PIC32MZ1024ECG124T-I/TL - 200MHz 1MB Flash MCU | Microchip
Артикул: PIC32MZ1024ECG124T-I/TL ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.2 | $132,00 |
| 100 | $11.85 | $1.185,00 |
| 500 | $10.55 | $5.275,00 |
| 1.000 | $9.4 | $9.400,00 |
PIC32MZ1024ECG124T-I/TL Обзор
What is a PIC32MZ microcontroller? PIC32MZ is Microchip's high-performance 32-bit MCU family based on the MIPS32 microAptiv core, succeeding the PIC32MX series. It sits in the hierarchy: 32-bit MCU -> MIPS architecture -> PIC32MZ family -> Embedded Connectivity (EC) sub-family. The EC line differentiates itself from the EF (Enhanced Floating-point) and EK (Ethernet + crypto) variants by combining Ethernet, USB, CAN, and a rich peripheral mix without on-chip crypto acceleration or the EF family's higher 252 MHz clock.
Key features include 1 MB Flash and 512 KB SRAM, an integrated 10/100 Ethernet MAC, USB 2.0 High-Speed OTG, two CAN 2.0b modules, six UART, four SPI, and four I2C peripherals. The 200 MHz core delivers 330 DMIPS / 831 CoreMark performance, and the part offers up to 97 programmable I/O lines with multiple 5V-tolerant inputs. Hardware crypto acceleration is absent on the EC line - designs requiring AES/SHA should select the EK variant.
Architecturally, the device integrates a FPU-less MIPS32 microAptiv core with a 5-stage pipeline, 16 KB I-cache, 4 KB D-cache, and tightly-coupled prefetch buffer. The 32-channel DMA controller and 9 input-capture/output-compare PWM timers make it well suited for time-deterministic control loops. The 124-pin VTLA package is a thermally-enhanced bottom-thermal-pad LGA-style land-grid package.
Typical applications include industrial Ethernet gateways, building automation controllers, USB/CAN-connected sensor hubs, low-end HMI panels, and graphical display terminals. Designers who need floating-point performance should evaluate PIC32MZ EF parts instead. The wide operating temperature range of -40C to +85C (industrial) supports deployment in factory and outdoor enclosures.
A key design consideration is the VTLA package's exposed thermal pad - it MUST be soldered to a top-layer copper pour of at least 25 mm squared to keep junction temperatures within spec under sustained CPU load. The 124-pin LGA-style land pattern requires precise stencil design; NSMD pads with 0.4 mm pitch are recommended.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet - giving engineers a one-stop reference for the PIC32MZ1024ECG124T-I/TL.
Аналоги без доработки для PIC32MZ1024ECG124T-I/TL — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC32MZ1024ECG124T-I/TL (тот же форм-фактор и посадочное место) — отличается по Core Architecture, Package, Mounting Type, ADC, Ethernet.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC32MZ1024ECK124T-I/TL
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC32MZ1024EFK124T-I/TL
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC32MZ1024ECG124-I/TL
✅ Прямая замена✓ В наличии
$11.85 / шт.
Открыть даташит →PIC32MZ1024ECG124T-E/TL
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC32MZ1024EFG124T-I/TL
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC32MZ1024ECG100T-I/PF
✅ Прямая замена✓ В наличии
$6.75 / шт.
Открыть даташит →PIC32MZ1024ECG124T-I/TL Максимальные параметры и электрические характеристики
| Core Architecture | MIPS32 microAptiv (PIC32) |
| CPU Bit Width | 32-bit |
| Maximum CPU Frequency | 200 MHz |
| Flash Program Memory | 1 MB (1024 KB) |
| SRAM | 512 KB |
| Корпус | 124-pin VTLA (9x9 mm) |
| Число выводов | 124 |
| Programmable I/O Pins | 97 |
| Ethernet | 10/100 MAC (integrated, requires external PHY) |
| USB | USB 2.0 High-Speed OTG |
| CAN | 2x CAN 2.0b |
| UART | 6 |
| SPI | 4 |
| I2C | 4 |
| DMA Channels | 32 |
| Диапазон рабочих температур | -40C to +85C (industrial) |
| Тип монтажа | Surface Mount (LGA-style land grid) |
| Статус RoHS | Compliant |
| Lead-Free | Yes |
| Уровень MSL | 3 (168 hours) |
Руководство по цоколевке PIC32MZ1024ECG124T-I/TL в корпусе 124-pin vtla (9x9 mm)
Цоколевка для PIC32MZ1024ECG124T-I/TL (корпус 124-pin vtla (9x9 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для PIC32MZ1024ECG124T-I/TL.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
PIC32MZ1024ECG124T-I/TL подходит для 6 применениеs: Industrial Ethernet Gateway, Building Automation Controller, USB Connected Sensor Hub, Low-End HMI / Display Terminal, Motor Control Front-End, IoT Edge Gateway with Ethernet.
Industrial Ethernet Gateway
The PIC32MZ1024ECG124T-I/TL fits industrial Ethernet gateways because it integrates a 10/100 MAC plus 1 MB Flash and 512 KB SRAM, enough headroom for TCP/IP, TLS, and Modbus TCP stacks. The 200 MHz MIPS32 microAptiv core delivers 330 DMIPS / 831 CoreMark, keeping wire-speed packet processing achievable. At 24 MHz system tick with DMA-driven MAC, the CPU stays available for application logic. The 124-pin VTLA footprint offers 97 I/O lines, sufficient for RS-485, RS-232, and digital inputs.
Рекомендуется
Building Automation Controller
The PIC32MZ1024ECG124T-I/TL supports BACnet MS/TP, KNX, or DALI gateways with its dual CAN 2.0b controllers, six UARTs, and ample Flash for protocol stacks. The 1 MB Flash accommodates both BACnet and Modbus stacks simultaneously, while 512 KB SRAM buffers protocol transactions without overflow. Industrial temperature grade (-40C to +85C) covers unheated equipment rooms. Designers can later migrate firmware to PIC32MZ EF or EK variants in the same VTLA-124 footprint for higher CPU throughput.
Рекомендуется
USB Connected Sensor Hub
USB 2.0 High-Speed OTG on the PIC32MZ1024ECG124T-I/TL enables it to act as a USB device or host, ideal for industrial sensor hubs interfacing to a PC or embedded host. The 200 MHz MIPS core plus 32-channel DMA handles bulk and interrupt USB transfers without CPU intervention. 1 MB Flash stores USB class drivers (CDC, HID, vendor), and 512 KB SRAM buffers data before forwarding over Ethernet or CAN. The part runs Microchip's MPLAB Harmony USB stack with proven driver support.
Рекомендуется
Low-End HMI / Display Terminal
The PIC32MZ1024ECG124T-I/TL serves as the host MCU for low-resolution color LCD panels driven over parallel PMP or SPI, with the 200 MHz core and 512 KB SRAM supporting emWin or Microchip Harmony graphics libraries. USB HID (touch input) and CAN (panel network) are easily multiplexed through the rich peripheral set. Designers building displays up to 4.3 inch can rely on this part without an external graphics controller. Migrating to PIC32MZ EF parts in the same 124-VTLA package doubles CPU throughput for higher-resolution panels.
Рекомендуется
Motor Control Front-End
PWM-rich motor control front-ends benefit from the PIC32MZ1024ECG124T-I/TL's nine input-capture/output-compare timers plus 32-channel DMA. Designers can drive a BLDC or PMSM with FOC algorithm, plus simultaneous Ethernet/CAN feedback to a higher-level controller. The 200 MHz MIPS32 microAptiv executes FOC loops in well under 10 microseconds. The 124-pin VTLA package offers thermal headroom for sustained computation when paired with proper PCB copper pour.
Рекомендуется
IoT Edge Gateway with Ethernet
An IoT edge gateway aggregating sensor data over Ethernet and CAN can run MQTT-SN or CoAP clients directly on the PIC32MZ1024ECG124T-I/TL, eliminating a separate SBC. The 1 MB Flash stores TLS certificates and an MQTT stack, while the 512 KB SRAM buffers publish queues. Microchip's MPLAB Harmony 3 framework simplifies integration with AWS IoT or Azure IoT SDKs. For designs needing the integrated crypto of TLS 1.3 hardware, migrating to PIC32MZ1024ECK124T-I/TL is a drop-in PCB change.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC32MZ1024ECG124T-I/TL — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC32MZ1024ECK124T-I/TL | PIC32MZ1024EFK124T-I/TL | PIC32MZ1024ECG124-I/TL | PIC32MZ1024ECG124T-E/TL | PIC32MZ1024EFG124T-I/TL |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 124-pin VTLA (9x9 mm) | 124-pin VTLA (9x9 mm) - same | 124-pin VTLA (9x9 mm) - same | 124-pin VTLA (9x9 mm) - same | 124-pin VTLA (9x9 mm) - same | 124-pin VTLA (9x9 mm) - same |
| Core / Architecture | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 252 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 252 MHz |
| Flash / SRAM | 1 MB / 512 KB | 1 MB / 512 KB | 1 MB / 512 KB | 1 MB / 512 KB | 1 MB / 512 KB | 1 MB / 512 KB |
| Hardware Crypto (AES/SHA) | No | Yes | Yes | No | No | No |
| FPU | No | No | Yes | No | No | Yes |
| Ethernet MAC | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) |
| USB | USB 2.0 HS OTG | USB 2.0 HS OTG | USB 2.0 HS OTG | USB 2.0 HS OTG | USB 2.0 HS OTG | USB 2.0 HS OTG |
| CAN | 2x CAN 2.0b | 2x CAN 2.0b | 2x CAN 2.0b | 2x CAN 2.0b | 2x CAN 2.0b | 2x CAN 2.0b |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +125C (extended) | -40C to +85C (industrial) |
Ключевые отличия
- Highest Flash + RAM combination in the PIC32MZ EC family at 124 pins (против PIC32MZ1024ECK124T-I/TL)
- 200 MHz CPU at lower power vs EF family (против PIC32MZ1024EFK124T-I/TL)
- Industrial-grade temperature range with widest pin-compatible migration path (против PIC32MZ1024ECG124T-E/TL)
Заметки по проектированию
The 124-pin VTLA package exposes a thermal pad on the bottom that MUST be soldered to a top-layer copper pour of at least 25 mm squared (per the Microchip PIC32MZ EC family datasheet). Without this thermal path, junction temperature can exceed 125C at full 200 MHz CPU load under industrial ambient. Use thermal via arrays (0.3 mm drill, 1.0 mm pitch, plugged-and-capped) connecting the top pad to internal copper planes for additional spreading.
The 124-pin VTLA is an LGA-style package with a 0.4 mm pitch. Microchip recommends NSMD (Non-Solder Mask Defined) pads with a 0.2 mm aperture reduction to avoid solder wicking under the land pad. Stencil thickness of 0.125 mm with electro-polished finish and Type 3 or Type 4 solder paste is recommended. Keep the thermal pad stencil opening windowed to ~50% coverage to prevent floating during reflow.
Decouple the PIC32MZ1024ECG124T-I/TL with a 100 nF X7R 0402 within 2 mm of each AVDD/VDD pair, plus a single 4.7 uF X5R bulk capacitor on each power domain. The internal 1.2V core regulator requires a 4.7 uF X5R + 100 nF X7R pair on the VCAP pin per the family datasheet. Place the bulk cap within 5 mm of the VCAP pin and keep traces short and wide.
Do not assume the EC sub-family has hardware crypto - the PIC32MZ1024ECG124 has no AES/SHA accelerators. If your application needs TLS 1.3 hardware offload, switch to the PIC32MZ1024ECK124T-I/TL drop-in replacement. Also, MPLAB Harmony 3 project configuration differs between EC and EF families: peripheral clock trees and PPS pin mapping must be re-verified when migrating firmware between them.
Информация о соответствии
RoHS compliant per Microchip product page. Not AEC-Q100 qualified; for automotive applications select from Microchip's dsPIC33 or SAM E70 automotive-qualified families. Reach compliance per EU REACH SVHC declaration on Microchip.com.