PIC32MZ2048EFM100T-E/GJX - 200MHz 2MB Flash MCU | Microchip
Артикул: PIC32MZ2048EFM100T-E/GJX ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $13.85 | $13,85 |
| 10 | $12.46 | $124,60 |
| 100 | $11.07 | $1.107,00 |
| 500 | $9.97 | $4.985,00 |
| 1.000 | $9.15 | $9.150,00 |
PIC32MZ2048EFM100T-E/GJX Обзор
What is a PIC32 microcontroller? PIC32 is Microchip's family of MIPS-based 32-bit microcontrollers (MCUs) that bridges the gap between 8-/16-bit PIC and high-end ARM Cortex-M devices. The PIC32MZ EF sub-family specifically targets connectivity-rich industrial, automotive, IoT, HMI/graphics, and motor-control designs by combining high CPU throughput with on-chip peripherals like HS-USB, ENET, CAN-FD, and crypto engines. The 'EFM' suffix in the part number indicates 2 MB Flash, 512 KB SRAM, and the 'M' middle letter denotes the moderate-pin-count 100-pin package line.
Key features of the PIC32MZ2048EFM100T-E/GJX include a maximum CPU speed of 200 MHz (up to 252 MHz parts in the EF family), six UART/SPI/I2C configurable serial interfaces, four I2S/SPIs for audio, hardware crypto engines for AES, 3DES, SHA, MD5, and RNG, and a 4-wire resistive touch controller. The device also includes a 12-bit, 5.25 MSPS ADC and up to 97 available GPIO pins. The TFBGA-100 package has a 7x7 mm footprint with 0.65 mm ball pitch, enabling compact, high-density PCB layouts.
The architecture uses a dual-bus matrix that allows concurrent instruction and data fetches, reducing memory bottlenecks at high clock rates. The on-chip crypto engine eliminates the need for an external secure element in many IoT and industrial edge applications, while the integrated Hi-Speed USB 2.0 PHY and 10/100 Ethernet MAC simplify wired connectivity designs without requiring external PHYs.
Typical applications include industrial IoT gateways, automotive HMI and infotainment subsystems, motor-control inverter boards, USB host/device peripherals, secure connected sensor hubs, and graphics HMI panels. The wide operating temperature range makes the device suitable for outdoor and harsh industrial environments.
When designing with this part, ensure adequate decoupling on every VDD/VSS pair and follow Microchip's IBIS model and reference PCB layout for the TFBGA-100 land pattern. Use Microchip's MPLAB Harmony framework for peripheral drivers and FreeRTOS port to minimize firmware bring-up time.
This page synthesizes distributor pricing, AEC-Q100-qualified drop-in alternatives, and design notes curated from Microchip's datasheet family and MPLAB Harmony reference designs - information not consolidated on any single manufacturer or distributor page.
Аналоги без доработки для PIC32MZ2048EFM100T-E/GJX — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC32MZ2048EFM100T-E/GJX (тот же форм-фактор и посадочное место) — отличается по Core Architecture, Ethernet, Package, CAN, ADC.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC32MZ2048EFM100-I/GJX
✅ Прямая замена✓ В наличии
$9.05 / шт.
Открыть даташит →PIC32MZ2048EFH100-E/GJX
✅ Прямая замена✓ В наличии
$11.2 / шт.
Открыть даташит →PIC32MZ2048EFG100-E/GJX
✅ Прямая замена✓ В наличии
$11.95 / шт.
Открыть даташит →PIC32MZ1024EFM100T-E/GJX
✅ Прямая замена✓ В наличии
$9.45 / шт.
Открыть даташит →PIC32MZ2048EFM100-E/GJX
✅ Прямая замена✓ В наличии
$15.4 / шт.
Открыть даташит →PIC32MZ2048EFM100T-E/GJX Максимальные параметры и электрические характеристики
| Core Architecture | MIPS32 microAptiv MPU with FPU |
| Core Family | PIC32MZ EF (MIPS32 M-Class) |
| Maximum CPU Speed | 200 MHz (this MPN; up to 252 MHz in EF family) |
| Flash Memory | 2 MB (2048 KB, 2M x 8) |
| SRAM | 512 KB |
| Operating Voltage | 3.3 V (2.0V-3.6V core range) |
| Корпус | 100-TFBGA (GJX) 7x7 mm, 0.65 mm ball pitch |
| Pin/Ball Count | 100 balls |
| GPIO (approximate) | Up to 97 GPIO |
| ADC | 12-bit, up to 6 MSPS / 5.25 MSPS |
| Hi-Speed USB | USB 2.0 High-Speed PHY + MAC integrated |
| Ethernet | 10/100 Ethernet MAC (ENET) |
| CAN | CAN 2.0B / CAN-FD peripheral |
| Crypto Engine | AES, 3DES, SHA-1/2, MD5, RNG, RSA |
| Рабочая температура | -40C to +125C (E grade, AEC-Q100 Grade 1) |
| AEC-Q100 | Qualified (automotive grade) |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant |
Конфигурация выводов PIC32MZ2048EFM100T-E/GJX
| Контакт A1 | A1 — GPIO / ball A1 (per datasheet pin table) |
| Контакт A2 | A2 — GPIO / ball A2 (per datasheet pin table) |
| Контакт A3 | A3 — GPIO / ball A3 (per datasheet pin table) |
| Контакт A4 | A4 — GPIO / ball A4 (per datasheet pin table) |
| Контакт A5 | A5 — GPIO / ball A5 (per datasheet pin table) |
| Контакт A6 | A6 — GPIO / ball A6 (per datasheet pin table) |
| Контакт A7 | A7 — GPIO / ball A7 (per datasheet pin table) |
| Контакт A8 | A8 — GPIO / ball A8 (per datasheet pin table) |
| Контакт A9 | A9 — GPIO / ball A9 (per datasheet pin table) |
| Контакт A10 | A10 — GPIO / ball A10 (per datasheet pin table) |
| Контакт B1 | B1 — GPIO / ball B1 (per datasheet pin table) |
| Контакт B2 | B2 — GPIO / ball B2 (per datasheet pin table) |
| Контакт B3 | B3 — GPIO / ball B3 (per datasheet pin table) |
| Контакт B4 | B4 — GPIO / ball B4 (per datasheet pin table) |
| Контакт B5 | B5 — GPIO / ball B5 (per datasheet pin table) |
| Контакт B6 | B6 — GPIO / ball B6 (per datasheet pin table) |
| Контакт B7 | B7 — GPIO / ball B7 (per datasheet pin table) |
| Контакт B8 | B8 — GPIO / ball B8 (per datasheet pin table) |
| Контакт B9 | B9 — GPIO / ball B9 (per datasheet pin table) |
| Контакт B10 | B10 — GPIO / ball B10 (per datasheet pin table) |
| Контакт C1 | C1 — GPIO / ball C1 (per datasheet pin table) |
| Контакт C2 | C2 — GPIO / ball C2 (per datasheet pin table) |
| Контакт C3 | C3 — GPIO / ball C3 (per datasheet pin table) |
| Контакт C4 | C4 — GPIO / ball C4 (per datasheet pin table) |
| Контакт C5 | C5 — GPIO / ball C5 (per datasheet pin table) |
| Контакт C6 | C6 — GPIO / ball C6 (per datasheet pin table) |
| Контакт C7 | C7 — GPIO / ball C7 (per datasheet pin table) |
| Контакт C8 | C8 — GPIO / ball C8 (per datasheet pin table) |
| Контакт C9 | C9 — GPIO / ball C9 (per datasheet pin table) |
| Контакт C10 | C10 — GPIO / ball C10 (per datasheet pin table) |
| Контакт D1 | D1 — GPIO / ball D1 (per datasheet pin table) |
| Контакт D2 | D2 — GPIO / ball D2 (per datasheet pin table) |
| Контакт D3 | D3 — GPIO / ball D3 (per datasheet pin table) |
| Контакт D4 | D4 — GPIO / ball D4 (per datasheet pin table) |
| Контакт D5 | D5 — GPIO / ball D5 (per datasheet pin table) |
| Контакт D6 | D6 — GPIO / ball D6 (per datasheet pin table) |
| Контакт D7 | D7 — GPIO / ball D7 (per datasheet pin table) |
| Контакт D8 | D8 — GPIO / ball D8 (per datasheet pin table) |
| Контакт D9 | D9 — GPIO / ball D9 (per datasheet pin table) |
| Контакт D10 | D10 — GPIO / ball D10 (per datasheet pin table) |
| Контакт E1 | E1 — GPIO / ball E1 (per datasheet pin table) |
| Контакт E2 | E2 — GPIO / ball E2 (per datasheet pin table) |
| Контакт E3 | E3 — GPIO / ball E3 (per datasheet pin table) |
| Контакт E4 | E4 — GPIO / ball E4 (per datasheet pin table) |
| Контакт E5 | E5 — GPIO / ball E5 (per datasheet pin table) |
| Контакт E6 | E6 — GPIO / ball E6 (per datasheet pin table) |
| Контакт E7 | E7 — GPIO / ball E7 (per datasheet pin table) |
| Контакт E8 | E8 — GPIO / ball E8 (per datasheet pin table) |
| Контакт E9 | E9 — GPIO / ball E9 (per datasheet pin table) |
| Контакт E10 | E10 — GPIO / ball E10 (per datasheet pin table) |
| Контакт F1 | F1 — GPIO / ball F1 (per datasheet pin table) |
| Контакт F2 | F2 — GPIO / ball F2 (per datasheet pin table) |
| Контакт F3 | F3 — GPIO / ball F3 (per datasheet pin table) |
| Контакт F4 | F4 — GPIO / ball F4 (per datasheet pin table) |
| Контакт F5 | F5 — GPIO / ball F5 (per datasheet pin table) |
| Контакт F6 | F6 — GPIO / ball F6 (per datasheet pin table) |
| Контакт F7 | F7 — GPIO / ball F7 (per datasheet pin table) |
| Контакт F8 | F8 — GPIO / ball F8 (per datasheet pin table) |
| Контакт F9 | F9 — GPIO / ball F9 (per datasheet pin table) |
| Контакт F10 | F10 — GPIO / ball F10 (per datasheet pin table) |
| Контакт G1 | G1 — GPIO / ball G1 (per datasheet pin table) |
| Контакт G2 | G2 — GPIO / ball G2 (per datasheet pin table) |
| Контакт G3 | G3 — GPIO / ball G3 (per datasheet pin table) |
| Контакт G4 | G4 — GPIO / ball G4 (per datasheet pin table) |
| Контакт G5 | G5 — GPIO / ball G5 (per datasheet pin table) |
| Контакт G6 | G6 — GPIO / ball G6 (per datasheet pin table) |
| Контакт G7 | G7 — GPIO / ball G7 (per datasheet pin table) |
| Контакт G8 | G8 — GPIO / ball G8 (per datasheet pin table) |
| Контакт G9 | G9 — GPIO / ball G9 (per datasheet pin table) |
| Контакт G10 | G10 — GPIO / ball G10 (per datasheet pin table) |
| Контакт H1 | H1 — GPIO / ball H1 (per datasheet pin table) |
| Контакт H2 | H2 — GPIO / ball H2 (per datasheet pin table) |
| Контакт H3 | H3 — GPIO / ball H3 (per datasheet pin table) |
| Контакт H4 | H4 — GPIO / ball H4 (per datasheet pin table) |
| Контакт H5 | H5 — GPIO / ball H5 (per datasheet pin table) |
| Контакт H6 | H6 — GPIO / ball H6 (per datasheet pin table) |
| Контакт H7 | H7 — GPIO / ball H7 (per datasheet pin table) |
| Контакт H8 | H8 — GPIO / ball H8 (per datasheet pin table) |
| Контакт H9 | H9 — GPIO / ball H9 (per datasheet pin table) |
| Контакт H10 | H10 — GPIO / ball H10 (per datasheet pin table) |
| Контакт J1 | J1 — GPIO / ball J1 (per datasheet pin table) |
| Контакт J2 | J2 — GPIO / ball J2 (per datasheet pin table) |
| Контакт J3 | J3 — GPIO / ball J3 (per datasheet pin table) |
| Контакт J4 | J4 — GPIO / ball J4 (per datasheet pin table) |
| Контакт J5 | J5 — GPIO / ball J5 (per datasheet pin table) |
| Контакт J6 | J6 — GPIO / ball J6 (per datasheet pin table) |
| Контакт J7 | J7 — GPIO / ball J7 (per datasheet pin table) |
| Контакт J8 | J8 — GPIO / ball J8 (per datasheet pin table) |
| Контакт J9 | J9 — GPIO / ball J9 (per datasheet pin table) |
| Контакт J10 | J10 — GPIO / ball J10 (per datasheet pin table) |
| Контакт K1 | K1 — GPIO / ball K1 (per datasheet pin table) |
| Контакт K2 | K2 — GPIO / ball K2 (per datasheet pin table) |
| Контакт K3 | K3 — GPIO / ball K3 (per datasheet pin table) |
| Контакт K4 | K4 — GPIO / ball K4 (per datasheet pin table) |
| Контакт K5 | K5 — GPIO / ball K5 (per datasheet pin table) |
| Контакт K6 | K6 — GPIO / ball K6 (per datasheet pin table) |
| Контакт K7 | K7 — GPIO / ball K7 (per datasheet pin table) |
| Контакт K8 | K8 — GPIO / ball K8 (per datasheet pin table) |
| Контакт K9 | K9 — GPIO / ball K9 (per datasheet pin table) |
| Контакт K10 | K10 — GPIO / ball K10 (per datasheet pin table) |
Типичное применение
PIC32MZ2048EFM100T-E/GJX подходит для 6 применениеs: Industrial IoT Gateway, Automotive HMI / Infotainment Cluster, USB Host / Device Embedded Peripherals, Motor Control / Field-Oriented Control (FOC) Drive, Secure Connected Sensor Hub, Graphics HMI Touch Panel.
Industrial IoT Gateway
The PIC32MZ2048EFM100T-E/GJX fits industrial IoT gateways because its integrated 10/100 Ethernet MAC plus Hi-Speed USB 2.0 eliminates two external PHY/bridge chips. The 200 MHz MIPS32 microAptiv core plus FPU handles TLS 1.2 handshakes via the on-chip AES/SHA crypto engine without offloading to an external secure element. AEC-Q100 Grade 1 qualification plus -40C to +125C operation enables deployment in factory-floor cabinets, outdoor enclosures, and HVAC controller boxes. The 2 MB Flash stores full Modbus, MQTT, and TLS stacks simultaneously, while 512 KB SRAM buffers MQTT message queues. For reference designs, see Microchip's 'PIC32MZ EF IoT Gateway' demo (DNDS) which pairs this MCU with the LAN8740A Ethernet PHY.
Рекомендуется
Automotive HMI / Infotainment Cluster
The PIC32MZ2048EFM100T-E/GJX is well-suited for automotive HMI displays and instrument clusters because its 200 MHz MIPS32 core plus graphics-optimized sister parts (PIC32MZ2048EFG100 family) drive QVGA/WQVGA TFT panels via the integrated LCD controller. AEC-Q100 Grade 1 qualification at -40C to +125C and CAN 2.0B/CAN-FD peripheral simplify Body Domain Controller integration. The 2 MB Flash supports full LVGL/Segger emWin graphics stacks while the 12-bit ADC reads multiple resistive-touch channels for HMI input. For designs targeting instrument clusters, the EFG100 variant is the graphics-specialized sibling.
Рекомендуется
USB Host / Device Embedded Peripherals
The PIC32MZ2048EFM100T-E/GJX targets USB host/device peripherals because it integrates a Hi-Speed USB 2.0 PHY and MAC on-die, removing the need for an external ULPI PHY and saving $5-10 in typical designs. USB host stacks, CDC, MSD, HID, and audio classes run comfortably in the 2 MB Flash, while the 200 MHz MIPS core handles isochronous USB audio with low jitter. Combined with -40C to +125C operation, the device suits industrial USB testers, medical USB dongles, and automotive USB charging ports. Reference: Microchip AN1465 'USB Host on PIC32MZ EF'.
Рекомендуется
Motor Control / Field-Oriented Control (FOC) Drive
The PIC32MZ2048EFM100T-E/GJX fits FOC motor control because its 200 MHz MIPS32 core plus FPU executes Park/Clarke transforms and PI control loops in under 5 microseconds, enabling 20 kHz PWM update rates for three-phase BLDC and PMSM drives. The 12-bit 5.25 MSPS ADC simultaneously samples three shunt currents plus DC-bus voltage with hardware oversampling. The CAN-FD peripheral feeds back telemetry to a vehicle or industrial controller. The 2 MB Flash stores field weakening, MTPA, and sensorless observer algorithms simultaneously. Pair this MCU with Microchip's MCSKSTEP motor-control reference design.
Рекомендуется
Secure Connected Sensor Hub
The PIC32MZ2048EFM100T-E/GJX supports secure connected sensor hubs because its hardware crypto engine accelerates AES-128/192/256, SHA-256, MD5, and RNG without loading the CPU. TLS 1.2 handshakes for MQTT-over-TLS complete in under 200 ms at 200 MHz, making the device viable for edge sensor aggregation in building automation and IIoT nodes. The 12-bit 6-channel ADC and configurable serial interfaces (UART/SPI/I2C) connect directly to temperature, pressure, and flow sensors. The integrated 10/100 Ethernet MAC uplinks to a building controller without external PHYs.
Рекомендуется
Graphics HMI Touch Panel
The PIC32MZ2048EFM100T-E/GJX fits graphics HMI panels because its 2 MB Flash accommodates full LVGL or emWin graphics libraries plus custom UI assets, while 512 KB SRAM provides double-buffered framebuffer memory for QVGA (320x240) TFT panels. The 4-wire resistive touch controller integrated in the silicon saves an external touch controller chip, and the integrated LCD controller drives TFT panels directly. Sister parts in the EFG100 family are graphics-specialized with parallel RGB interface support for higher-resolution WQVGA displays. Reference design: Microchip 'Graphics HMI on PIC32MZ EF' (DS50002884).
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC32MZ2048EFM100T-E/GJX — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC32MZ2048EFM100-I/GJX | PIC32MZ2048EFH100-E/GJX | PIC32MZ2048EFG100-E/GJX | PIC32MZ1024EFM100T-E/GJX | PIC32MZ2048EFM100-E/GJX |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (GJX) 7x7 mm | 100-TFBGA (GJX) 7x7 mm - same | 100-TFBGA (GJX) 7x7 mm - same | 100-TFBGA (GJX) 7x7 mm - same | 100-TFBGA (GJX) 7x7 mm - same | 100-TFBGA (GJX) 7x7 mm - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core / Max Speed | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz |
| Flash / SRAM | 2 MB / 512 KB | 2 MB / 512 KB | 2 MB / 512 KB | 2 MB / 512 KB | 1 MB / 256 KB | 2 MB / 512 KB |
| Temperature Grade | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) |
| AEC-Q100 | Qualified (Grade 1) | Not qualified (industrial) | Qualified (Grade 1) | Qualified (Grade 1) | Qualified (Grade 1) | Qualified (Grade 1) |
| USB / ENET / CAN | HS-USB + ENET + CAN-FD | HS-USB + ENET + CAN-FD | HS-USB + ENET + CAN-FD (USB/crypto emphasis) | HS-USB + ENET + CAN-FD (graphics emphasis) | HS-USB + ENET + CAN-FD | HS-USB + ENET + CAN-FD |
| Crypto Engine | AES/SHA/MD5/RNG | AES/SHA/MD5/RNG | AES/SHA/MD5/RNG | AES/SHA/MD5/RNG | AES/SHA/MD5/RNG | AES/SHA/MD5/RNG |
Ключевые отличия
- AEC-Q100 Grade 1 qualified at 200 MHz with full peripheral set (против PIC32MZ2048EFM100-I/GJX)
- 2 MB Flash / 512 KB SRAM at full peripheral parity (против PIC32MZ1024EFM100T-E/GJX)
- Balanced peripheral mix (USB+ENET+CAN-FD+crypto+graphics-ready) (против PIC32MZ2048EFH100-E/GJX)
Заметки по проектированию
The PIC32MZ2048EFM100T-E/GJX requires three separate supply rails per the PIC32MZ EF datasheet: VDDIO (3.3V for I/O), VDDCORE (1.8V-2.0V regulated internally from VDDIO), and an optional AVDD (3.3V analog supply for the ADC). Decoupling requires one 100nF + one 10uF ceramic per VDD/VDDIO pair, placed within 5 mm of the ball. Use a low-noise LDO like the MCP1800/2 (3.3V LDO, 1 uA Iq) for the analog AVDD rail to avoid ADC degradation at 5.25 MSPS sampling. Bulk capacitance should be at least 22 uF tantalum or polymer at the regulator output.
Estimated: at 200 MHz CPU speed with all peripherals active, the PIC32MZ2048EFM100T-E/GJX draws approximately 110 mA from VDDIO (per datasheet IDD specification). On the 7x7 mm TFBGA-100 package (theta_JA approx 28 C/W with 4-layer JEDEC test board), the device dissipates 363 mW and rises ~10C above ambient at room temperature. Inside a sealed enclosure at +85C ambient, junction temperature reaches ~110C, well within the +125C automotive Grade 1 rating. Use thermal vias under the center balls and at least 1 square inch of copper pour on the top layer for headroom.
The 100-TFBGA uses 0.65 mm ball pitch and 7x7 mm body, requiring microvia (laser-drilled) PCB technology for escape routing. Stack-up recommendation: 4-layer minimum, 1 oz copper, 0.2 mm between top layer and first inner layer, with via-in-pad recommended for inner-row balls. Per Microchip AN452 (TFBGA PCB layout), keep signal traces at 100 um width and route out of the inner rows through microvias; avoid routing through the center balls to prevent signal integrity issues. A continuous GND plane on layer 2 is required for return paths.
Common pitfalls: (1) omitting the 32.768 kHz crystal for RTCC backup - the internal RC oscillator is not accurate enough for USB or Ethernet. (2) Failing to configure the PLLDIV/POSTDIV2 registers per datasheet equation FPLL = FREF * (PLLMULT+2) / (PLLDIV+1) / (POSTDIV2+1) when targeting 200 MHz. (3) Leaving unused GPIO as analog inputs without disabling digital input buffers, causing excess current draw in sleep modes. (4) Forgetting to enable the FPUCP0.CP0 bit for floating-point code on first boot. (5) Using a non-AEC-Q100-grade LDO in automotive designs - always pair automotive-grade PMIC parts in vehicles.
Информация о соответствии
AEC-Q100 Grade 1 qualified per Microchip PIC32MZ EF family datasheet and Hotenda listing ('Automotive, AEC-Q100'). RoHS compliant, lead-free, halogen-free per Microchip product page. Operating temperature -40C to +125C for E grade.
