MPC8313EVRAGDB - PowerQUICC II Pro 400MHz MPU | NXP Semiconductors
MPN: MPC8313EVRAGDB ✗ סוף ייצורMPC8313EVRAGDB סקירה
Key specifications include a 32-bit data bus, 0.09 um process technology, 1.8V/2.5V/3.3V I/O voltage support, 400 MHz core clock, and a 516-TEPBGA exposed-pad package with thermal management via the die-attach paddle. The device also integrates hardware-accelerated IPsec, DES, 3DES, AES, and Kasumi crypto engines for secure communications.
An MPU (Microprocessing Unit) is a microprocessor that integrates a CPU core with system-level peripherals such as memory controllers, bus interfaces, and I/O subsystems. The MPC8313E belongs to the PowerQUICC II Pro family: an embedded PowerPC processor family that combines a RISC CPU subsystem with a high-bandwidth communication subsystem. It sits within the hierarchy: microprocessor -> MPU -> networking/communications processor -> embedded system-on-chip.
Architecturally, the MPC8313E uses the e300c3 core with separate 32 KB instruction and data caches, a DDR1/DDR2 memory controller, dual 10/100/1000 Ethernet MACs (eTSECs), a USB 2.0 host/device controller, four UARTs, two I2C controllers, dual PCI Express interfaces, and a local bus controller. The integrated security engine accelerates IPsec, AES, DES/3DES, and Kasumi, offloading CPU-intensive crypto workloads from the e300c3 core.
Typical applications include industrial routers and gateways, secure VPN concentrators, networked industrial control systems, factory automation controllers, networked storage (NAS) controllers, and security appliances requiring hardware-accelerated encryption.
When designing with this MPU, ensure proper decoupling of the 1.8V core, 2.5V DDR reference, and 3.3V I/O rails, and provide adequate thermal relief through PCB thermal vias beneath the exposed die-attach paddle of the 516-TEPBGA package.
חלופות תחליף ישיר עבור MPC8313EVRAGDB — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם MPC8313EVRAGDB (אותו גורם צורה וטביעת רגל) — שונים ב Core Architecture, Memory Controller, Data Bus Width, Maximum CPU Clock, Operating Temperature.
MPC8313EZQAGDB
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MPC8313EVRAFFB
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MPC8313EZQAFFA
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MPC8313EZQADD
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MPC8323EVRADDCA
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
MPC8313EVRAGDB דירוגים מרביים ומאפיינים חשמליים
| Processor Series | MPC83xx (PowerQUICC II Pro) |
| Core | PowerPC e300c3 |
| Core Architecture | 32-bit RISC |
| רוחב אפיק נתונים | 32 bit |
| Maximum CPU Clock | 400 MHz |
| Number of Cores | 1 |
| Process Technology | 0.09 um CMOS |
| Supply Voltage - I/O | 1.8V / 2.5V / 3.3V |
| מארז | 516-TEPBGA (27x27 mm) with Exposed Pad |
| Number of Pins/Balls | 516 balls |
| סוג הרכבה | Surface Mount (BGA) |
| טמפרטורת פעולה | -40C to +85C (Industrial) |
| Integrated Ethernet MACs | 2 (10/100/1000 Mbps eTSECs) |
| PCI Express | 2 x PCIe interfaces |
| USB Interface | USB 2.0 Host/Device |
| Cryptography Engine | Hardware IPsec, AES, DES/3DES, Kasumi |
| Security Enabled | Yes (E suffix) |
| סטטוס RoHS | non-compliant per legacy Freescale datasheet |
| Memory Controller | DDR1/DDR2 SDRAM |
| Pin/Ball Count | 516 |
מדריך תצורת פינים של MPC8313EVRAGDB 516-tepbga (27x27 mm) with exposed pad
תצורת פינים עבור MPC8313EVRAGDB (מארזת 516-tepbga (27x27 mm) with exposed pad). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור MPC8313EVRAGDB.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
MPC8313EVRAGDB מתאים עבור 6 יישוםs: Industrial VPN / IPsec Gateway, Industrial Ethernet Router / Gateway, Factory Automation Controller, Network-Attached Storage (NAS) Controller, Secure Print Server / Imaging Appliance, IP-PBX / Unified Communications Media Gateway.
Industrial VPN / IPsec Gateway
The MPC8313EVRAGDB's hardware IPsec, AES, DES/3DES, and Kasumi engines deliver wire-rate encryption at its 400 MHz CPU clock, offloading crypto workloads from the e300c3 core. Deployed between WAN and LAN interfaces with dual Gigabit eTSECs, it sustains multi-tunnel throughput for branch-office and industrial edge VPN concentrators. Compared to a software-only crypto path on a generic MPU, it consumes 60-70% less CPU headroom at 1 Gbps.
מומלץ
Industrial Ethernet Router / Gateway
Dual 10/100/1000 eTSECs combined with DDR1/DDR2 support make the MPC8313EVRAGDB a fit for industrial routers and protocol gateways bridging fieldbus (Modbus TCP, PROFINET) to enterprise networks. The e300c3 core runs an embedded Linux routing stack with iptables/QoS at sub-100 microsecond latency. The 516-TEPBGA exposed-die paddle supports industrial -40C to +85C environments with proper PCB thermal design.
מומלץ
Factory Automation Controller
Dual PCIe interfaces provide deterministic connectivity to FPGA-based motion controllers and high-speed I/O modules on the backplane, while four UARTs and dual I2C controllers connect to sensors, drives, and HMIs. The DDR2 controller with optional ECC delivers robust memory throughput for deterministic real-time control loops. Integrated crypto provides secure firmware update authentication over industrial Ethernet.
מומלץ
Network-Attached Storage (NAS) Controller
The MPC8313EVRAGDB's gigabit eTSEC plus local bus controller enables the chip to act as a low-power NAS or iSCSI target front-end, offloading file-system operations to a separate SATA controller over PCIe. DDR1/DDR2 with ECC provides memory needed for caching. The hardware crypto engine accelerates encrypted-filesystem operations (LUKS, IPsec-encrypted SMB) without taxing the CPU.
מומלץ
Secure Print Server / Imaging Appliance
Embedded printing and imaging appliances use the MPC8313EVRAGDB for its two Gigabit Ethernet MACs (one network, one service-port), USB 2.0 host controller (for media readers), and hardware AES acceleration for secure-job releases. The 400 MHz e300c3 core handles network protocol stacks and printer firmware, while the crypto engine secures SNMPv3 and IPsec management traffic. Industrial temperature grade supports deployment in copiers and factory print stations.
מומלץ
IP-PBX / Unified Communications Media Gateway
The 400 MHz e300c3 core plus dual Gigabit Ethernet MACs enables the MPC8313EVRAGDB to bridge IP-PBX media (VoIP RTP streams, T.38 fax) between enterprise WAN and legacy PSTN/TDM circuits via external DSP codecs. DDR1/DDR2 memory supports jitter buffers and codec buffers for concurrent channels. The integrated crypto engine secures SIP/TLS and SRTP media for compliance-sensitive deployments.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור MPC8313EVRAGDB — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | MPC8313EZQAGDB | MPC8313EVRAFFB | MPC8313EZQAFFA |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-TEPBGA (27x27 mm) | 516-TEPBGA (27x27 mm) | 516-TEPBGA (27x27 mm) | 516-TEPBGA (27x27 mm) |
| Core Clock Speed | 400 MHz | 400 MHz | 333 MHz | 333 MHz |
| Crypto Engine (E suffix) | Yes (IPsec, AES, DES/3DES, Kasumi) | No | Yes | No |
| DDR Memory Controller | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 |
| Gigabit Ethernet MACs | 2 x eTSEC | 2 x eTSEC | 2 x eTSEC | 2 x eTSEC |
| PCI Express Lanes | 2 x PCIe | 2 x PCIe | 2 x PCIe | 2 x PCIe |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
| Core Architecture | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 |
מבדילים עיקריים
- Integrated hardware security engine (E suffix) (לעומתMPC8313VRAGDB (non-E variant))
- Higher 400 MHz core clock vs AFFB bin (לעומתMPC8313EVRAFFB)
- Security-enabled with industrial temperature grade (לעומתMPC8313EZQAFFA (Z suffix, no security))
הערות תכנון
Estimated: at 400 MHz with 1.5-2.0 W typical dissipation, the 516-TEPBGA exposed die-attach paddle must be soldered to a central copper land with a 6x6 thermal-via array (0.3 mm drilled, 1.0 mm pitch) connecting to inner plane layers. Without this thermal relief, the junction temperature can exceed the +85C industrial limit at the upper end of the operating range. For continuous operation at full CPU load, also consider a heatsink bonded to a copper heat-spreader over the BGA.
The 516-ball BGA at 1.0 mm pitch requires 8-layer or 10-layer PCB stack-up with controlled impedance for the DDR2, Gigabit Ethernet, and PCIe routing. Use a microsection to confirm via-in-pad plating and 0.4 mm via capture pads with 0.2 mm laser-drilled vias for escape routing. Recommend 0.5 oz copper on outer layers and 1.0 oz on inner power/ground planes to handle the inrush currents from PowerQUICC II Pro power-up sequencing.
Decouple the three voltage rails (1.8V core, 2.5V DDR reference, 3.3V I/O) with bulk capacitors at the board edge and 10 uF ceramic + 0.1 uF high-frequency decoupling placed within 3 mm of each BGA ball group. The DDR reference voltage (MVREF) requires an external precision divider or buffer with 1% tolerance to maintain JEDEC-compliant signal integrity. Power sequencing between 1.8V and 3.3V must follow NXP's recommended rail order to avoid latchup.
Do not confuse the MPC8313E family with the MPC8315E - the latter is a newer, active-lifecycle part with the same 516-TEPBGA pinout but different silicon revision. The MPC8308CVMAGDA and MPC8378VRALGA are NOT pin-compatible drop-in substitutes despite similar product codes - they belong to different PowerQUICC II Pro sub-families with different ball maps, peripheral complements, and DDR controller IP, requiring board re-spin and BSP rebuild.
מידע על תאימות
Lead-based finish per legacy Freescale/NXP datasheet. Halogen-free status listed as 'Not Compliant' per distributor cross-reference data. Reach registration maintained by NXP as legacy substance.
