MSC8156SVT1000B - SC3850 6-Core DSP, 1 GHz, 783-FCBGA | NXP
Артикул: MSC8156SVT1000B ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $193.95 | $193,95 |
| 10 | $175.5 | $1.755,00 |
| 100 | $152 | $15.200,00 |
| 500 | $138.25 | $69.125,00 |
| 1.000 | $124.8 | $124.800,00 |
MSC8156SVT1000B Обзор
A DSP (Digital Signal Processor) is a specialized microprocessor optimized for high-speed numerical computation on streaming data, typically MACs (multiply-accumulate) per cycle, used in wireless basestations, video transcoding, and real-time signal analysis. The MSC8156 belongs to the high-tier DSP family within the power-management-adjacent SoC category - meaning it is a heterogeneous compute SoC combining multiple DSP cores, MAPLE-B multi-acceleration platform engines, DDR3 memory controller, and SerDes interfaces, sitting above single-core DSPs in the embedded-compute taxonomy.
Key features include the SC3850 VLIW-style DSP core supporting SIMD-style packed operations, six cores delivering up to 6 GHz of DSP aggregate clock, hardware acceleration blocks for turbo decoding and Viterbi decoding, an integrated DDR2/DDR3 memory controller supporting up to 8 GB of addressable memory, four lanes of high-speed SerDes, and a MAPLE-B baseband acceleration engine. The device is fabricated in a low-power CMOS process.
Typical applications include 3G/4G wireless basestation baseband processing, multi-channel voice/audio processing, software-defined radio (SDR) front-ends, high-density channel cards for carrier-grade infrastructure, and real-time video transcoding in broadcast equipment. The wide memory bandwidth and six-core parallelism make it ideal for signal-processing workloads that exceed what an FPGA or general-purpose CPU can sustain at low power.
When designing with the MSC8156, allocate adequate PCB area for the 29x29 mm FCBGA land pattern and follow NXP's PCB layout and thermal guidelines in the datasheet. Decoupling must be dense and placed close to each power-supply ball cluster to support the high transient current of the core when six cores are simultaneously active.
This page synthesizes distributor stock, parametric data, and application notes for engineers evaluating the MSC8156SVT1000B for new designs or legacy board rework, going beyond the raw datasheet by including cross-reference candidates and design trade-off analysis.
Аналоги без доработки для MSC8156SVT1000B — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MSC8156SVT1000B (тот же форм-фактор и посадочное место) — отличается по Mounting Type, Core Architecture, Non-Volatile Memory, Series, On-Chip RAM.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MSC8156SVT800B
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
MSC8156SVT1200B
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
MSC8156EVM
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
MSC8156ESVT1000B
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$138 / шт.
Открыть даташит →MSC8256SVT1000B
✅ Прямая замена✓ В наличии
$189 / шт.
Открыть даташит →MSC8256SVT800B
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
MSC8156SVT1000B Характеристики
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | StarCore MSC815x |
| Type | SC3850 Six-Core Digital Signal Processor |
| Core Count | 6 x SC3850 |
| Core Clock Frequency | 1 GHz |
| L1 Instruction Cache (per core) | 32 KB |
| L1 Data Cache (per core) | 32 KB |
| Unified L2 Cache | 512 KB (configurable, per subsystem) |
| On-Chip RAM | 576 KB |
| Non-Volatile Memory | ROM (96 KB) |
| Корпус / Типоразмер | 783-FCBGA (29x29 mm) |
| Number of Terminals | 783 |
| Terminal Form | Ball |
| Packaging | Tray |
| Тип монтажа | Surface Mount |
Руководство по цоколевке MSC8156SVT1000B в корпусе 783-fcbga (29x29 mm)
Цоколевка для MSC8156SVT1000B (корпус 783-fcbga (29x29 mm)). Нумерация выводов, функции и схемы подключения определены в техническом описании производителя. Обратитесь к нему для точного посадочного места и рекомендаций по пайке.
Нет подробных данных о распиновке для MSC8156SVT1000B.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
MSC8156SVT1000B подходит для 6 применениеs: 3G/4G Wireless Basestation Baseband, Multi-Channel Voice / Audio Processing, Software-Defined Radio (SDR) Front-End, High-Density Channel Card / Carrier Infrastructure, Real-Time Video Transcoding / Broadcast Equipment, Industrial / Defense Multi-Axis DSP Compute.
3G/4G Wireless Basestation Baseband
The MSC8156SVT1000B's six SC3850 cores at 1 GHz plus MAPLE-B acceleration make it purpose-built for 3G/4G basestation baseband processing, where channel cards must handle PHY-layer PHY in real time. A single device can sustain up to 6 GHz of aggregate DSP throughput, decoding turbo/Viterbi streams, running FFT/IFFT, and driving multi-antenna processing with deterministic latency. Designers typically place the MSC8156 between the RF front-end and the backhaul, paired with a DDR3 memory bank of 1-4 GB for soft-buffer storage and a multi-rail PMIC for sequencing the 1.0 V core, 1.5 V DDR3, and analog SerDes rails.
Рекомендуется
Multi-Channel Voice / Audio Processing
Channelized audio workloads - voice-over-IP gateways, professional audio mixers, broadcast codecs - are a natural fit for the MSC8156SVT1000B because each SC3850 core can independently process a stream of audio channels with SIMD-style packed operations. The 576 KB on-chip RAM plus 96 KB ROM keep small routing tables on-chip, while the DDR3 controller supplies deeper sample buffers. The chip's deterministic scheduling gives audio engineers sample-accurate timing, supporting both pro-grade AES67/Dante-style transport and lower-tier conferencing systems.
Рекомендуется
Software-Defined Radio (SDR) Front-End
Software-defined radio platforms use the MSC8156SVT1000B's six cores to run multiple simultaneous demodulation chains (e.g., LTE + GSM + GPS) with MAPLE-B accelerating FFT/channel estimation. The high-speed SerDes interfaces connect to wideband ADC/DAC front-ends, while the DDR3 controller absorbs large buffers between ADC and DSP. Reconfiguration across waveforms is achieved by simply swapping firmware rather than the silicon, which is the canonical SDR advantage and one of the strongest fits for this part in production designs.
Рекомендуется
High-Density Channel Card / Carrier Infrastructure
For carrier-grade infrastructure such as fiber-to-the-x aggregation, line cards, and multiservice edge platforms, the MSC8156SVT1000B's 783-FCBGA integration of six cores, memory controller, and SerDes lets each card handle hundreds of channels in a single chip. Manufacturers building NAT routers, deep-packet-inspection appliances, or SBCs (session border controllers) benefit from predictable per-channel latency. The trade-off vs an FPGA is software-upgradeability and faster time-to-market on protocol updates.
Рекомендуется
Real-Time Video Transcoding / Broadcast Equipment
Broadcast transcoders that must encode/decode multiple video streams at the same time benefit from the MSC8156SVT1000B's six independent DSP cores, each capable of running H.264 / HEVC DSP-side pre-processing or audio/video sync. Although the SC3850 cores are fixed-point (with hardware SIMD-style packed ops), they excel at motion estimation, rate-control arithmetic, and block-level DSP assistance to a paired host SoC. Several cores can also be reserved for transcoding while others run audio downmix or DRM processing in parallel.
Рекомендуется
Industrial / Defense Multi-Axis DSP Compute
Defense signal-intelligence, industrial-vibration analysis, and machine-vision pre-processing platforms exploit the MSC8156SVT1000B's six cores running parallel FFTs and matched filters at deterministic rates. MAPLE-B plus the SC3850's tight loop pipeline support continuous data flow at hundreds of MSPS, with DDR3 buffering long acquisitions. Industrial customers also value the long lifecycle and the deterministic latency that AOI and condition-monitoring systems demand.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MSC8156SVT1000B — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MSC8156SVT800B | MSC8156SVT1200B | MSC8156EVM | MSC8156ESVT1000B | MSC8256SVT1000B | MSC8256SVT800B |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same |
| Core Architecture | 6 x SC3850 (StarCore) | 6 x SC3850 (StarCore) | 6 x SC3850 (StarCore) | 6 x SC3850 (StarCore) | 6 x SC3850 (StarCore) | MSC8256 series (sibling) | MSC8256 series (sibling) |
| Core Clock | 1000 MHz | 800 MHz | 1200 MHz | 1000 MHz (eval board) | 1000 MHz | 1000 MHz | 800 MHz |
| Memory Controller | DDR2/DDR3 | DDR2/DDR3 | DDR2/DDR3 | DDR2/DDR3 | DDR2/DDR3 | DDR2/DDR3 | DDR2/DDR3 |
| Lifecycle Status | NRND | NRND | NRND | EOL/legacy | NRND | NRND | NRND |
Ключевые отличия
- Six independent 1 GHz SC3850 cores in one package (против TMS320C6678ACYP)
- Integrated DDR2/DDR3 + SerDes + MAPLE-B acceleration (против MSC8156SVT800B)
- Speed-bin flexibility vs MSC8156EVM board variant (против MSC8156EVM)
Заметки по проектированию
At full load with six SC3850 cores at 1 GHz the MSC8156SVT1000B can draw several watts of core power concentrated in the central die region. Use a dense array of thermal vias under the FCBGA and a thermal pad/E-PAD routed to inner copper planes for spreading. Per NXP reference designs, an aluminum or copper heatsink is recommended for production deployments; check theta_JA from the latest datasheet revision against the application's ambient temperature. Estimated: at 6 GHz aggregate with 1.0 V core and typical 1-2 W per core, total core power can exceed 6-9 W under sustained workloads. Always verify against silicon-rev-specific errata.
The 783-ball FCBGA requires a 0.8 mm-or-finer pitch land pattern with non-solder-mask-defined (NSMD) pads for stress relief. Match the NXP reference layout exactly for the DDR3, SerDes, and Ethernet ball clusters; signal-integrity simulations are recommended for any routing change because the high-speed interfaces are sensitive to via stub length and reference-plane discontinuities. Use microvia stacks with 0.1 mm pitch keep-out to reach the inner layer escape pattern from the dense ball grid.
Separate analog and digital grounds with a single tie-point underneath the MSC8156SVT1000B to avoid high-current return paths crossing sensitive analog SerDes signals. Place the DDR3 termination VTT regulator and bulk decoupling within 5 mm of the VTT balls, and route DDR3 clocks with matched lengths to the tolerance in the reference manual. The MAPLE-B and JTAG signals can be routed on inner layers but must avoid crossing the SerDes reference planes.
Sequence the multi-rail supplies in the order specified by the MSC8156 datasheet to avoid latch-up: typically 3.3 V I/O first, then 1.5 V DDR3, then 1.0 V core, then SerDes analog. Use a PMIC with adjustable ramp rates - the part's boot ROM expects specific power-rail timing windows, and deviations can prevent JTAG connection. Each rail needs at least 22 uF of bulk ceramic plus a 1-2 uF mid-frequency decoupling pool near the FCBGA balls.
Common pitfalls when bringing up the MSC8156SVT1000B include: (1) using a wrong boot mode configuration (RCW) for the silicon revision - always read the latest errata before programming RCW; (2) skipping DDR3 read/write deskew training which is mandatory because the integrated controller's eye margins are tighter than discrete parts; (3) overlooking SerDes pre-emphasis and equalization settings for longer backplane traces; (4) placing the part in a sealed enclosure without thermal modeling, given the 6-9 W typical core dissipation.
Информация о соответствии
RoHS, REACH, lead-free, and halogen-free status were not present in the verified web data; all set to 'unknown'. This part is classified as a commercial-grade DSP, not automotive, so AEC-Q100 does not apply. Always verify with the most recent PCN or contact NXP directly for the current compliance position on legacy NRND parts.
