NXP Semiconductors

MPC8313EVRAGDB - PowerQUICC II Pro 400MHz MPU | NXP Semiconductors

Артикул: MPC8313EVRAGDB ✗ Снят с производства
В наличии Отправка в течение 1–3 рабочих дней
1.8V / 2.5V / 3.3V Vdss 516-TEPBGA (27x27 mm) with Exposed Pad Package 400 MHz Speed DDR1/DDR2 SDRAM Memory
От $17.9 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-16
Оптовые цены
Кол-во Цена за ед. Итого
1 $24.98 $24,98
10 $23.45 $234,50
100 $21.1 $2.110,00
500 $19.25 $9.625,00
1.000 $17.9 $17.900,00
ℹ️ Все цены указаны в USD

MPC8313EVRAGDB Обзор

The NXP Semiconductors MPC8313EVRAGDB is a PowerQUICC II Pro microprocessor (MPU) built on the PowerPC e300c3 core, delivering 400 MHz of processing performance in a 516-ball TEPBGA (27x27 mm) package with security/encryption enabled. The MPC8313E integrates a CPU, a DDR memory controller, dual Gigabit Ethernet MACs, PCI Express, and a security engine, providing a complete system-on-chip solution for networking and industrial applications.

Key specifications include a 32-bit data bus, 0.09 um process technology, 1.8V/2.5V/3.3V I/O voltage support, 400 MHz core clock, and a 516-TEPBGA exposed-pad package with thermal management via the die-attach paddle. The device also integrates hardware-accelerated IPsec, DES, 3DES, AES, and Kasumi crypto engines for secure communications.

An MPU (Microprocessing Unit) is a microprocessor that integrates a CPU core with system-level peripherals such as memory controllers, bus interfaces, and I/O subsystems. The MPC8313E belongs to the PowerQUICC II Pro family: an embedded PowerPC processor family that combines a RISC CPU subsystem with a high-bandwidth communication subsystem. It sits within the hierarchy: microprocessor -> MPU -> networking/communications processor -> embedded system-on-chip.

Architecturally, the MPC8313E uses the e300c3 core with separate 32 KB instruction and data caches, a DDR1/DDR2 memory controller, dual 10/100/1000 Ethernet MACs (eTSECs), a USB 2.0 host/device controller, four UARTs, two I2C controllers, dual PCI Express interfaces, and a local bus controller. The integrated security engine accelerates IPsec, AES, DES/3DES, and Kasumi, offloading CPU-intensive crypto workloads from the e300c3 core.

Typical applications include industrial routers and gateways, secure VPN concentrators, networked industrial control systems, factory automation controllers, networked storage (NAS) controllers, and security appliances requiring hardware-accelerated encryption.

When designing with this MPU, ensure proper decoupling of the 1.8V core, 2.5V DDR reference, and 3.3V I/O rails, and provide adequate thermal relief through PCB thermal vias beneath the exposed die-attach paddle of the 516-TEPBGA package.

Аналоги без доработки для MPC8313EVRAGDB — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MPC8313EVRAGDB (тот же форм-фактор и посадочное место) — отличается по Core Architecture, Memory Controller, Data Bus Width, Maximum CPU Clock, Operating Temperature.

NXP Semiconductors
Core Architecture: PowerPC e300c3 (32-bit)
Memory Controller: DDR1/DDR2 (up to 266 MHz)
Maximum CPU Clock: 267 MHz
Сравнить с MPC8313EVRAGDB →
NXP Semiconductors
Core Architecture: PowerPC e300c3
Memory Controller: DDR1/DDR2 (up to 256 MB addressable)
Data Bus Width: 32-bit
Сравнить с MPC8313EVRAGDB →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MPC8313EZQAGDB

✅ Прямая замена
📦 516-TEPBGA (27x27 mm)
same 516-TEPBGA footprint, no crypto engine (Z suffix), security block removed

📋 Справочный аналог (нет в каталоге)

MPC8313EVRAFFB

✅ Прямая замена
NXP Semiconductors
📦 516-TEPBGA (27x27 mm)
NXP Semiconductors (formerly Freescale) · Active · PowerPC e300c3 · MPC83xx (PowerQUICC II Pro) · 1 · 32-bit · 333 MHz · 516-TEPBGA (27 mm x 27 mm) with exposed die pad

✓ В наличии

$42.85 / шт.

Открыть даташит →

MPC8313EZQAFFA

✅ Прямая замена
📦 516-TEPBGA (27x27 mm)
same 516-TEPBGA footprint, no security engine, lower-speed industrial bin

📋 Справочный аналог (нет в каталоге)

MPC8313EZQADD

✅ Прямая замена
📦 516-TEPBGA (27x27 mm)
same 516-TEPBGA footprint, no security engine, lead-based industrial bin

📋 Справочный аналог (нет в каталоге)

MPC8323EVRADDCA

✅ Прямая замена ⚠️ Характеристики не проверены
📦 516-TEPBGA (27x27 mm)
same 516-TEPBGA footprint, newer die, 266 MHz core (-33.5%), same crypto engine

📋 Справочный аналог (нет в каталоге)

MPC8313EVRAGDB Максимальные параметры и электрические характеристики

Processor Series MPC83xx (PowerQUICC II Pro)
Core PowerPC e300c3
Core Architecture 32-bit RISC
Разрядность шины данных 32 bit
Maximum CPU Clock 400 MHz
Number of Cores 1
Process Technology 0.09 um CMOS
Supply Voltage - I/O 1.8V / 2.5V / 3.3V
Корпус 516-TEPBGA (27x27 mm) with Exposed Pad
Number of Pins/Balls 516 balls
Тип монтажа Surface Mount (BGA)
Рабочая температура -40C to +85C (Industrial)
Integrated Ethernet MACs 2 (10/100/1000 Mbps eTSECs)
PCI Express 2 x PCIe interfaces
USB Interface USB 2.0 Host/Device
Cryptography Engine Hardware IPsec, AES, DES/3DES, Kasumi
Security Enabled Yes (E suffix)
Статус RoHS non-compliant per legacy Freescale datasheet
Memory Controller DDR1/DDR2 SDRAM
Pin/Ball Count 516

Руководство по цоколевке MPC8313EVRAGDB в корпусе 516-tepbga (27x27 mm) with exposed pad

Цоколевка для MPC8313EVRAGDB (корпус 516-tepbga (27x27 mm) with exposed pad). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.

Схема цоколевки корпуса 516-tepbga (27x27 mm) with exposed pad для MPC8313EVRAGDB

Нет подробных данных о распиновке для MPC8313EVRAGDB.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

MPC8313EVRAGDB подходит для 6 применениеs: Industrial VPN / IPsec Gateway, Industrial Ethernet Router / Gateway, Factory Automation Controller, Network-Attached Storage (NAS) Controller, Secure Print Server / Imaging Appliance, IP-PBX / Unified Communications Media Gateway.

🌐

Industrial VPN / IPsec Gateway

The MPC8313EVRAGDB's hardware IPsec, AES, DES/3DES, and Kasumi engines deliver wire-rate encryption at its 400 MHz CPU clock, offloading crypto workloads from the e300c3 core. Deployed between WAN and LAN interfaces with dual Gigabit eTSECs, it sustains multi-tunnel throughput for branch-office and industrial edge VPN concentrators. Compared to a software-only crypto path on a generic MPU, it consumes 60-70% less CPU headroom at 1 Gbps.

🏭

Industrial Ethernet Router / Gateway

Dual 10/100/1000 eTSECs combined with DDR1/DDR2 support make the MPC8313EVRAGDB a fit for industrial routers and protocol gateways bridging fieldbus (Modbus TCP, PROFINET) to enterprise networks. The e300c3 core runs an embedded Linux routing stack with iptables/QoS at sub-100 microsecond latency. The 516-TEPBGA exposed-die paddle supports industrial -40C to +85C environments with proper PCB thermal design.

🤖

Factory Automation Controller

Dual PCIe interfaces provide deterministic connectivity to FPGA-based motion controllers and high-speed I/O modules on the backplane, while four UARTs and dual I2C controllers connect to sensors, drives, and HMIs. The DDR2 controller with optional ECC delivers robust memory throughput for deterministic real-time control loops. Integrated crypto provides secure firmware update authentication over industrial Ethernet.

🖥️

Network-Attached Storage (NAS) Controller

The MPC8313EVRAGDB's gigabit eTSEC plus local bus controller enables the chip to act as a low-power NAS or iSCSI target front-end, offloading file-system operations to a separate SATA controller over PCIe. DDR1/DDR2 with ECC provides memory needed for caching. The hardware crypto engine accelerates encrypted-filesystem operations (LUKS, IPsec-encrypted SMB) without taxing the CPU.

🖨️

Secure Print Server / Imaging Appliance

Embedded printing and imaging appliances use the MPC8313EVRAGDB for its two Gigabit Ethernet MACs (one network, one service-port), USB 2.0 host controller (for media readers), and hardware AES acceleration for secure-job releases. The 400 MHz e300c3 core handles network protocol stacks and printer firmware, while the crypto engine secures SNMPv3 and IPsec management traffic. Industrial temperature grade supports deployment in copiers and factory print stations.

📞

IP-PBX / Unified Communications Media Gateway

The 400 MHz e300c3 core plus dual Gigabit Ethernet MACs enables the MPC8313EVRAGDB to bridge IP-PBX media (VoIP RTP streams, T.38 fax) between enterprise WAN and legacy PSTN/TDM circuits via external DSP codecs. DDR1/DDR2 memory supports jitter buffers and codec buffers for concurrent channels. The integrated crypto engine secures SIP/TLS and SRTP media for compliance-sensitive deployments.

Сводка рекомендуемых товаров

MPC8315E Active successor with updated silicon Используется в: Industrial VPN / IPsec Gateway, Secure Print Server / Imaging Appliance MPC8536E Higher-throughput crypto engine for 10G aggregation Используется в: Industrial VPN / IPsec Gateway, Factory Automation Controller MPC8313EVRAGDB NXP Semiconductors Используется в: Industrial Ethernet Router / Gateway, Factory Automation Controller, Network-Attached Storage (NAS) Controller, Secure Print Server / Imaging Appliance, IP-PBX / Unified Communications Media Gateway MPC8308CVMAGDA Lower-cost reduced-throughput sibling Используется в: Industrial Ethernet Router / Gateway MPC8323E Pin-compatible successor with improved throughput Используется в: Network-Attached Storage (NAS) Controller MPC8360E Higher-throughput alternative with QUICC Engine Используется в: IP-PBX / Unified Communications Media Gateway
What is the core architecture of the MPC8313EVRAGDB?
The MPC8313EVRAGDB is built on the PowerPC e300c3 core, a 32-bit RISC processor that runs at up to 400 MHz. The e300c3 includes separate 32 KB instruction and data caches and supports hardware multiply-accumulate. As part of NXP's PowerQUICC II Pro family (MPC83xx), it integrates the CPU with a communication subsystem optimized for networking workloads.
What package does the MPC8313EVRAGDB use?
The MPC8313EVRAGDB is housed in a 516-ball TEPBGA (Tape Enhanced Plastic Ball Grid Array) measuring 27 x 27 mm with an exposed die-attach paddle for thermal management. The package supports surface-mount assembly with standard BGA reflow profiles and uses 1.0 mm ball pitch typical of NXP's PowerQUICC II Pro family.
What is the difference between the MPC8313EVRAGDB and MPC8313VRAGDB?
The MPC8313EVRAGDB includes a hardware cryptography engine that accelerates IPsec, AES, DES/3DES, and Kasumi, while the MPC8313VRAGDB omits the security block to reduce cost in applications without cryptographic requirements. Both parts are pin-compatible on the same 516-TEPBGA package, allowing the secure variant to drop into a non-secure design if needed.
Is the MPC8313EVRAGDB still in production?
No, the MPC8313EVRAGDB is marked as obsolete / end-of-life per the legacy Freescale/NXP lifecycle records, with EOL declared for the part family. New design-in is strongly discouraged - consider the MPC8315E or MPC8323E for new projects, which remain in active production.
Where can I download the MPC8313EVRAGDB datasheet PDF?
The official NXP MPC8313E (MPC8313EEC) datasheet is hosted at nxp.com under the PowerQUICC II Pro product page, which consolidates the device datasheet, reference manual, and errata documents. Heisener and Octopart distributor pages also link to the canonical PDF for engineers wanting a single-file reference.
What is the current price of the MPC8313EVRAGDB?
The MPC8313EVRAGDB lists at approximately USD 24.98 per unit on tier-1 distributor stock, as of 2026-10-16, with downward price breaks at higher quantities. Because the part is obsolete, pricing is set by remaining channel inventory and broker stock rather than manufacturer MSRP, so quotes can vary widely week to week.
What drop-in replacement exists for the MPC8313EVRAGDB?
Direct pin-compatible drop-in replacements within the MPC83xx PowerQUICC family include the MPC8313EZQAGDB (same die in a different speed bin) and the MPC8313EVRAFFB (encryption-enabled, 333 MHz variant). For new designs, the MPC8315E and MPC8323E provide pin-compatible migration paths with updated silicon and active lifecycle status.
How does the MPC8313EVRAGDB compare to the MPC8378VRALGA?
The MPC8378VRALGA uses a higher-performance e500 core running up to 800 MHz in a 489-ball TEPBGA package, while the MPC8313EVRAGDB uses the older e300c3 core at 400 MHz in a 516-ball TEPBGA. Both integrate Ethernet and DDR controllers, but the MPC8378 trades pin count for higher frequency and is NOT pin-compatible due to different ball maps.
What applications is the MPC8313EVRAGDB best suited for?
The MPC8313EVRAGDB is optimized for industrial networking and secure communications: VPN/IPsec gateway appliances, factory-automation routers, networked industrial control, secure print servers, and IP-PBX media gateways. The hardware crypto engine makes it particularly suited to designs that need IPsec, AES-128/192/256, or Kasumi acceleration without consuming CPU cycles.
Does the MPC8313EVRAGDB support DDR2 memory?
Yes, the MPC8313EVRAGDB's integrated DDR memory controller supports both DDR1 and DDR2 SDRAM, allowing designs to use either density without changing the controller. The controller provides up to 16-bit ECC for industrial applications that require error detection in noisy environments. Memory parameters are configurable through the DDR configuration registers.
Can the MPC8313EVRAGDB replace the MPC8308CVMAGDA?
The MPC8313EVRAGDB and MPC8308CVMAGDA are NOT pin-compatible drop-in replacements - they belong to different MPC sub-families with different ball maps and peripheral sets. Designers should not attempt a board-level swap without re-routing BGA fanout, re-validating DDR layout, and re-writing board-support-package initialization code for the new peripheral layout.
How many PCIe lanes does the MPC8313EVRAGDB provide?
The MPC8313EVRAGDB integrates two PCI Express interfaces, each typically configurable as either an x1 lane or x2 link depending on board wiring and reset configuration. These PCIe interfaces share routing with the local bus controller and require careful board design to maintain signal integrity at Gen1 data rates.
Is the MPC8313EVRAGDB RoHS compliant?
Per legacy Freescale/NXP datasheet records, the MPC8313EVRAGDB is NOT RoHS compliant (lead-based finish). For RoHS-compliant industrial designs requiring the same functional set, the recommended path is to migrate to the MPC8315E or a similar PowerQUICC II Pro processor that ships with a lead-free finish.
What BSP/software ecosystem supports the MPC8313EVRAGDB?
The MPC8313EVRAGDB is supported by NXP's Linux BSP, VxWorks BSP, and Green Hills INTEGRITY BSP packages under the PowerQUICC II Pro SDK. These BSPs include U-Boot firmware, device trees, and a long-term maintained kernel tree for the e300c3 core, plus reference drivers for DDR, eTSEC, USB, and the crypto engine.
What is the power dissipation of the MPC8313EVRAGDB at 400 MHz?
At 400 MHz the MPC8313EVRAGDB typically dissipates approximately 1.5 W to 2.0 W depending on workload, DDR clock, and Ethernet activity. The exposed die-attach paddle of the 516-TEPBGA package requires thermal vias to an inner copper plane to keep junction temperature within the -40C to +85C industrial operating range.

Справочные инженерные данные для MPC8313EVRAGDB — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MPC8313EVRAGDB when you need wire-rate hardware-accelerated IPsec/AES with 400 MHz of e300c3 performance in industrial networking and security appliances. If your design does not need encryption but still needs 400 MHz throughput, the MPC8313EZQAGDB is a pin-compatible, lower-cost alternative. If your throughput budget can be reduced to 333 MHz, the MPC8313EVRAFFB (E suffix, 333 MHz) or MPC8313EZQAFFA (no crypto, 333 MHz) drops into the same footprint. For new designs or RoHS-compliant industrial builds, NXP recommends the MPC8315E family as the active-lifecycle successor with the same 516-TEPBGA footprint. Avoid the MPC8308CVMAGDA and MPC8378VRALGA - they are NOT pin-compatible and require a full board re-spin.

Сравнение с аналогами

Параметр Этот товар MPC8313EZQAGDB MPC8313EVRAFFB MPC8313EZQAFFA
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 516-TEPBGA (27x27 mm) 516-TEPBGA (27x27 mm) 516-TEPBGA (27x27 mm) 516-TEPBGA (27x27 mm)
Core Clock Speed 400 MHz 400 MHz 333 MHz 333 MHz
Crypto Engine (E suffix) Yes (IPsec, AES, DES/3DES, Kasumi) No Yes No
DDR Memory Controller DDR1/DDR2 DDR1/DDR2 DDR1/DDR2 DDR1/DDR2
Gigabit Ethernet MACs 2 x eTSEC 2 x eTSEC 2 x eTSEC 2 x eTSEC
PCI Express Lanes 2 x PCIe 2 x PCIe 2 x PCIe 2 x PCIe
Lifecycle Status Obsolete Obsolete Obsolete Obsolete
Core Architecture PowerPC e300c3 PowerPC e300c3 PowerPC e300c3 PowerPC e300c3

Ключевые отличия

  • Integrated hardware security engine (E suffix) (против MPC8313VRAGDB (non-E variant))
  • Higher 400 MHz core clock vs AFFB bin (против MPC8313EVRAFFB)
  • Security-enabled with industrial temperature grade (против MPC8313EZQAFFA (Z suffix, no security))

Заметки по проектированию

Estimated: at 400 MHz with 1.5-2.0 W typical dissipation, the 516-TEPBGA exposed die-attach paddle must be soldered to a central copper land with a 6x6 thermal-via array (0.3 mm drilled, 1.0 mm pitch) connecting to inner plane layers. Without this thermal relief, the junction temperature can exceed the +85C industrial limit at the upper end of the operating range. For continuous operation at full CPU load, also consider a heatsink bonded to a copper heat-spreader over the BGA.

The 516-ball BGA at 1.0 mm pitch requires 8-layer or 10-layer PCB stack-up with controlled impedance for the DDR2, Gigabit Ethernet, and PCIe routing. Use a microsection to confirm via-in-pad plating and 0.4 mm via capture pads with 0.2 mm laser-drilled vias for escape routing. Recommend 0.5 oz copper on outer layers and 1.0 oz on inner power/ground planes to handle the inrush currents from PowerQUICC II Pro power-up sequencing.

Decouple the three voltage rails (1.8V core, 2.5V DDR reference, 3.3V I/O) with bulk capacitors at the board edge and 10 uF ceramic + 0.1 uF high-frequency decoupling placed within 3 mm of each BGA ball group. The DDR reference voltage (MVREF) requires an external precision divider or buffer with 1% tolerance to maintain JEDEC-compliant signal integrity. Power sequencing between 1.8V and 3.3V must follow NXP's recommended rail order to avoid latchup.

Do not confuse the MPC8313E family with the MPC8315E - the latter is a newer, active-lifecycle part with the same 516-TEPBGA pinout but different silicon revision. The MPC8308CVMAGDA and MPC8378VRALGA are NOT pin-compatible drop-in substitutes despite similar product codes - they belong to different PowerQUICC II Pro sub-families with different ball maps, peripheral complements, and DDR controller IP, requiring board re-spin and BSP rebuild.

Информация о соответствии

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Без свинца
No
Без галогенов
No
Конфликтные минералы
Compliant

Lead-based finish per legacy Freescale/NXP datasheet. Halogen-free status listed as 'Not Compliant' per distributor cross-reference data. Reach registration maintained by NXP as legacy substance.

Данные проверены: 2026-10-16 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors Freescale Semiconductor MPC8313EVRAGDB MPC8313E MPC8313VRAGDB MPC83xx PowerQUICC II Pro PowerPC e300c3 eTSEC IPsec AES DES Kasumi DDR2 PCI Express USB 2.0 RoHS TEPBGA-516 industrial automation VPN gateway BSP Linux VxWorks
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