MSC8156SVT1000B - SC3850 6-Core DSP, 1 GHz, 783-FCBGA | NXP
부품 번호: MSC8156SVT1000B ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $193.95 | $193.95 |
| 10 | $175.5 | $1,755.00 |
| 100 | $152 | $15,200.00 |
| 500 | $138.25 | $69,125.00 |
| 1,000 | $124.8 | $124,800.00 |
MSC8156SVT1000B 개요
A DSP (Digital Signal Processor) is a specialized microprocessor optimized for high-speed numerical computation on streaming data, typically MACs (multiply-accumulate) per cycle, used in wireless basestations, video transcoding, and real-time signal analysis. The MSC8156 belongs to the high-tier DSP family within the power-management-adjacent SoC category - meaning it is a heterogeneous compute SoC combining multiple DSP cores, MAPLE-B multi-acceleration platform engines, DDR3 memory controller, and SerDes interfaces, sitting above single-core DSPs in the embedded-compute taxonomy.
Key features include the SC3850 VLIW-style DSP core supporting SIMD-style packed operations, six cores delivering up to 6 GHz of DSP aggregate clock, hardware acceleration blocks for turbo decoding and Viterbi decoding, an integrated DDR2/DDR3 memory controller supporting up to 8 GB of addressable memory, four lanes of high-speed SerDes, and a MAPLE-B baseband acceleration engine. The device is fabricated in a low-power CMOS process.
Typical applications include 3G/4G wireless basestation baseband processing, multi-channel voice/audio processing, software-defined radio (SDR) front-ends, high-density channel cards for carrier-grade infrastructure, and real-time video transcoding in broadcast equipment. The wide memory bandwidth and six-core parallelism make it ideal for signal-processing workloads that exceed what an FPGA or general-purpose CPU can sustain at low power.
When designing with the MSC8156, allocate adequate PCB area for the 29x29 mm FCBGA land pattern and follow NXP's PCB layout and thermal guidelines in the datasheet. Decoupling must be dense and placed close to each power-supply ball cluster to support the high transient current of the core when six cores are simultaneously active.
This page synthesizes distributor stock, parametric data, and application notes for engineers evaluating the MSC8156SVT1000B for new designs or legacy board rework, going beyond the raw datasheet by including cross-reference candidates and design trade-off analysis.
드롭인 대체품: MSC8156SVT1000B — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MSC8156SVT1000B (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Core Architecture, Non-Volatile Memory, Series, On-Chip RAM.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MSC8156SVT800B
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MSC8156SVT1200B
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MSC8156EVM
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MSC8156ESVT1000B
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$138 / 개
데이터시트 보기 →MSC8256SVT1000B
✅ 드롭인✓ 재고 있음
$189 / 개
데이터시트 보기 →MSC8256SVT800B
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MSC8156SVT1000B 사양
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | StarCore MSC815x |
| Type | SC3850 Six-Core Digital Signal Processor |
| Core Count | 6 x SC3850 |
| Core Clock Frequency | 1 GHz |
| L1 Instruction Cache (per core) | 32 KB |
| L1 Data Cache (per core) | 32 KB |
| Unified L2 Cache | 512 KB (configurable, per subsystem) |
| On-Chip RAM | 576 KB |
| Non-Volatile Memory | ROM (96 KB) |
| 패키지 / 케이스 | 783-FCBGA (29x29 mm) |
| Number of Terminals | 783 |
| Terminal Form | Ball |
| Packaging | Tray |
| 실장 유형 | Surface Mount |
MSC8156SVT1000B 783-fcbga (29x29 mm) 핀 구성 가이드
MSC8156SVT1000B(783-fcbga (29x29 mm) 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: MSC8156SVT1000B.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MSC8156SVT1000B 적합 용도: 6 애플리케이션s: 3G/4G Wireless Basestation Baseband, Multi-Channel Voice / Audio Processing, Software-Defined Radio (SDR) Front-End, High-Density Channel Card / Carrier Infrastructure, Real-Time Video Transcoding / Broadcast Equipment, Industrial / Defense Multi-Axis DSP Compute.
3G/4G Wireless Basestation Baseband
The MSC8156SVT1000B's six SC3850 cores at 1 GHz plus MAPLE-B acceleration make it purpose-built for 3G/4G basestation baseband processing, where channel cards must handle PHY-layer PHY in real time. A single device can sustain up to 6 GHz of aggregate DSP throughput, decoding turbo/Viterbi streams, running FFT/IFFT, and driving multi-antenna processing with deterministic latency. Designers typically place the MSC8156 between the RF front-end and the backhaul, paired with a DDR3 memory bank of 1-4 GB for soft-buffer storage and a multi-rail PMIC for sequencing the 1.0 V core, 1.5 V DDR3, and analog SerDes rails.
추천
Multi-Channel Voice / Audio Processing
Channelized audio workloads - voice-over-IP gateways, professional audio mixers, broadcast codecs - are a natural fit for the MSC8156SVT1000B because each SC3850 core can independently process a stream of audio channels with SIMD-style packed operations. The 576 KB on-chip RAM plus 96 KB ROM keep small routing tables on-chip, while the DDR3 controller supplies deeper sample buffers. The chip's deterministic scheduling gives audio engineers sample-accurate timing, supporting both pro-grade AES67/Dante-style transport and lower-tier conferencing systems.
추천
Software-Defined Radio (SDR) Front-End
Software-defined radio platforms use the MSC8156SVT1000B's six cores to run multiple simultaneous demodulation chains (e.g., LTE + GSM + GPS) with MAPLE-B accelerating FFT/channel estimation. The high-speed SerDes interfaces connect to wideband ADC/DAC front-ends, while the DDR3 controller absorbs large buffers between ADC and DSP. Reconfiguration across waveforms is achieved by simply swapping firmware rather than the silicon, which is the canonical SDR advantage and one of the strongest fits for this part in production designs.
추천
High-Density Channel Card / Carrier Infrastructure
For carrier-grade infrastructure such as fiber-to-the-x aggregation, line cards, and multiservice edge platforms, the MSC8156SVT1000B's 783-FCBGA integration of six cores, memory controller, and SerDes lets each card handle hundreds of channels in a single chip. Manufacturers building NAT routers, deep-packet-inspection appliances, or SBCs (session border controllers) benefit from predictable per-channel latency. The trade-off vs an FPGA is software-upgradeability and faster time-to-market on protocol updates.
추천
Real-Time Video Transcoding / Broadcast Equipment
Broadcast transcoders that must encode/decode multiple video streams at the same time benefit from the MSC8156SVT1000B's six independent DSP cores, each capable of running H.264 / HEVC DSP-side pre-processing or audio/video sync. Although the SC3850 cores are fixed-point (with hardware SIMD-style packed ops), they excel at motion estimation, rate-control arithmetic, and block-level DSP assistance to a paired host SoC. Several cores can also be reserved for transcoding while others run audio downmix or DRM processing in parallel.
추천
Industrial / Defense Multi-Axis DSP Compute
Defense signal-intelligence, industrial-vibration analysis, and machine-vision pre-processing platforms exploit the MSC8156SVT1000B's six cores running parallel FFTs and matched filters at deterministic rates. MAPLE-B plus the SC3850's tight loop pipeline support continuous data flow at hundreds of MSPS, with DDR3 buffering long acquisitions. Industrial customers also value the long lifecycle and the deterministic latency that AOI and condition-monitoring systems demand.
추천
추천 제품 요약
엔지니어링 참조 데이터: MSC8156SVT1000B — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MSC8156SVT800B | MSC8156SVT1200B | MSC8156EVM | MSC8156ESVT1000B | MSC8256SVT1000B | MSC8256SVT800B |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same |
| Core Architecture | 6 x SC3850 (StarCore) | 6 x SC3850 (StarCore) | 6 x SC3850 (StarCore) | 6 x SC3850 (StarCore) | 6 x SC3850 (StarCore) | MSC8256 series (sibling) | MSC8256 series (sibling) |
| Core Clock | 1000 MHz | 800 MHz | 1200 MHz | 1000 MHz (eval board) | 1000 MHz | 1000 MHz | 800 MHz |
| Memory Controller | DDR2/DDR3 | DDR2/DDR3 | DDR2/DDR3 | DDR2/DDR3 | DDR2/DDR3 | DDR2/DDR3 | DDR2/DDR3 |
| Lifecycle Status | NRND | NRND | NRND | EOL/legacy | NRND | NRND | NRND |
주요 차별점
- Six independent 1 GHz SC3850 cores in one package (vs TMS320C6678ACYP)
- Integrated DDR2/DDR3 + SerDes + MAPLE-B acceleration (vs MSC8156SVT800B)
- Speed-bin flexibility vs MSC8156EVM board variant (vs MSC8156EVM)
설계 노트
At full load with six SC3850 cores at 1 GHz the MSC8156SVT1000B can draw several watts of core power concentrated in the central die region. Use a dense array of thermal vias under the FCBGA and a thermal pad/E-PAD routed to inner copper planes for spreading. Per NXP reference designs, an aluminum or copper heatsink is recommended for production deployments; check theta_JA from the latest datasheet revision against the application's ambient temperature. Estimated: at 6 GHz aggregate with 1.0 V core and typical 1-2 W per core, total core power can exceed 6-9 W under sustained workloads. Always verify against silicon-rev-specific errata.
The 783-ball FCBGA requires a 0.8 mm-or-finer pitch land pattern with non-solder-mask-defined (NSMD) pads for stress relief. Match the NXP reference layout exactly for the DDR3, SerDes, and Ethernet ball clusters; signal-integrity simulations are recommended for any routing change because the high-speed interfaces are sensitive to via stub length and reference-plane discontinuities. Use microvia stacks with 0.1 mm pitch keep-out to reach the inner layer escape pattern from the dense ball grid.
Separate analog and digital grounds with a single tie-point underneath the MSC8156SVT1000B to avoid high-current return paths crossing sensitive analog SerDes signals. Place the DDR3 termination VTT regulator and bulk decoupling within 5 mm of the VTT balls, and route DDR3 clocks with matched lengths to the tolerance in the reference manual. The MAPLE-B and JTAG signals can be routed on inner layers but must avoid crossing the SerDes reference planes.
Sequence the multi-rail supplies in the order specified by the MSC8156 datasheet to avoid latch-up: typically 3.3 V I/O first, then 1.5 V DDR3, then 1.0 V core, then SerDes analog. Use a PMIC with adjustable ramp rates - the part's boot ROM expects specific power-rail timing windows, and deviations can prevent JTAG connection. Each rail needs at least 22 uF of bulk ceramic plus a 1-2 uF mid-frequency decoupling pool near the FCBGA balls.
Common pitfalls when bringing up the MSC8156SVT1000B include: (1) using a wrong boot mode configuration (RCW) for the silicon revision - always read the latest errata before programming RCW; (2) skipping DDR3 read/write deskew training which is mandatory because the integrated controller's eye margins are tighter than discrete parts; (3) overlooking SerDes pre-emphasis and equalization settings for longer backplane traces; (4) placing the part in a sealed enclosure without thermal modeling, given the 6-9 W typical core dissipation.
규정 준수 정보
RoHS, REACH, lead-free, and halogen-free status were not present in the verified web data; all set to 'unknown'. This part is classified as a commercial-grade DSP, not automotive, so AEC-Q100 does not apply. Always verify with the most recent PCN or contact NXP directly for the current compliance position on legacy NRND parts.
