XC6SLX45-2CSG324I - 43,661-Cell Spartan-6 FPGA | AMD
Артикул: XC6SLX45-2CSG324I ✓ АктивенXC6SLX45-2CSG324I Обзор
A field-programmable gate array is a programmable digital semiconductor that combines configurable logic, block RAM, programmable I/O, and dedicated hard intellectual property into one device. An FPGA belongs to the programmable-logic hierarchy, sitting above fixed-function logic devices and supporting parallel hardware acceleration, interface bridging, control, and signal processing. The Spartan-6 LX family combines these resources in devices intended for cost-sensitive, high-volume embedded systems.
Key resources include 43,661 logic cells, 3,411 configurable logic blocks, 2,138,112 RAM bits, and 218 I/O. The -2 suffix identifies the device speed grade, while the I suffix denotes the industrial-temperature option. The CSG324 package is a lead-free 15 mm by 15 mm surface-mount BGA with a 0.80 mm ball pitch and 324 terminals.
The Spartan-6 architecture supports programmable logic, block RAM, digital signal processing resources, memory interfaces, and selectable I/O standards. Its combination of substantial logic density and 218 user I/O allows one device to consolidate functions that might otherwise require an FPGA, microcontroller, and discrete interface logic. The 45 nm implementation also supports a broad family of industrial, consumer, communications, and automotive-infotainment designs.
Typical applications include industrial automation controllers, automotive infotainment systems, video and image-processing pipelines, communications-interface bridges, embedded control systems, and general-purpose accelerator boards. The 218-I/O package is particularly useful when a design must connect multiple buses, converters, memories, and external control signals while retaining substantial parallel-processing capability.
PCB design should follow the AMD package pinout file and the selected Spartan-6 design constraints. Place decoupling capacitors close to supply pins, preserve the required ballout and power-plane geometry, and provide a clean configuration path for reliable startup. Validate timing with the implementation tools appropriate to the installed device and speed grade.
This product record combines the verified Spartan-6 resource figures with package-specific sourcing guidance, application analysis, comparison parameters, and practical replacement-selection considerations. It is intended to help engineers distinguish true same-package options from superficially similar devices with different speed grades, temperature grades, densities, or footprints.
Аналоги без доработки для XC6SLX45-2CSG324I — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с XC6SLX45-2CSG324I (тот же форм-фактор и посадочное место) — отличается по Package, Process Technology, Package Dimensions, Temperature Grade, Logic Cells.
XC6SLX45-3CSG324I
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Открыть даташит →XC6SLX45-L1CSG324I
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XC6SLX45-2CSG324C
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Открыть даташит →XC6SLX45-2CSG324Q
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XA6SLX45-2CSG324I
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XC6SLX45-2CSG324I Максимальные параметры и электрические характеристики
| Device Type | Spartan-6 LX field-programmable gate array (FPGA) |
| Logic Cells | 43,661 cells |
| Configurable Logic Blocks | 3,411 CLBs |
| Total RAM | 2,138,112 bits |
| User I/O Count | 218 I/O |
| Internal Frequency | 500 MHz |
| Process Technology | 45 nm |
| Performance Grade | -2 speed grade |
| Temperature Grade | Industrial: -40 °C to +100 °C junction temperature |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Package Type | 324-LFBGA, CSBGA-324, MO-275 |
| Package Dimensions | 15 mm x 15 mm |
| Ball Pitch | 0.80 mm |
| Terminal Count | 324 terminals |
| Тип монтажа | Surface-mount SMD |
| Lead-Free Status | Lead-free |
| Статус RoHS | RoHS compliant |
| Device Family | Spartan-6 LX |
Руководство по цоколевке XC6SLX45-2CSG324I в корпусе 15 mm x 15 mm
Цоколевка для XC6SLX45-2CSG324I (корпус 15 mm x 15 mm). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для XC6SLX45-2CSG324I.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
XC6SLX45-2CSG324I подходит для 6 применениеs: Industrial Automation Controller, Automotive Infotainment Bridge, Video and Image Processing Pipeline, Communications Interface Bridge, Embedded Control and Acquisition System, Consumer and Industrial Automation Equipment.
Industrial Automation Controller
The XC6SLX45-2CSG324I fits industrial automation because it combines 43,661 logic cells with 218 I/O while carrying the industrial-temperature suffix. Engineers can implement sequencing, motion-control interfaces, machine interlocks, sensor acquisition, and communications bridging in one device. The 45 nm Spartan-6 LX architecture allows parallel control logic to execute deterministically, while 2,138,112 RAM bits support packet buffering and local data paths. The -2 grade should be checked against the required clock and interface timing, and the PCB should follow AMD's CSG324 power and ballout requirements.
Рекомендуется
Automotive Infotainment Bridge
The XC6SLX45-2CSG324I is suitable for automotive infotainment and display-interface bridging, where programmable logic can consolidate protocol conversion and control functions. Its 218 I/O provide ample connections for display links, serializers, memory interfaces, and control peripherals, while 43,661 logic cells support parallel datapaths. The industrial-temperature designation supports equipment operating beyond typical room-temperature conditions. Designers should perform the appropriate automotive qualification review, validate timing for the selected -2 speed grade, and implement clean power distribution across the 324-ball CSBGA.
Рекомендуется
Video and Image Processing Pipeline
The XC6SLX45-2CSG324I can implement parallel video or image-processing pipelines by mapping pixel transport, thresholding, filtering, and control functions into its 43,661 logic cells. Its 2,138,112 RAM bits provide useful local line buffers, while 218 I/O accommodate data capture and interface logic. The -2 speed grade supports clocked datapath designs when the implementation meets timing constraints. Engineers should use the AMD Spartan-6 clocking and memory resources according to the target video timing, and confirm that the selected CSG324 board supports the required physical and signal interfaces.
Рекомендуется
Communications Interface Bridge
The XC6SLX45-2CSG324I is appropriate for protocol bridges that translate among serial, parallel, memory, and control interfaces. Its 218 I/O reduce the need for external glue logic, while the programmable logic fabric supports simultaneous packet processing, buffering, and state management. The 2,138,112 RAM bits can be partitioned for FIFOs or dual-port buffers. For a bridge design, engineers should constrain all interface clocks, review the selected -2 grade's timing margin, and follow the AMD CSG324 package guidance for power integrity, decoupling, and signal routing.
Рекомендуется
Embedded Control and Acquisition System
The XC6SLX45-2CSG324I supports embedded control and data-acquisition systems requiring deterministic parallel logic alongside configurable I/O. Engineers can implement sampling control, trigger sequencing, sensor conditioning logic, and memory-managed data paths without relying on a separate microcontroller for every real-time function. The 43,661-cell fabric and 218 I/O provide meaningful consolidation in compact embedded equipment. The design should include careful clock-domain boundary constraints, I/O-standard assignments compatible with external devices, and thermal verification for the industrial-temperature CSG324 package.
Рекомендуется
Consumer and Industrial Automation Equipment
The XC6SLX45-2CSG324I fits cost-sensitive high-volume equipment requiring extensive programmable logic without the complexity of a larger FPGA. Its 45 nm Spartan-6 LX implementation balances logic density, memory, and I/O availability for consumer-adjacent products and industrial automation modules. The 324-ball package supports compact board construction, although its 0.80 mm pitch requires appropriate assembly capability. Designers should verify lifecycle objectives, configure the device for robust startup, and validate both functional behavior and timing after each implementation change.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для XC6SLX45-2CSG324I — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | XC6SLX45-3CSG324I | XC6SLX45-L1CSG324I | XC6SLX45-2CSG324C | XC6SLX45-2CSG324Q | XA6SLX45-2CSG324I |
|---|---|---|---|---|---|---|
| Package | 324-ball CSBGA | 324-ball CSBGA | 324-ball CSBGA | 324-ball CSBGA | 324-ball CSBGA | 324-ball CSBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 class |
| Logic Cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells |
| RAM Bits | 2,138,112 bits | 2,138,112 bits | 2,138,112 bits | 2,138,112 bits | 2,138,112 bits | 2,138,112 bits |
| User I/O | 218 I/O | 218 I/O | 218 I/O | 218 I/O | 218 I/O | 218 I/O |
| Speed Grade | -2 | -3 | -1L | -2 | -2 | -2 |
| Temperature Grade | Industrial | Industrial | Industrial | Commercial | Q-grade option | Industrial |
| Process Technology | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm |
| Core Supply Voltage | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V |
Ключевые отличия
- Uses the -2 performance grade within the Spartan-6 LX family (против XC6SLX45-3CSG324I)
- Provides the industrial-temperature suffix for embedded equipment (против XC6SLX45-2CSG324C)
- Retains 218 I/O and 2,138,112 RAM bits in the same 324-ball CSBGA (против XC6SLX45-L1CSG324I)
- Offers 43,661 logic cells for integrated control and datapath processing (против XC6SLX25-3CSG324I)
Заметки по проектированию
Use the AMD CSG324 package drawing and ASCII ballout as the controlling sources for land patterns and electrical assignments. The package is a 15 mm by 15 mm, 324-ball BGA with 0.80 mm pitch, so small placement or registration errors can create open or shorted connections. Confirm drill, solder-mask, paste, and assembly-capability requirements with the board manufacturer before releasing the layout.
Assign every power and ground ball according to the AMD Spartan-6 package file rather than merging balls by apparent function alone. Decoupling capacitors should be placed near the corresponding device pins with short current loops, while the power and ground planes must satisfy the simultaneous switching requirements of the selected design. Validate the 1.14 V to 1.26 V core-supply range across temperature and process corners.
Do not treat a same-package FPGA as automatically interchangeable. Compare the XC6SLX45 density, -2 or alternative speed grade, I/O count, voltage configuration, temperature range, pin assignments, and block-RAM mix, then rerun timing and power analysis. Configuration compatibility also matters because existing bitstreams may need regeneration when the target device, speed grade, or design revision changes.
Estimated: device dissipation depends on the implemented design and cannot be calculated from the part number alone. Evaluate utilization, toggle rate, configured RAM, I/O activity, voltage, and ambient temperature using the AMD power tools, then add the measured or estimated junction rise to the worst-case ambient condition. The industrial suffix does not remove the need to control internal power density and board temperature.
Apply the AMD Spartan-6 I/O and clocking guidance for every external interface, including I/O standard, drive strength, slew, pull behavior, and timing constraints. Keep high-speed routes short, provide continuous reference planes where required, and separate noisy clock or power-conversion paths from sensitive inputs. Re-run implementation after any pin constraint or package-related change.
Информация о соответствии
The device is identified as RoHS compliant and lead-free in the manufacturer-family and distributor specification records. No verified automotive qualification statement, REACH declaration, halogen-free declaration, or conflict-minerals declaration was identified.
