W25N01GVZEIR-TR - 1Gb QSPI SLC NAND Flash | Winbond
Артикул: W25N01GVZEIR-TR ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $11.63 | $11,63 |
| 10 | $9.95 | $99,50 |
| 100 | $7.85 | $785,00 |
| 500 | $6.42 | $3.210,00 |
| 1.000 | $5.38 | $5.380,00 |
| 3.000 | $4.55 | $13.650,00 |
W25N01GVZEIR-TR Обзор
A NAND Flash is a non-volatile memory that stores bits in floating-gate NAND strings, achieving higher density per cell than NOR at the cost of sequential-only programming and mandatory bad-block management. Compared with NOR Flash, NAND Flash offers lower cost-per-bit and faster erase/write cycles but cannot execute-in-place (XIP) and requires an embedded ECC engine and a Bad Block Management (BBM) lookup table - both of which W25N01GVZEIR-TR integrates on-die.
Key features include SPI modes 0 and 3 clocking, Quad-SPI (x4 I/O) at 104 MHz delivering up to ~416 Mb/s read throughput (with the internal 2-Kbyte buffer in continuous-read mode), a hardware/software reset pin, write-enable latch, 4-KB sector erase, internal ECC with ECC-status reporting, Bad Block Management LUT, OTP security region, hardware and software write protection, and a -40C to +85C industrial operating range. The 8-WSON package includes an exposed thermal pad that ties to GND for board-level thermal dissipation.
Architecturally, the die provides a 2-Kbyte data-buffer between the serial SPI/QSPI host interface and the 1 Gbit NAND array; the host streams commands across SPI (standard or quad) and the buffer transfers block data to/from the array, allowing the controller to suspend/resume reads without re-issuing page reads. This buffered architecture, combined with on-die ECC correction, enables reliable random-access patterns that older raw-NAND parts cannot deliver.
Typical applications include IoT firmware storage, Linux kernel/rootfs storage for industrial gateways, data-logger file systems, smart-meter data retention, point-of-sale (POS) terminals, and consumer electronics where low-cost, high-density, non-volatile code/data storage is required and XIP is unnecessary.
When designing, ensure the host driver implements the Winbond SPI-NAND command set, allocates a 2-Kbyte transfer buffer, and respects the ECC-status bits before declaring a page valid; failure to implement BBM-LUT will shorten useful endurance on parts with even one factory-marked bad block.
This page synthesises distributor pricing, drop-in alternatives across Winbond and Macronix/ISSI families, and practical design notes not found in the raw manufacturer datasheet, helping hardware engineers shorten qualification cycles.
Аналоги без доработки для W25N01GVZEIR-TR — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
W25N01GVZEIG
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
W25N01GWZEIR
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
W74M01GVZEIG
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MX35LF1GE4AB
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
IS37SML01G1-DLI
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
GD5F1GQ5REYIGR
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
W25N01GVZEIR-TR Максимальные параметры и электрические характеристики
| Тип памяти | Non-volatile NAND Flash (SLC) |
| Memory Density | 1 Gbit (128 MB) |
| Организация памяти | 128M x 8 |
| Memory Interface | SPI / Quad-SPI (Standard SPI, Dual SPI, Quad SPI) |
| Максимальная тактовая частота | 104 MHz |
| Access Time | 7 ns |
| Supply Voltage (VCC) | 2.7 V to 3.6 V |
| Рабочая температура | -40 C to +85 C (industrial) |
| Package Type | 8-WSON (8x6 mm) with exposed thermal pad |
| Тип монтажа | Surface Mount |
| Block Size | 64 pages x 2048 + 64 spare bytes (per datasheet) |
| Page Size | 2048 bytes + 64 spare bytes |
| Read Buffer | Internal 2 Kbyte SRAM buffer for continuous read |
| On-die ECC | Internal ECC engine with ECC-status register |
| Bad Block Management | Internal BBM Look-Up Table (LUT) |
| Security | OTP security region with lock; hardware and software WP |
| Reset | Hardware RESET# pin plus software reset command |
| Write Protection | Software WP and hardware WP# pin |
| Compliance | RoHS compliant, lead-free, halogen-free per datasheet |
| MSL | MSL3 (per package qualification) |
Конфигурация выводов W25N01GVZEIR-TR
| Контакт 1 | /CS# — Chip select, active low |
| Контакт 2 | DO (IO1) — Serial data out / IO1 in Quad-SPI mode |
| Контакт 3 | /WP# (IO2) — Write protect, active low / IO2 in Quad-SPI mode |
| Контакт 4 | GND — Ground |
| Контакт 5 | DI (IO0) — Serial data in / IO0 in Quad-SPI mode |
| Контакт 6 | CLK — Serial clock |
| Контакт 7 | /HOLD# or /RESET# (IO3) — Hold or Reset, active low / IO3 in Quad-SPI mode |
| Контакт 8 | VCC — Power supply (2.7V to 3.6V) |
| Контакт EP | Thermal Pad — Exposed pad - tie to GND for thermal dissipation |
Типичное применение
W25N01GVZEIR-TR подходит для 6 применениеs: IoT Firmware Storage, Industrial Gateway Root Filesystem, Smart Meter Data Logging, Point-of-Sale (POS) Terminal Storage, Consumer Electronics Data Storage, Automotive Infotainment Boot Storage.
IoT Firmware Storage
The W25N01GVZEIR-TR is a natural fit for IoT firmware storage because its 1 Gbit (128 MB) capacity comfortably accommodates Linux rootfs, Wi-Fi/BLE stack images and OTA staging buffers while the on-die ECC and BBM LUT eliminate external error-correction logic. Typical hook-up ties the host MCU's SPI/QSPI peripheral to /CS#, CLK, IO0-IO3 and reads at 104 MHz, draining the 2 KB buffer to MCU RAM; this design cost-effectively shadows firmware from NAND to MCU internal flash at boot, supporting OTA updates without external SRAM.
Рекомендуется
Industrial Gateway Root Filesystem
Industrial gateways running Yocto or Buildroot Linux require reliable, high-density, non-volatile storage that survives extended thermal cycling - the W25N01GVZEIR-TR's -40 C to +85 C range, internal ECC and BBM lookup table satisfy all three. With the 104 MHz Quad-SPI interface, the 1 Gbit capacity holds ~16-32 MB of compressed rootfs plus update staging space; the host CPU (e.g., i.MX8M Mini) uses DMA on the QSPI peripheral to refill the 2 KB on-chip buffer, sustaining read throughput around 25 MB/s effective, sufficient for rootfs execution under QEMU/UBI.
Рекомендуется
Smart Meter Data Logging
Smart electricity/water/gas meters accumulate interval data over 10-15 years; the W25N01GVZEIR-TR stores 128 MB of rolling telemetry and event logs in a 1 Gbit SLC NAND with hardware/software write protection to prevent unauthorised firmware reflash. The on-die ECC corrects bit errors induced by 15-year data retention, while the BBM LUT remaps factory-bad blocks silently; meters typically wire METER-CPU -> SPI -> /CS#, IO0/IO1/IO2/IO3 with WP# tied to a tamper-detect GPIO to assert software write-protect on tamper events.
Рекомендуется
Point-of-Sale (POS) Terminal Storage
POS terminals require reliable non-volatile storage for transaction logs, signature images, firmware, and cryptographic key material. The W25N01GVZEIR-TR's 128 MB density stores a full Linux userland plus audit logs, while the hardware WP# pin allows the secure-element controller to assert write-protect during firmware validation - preventing unauthenticated writes. The 104 MHz QSPI bus delivers responsive application launch times, and the WSON 8x6 mm footprint supports the slim handset form factors common in modern POS hardware.
Рекомендуется
Consumer Electronics Data Storage
Consumer devices such as IP cameras, smart speakers, wearables and connected appliances need 32-128 MB of firmware/data storage at minimal cost - the W25N01GVZEIR-TR achieves the lowest cost-per-bit at 1 Gbit density and provides hardware ECC that extends endurance over the typical 5-7 year consumer product life. Designers wire the W25N01GVZEIR-TR to the SoC's QSPI controller in SPI-mode 0, copy the firmware image to DRAM at boot, and rely on the BBM LUT to handle factory-bad blocks transparently; the -40 C to +85 C range covers most consumer thermal environments.
Рекомендуется
Automotive Infotainment Boot Storage
Although not AEC-Q100 qualified in this specific -TR suffix, the W25N01GVZEIR-TR supports -40 C to +85 C cabin-class thermal operation and is used as boot/storage companion to automotive SoCs in rear-seat entertainment, head-unit secondary displays, and ADAS sensor loggers. The 1 Gbit density accommodates the secondary ECU's RTOS image plus calibration tables, and the on-die ECC reduces host CPU cycles otherwise spent on software error correction; typical designs pair this part with an SPI master capable of 104 MHz Quad-SPI I/O.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для W25N01GVZEIR-TR — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | W25N01GVZEIG | W25N01GWZEIR | W74M01GVZEIG | MX35LF1GE4AB | IS37SML01G1-DLI | GD5F1GQ5REYIGR |
|---|---|---|---|---|---|---|---|
| Brand | Winbond | Winbond | Winbond | Winbond | Macronix | ISSI | GigaDevice |
| Package | 8-WSON (8x6 mm) | 8-WSON (8x6 mm) - same | 8-WSON (8x6 mm) - same | 8-WSON (8x6 mm) - same | 8-WSON (8x6 mm) - same | 8-WSON (8x6 mm) - same | 8-WSON (8x6 mm) - same |
| Memory Density | 1 Gbit (128 MB) | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit |
| Maximum Clock Frequency | 104 MHz (SDR) | 104 MHz | 208 MHz (DTR) | 104 MHz | 104 MHz | 104 MHz | 120 MHz |
| Cell Type | SLC NAND | SLC NAND | SLC NAND | SLC NAND | SLC NAND | SLC NAND | SLC NAND |
| On-die ECC | Yes (internal) | Yes | Yes | Yes | Yes | Yes | Yes |
| BBM Look-Up Table | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Command Set Compatibility | Winbond W25N SPI-NAND | Winbond - identical | Winbond GW - superset | Winbond - identical | Macronix MX35LF family | ISSI proprietary | GigaDevice SPI-NAND |
Ключевые отличия
- Industrial -40 C to +85 C temperature range across -TR suffix (против W25N01GVZEIR (non-TR, tray packaging only))
- Higher 104 MHz Quad-SPI throughput with internal 2 KB buffer (против MX35LF1GE4AB (Macronix 1 Gbit QSPI NAND))
- Identical command set across Winbond W25N-GV family (против GD5F1GQ5REYIGR (GigaDevice))
Заметки по проектированию
Estimated: The 8-WSON 8x6 mm package has an exposed thermal pad (EP) that must be soldered to a board-side GND copper pad of at least 4 sqcm of copper to achieve rated endurance. Without proper EP soldering, junction temperature can exceed 110 C in continuous-read mode at 104 MHz, reducing data retention below 10 years. Use 0.1 uF + 4.7 uF decoupling caps close to VCC pin 8, plus a 10 kohm pull-up on /CS# to prevent spurious chip-select during power-up.
The /HOLD# pin (pin 7) and /RESET# pin (pin 7) share the same physical ball in 8-WSON. Confirm the device configuration at power-up (status register S0[5]) to know whether pin 7 behaves as HOLD or RESET - the wrong assumption causes I/O lockups on noisy PCB designs. Per Winbond AN-120, tie pin 7 high via 10 kohm to VCC during reset, never leave it floating, else Quad-SPI commands may not wake up correctly.
Estimated: Quad-SPI at 104 MHz with 4 data lines crossing 25 mm of FR-4 trace creates 2-3 ns of inter-symbol skew; route IO0-IO3 with matched lengths within 1 mm and 50 ohm controlled impedance. Series 33 ohm damping resistors on each IO line, placed within 5 mm of the W25N01GVZEIR-TR, suppress ringing on the QSPI bus. Keep CLK trace length matched to IO0 within 0.5 mm to avoid setup-time violations at 104 MHz.
When cascading two W25N01GVZEIR-TR devices on a shared SPI bus, isolate each chip-select with a 10 kohm pull-up and add 4.7 kohm series resistors on /CS# to damp bus contention during SPI master reconfig. Verify with an oscilloscope that VCC ripple stays below 50 mVpp during peak page-read bursts of 2 KB, otherwise ECC may misreport single-bit errors as uncorrectable. Add a bulk 10 uF tantalum + 100 nF ceramic at the W25N01GVZEIR-TR VCC pin to suppress high-frequency switching noise from the QSPI buffer transfer.
Информация о соответствии
RoHS compliant and lead-free per Winbond datasheet ordering information; halogen-free PCB-friendly molding compound; not AEC-Q100 qualified - for automotive under-hood designs select an automotive-qualified alternate or work with Winbond for custom screening.
