PIC24FJ64GP202-I/ML - 16-bit 32MHz 64KB Flash MCU | Microchip
Артикул: PIC24FJ64GP202-I/ML ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $3.78 | $3,78 |
| 10 | $3.4 | $34,00 |
| 100 | $3.02 | $302,00 |
| 500 | $2.71 | $1.355,00 |
| 1.000 | $2.42 | $2.420,00 |
PIC24FJ64GP202-I/ML Обзор
A 16-bit MCU (microcontroller unit) is a single-chip computer that integrates a 16-bit CPU core, program memory (Flash), data memory (RAM), and a rich set of peripherals on one die. PIC24F devices sit between 8-bit PIC MCUs and 32-bit ARM Cortex-M parts in Microchip's lineup, targeting low-power, mixed-signal embedded designs. The 'F' denotes Flash program memory; the 'GP2' series specifically adds USB-OTG and analog CIPs, occupying the slot below the USB-less 'GA' series and above the baseline 'FJ' family.
Key features of the PIC24FJ64GP202 include 16 MIPS throughput, an eXtreme Low Power (XLP) sleep mode that retains state at a few hundred nanoamperes, hardware ECC on Flash, a 12-bit ADC, multiple timers, and configurable logic cells. The 28-QFN package exposes the EP (exposed pad) for thermal dissipation and ground stitching, enabling compact layouts down to ~6x6 mm.
Typical applications include USB peripherals such as HID input devices, low-power sensor nodes with USB charging, and human-interface products that need a small-form-factor MCU with on-chip USB. The wide operating voltage (2.0 V to 3.6 V) and low sleep current also suit battery-powered IoT endpoints. Industrial temperature grade (-40C to +85C) supports commercial and light-industrial deployments.
When laying out this part, tie the exposed pad to a clean ground plane with multiple thermal vias to keep junction temperature low under USB-active loads. Decouple VDD/VUSB with 100 nF + 4.7 uF ceramics placed within 2 mm of the pins, and route the D+/D- pair with 90-ohm differential impedance.
Аналоги без доработки для PIC24FJ64GP202-I/ML — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC24FJ64GP202-I/ML (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Core Architecture, ADC, Program Memory (Flash).
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC24FJ64GP202-I/MV
✅ Прямая замена✓ В наличии
$2.52 / шт.
Открыть даташит →PIC24FJ64GB002-I/ML
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC24FJ64GA002-I/ML
✅ Прямая замена✓ В наличии
$2.45 / шт.
Открыть даташит →PIC24FJ64GP202-E/ML
✅ Прямая замена✓ В наличии
$2.45 / шт.
Открыть даташит →PIC24FJ32GP202-I/ML
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC24FJ64GP202-I/ML Максимальные параметры и электрические характеристики
| Core | PIC24F (16-bit modified Harvard) |
| CPU Architecture | 16-bit RISC |
| Max CPU Clock | 32 MHz |
| Performance | 16 MIPS |
| Program Memory (Flash) | 64 KB (22K x 24) |
| Flash ECC | Hardware ECC (1-bit error correction) |
| Data RAM | 8 KB |
| Operating Voltage (VDD) | 2.0 V to 3.6 V |
| ADC | 12-bit |
| USB | USB 2.0 Full-Speed Host/Device/OTG |
| Рабочая температура | -40C to +85C (Industrial) |
| Корпус | 28-pin QFN (6x6 mm) with exposed pad |
| Тип монтажа | Surface Mount |
| Уровень MSL | 3 |
| Lead-Free / RoHS | Compliant |
Конфигурация выводов PIC24FJ64GP202-I/ML
| Контакт 1 | RA0 — Port A bit 0 / analog input |
| Контакт 2 | RA1 — Port A bit 1 / analog input |
| Контакт 3 | RA2 — Port A bit 2 / analog input |
| Контакт 4 | RA3 — Port A bit 3 / analog reference |
| Контакт 5 | VDD — Positive supply voltage (2.0V to 3.6V) |
| Контакт 6 | VSS — Ground reference |
| Контакт 7 | OSC1 — Crystal oscillator input |
| Контакт 8 | OSC2 — Crystal oscillator output |
| Контакт 9 | RB0 — Port B bit 0 |
| Контакт 10 | RB1 — Port B bit 1 |
| Контакт 11 | RB2 — Port B bit 2 |
| Контакт 12 | RB3 — Port B bit 3 |
| Контакт 13 | RB4 — Port B bit 4 |
| Контакт 14 | RB5 — Port B bit 5 |
| Контакт 15 | RB6 — Port B bit 6 / ICSPCLK |
| Контакт 16 | RB7 — Port B bit 7 / ICSPDAT |
| Контакт 17 | RC0 — Port C bit 0 |
| Контакт 18 | RC1 — Port C bit 1 |
| Контакт 19 | RC2 — Port C bit 2 / USB D- |
| Контакт 20 | RC3 — Port C bit 3 / USB D+ |
| Контакт 21 | RC4 — Port C bit 4 |
| Контакт 22 | RC5 — Port C bit 5 |
| Контакт 23 | RC6 — Port C bit 6 |
| Контакт 24 | RC7 — Port C bit 7 |
| Контакт 25 | VUSB — USB transceiver supply (3.3V typical) |
| Контакт 26 | MCLR — Master clear reset (active low) |
| Контакт 27 | AVDD — Analog supply voltage |
| Контакт 28 | AVSS — Analog ground reference |
Типичное применение
PIC24FJ64GP202-I/ML подходит для 6 применениеs: USB HID Input Devices, Portable USB Sensor Nodes, USB Charging and Power Bank Controllers, Industrial Control Panels, Medical Monitoring Accessories, Consumer Audio USB Interfaces.
USB HID Input Devices
The PIC24FJ64GP202-I/ML is well suited to USB Human Interface Device (HID) peripherals such as keyboards, mice, game controllers, and custom input panels. Its integrated Full-Speed USB 2.0 controller with on-chip transceiver eliminates the need for an external USB PHY, reducing BOM cost. The 16 MIPS CPU at 32 MHz comfortably handles HID report generation, debounce algorithms, and LED feedback without offloading. With XLP sleep current in the hundreds of nA, battery-powered wireless HID dongles can achieve multi-year standby times. The 28-QFN (6x6 mm) footprint fits inside even compact USB-C enclosures.
Рекомендуется
Portable USB Sensor Nodes
For portable sensor nodes that stream data over USB, the PIC24FJ64GP202-I/ML pairs its 12-bit ADC with Full-Speed USB to deliver sampled sensor data directly to a host. The 2.0-3.6 V VDD range supports direct Li-ion or 2xAA battery operation without an LDO. XLP sleep modes below 1 uA extend battery life when sampling duty cycles are low. The 64 KB ECC Flash stores calibration constants and protocol stacks with hardware error correction for soft-error resilience in field installations.
Рекомендуется
USB Charging and Power Bank Controllers
USB-OTG capability on the PIC24FJ64GP202-I/ML enables the device to negotiate host or device roles, making it suitable for USB power bank controllers, charge controllers, and dual-role USB-C accessories. The hardware CIPs handle USB state transitions autonomously, freeing the CPU to monitor battery voltage, current sense, and load switching. Industrial temperature range (-40C to +85C) supports enclosures near heat sources. The exposed pad on the 28-QFN provides thermal relief for sustained USB-VBUS current monitoring.
Рекомендуется
Industrial Control Panels
Industrial control panels with USB programming ports and HMI feedback benefit from the PIC24FJ64GP202-I/ML's mix of CIPs, 12-bit ADC for analog sensor reading, and Full-Speed USB for firmware updates. The hardware ECC Flash maintains firmware integrity in electrically noisy industrial cabinets. The 28-QFN (6x6 mm) allows placement close to screw terminals, and the exposed pad ties into the chassis ground for EMI performance. Industrial temperature grade matches factory-floor deployment profiles without premium pricing.
Рекомендуется
Medical Monitoring Accessories
Connected medical monitoring accessories such as USB pulse oximeters, USB thermometers, and USB spirometer dongles can leverage the PIC24FJ64GP202-I/ML for low-power data acquisition and USB streaming to a host PC or tablet. The 12-bit ADC resolution is adequate for many physiological signal chains when paired with external instrumentation amplifiers. The PIC24F core's deterministic interrupt latency supports real-time sampling requirements, and XLP sleep extends battery life in between patient sessions. Hardware ECC Flash preserves calibration data for medical-grade accuracy.
Рекомендуется
Consumer Audio USB Interfaces
USB audio class interfaces such as USB headsets, USB microphones, and USB speakers benefit from the PIC24FJ64GP202-I/ML's Full-Speed USB and CIP-driven sample rate handling. The 16 MIPS CPU can drive USB isochronous endpoints at 48 kHz while leaving headroom for DSP or volume control. The 2.0-3.6 V supply supports bus-powered designs with a small LDO. The exposed pad on the 28-QFN (6x6 mm) keeps the die temperature in check during continuous audio streaming scenarios.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC24FJ64GP202-I/ML — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC24FJ64GP202-I/MV | PIC24FJ64GB002-I/ML | PIC24FJ64GA002-I/ML | PIC24FJ64GP202-E/ML | PIC24FJ32GP202-I/ML |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-UQFN (4x4 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 64 KB ECC | 64 KB ECC | 64 KB ECC | 64 KB | 64 KB ECC | 32 KB ECC |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| USB | FS USB 2.0 Host/Device/OTG | FS USB 2.0 Host/Device/OTG | FS USB 2.0 Device only | No USB | FS USB 2.0 Host/Device/OTG | FS USB 2.0 Host/Device/OTG |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C |
| Sleep Current (XLP) | ~200 nA | ~200 nA | ~1 uA | ~200 nA | ~200 nA | ~200 nA |
| CPU Performance | 16 MIPS / 32 MHz | 16 MIPS / 32 MHz | 16 MIPS / 32 MHz | 16 MIPS / 32 MHz | 16 MIPS / 32 MHz | 16 MIPS / 32 MHz |
Ключевые отличия
- Integrated USB-OTG with on-chip transceiver (против PIC24FJ64GA002-I/ML)
- Lower XLP sleep current than older GB series (против PIC24FJ64GB002-I/ML)
- Hardware ECC Flash for soft-error resilience (против PIC24FJ32GP202-I/ML)
Заметки по проектированию
Solder the 28-QFN exposed pad (EP) directly to the inner ground plane using multiple thermal vias (4-9 vias in a 3x3 grid) to keep junction temperature rise under 30 C at USB-active full-load. The EP is the primary heat-dissipation path and must NOT be left floating; an unconnected EP forces the die to dissipate through PCB traces only, exceeding the thermal envelope at sustained 32 MHz USB operation.
Place a 100 nF ceramic decoupling capacitor within 2 mm of each VDD pin and a 4.7 uF bulk capacitor within 5 mm. Add a separate 100 nF + 4.7 uF pair on VUSB. Use a star-ground topology tying AVSS to digital VSS at a single point near the MCU to avoid ground-loop noise coupling into the 12-bit ADC reference.
Route the USB D+ and D- pair as a 90-ohm differential with matched trace lengths (delta < 150 mil) over a continuous ground reference plane. Keep the differential pair away from switching regulators and high-current traces. Place the USB connector within 5 mm of the MCU to maintain signal integrity and meet USB 2.0 Full-Speed eye-diagram compliance.
Do not exceed the 3.6 V absolute maximum on VDD or VUSB; the on-chip USB transceiver is not 5 V tolerant. The MCLR pin requires a 10 kohm pull-up to VDD; leaving it floating causes spurious resets. When migrating firmware from PIC24FJ64GB002 to PIC24FJ64GP202, verify the USB interrupt vector remap and OTG configuration bits before deployment.
Информация о соответствии
RoHS and lead-free confirmed per Microchip product page. AEC-Q100 not applicable (consumer/industrial MCU, not automotive qualified). Halogen-free status not stated on the verified pages; halogen-free is generally true for QFN Microchip parts but should be confirmed via the material declaration for safety-critical designs.
