MPC860SRCZQ50D4 - PowerQUICC 50MHz MPU, 357-PBGA | NXP
부품 번호: MPC860SRCZQ50D4 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $85 | $85.00 |
| 10 | $78.2 | $782.00 |
| 100 | $72.5 | $7,250.00 |
| 500 | $68 | $34,000.00 |
| 1,000 | $64.5 | $64,500.00 |
MPC860SRCZQ50D4 개요
A PowerQUICC (PowerPC QUICC) processor is a family of integrated communications microprocessors originally developed by Freescale (formerly Motorola Semiconductor) and now part of NXP Semiconductors. It combines a PowerPC embedded processor core with the QUICC engine, a dedicated RISC-based communications processor module. The architecture sits in the broader hierarchy of microprocessor (MPU) -> embedded MPU -> integrated communications processor -> system-on-chip class device, designed to handle multiple serial channels and networking stacks without burdening the main CPU.
Key features of the MPC860SRCZQ50D4 include a 32-bit single-issue core, on-chip 4KB instruction cache and 4KB data cache, integrated CPM (Communications Processor Module) supporting multiple SCCs and SMCs, and 3.3V I/O supply with 5V-tolerant inputs. The wide 32-bit external bus, integrated memory controller (UPM/GLBIO), and integrated peripheral set reduce system BOM cost for routers, bridges, and ISDN terminal adapters. The 357-PBGA (25x25 mm) package provides high pin density while supporting commercial and industrial temperature grades within the MPC860 family.
Architecturally, the device pairs the PowerPC core with the CPM via an internal bus, allowing offloading of serial protocol processing. This dual-processor partitioning is what gave PowerQUICC its longevity in networking gear; the CPM handles HDLC, UART, transparent, and bisync framing, leaving the core free for routing and control-plane software.
Typical applications include ISDN terminal adapters, xDSL modems, low-end routers, industrial control with serial aggregation, and legacy telecom equipment. The wide integration makes it attractive for compact designs requiring multiple serial ports without external UARTs.
When designing with the MPC860SRCZQ50D4, verify that your firmware uses the correct CPM microcode revision, and confirm DDR/SDRAM timing closure with the integrated memory controller. Note that this part is in NXP's discontinuance program, so long-life industrial designs should qualify replacements or stockpile now.
This page synthesizes distributor availability, drop-in alternatives, and design notes not found in the manufacturer datasheet alone, helping engineers rapidly assess whether the MPC860SRCZQ50D4 fits legacy designs or whether a modern replacement should be evaluated.
드롭인 대체품: MPC860SRCZQ50D4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC860SRCZQ50D4 (동일 폼 팩터 및 풋프린트) — 차이점: RoHS Status, Core Architecture, Operating Temperature, Package, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC860SRVR50D4
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC860TZQ50D4
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC860DTCZQ50D4
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC860PVR80D4
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC860DTVR50D4
✅ 드롭인✓ 재고 있음
$59.8 / 개
데이터시트 보기 →MPC860SRCZQ50D4 최대 정격 & 전기적 특성
| Processor Family | MPC8xx PowerQUICC |
| Core Architecture | PowerPC 32-bit |
| Core Count | 1 |
| Operating Frequency | 50 MHz |
| Process Technology | 0.32 µm CMOS |
| 공급 전압 | 3.3 V |
| 패키지 | 357-PBGA (25x25 mm) |
| 실장 유형 | Surface Mount |
| Instruction Cache | 4 KB |
| Data Cache | 4 KB |
| Integrated CPM | Yes (QUICC engine, multiple SCCs/SMCs) |
| External Bus Width | 32-bit |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| RoHS 상태 | RoHS status per datasheet |
| 수명 주기 상태 | Discontinuance / Last Time Buy per NXP PCN |
MPC860SRCZQ50D4 357-pbga (25x25 mm) 핀 구성 가이드
MPC860SRCZQ50D4(357-pbga (25x25 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC860SRCZQ50D4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC860SRCZQ50D4 적합 용도: 6 애플리케이션s: ISDN Terminal Adapter, Low-End Router / Bridge, xDSL Modem / CPE, Industrial Serial Aggregation Gateway, Legacy Telecom Control Board, Embedded Networking Reference Platform.
ISDN Terminal Adapter
The MPC860SRCZQ50D4's integrated CPM (Communications Processor Module) handles HDLC framing for ISDN BRI/U interfaces, offloading protocol processing from the 50 MHz PowerPC core. This dual-engine partitioning lets the core run the terminal adapter's PPP stack while the CPM services the D-channel and B-channels transparently. With 4KB instruction and 4KB data caches and an integrated memory controller, the MPC860SRCZQ50D4 fits an ISDN TA reference design on a single chip, reducing BOM cost versus a discrete CPU-plus-UART approach.
추천
Low-End Router / Bridge
The MPC860SRCZQ50D4 is a classic choice for low-end SOHO routers and bridges because the CPM handles Ethernet and HDLC framing while the core runs the routing/forwarding logic. At 50 MHz with a 32-bit external bus, the device delivers sufficient throughput for sub-10 Mbps WAN links. The integrated memory controller (UPM/GLBIO) supports DRAM and Flash directly, removing the need for an external memory chip in many designs.
추천
xDSL Modem / CPE
In xDSL customer-premises equipment, the MPC860SRCZQ50D4's CPM serial channels can drive the DSL framer interface while the core runs the PPPoE/ATM stack. The 50 MHz core and 32-bit bus are sufficient for downstream rates in the 1-7 Mbps range typical of early ADSL deployments. The 357-PBGA package supports compact CPE form factors.
추천
Industrial Serial Aggregation Gateway
Industrial gateways that aggregate multiple RS-232/485 links benefit from the MPC860SRCZQ50D4's multiple SCCs and SMCs, each capable of independent UART, HDLC, or transparent operation. The core runs the Modbus/industrial protocol stack while the CPM polls the serial channels. The integrated memory controller and wide 32-bit bus keep external component count low - critical for cost-sensitive industrial designs.
추천
Legacy Telecom Control Board
The MPC860SRCZQ50D4 is widely deployed in legacy telecom control boards where its CPM handles E1/T1 framer interfaces (via external line interface units) and the core runs the control-plane software. Its longevity and stable toolchain have kept it in service in central-office equipment well past its original product life. Designers maintaining these systems need the MPC860SRCZQ50D4 for spares and repairs.
추천
Embedded Networking Reference Platform
Engineering teams use the MPC860SRCZQ50D4 as a reference platform for PowerQUICC firmware development, including CPM microcode bring-up, UPM timing tuning, and PowerPC toolchain validation. The 357-PBGA package's standard land pattern and abundant documentation make it a useful training vehicle for engineers learning the MPC8xx architecture.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC860SRCZQ50D4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC860SRVR50D4 | MPC860TZQ50D4 | MPC860DTCZQ50D4 | MPC860PVR80D4 | MPC860DTVR50D4 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA - same | 357-PBGA - same | 357-PBGA - same | 357-PBGA - same | 357-PBGA - same |
| Core Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 80 MHz | 50 MHz |
| Core Architecture | PowerPC 32-bit (MPC8xx) | PowerPC 32-bit (MPC8xx) | PowerPC 32-bit (MPC8xx) | PowerPC 32-bit (MPC8xx) | PowerPC 32-bit (MPC8xx) | PowerPC 32-bit (MPC8xx) |
| Integrated CPM | Yes (multiple SCCs/SMCs) | Yes | Yes | Yes (different CPM config) | Yes | Yes (different CPM config) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| External Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Lifecycle Status | Last Time Buy / Discontinuance | Discontinued - stock only | Discontinued - stock only | Discontinued - stock only | Discontinued - stock only | Discontinued - stock only |
주요 차별점
- 50 MHz core with full QUICC CPM (vs MPC860PVR80D4)
- SR-suffix revision in the MPC860 family (vs MPC860TZQ50D4)
- Integrated CPM offloads serial protocols (vs Discrete MPU + external UARTs)
설계 노트
The 357-PBGA package has a junction-to-ambient thermal resistance in the 15-20 C/W range with adequate PCB copper. The MPC860SRCZQ50D4 typically dissipates 1-2 W at 50 MHz with 3.3 V supply. Ensure at least 4-layer PCB construction with continuous ground planes beneath the BGA to keep junction temperature within the operating range.
The 357-ball PBGA requires a precisely matched BGA land pattern per the manufacturer's mechanical drawing. Use NSMD (non-solder mask defined) pads for better joint reliability. Route escape traces on inner layers to break out the dense 1.27 mm pitch ball array. Recommend JEDEC J-STD-020 MSL-3 or better handling for the BGA.
Do not assume the 'SR' vs 'T' suffix is interchangeable without verifying against the MPC860 datasheet's device-marking table - these suffixes encode temperature grade and errata revisions. Also, the CPM microcode must match the silicon revision; loading incorrect microcode can hang the CPM silently. Always validate the full part marking against the datasheet before board bring-up.
규정 준수 정보
Lead Free Status per datasheet: Contains Lead. RoHS status per distributor listing marked as 'RoHS' but exact compliance level not confirmed in source data - set to unknown. AEC-Q100 not applicable for this communications MPU.
