/IOC1 — Port T / Timer Channel 1 |
| Broche 22 | PT2/IOC2 — Port T / Timer Channel 2 |
| Broche 23 | PT3/IOC3 — Port T / Timer Channel 3 |
| Broche 24 | PT4/IOC4 — Port T / Timer Channel 4 |
| Broche 25 | PT5/IOC5 — Port T / Timer Channel 5 |
| Broche 26 | PT6/IOC6 — Port T / Timer Channel 6 |
| Broche 27 | PT7/IOC7 — Port T / Timer Channel 7 |
| Broche 28 | PA0/AN0 — Port A / ADC Channel 0 |
| Broche 29 | PA1/AN1 — Port A / ADC Channel 1 |
| Broche 30 | PA2/AN2 — Port A / ADC Channel 2 |
| Broche 31 | PA3/AN3 — Port A / ADC Channel 3 |
| Broche 32 | PA4/AN4 — Port A / ADC Channel 4 |
| Broche 33 | PA5/AN5 — Port A / ADC Channel 5 |
| Broche 34 | PA6/AN6 — Port A / ADC Channel 6 |
| Broche 35 | PA7/AN7 — Port A / ADC Channel 7 |
| Broche 36 | PB0/MISO0 — Port B / SPI0 MISO |
| Broche 37 | PB1/MOSI0 — Port B / SPI0 MOSI |
| Broche 38 | PB2/SCK0 — Port B / SPI0 SCK |
| Broche 39 | PB3/SS0 — Port B / SPI0 SS |
| Broche 40 | PB4/MISO1 — Port B / SPI1 MISO |
| Broche 41 | PB5/MOSI1 — Port B / SPI1 MOSI |
| Broche 42 | PB6/SCK1 — Port B / SPI1 SCK |
| Broche 43 | PB7/SS1 — Port B / SPI1 SS |
| Broche 44 | PM0 — Port M pin 0 |
| Broche 45 | PM1 — Port M pin 1 |
| Broche 46 | PJ0 — Port J pin 0 |
| Broche 47 | PJ1 — Port J pin 1 |
| Broche 48 | XFC — PLL Filter Capacitor |
| Broche 49 | VDDPLL — PLL Supply (5V) |
| Broche 50 | VSSPLL — PLL Ground |
| Broche 51 | EXTAL — External Crystal / Oscillator |
| Broche 52 | XTAL — Crystal Connection |
Applications typiques
MC9S12GC64MPBE convient pour 6 applications: Automotive Body Control Modules, Industrial Sensor Signal Conditioning, HVAC Actuator and Damper Control, Instrument Cluster Subfunctions, LIN Network Slave Nodes, Low-End Motor Control (PWM Drivers).
Automotive Body Control Modules
The MC9S12GC64MPBE's 16-bit HCS12 core and 64KB Flash make it well-suited for automotive body control modules (BCMs) that manage lighting, wipers, door locks, and mirror positioning. The on-chip ADC (8/10-bit) reads switch and sensor inputs while TIM modules generate PWM outputs for lamp dimming and motor drive. The SCI/SPI peripherals connect to LIN transceivers for body networking. Operating from 2.97V to 5.5V handles automotive crank conditions from 6V to 18V transients via external regulator. The 52-LQFP footprint fits behind dashboard panels and the -40C to +125C temperature range survives under-hood environments.
Recommandé
Industrial Sensor Signal Conditioning
Industrial sensor signal conditioning boards leverage the MC9S12GC64MPBE's on-chip ADC and SCI to digitize analog sensor outputs and transmit via RS-232 or RS-485 for PLC/SCADA integration. The 25MHz bus provides ample throughput for moving-average filtering and linearization math within the 64KB Flash firmware budget. Built-in EEPROM (1KB) stores calibration coefficients, while BDM enables factory calibration via single-wire debug. The wide 2.97V-5.5V supply range handles 24V industrial bus rails with external LDO. Companion HCS12 family devices (MC9S12GC32/96) provide cost/feature scaling within the same pinout.
Recommandé
HVAC Actuator and Damper Control
HVAC actuator and damper control nodes use the MC9S12GC64MPBE's TIM module PWM outputs to drive small DC brushless motor drivers and servo actuators. The 16-bit HCS12 core executes PI/PID control loops faster than 8-bit MCUs, while 4KB RAM accommodates multi-axis state variables. SCI interfaces central climate controllers via LIN bus. The internal bandgap VREG simplifies board design and reduces external component count. Operating from 2.97V-5.5V at automotive 12V bus levels and -40C to +125C guarantees reliable performance behind vehicle HVAC panels.
Recommandé
Instrument Cluster Subfunctions
The MC9S12GC64MPBE handles instrument cluster subfunctions such as gauge pointer stepper control, telltale lamp driving, and odometer storage in its 1KB on-chip EEPROM. The 16-bit HCS12 core executes stepper acceleration profiles smoothly across the full -40C to +125C automotive range. SCI peripheral streams diagnostic data to the main cluster MCU via LIN or K-Line. The 52-LQFP footprint enables compact PCB placement behind gauge faces. Same-family MC9S12C64MPBE or MC9S12GC128MPBE allows code-size scaling without PCB changes.
Recommandé
LIN Network Slave Nodes
LIN network slave nodes for window lift, mirror adjust, and seat positioning make effective use of the MC9S12GC64MPBE's SCI peripheral with external LIN transceiver. The 16-bit core implements the LIN 2.x protocol stack with deterministic latency below 1ms, while 64KB Flash holds application + LIN diagnostic layers. Hardware BDM enables factory programming before the LIN node is network-addressed. The 52-LQFP 10x10 package fits inside door module and seat control enclosures and AEC-Q100 grade variants of the same die are available for safety-critical applications.
Recommandé
Low-End Motor Control (PWM Drivers)
Low-end motor control loops for small BLDC, stepper, and brushed-DC motors leverage the MC9S12GC64MPBE's TIM module PWM channels, ADC input, and SCI feedback interface. At 25MHz, the HCS12 core executes field-oriented control (FOC) or trapezoidal commutation at switching frequencies up to 20kHz, sufficient for sub-100W motors. The 4KB RAM holds FOC state buffers. Internal VREG simplifies the power section. The 52-LQFP footprint with 0.65mm pitch allows SMT manufacturing. Companion products from the same family (MC9S12GC64CFUE PQFP-80 variant) provide higher pin count for multi-axis control.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12GC64MPBE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12C64MPBE | MC9S12GC32MPBE | MC9S12GC96MPBE | MC9S12GC128MPBE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 52-LQFP (10x10 mm) | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same |
| Core | HCS12 (16-bit) | HCS12 (16-bit) - same | HCS12 (16-bit) - same | HCS12 (16-bit) - same | HCS12 (16-bit) - same |
| Flash Memory | 64 KB | 64 KB | 32 KB (-50%) | 96 KB (+50%) | 128 KB (+100%) |
| Bus Speed (max) | 25 MHz | 25 MHz - same | 25 MHz - same | 25 MHz - same | 25 MHz - same |
| Operating Voltage | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
| Temperature Range | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Principaux différenciateurs
- Pin-compatible scaling across 32KB to 128KB Flash (vs MC9S12GC128MPBE)
- Same package, smaller Flash option for cost-down (vs MC9S12GC32MPBE)
- Identical HCS12 core as predecessors (vs MC9S12C64MPBE)
Notes de conception
The MC9S12GC64MPBE requires separate analog and digital supply decoupling: place a 100nF ceramic capacitor close to each VDD/VSS pair and a 4.7-10uF bulk capacitor on VDDR for the internal voltage regulator. VDDPLL also needs its own decoupling (100nF plus the PLL filter capacitor on XFC pin). The internal VREG output (about 2.5V typical) is not brought out externally; ensure VDDR is fed from 5V to enable the on-chip regulator.
For 52-LQFP (10x10 mm) PCB layout, use at least 4-layer stack-up with a continuous ground plane under the package for thermal dissipation and EMI. Keep BDM trace (pin 18) short and away from noisy signals; ESD protection (TVS diode) at the BKGD pin is recommended for production programming connectors. Route the EXTAL/XTAL crystal traces with guard ground and keep capacitance below 10pF on each side to avoid crystal load-pull.
When migrating from MC9S12C64 to MC9S12GC64, verify register names in the SCI, SPI, and TIM peripherals - the S12GC family introduced minor naming changes in the timer module and PWM registers. Existing firmware may need header-file updates. Also confirm Flash erase/program timing: S12GC parts have a 64-byte page size and similar algorithms to S12C, but in-application programming commands differ slightly - consult the S12GC reference manual.
At max 25MHz core frequency and 5V supply, the MC9S12GC64MPBE dissipates approximately 100-150mW typical (estimated: P = Vdd x I_run x activity_factor). With a 52-LQFP package theta_JA of roughly 60-75 C/W on a 4-layer PCB, junction temperature rise stays below 10C at room ambient. Verify by measuring Tj in your final application if operating at -40C cold-start with full peripheral activity.
Informations de conformité
AEC-Q100 qualified per NXP automotive grade designation; RoHS compliant per NXP product page. Suitable for automotive body and chassis applications.
