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NXP Semiconductors

MPC860SRCZQ50D4 - PowerQUICC 50MHz MPU, 357-PBGA | NXP

Артикул: MPC860SRCZQ50D4 ⚠ Последняя закупка
В наличии Отправка в течение 1–3 рабочих дней
3.3 V Vdss 357-PBGA (25x25 mm) Package 50 MHz Speed
От $64.5 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-15
Оптовые цены
Кол-во Цена за ед. Итого
1 $85 $85,00
10 $78.2 $782,00
100 $72.5 $7.250,00
500 $68 $34.000,00
1.000 $64.5 $64.500,00
ℹ️ Все цены указаны в USD

MPC860SRCZQ50D4 Обзор

The NXP MPC860SRCZQ50D4 is a PowerQUICC integrated communications microprocessor based on the MPC8xx family, featuring a 32-bit core running at 50 MHz, housed in a 357-ball PBGA (25x25 mm) package. It is built on a 0.32 µm process and integrates a PowerPC core with on-chip communications peripherals, targeting networking, telecom, and embedded control applications.

A PowerQUICC (PowerPC QUICC) processor is a family of integrated communications microprocessors originally developed by Freescale (formerly Motorola Semiconductor) and now part of NXP Semiconductors. It combines a PowerPC embedded processor core with the QUICC engine, a dedicated RISC-based communications processor module. The architecture sits in the broader hierarchy of microprocessor (MPU) -> embedded MPU -> integrated communications processor -> system-on-chip class device, designed to handle multiple serial channels and networking stacks without burdening the main CPU.

Key features of the MPC860SRCZQ50D4 include a 32-bit single-issue core, on-chip 4KB instruction cache and 4KB data cache, integrated CPM (Communications Processor Module) supporting multiple SCCs and SMCs, and 3.3V I/O supply with 5V-tolerant inputs. The wide 32-bit external bus, integrated memory controller (UPM/GLBIO), and integrated peripheral set reduce system BOM cost for routers, bridges, and ISDN terminal adapters. The 357-PBGA (25x25 mm) package provides high pin density while supporting commercial and industrial temperature grades within the MPC860 family.

Architecturally, the device pairs the PowerPC core with the CPM via an internal bus, allowing offloading of serial protocol processing. This dual-processor partitioning is what gave PowerQUICC its longevity in networking gear; the CPM handles HDLC, UART, transparent, and bisync framing, leaving the core free for routing and control-plane software.

Typical applications include ISDN terminal adapters, xDSL modems, low-end routers, industrial control with serial aggregation, and legacy telecom equipment. The wide integration makes it attractive for compact designs requiring multiple serial ports without external UARTs.

When designing with the MPC860SRCZQ50D4, verify that your firmware uses the correct CPM microcode revision, and confirm DDR/SDRAM timing closure with the integrated memory controller. Note that this part is in NXP's discontinuance program, so long-life industrial designs should qualify replacements or stockpile now.

This page synthesizes distributor availability, drop-in alternatives, and design notes not found in the manufacturer datasheet alone, helping engineers rapidly assess whether the MPC860SRCZQ50D4 fits legacy designs or whether a modern replacement should be evaluated.

Аналоги без доработки для MPC860SRCZQ50D4 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MPC860SRCZQ50D4 (тот же форм-фактор и посадочное место) — отличается по RoHS Status, Core Architecture, Operating Temperature, Package, Process Technology.

NXP Semiconductors
RoHS Status: Non-Compliant (legacy BGA with lead-bearing solder balls)
Operating Temperature: -40 C to +95 C
Package: 357-PBGA, 25x25 mm
Сравнить с MPC860SRCZQ50D4 →
NXP Semiconductors
RoHS Status: RoHS Compliant
Core Architecture: 32-bit PowerPC
Operating Temperature: 0C to +95C
Сравнить с MPC860SRCZQ50D4 →
NXP Semiconductors
RoHS Status: Non-Compliant (per NXP product page / DigiChip datasheet)
Core Architecture: PowerPC
Operating Temperature: -40C to +95C (industrial)
Сравнить с MPC860SRCZQ50D4 →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MPC860SRVR50D4

✅ Прямая замена
📦 357-PBGA
Same MPC8xx PowerQUICC core and 50 MHz speed, different package suffix within the same 357-BGA family

📋 Справочный аналог (нет в каталоге)

MPC860TZQ50D4

✅ Прямая замена
📦 357-PBGA
Same MPC860 family and 50 MHz speed; T-suffix variant for different temperature/operating grade

📋 Справочный аналог (нет в каталоге)

MPC860DTCZQ50D4

✅ Прямая замена
📦 357-PBGA
Same MPC860 family and 50 MHz speed; DTC-suffix variant differs in CPM configuration but shares the 357-BGA footprint

📋 Справочный аналог (нет в каталоге)

MPC860PVR80D4

✅ Прямая замена
📦 357-PBGA
Same MPC860 family and 357-BGA package; +60% core frequency (80 MHz vs 50 MHz) - higher performance drop-in

📋 Справочный аналог (нет в каталоге)

MPC860DTVR50D4

✅ Прямая замена
NXP Semiconductors
📦 357-PBGA
MPC8xx PowerQUICC · 32-bit PowerPC · 1 · 50 MHz · 3.3 V · 357-PBGA (25 x 25 mm) · Surface Mount · Tray

✓ В наличии

$59.8 / шт.

Открыть даташит →

MPC860SRCZQ50D4 Максимальные параметры и электрические характеристики

Processor Family MPC8xx PowerQUICC
Core Architecture PowerPC 32-bit
Core Count 1
Operating Frequency 50 MHz
Process Technology 0.32 µm CMOS
Напряжение питания 3.3 V
Корпус 357-PBGA (25x25 mm)
Тип монтажа Surface Mount
Instruction Cache 4 KB
Data Cache 4 KB
Integrated CPM Yes (QUICC engine, multiple SCCs/SMCs)
External Bus Width 32-bit
Packaging Tray
Lead Free Status Contains Lead
Статус RoHS RoHS status per datasheet
Статус жизненного цикла Discontinuance / Last Time Buy per NXP PCN

Руководство по цоколевке MPC860SRCZQ50D4 в корпусе 357-pbga (25x25 mm)

Цоколевка для MPC860SRCZQ50D4 (корпус 357-pbga (25x25 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.

Схема цоколевки корпуса 357-pbga (25x25 mm) для MPC860SRCZQ50D4

Нет подробных данных о распиновке для MPC860SRCZQ50D4.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

MPC860SRCZQ50D4 подходит для 6 применениеs: ISDN Terminal Adapter, Low-End Router / Bridge, xDSL Modem / CPE, Industrial Serial Aggregation Gateway, Legacy Telecom Control Board, Embedded Networking Reference Platform.

🌐

ISDN Terminal Adapter

The MPC860SRCZQ50D4's integrated CPM (Communications Processor Module) handles HDLC framing for ISDN BRI/U interfaces, offloading protocol processing from the 50 MHz PowerPC core. This dual-engine partitioning lets the core run the terminal adapter's PPP stack while the CPM services the D-channel and B-channels transparently. With 4KB instruction and 4KB data caches and an integrated memory controller, the MPC860SRCZQ50D4 fits an ISDN TA reference design on a single chip, reducing BOM cost versus a discrete CPU-plus-UART approach.

🌐

Low-End Router / Bridge

The MPC860SRCZQ50D4 is a classic choice for low-end SOHO routers and bridges because the CPM handles Ethernet and HDLC framing while the core runs the routing/forwarding logic. At 50 MHz with a 32-bit external bus, the device delivers sufficient throughput for sub-10 Mbps WAN links. The integrated memory controller (UPM/GLBIO) supports DRAM and Flash directly, removing the need for an external memory chip in many designs.

📡

xDSL Modem / CPE

In xDSL customer-premises equipment, the MPC860SRCZQ50D4's CPM serial channels can drive the DSL framer interface while the core runs the PPPoE/ATM stack. The 50 MHz core and 32-bit bus are sufficient for downstream rates in the 1-7 Mbps range typical of early ADSL deployments. The 357-PBGA package supports compact CPE form factors.

🏭

Industrial Serial Aggregation Gateway

Industrial gateways that aggregate multiple RS-232/485 links benefit from the MPC860SRCZQ50D4's multiple SCCs and SMCs, each capable of independent UART, HDLC, or transparent operation. The core runs the Modbus/industrial protocol stack while the CPM polls the serial channels. The integrated memory controller and wide 32-bit bus keep external component count low - critical for cost-sensitive industrial designs.

📞

Legacy Telecom Control Board

The MPC860SRCZQ50D4 is widely deployed in legacy telecom control boards where its CPM handles E1/T1 framer interfaces (via external line interface units) and the core runs the control-plane software. Its longevity and stable toolchain have kept it in service in central-office equipment well past its original product life. Designers maintaining these systems need the MPC860SRCZQ50D4 for spares and repairs.

🖥️

Embedded Networking Reference Platform

Engineering teams use the MPC860SRCZQ50D4 as a reference platform for PowerQUICC firmware development, including CPM microcode bring-up, UPM timing tuning, and PowerPC toolchain validation. The 357-PBGA package's standard land pattern and abundant documentation make it a useful training vehicle for engineers learning the MPC8xx architecture.

Сводка рекомендуемых товаров

MPC860SRVR50D4 Same family, alternate temperature grade drop-in Используется в: ISDN Terminal Adapter, Low-End Router / Bridge MPC860TZQ50D4 Same family drop-in for availability diversification Используется в: ISDN Terminal Adapter, Industrial Serial Aggregation Gateway MPC860PVR80D4 80 MHz drop-in for higher router throughput Используется в: Low-End Router / Bridge, Embedded Networking Reference Platform MPC860DTCZQ50D4 Same family drop-in with different CPM config Используется в: xDSL Modem / CPE MPC860DTVR50D4 NXP Semiconductors Используется в: Legacy Telecom Control Board
What is the MPC860SRCZQ50D4 and what does it do?
The MPC860SRCZQ50D4 is an NXP PowerQUICC integrated communications microprocessor in the MPC8xx family. It integrates a 50 MHz 32-bit PowerPC core with a CPM (Communications Processor Module) that offloads serial protocol handling, making it suitable for routers, ISDN terminal adapters, and xDSL modems. According to the NXP product page, it is now under discontinuance.
What is the operating frequency of MPC860SRCZQ50D4?
The MPC860SRCZQ50D4 runs the PowerPC core and CPM at 50 MHz. This frequency is shared between the core and the on-chip CPM engine. The 50 MHz grade is the lower-speed option in the MPC860 family; higher 66 MHz and 80 MHz variants exist for more demanding applications.
What package does the MPC860SRCZQ50D4 use?
The MPC860SRCZQ50D4 is packaged in a 357-ball PBGA (Plastic Ball Grid Array) measuring 25x25 mm. This is the high-density BGA package used for the MPC860 family. PCB designs require a corresponding BGA land pattern and standard reflow profile per JEDEC J-STD-020.
Is the MPC860SRCZQ50D4 still in production?
No. Per the NXP product page, the MPC860SRCZQ50D4 is in the End of Life / Discontinuance program with Last Time Buy status. Customers with active designs should qualify a replacement or place a Last Time Buy order before the PCN deadline. Inventory is still available through distributors and authorized stockists.
What is the lead time for MPC860SRCZQ50D4 today?
As of 2026-10-16, the MPC860SRCZQ50D4 lead time depends on stock remaining at distributors and the Last Time Buy window set by NXP. New factory orders are no longer accepted. Authorized distributors and franchised stockists may have inventory; expect extended lead times once remaining stock is depleted.
Where can I buy the MPC860SRCZQ50D4 online?
As of 2026-10-16, the MPC860SRCZQ50D4 is available through authorized distributors including DigiKey, Mouser, and Octopart-listed resellers. Note that the part is in Last Time Buy status, so pricing and stock fluctuate rapidly. Verify RoHS compliance and date code with the supplier before placing volume orders.
How much does the MPC860SRCZQ50D4 cost?
As of 2026-10-16, the MPC860SRCZQ50D4 is priced at approximately $85 per unit at qty 1, with volume discounts to around $64.50 at qty 1000. Pricing varies by distributor and reflects the part's EOL status - last-time-buy and post-EOL stock typically commands a premium over actively-produced equivalents.
What is the difference between MPC860SRCZQ50D4 and MPC860TZQ50D4?
Both parts share the same MPC8xx PowerQUICC architecture and 50 MHz speed, and both come in the 357-PBGA package. The differentiating suffixes in the MPC860 part-number system denote temperature grade, revision, and special screening. Refer to the MPC860 family datasheet to confirm whether T-suffix versus SR-suffix variants differ in operating temperature range or errata fixes.
What is the difference between MPC860SRCZQ50D4 and MPC860DTVR50D4?
Both are MPC860 PowerQUICC variants. The 'SRC' and 'DTVR' suffixes denote different package/grade combinations within the MPC860 family. The MPC860DTVR50D4 uses a different package/temperature rating. Confirm package pinout and operating temperature range against your PCB layout before substituting, as BGA versus other packages are not interchangeable.
Is there a drop-in replacement for the MPC860SRCZQ50D4?
There is no perfect drop-in replacement for the MPC860SRCZQ50D4 because the entire MPC860 family is being discontinued. Engineers should consider: (1) other MPC860 speed/grade variants like the MPC860SRVR50D4 in the same family, or (2) modern NXP QorIQ / i.MX parts which require board redesign. Always verify pinout and peripheral compatibility before substituting.
What is the best NXP equivalent for the MPC860SRCZQ50D4?
Within the NXP portfolio, the closest modern successors to the MPC860 PowerQUICC are the QorIQ P-series and Layerscape communications processors. These are not drop-in replacements - they require PCB redesign and firmware porting - but they preserve the integrated communications processor (CPM-equivalent) architecture the MPC860 pioneered. Check the NXP product change notice for recommended successors.
Where do I download the MPC860SRCZQ50D4 datasheet PDF?
The official MPC860SRCZQ50D4 datasheet (MPC860 Hardware Specifications) is available on the NXP product page at nxp.com, the Octopart datasheet portal, and archive sites such as alldatasheet.com. The document is approximately 80 pages and covers electrical characteristics, AC timing, and package information for the MPC860 family.
Where can I find the pinout for the MPC860SRCZQ50D4?
The 357-PBGA pinout (ball map) is documented in the MPC860 Hardware Specifications datasheet section on package pinout. The part uses a 25x25 mm PBGA, so use the manufacturer's BGA land pattern and the ball coordinate diagram from the datasheet for PCB layout. Cross-reference by signal name rather than ball number when comparing against other MPC860 variants.
What applications use the MPC860SRCZQ50D4?
The MPC860SRCZQ50D4 is designed for embedded networking and telecom applications including ISDN terminal adapters, xDSL modems, low-end routers and bridges, industrial serial aggregation, and legacy telecom equipment. The integrated CPM handles HDLC, UART, and bisync protocols, freeing the main core for routing and control-plane tasks.
What is the operating temperature range of the MPC860SRCZQ50D4?
The 'D4' suffix in the MPC860SRCZQ50D4 part number denotes the operating temperature grade per NXP's MPC8xx naming convention. The exact temperature range for the 'D4' grade should be verified in the MPC860 datasheet section on device markings and temperature ranges. Common grades in the MPC860 family span 0 to 70 °C (commercial) and -40 to +85 °C (industrial).

Справочные инженерные данные для MPC860SRCZQ50D4 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MPC860SRCZQ50D4 when maintaining legacy PowerQUICC designs that require a 50 MHz 32-bit MPU with the integrated QUICC CPM in a 357-PBGA. Choose the MPC860PVR80D4 (80 MHz) when you need higher throughput on the same 357-BGA footprint and your firmware supports the higher speed grade. Choose the MPC860TZQ50D4 when the suffix mapping indicates a better temperature-grade match. Avoid using non-MPC860 modern QorIQ/i.MX parts as direct substitutes - they require board redesign and firmware porting, though they offer much higher performance. Because the entire MPC860 family is in NXP's discontinuance program, plan a Last Time Buy or qualify a modern replacement now.

Сравнение с аналогами

Параметр Этот товар MPC860SRVR50D4 MPC860TZQ50D4 MPC860DTCZQ50D4 MPC860PVR80D4 MPC860DTVR50D4
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 357-PBGA (25x25 mm) 357-PBGA - same 357-PBGA - same 357-PBGA - same 357-PBGA - same 357-PBGA - same
Core Frequency 50 MHz 50 MHz 50 MHz 50 MHz 80 MHz 50 MHz
Core Architecture PowerPC 32-bit (MPC8xx) PowerPC 32-bit (MPC8xx) PowerPC 32-bit (MPC8xx) PowerPC 32-bit (MPC8xx) PowerPC 32-bit (MPC8xx) PowerPC 32-bit (MPC8xx)
Integrated CPM Yes (multiple SCCs/SMCs) Yes Yes Yes (different CPM config) Yes Yes (different CPM config)
Supply Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
External Bus Width 32-bit 32-bit 32-bit 32-bit 32-bit 32-bit
Lifecycle Status Last Time Buy / Discontinuance Discontinued - stock only Discontinued - stock only Discontinued - stock only Discontinued - stock only Discontinued - stock only

Ключевые отличия

  • 50 MHz core with full QUICC CPM (против MPC860PVR80D4)
  • SR-suffix revision in the MPC860 family (против MPC860TZQ50D4)
  • Integrated CPM offloads serial protocols (против Discrete MPU + external UARTs)

Заметки по проектированию

The 357-PBGA package has a junction-to-ambient thermal resistance in the 15-20 C/W range with adequate PCB copper. The MPC860SRCZQ50D4 typically dissipates 1-2 W at 50 MHz with 3.3 V supply. Ensure at least 4-layer PCB construction with continuous ground planes beneath the BGA to keep junction temperature within the operating range.

The 357-ball PBGA requires a precisely matched BGA land pattern per the manufacturer's mechanical drawing. Use NSMD (non-solder mask defined) pads for better joint reliability. Route escape traces on inner layers to break out the dense 1.27 mm pitch ball array. Recommend JEDEC J-STD-020 MSL-3 or better handling for the BGA.

Do not assume the 'SR' vs 'T' suffix is interchangeable without verifying against the MPC860 datasheet's device-marking table - these suffixes encode temperature grade and errata revisions. Also, the CPM microcode must match the silicon revision; loading incorrect microcode can hang the CPM silently. Always validate the full part marking against the datasheet before board bring-up.

Информация о соответствии

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Без свинца
No
Без галогенов
Unknown
Конфликтные минералы
Unknown

Lead Free Status per datasheet: Contains Lead. RoHS status per distributor listing marked as 'RoHS' but exact compliance level not confirmed in source data - set to unknown. AEC-Q100 not applicable for this communications MPU.

Данные проверены: 2026-10-16 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors Freescale Semiconductor MPC860SRCZQ50D4 MPC860SRVR50D4 MPC860TZQ50D4 MPC860DTCZQ50D4 MPC860PVR80D4 MPC860DTVR50D4 PowerQUICC MPC8xx PowerPC QUICC engine CPM (Communications Processor Module) PBGA 357-ball BGA HDLC UART SCC SMC ISDN xDSL embedded MPU JEDEC J-STD-020 0.32 µm CMOS 32-bit external bus
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